Author: claimsbot

1. An electrode configured to provide electrical contact with a subject’s skin, the electrode comprising:
a conductive layer configured to spread current and to transmit electrical signals to andor receive electrical signals from the subject’s skin, the conductive layer having a first conductive surface through which electrical signals are transmitted to andor received from the subject’s skin, the first conductive surface being on a side of the conductive layer that faces toward the skin of the subject if the electrode is installed on the subject;
a gel layer formed on the same side of the conductive layer as the first conductive surface, the gel layer having a first interface surface configured to directly contact the subject’s skin if the electrode is installed on the subject, and to conduct electrical signals between the subject’s skin and the first conductive surface, the first interface surface having a surface area larger than that of the first conductive surface.
2. The electrode of claim 1, further comprising an adhesive layer having a second interface surface configured to contact and adhere to the subject’s skin, the adhesive layer being positioned relative to the gel layer such that the first interface surface is flush with the second interface surface.
3. The electrode of claim 2, wherein the adhesive layer generally surrounds a periphery of the gel layer.
4. The electrode of claim 1, wherein the gel layer and the conductive layer are formed such that a footprint of the first interface surface overlaps the entirety of a footprint of the first conductive surface.
5. The electrode of claim 1, further comprising a first layer having a connector contact surface configured to connect the electrode to an external electrical apparatus, wherein the first layer has a generally flat back surface on the same side of the electrode as the connector contact surface and a detent in the flat back surface, the connector contact surface being located in the detent.
6. An electrode configured to provide electrical contact with a subject’s skin, the electrode comprising:
means for transmitting electrical signals to andor receive electrical signals from the subject’s skin, the transmission provided by a conductive layer having a first conductive surface configured to transmit electrical signals to andor receive electrical signals from the subject’s skin, the first conductive surface being on a side of the conductive layer that faces toward the skin of the subject if the electrode is installed on the subject;
means for conducting electric signals between the subject’s skin and the first conductive surface, the conduction provided by a gel layer formed on the same side of the conductive layer as the first conductive surface, the gel layer having a first interface surface configured to directly contact the subject’s skin if the electrode is installed on the subject, the first interface surface having a surface area larger than that of the first conductive surface.
7. The electrode of claim 6, further comprising means for contacting and adhering the electrode to a subject’s skin, the contact and adhesion provided by an adhesive layer having a second interface surface, the adhesive layer being positioned relative to the gel layer such that the first interface surface is flush with the second interface surface.
8. The electrode of claim 7, wherein the adhesive layer generally surrounds a periphery of the gel layer.
9. The electrode of claim 6, wherein the gel layer and the conductive layer are formed such that a footprint of the first interface surface overlaps the entirety of a footprint of the first conductive surface.
10. The electrode of claim 6, further comprising means for connecting the electrode to an external electrical apparatus, wherein the connection is provided by a first layer having a connector contact surface configured to connect the electrode to an external electrical apparatus, and wherein the first layer has a generally flat back surface on the same side of the electrode as the connector contact surface and a detent in the flat back surface, the connector contact surface being located in the detent.
11. A method of manufacturing an electrode for providing electrical contact with a subject’s skin, comprising:
forming a conductive layer configured to transmit electrical signals to andor receive electrical signals from the subject’s skin, the conductive layer having a first conductive surface through which electrical signals are transmitted to andor received from the subject’s skin, the first conductive surface being on a side of the conductive layer that faces toward the skin of the subject if the electrode is installed on the subject; and
forming a gel layer on the same side of the conductive layer as the first conductive surface, the gel layer having a first interface surface configured to directly contact the subject’s skin if the electrode is installed on the subject, and to conduct electrical signals between the subject’s skin and the first conductive surface, the first interface surface having a surface area larger than that of the first conductive surface.
12. The method of claim 11, further comprising forming an adhesive layer having a second interface surface configured to contact and adhere to the subject’s skin, the adhesive layer being positioned relative to the gel layer such that the first interface surface is flush with the second interface surface.
13. The method of claim 12, wherein the adhesive layer generally surrounds a periphery of the gel layer.
14. The method of claim 11, wherein the gel layer and the conductive layer are formed such that a footprint of the first interface surface overlaps the entirety of a footprint of the first conductive surface.
15. The method of claim 11, further comprising forming a first layer having a connector contact surface configured to connect the electrode to an external electrical apparatus, wherein the first layer has a generally flat back surface on the same side of the electrode as the connector contact surface and a detent in the flat back surface, the connector contact surface being located in the detent.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A rack that is adapted to retain and a rotate a plurality of CD cases or cases containing other items which case has first and second major planar surfaces and edges connecting the first and second major surfaces, the rack comprising:
a loop comprised of a plurality of holders that are each adapted to receive one or more cases, each said holder including:
a base with a holder-engaging mechanism that can interlock to an adjacent similar holder;
first and second fingers extending from said base and adapted to receive a case;
first and second walls extending from said base and between the first and second fingers, the first and second walls adapted to receive the case wherein the first and second walls further include a lower wall extending therefrom;
first and second projections extending from said lower walls, with the first and second projections directed toward each other such that said first and second projections are adapted to frictionally engage the first and second major surfaces of the case;

a structure to support said loop; and
a motor to cause said loop to rotate.
2. The holder of claim 1 wherein said first and second projections are bump projections.
3. The holder of claim 1 wherein said first and second projections are made of a series of separate bump-like projections.
4. The holder of claim 1 wherein said first and second projections includes rubber.
5. A rack that can store a plurality of CD cases or cases holding other items, the rack comprising:
an upright support structure;
a continuous loop of interlocking holders supported on said upright support structure so as to be able to rotate;
a motor to drive rotation of the loop; and
wherein each holder in the continuous loop of interlocking object holders comprises:
a base;
first and second arms coupled to the base and spaced apart a distance from each other, wherein the first and second arms are adapted to admit at least a portion of at least one object to be retained by the holder;
at least one protrusion disposed on said first arm and said second arm and adapted to frictionally engage at least one depression on at least one object to be retained by the holder; the base further includes a pair of lower walls extending therefrom
a male holder engaging mechanism extending outward from the base with a slot located through the base and adjacent to the male holder-engaging mechanism;
a female holder engaging mechanism extending outward from the base, having a distal end which distal end is shaped in order to be received in the slot;

wherein a male holder engaging mechanism on a first said holder is disposed to matingly interlock with a female holder engaging mechanism on a second said holder, and a female holder engaging mechanism said first said holder is disposed to matingly interlock with a male holder engaging mechanism on a third said holder in forming said loop.

1. A wiring structure comprising: an insulating layer having an upper surface, a lower surface, and a connection hole communicating between the upper and bottom surfaces, the connection hole including a bottom at the lower surface and an opening at the upper surface; a body to be wired that is placed below the lower surface or at the bottom inside the connection hole so as to expose at least a portion thereof from the bottom of the connection hole, and a conductive pattern that is patterned inside and outside of the connection hole and that has an electrode portion disposed inside the connection hole and connected to the body to be wired, wherein a cross-sectional area of the electrode portion increases toward the body to be wired and the electrode portion is disposed to contact at least a portion of an inner wall of the connection hole and so as to define a space region between the electrode portion and the inner wall of the connection hole in which at least a portion of the inner wall of the connection hole and the electrode portion are not in contact, and wherein an upper-most point of the electrode portion is below the opening of the connection hole.
2. The wiring structure according to claim 1, wherein a width of an upper portion of the electrode portion is smaller than an opening diameter of the connection hole.
3. The wiring structure according to claim 1, wherein the electrode portion is disposed so as to cover the entire exposed surface of the body to be wired that is exposed from the bottom of the connection hole.
4. The wiring structure according to claim 1, wherein the conductive pattern including the electrode portion is formed of Cu.
5. The wiring structure according to claim 1, wherein the conductive pattern including the electrode portion is formed by plating.
6. The wiring structure according to claim 1, wherein the electrode portion has a flat upper surface distal from the body to he wired, and the cross-sectional area of the electrode portion increases from the flat upper surface toward the body to be wired.
7. The wiring structure according to claim 1, wherein an upper portion of the electrode portion includes a flat upper surface and side surfaces, the flat upper surface is distal from the body to be wired, the upper portion has a trapezoidal cross section, and the sides are not in contact with the inner wall of the connection hole.
8. The wiring structure according to claim 2, wherein the electrode portion is disposed so as to cover the entire exposed surface of the body to be wired that is exposed from the bottom of the connection hole.
9. A printed wiring board comprising a plurality of wiring structures formed therein, the wiring structures each comprising: an insulating layer having an upper surface, a lower surface, and a connection hole communicating between the upper and bottom surfaces, the connection hole including a bottom at the lower surface and an opening at the upper surface; a body to be wired that is placed below or at the bottom inside the insulating layer so as to expose at least a portion from the bottom of the connection hole; and a conductive pattern that is patterned inside and outside of the connection hole and that has an electrode portion disposed inside the connection hole and connected to the body to be wired, wherein a cross-sectional area of the electrode portion increases toward the body to be wired, the electrode portion is disposed to contact at least a portion of an inner wall of the connection hole and so as to define a space region between the electrode portion and the inner wall of the connection hole in which at least a portion of the inner wall of the connection hole and the electrode portion are not in contact, and an upper-most point of the electrode portion is below the opening of the connection hole.
10. The printing wiring board according to claim 9, wherein the conductive pattern including the electrode portion is formed of Cu.
11. The printing wiring board according to claim 9, wherein the conductive pattern including the electrode portion is formed by plating.
12. The printing wiring board according to claim 9, wherein the electrode portion has a flat upper surface distal from the body to be wired, and the cross-sectional area of the electrode portion increases from the flat upper surface toward the body to be wired.
13. The printing wiring board according to claim 9, wherein an upper portion of the electrode portion includes a flat upper surface and side surfaces, the flat upper surface is distal from the body to be wired, the upper portion has a trapezoidal cross section, and the sides are not in contact with the inner wall of the connection hole.
14. A method for manufacturing a wiring structure, which comprises: an insulating layer formation step for forming an insulating layer on a body to be wired, the insulating layer having an upper surface and a lower surface, a connection hole formation step for forming at least one connection hole in the insulating layer so as to expose at least a portion of the body to be wired from the connection hole, the connection hole including a bottom at the lower surface and an opening at the upper surface and communicating between the upper and bottom surfaces, and
a conductive pattern formation step for forming, by patterning, a conductive pattern that is patterned inside and outside of the connection hole and that has an electrode portion disposed inside the connection hole and connected to the body to be wired, wherein in the conductive pattern formation step, the electrode portion is formed to have a cross-sectional area that increases toward the body to be wired inside the connection hole and in contact with at least a portion of an inner wall of the connection hole and to define a space region between the electrode portion and the inner wall of the connection hole in which an inner wall of the connection hole is not in contact with the electrode portion, and the electrode portion is formed to have an upper-most point below the opening of the connection hole.
15. The method according to claim 14, wherein the conductive pattern including the electrode portion is formed of Cu.
16. The method according to claim 14, wherein the conductive pattern including the electrode portion is formed by plating.
17. The method according to claim 14, wherein the electrode portion has a flat upper surface distal from the body to be wired, and the cross-sectional area of the electrode portion increases from the flat upper surface toward the body to be wired.
18. The method according to claim 14, wherein an upper portion of the electrode portion includes a fiat upper surface and side surfaces, the flat upper surface is distal from the body to be wired, the upper portion has a trapezoidal cross section, and the sides are not in contact with the inner wall of the connection hole.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A compound selected from the group consisting of piperidine carboxylic acid amides of the formula (I)
wherein
W is a phenyl ring or a six-membered, non benzofused aromatic ring containing one to four nitrogen atoms, wherein said ring is substituted by V in para position;
V represents a bond; \u2014(CH2)r\u2014; -A-(CH2)s\u2014; \u2014CH2-A-(CH2)t\u2014; \u2014(CH2)s-A-; \u2014(CH2)2-A-(CH2)u\u2014; -A-(CH2)v\u2014B\u2014; \u2014CH2\u2014CH2\u2014CH2-A-CH2\u2014; -A-CH2\u2014CH2\u2014B\u2014CH2\u2014; \u2014CH2-A-CH2\u2014CH2\u2014B\u2014; \u2014CH2\u2014CH2\u2014CH2-A-CH2\u2014CH2\u2014; \u2014CH2\u2014CH2\u2014CH2\u2014CH2-A-CH2\u2014; -A-CH2\u2014CH2\u2014B\u2014CH2\u2014CH2\u2014; \u2014CH2-A-CH2\u2014CH2\u2014B\u2014CH2\u2014; \u2014CH2-A-CH2\u2014CH2\u2014CH2\u2014B\u2014; \u2014CH2\u2014CH2-A-CH2\u2014CH2\u2014B\u2014; \u2014O\u2014CH2\u2014CH(OCH3)\u2014CH2\u2014O\u2014; \u2014O\u2014CH2\u2014CH(CH3)\u2014CH2\u2014O\u2014; \u2014O\u2014CH2\u2014CH(CF3)\u2014CH2\u2014O\u2014; \u2014O\u2014CH2\u2014C(CH3)2\u2014CH2\u2014O\u2014; \u2014O\u2014CH2\u2014C(CH3)2\u2014O\u2014; \u2014O\u2014C(CH3)2\u2014CH2\u2014O\u2014; \u2014O\u2014CH2\u2014CH(CH3)\u2014O\u2014; \u2014O\u2014CH(CH3)\u2014CH2\u2014O\u2014; \u2014O\u2014CH2\u2014C(CH2CH2)\u2014O\u2014; or \u2014O\u2014C(CH2CH2)\u2014CH2\u2014O\u2014;
A and B independently represent \u2014O\u2014 or \u2014S\u2014;
U represents unsubstituted aryl; mono-, di-, tri- or tetra-substituted aryl wherein the substituents are independently selected from the group consisting of halogen, alkyl, alkoxy, and \u2014CF3; or mono-, di-, or tri-substituted heteroaryl wherein the substituents are independently selected from the group consisting of halogen, alkyl, alkoxy, and \u2014CF3;
Q represents methylene or ethylene;
M represents an aryl, quinolinyl, isoquinolinyl, dihydroquinolinyl or tetrahydroquinolinyl group wherein said groups can optionally be mono- or di-substituted with substituents independently selected from the group consisting of alkyl; alkoxy; \u2014OCF3; \u2014CF3; hydroxy-alkyl; halogen; alkyl-O\u2014(CH2)x\u2014CH2\u2014; alkyl-O\u2014(CH2)y\u2014O\u2014; R\u20322N\u2014(CH2)x\u2014CH2\u2014, wherein R\u2032 is independently selected from the group consisting of hydrogen, alkyl (optionally substituted by one, two or three fluorine atoms), cyclopropyl, cyclopropyl-methyl, \u2014C(\u2550O)O\u2014R\u2033, and \u2014C(\u2550O)\u2014R\u2033 wherein R\u2033 is C1-Cx-alkyl, \u2014CF3, \u2014CH2\u2014CF3 or cyclopropyl; and R\u2032\u2033NH\u2014C(\u2550O)\u2014(O)z\u2014(CH2)x\u2014CH2\u2014, wherein R\u2032\u2033 is alkyl or cyclopropyl;
R1 represents alkyl or cycloalkyl;
n is the integer 0 or 1;
r is the integer 3, 4, 5, or 6;
s is the integer 2, 3, 4, or 5;
t is the integer 1, 2, 3, or 4;
u is the integer 1, 2, or 3; and
v is the integer 2, 3, or 4;
x is the integer 0, 1, 2, 3, or 4;
v is the integer 2, 3, or 4;
z is the integer 0 or 1;
in free or pharmaceutically acceptable salt form.
2. A compound according to claim 1, wherein n is the integer 1 and the ring substituents (\u2014CON(R1)-Q-M) and (\u2014W\u2014V\u2014U) are trans to each other.
3. A compound according to claim 1, wherein n is the integer 0 and the configurations at positions 3 and 4 of the piperidine ring of formula (I) are 3R and 4S, respectively.
4. A compound according to claim 1, wherein M represents an aryl, quinolinyl, isoquinolinyl, dihydroquinolinyl or tetrahydroquinolinyl group wherein said groups can optionally be mono- or di-substituted with substituents independently selected from the group consisting of alkyl; alkoxy; \u2014OCF3; \u2014CF3; hydroxy-alkyl; halogen; alkyl-O\u2014(CH2)x\u2014CH2\u2014; alkyl-O\u2014(CH2)y\u2014O\u2014; and R\u20322N\u2014(CH2)x\u2014CH2\u2014, wherein R\u2032 is independently selected from the group consisting of hydrogen, alkyl, cyclopropyl, and \u2014C(\u2550O)\u2014R\u2033 wherein R\u2033 is C1-Cx-alkyl, \u2014CF3, \u2014CH2\u2014CF3 or cyclopropyl.
5. A compound according to claim 1, wherein M represents the following radical:
wherein R2 is methyl or chlorine, R3 is hydrogen, and R4 represents hydrogen, \u2014CH2CH2\u2014O\u2014CH3, \u2014CH2CH2CH2\u2014O\u2014CH3, or R\u2032NH\u2014(CH2)x\u2014CH2\u2014 wherein R\u2032 is \u2014CH2\u2014CHF2, \u2014CH2\u2014CF3, cyclopropyl, \u2014CO\u2014CH3, \u2014CO\u2014CH2\u2014CF3, \u2014CO\u2014CH2\u2014CH3, or cyclopropyl-carbonyl, with the proviso that in this case R4 is hydrogen, R3 represents methyl, methoxy, chlorine, or \u2014O\u2014CH2CH2\u2014O\u2014CH3.
6. A compound according to claim 1, wherein Q is methylene.
7. A compound according to claim 1, wherein W represents a phenyl ring substituted by V in para position or a heteroaryl containing one nitrogen atom.
8. A compound according to claim 1, wherein V represents
a.)(-A-(CH2)s, wherein A represents O, wherein s is 2 or 3 and wherein V is linked to U of formula (I) via A, or
b.) \u2014OCH2CH2O\u2014.
9. A compound according to claim 1, wherein U is a mono-, di-, or tri-substituted phenyl.
10. A compound according to claim 1, wherein R1 is cyclopropyl.
11. A compound according to claim 1, selected from the group consisting of:
(1R*,5S*,6R*,7S*)-7-{4-3-(2-chloro-3,6-difluoro-phenoxy)-propyl-phenyl}-3,9-diaza-bicyclo3.3.1nonane-6-carboxylic acid cyclopropyl-(2,3-dichloro-benzyl)-amide, in free or pharmaceutically acceptable salt form;
4-{4-3-(2-chloro-3,6-difluoro-phenoxy)-propyl-phenyl}-piperidine-3-carboxylic acid cyclopropyl-(3-methoxy-2-methyl-benzyl)-amide, in free or pharmaceutically acceptable salt form;
4-{4-3-(2,6-dichloro-4-methyl-phenoxy)-propyl-phenyl}-piperidine-3-carboxylic acid cyclopropyl-(3-methoxy-2-methyl-benzyl)-amide, in free or pharmaceutically acceptable salt form;
4-{4-3-(2,3,6-trifluoro-phenoxy)-propyl-phenyl} -piperidine-3-carboxylic acid cyclopropyl-(3-methoxy-2-methyl-benzyl)-amide, in free or pharmaceutically acceptable salt form;
4-{4-3-(2-chloro-3,6-difluoro-phenoxy)-propyl-phenyl}-piperidine-3-carboxylic acid cyclopropyl-(2,3-dimethyl-benzyl)-amide, in free or pharmaceutically acceptable salt form;
4-{4-3-(2,6-dichloro-4-methyl-phenoxy)-propyl-phenyl}-piperidine-3-carboxylic acid cyclopropyl-(2,3-dimethyl-benzyl)-amide, in free or pharmaceutically acceptable salt form;
4-{4-3-(2-chloro-6-fluoro-3-methyl-phenoxy)-propyl-phenyl}-piperidine-3-carboxylic acid cyclopropyl-(2,3-dimethyl-benzyl)-amide, in free or pharmaceutically acceptable salt form: and
4-{4-3-(2,3,6-trifluoro-phenoxy)-propyl-phenyl}-piperidine-3-carboxylic acid cyclopropyl-(2,3-dimethyl-benzyl)-amide in free or pharmaceutically acceptable salt form.
12. A compound according to claim 1, selected from the group consisting of:
(3R*,4S*)-4-{4-2-(2,6-dichloro-4-methylphenoxy)ethoxyphenyl}-piperidine-3-carboxylic acid cyclopropyl-(2,3-dimethylbenzyl)-amide, in free or pharmaceutically acceptable salt form,
(3R,4S)-4-{4-2-(2,6-Dichloro-4-methyl-phenoxy)-ethoxy-phenyl}-piperidine-3-carboxylic acid 2-chloro-5-(3-methoxy-propyl)-benzyl-cyclopropyl-amide, in free or pharmaceutically acceptable salt form:
(3R,4S)-4-{4-2-(2,6-dichloro-4-methyl-phenoxy)-ethoxy-phenyl}-piperidine-3-carboxylic acid 2-chloro-5-(2-methoxy-ethyl)-benzyl-cyclopropyl-amide, in free or pharmaceutical acceptable salt form;
(3R,4S)-6-2-(2,6-dichloro-4-methyl-phenoxy)-ethoxy-1\u2032,2\u2032,3\u2032,4\u2032,5\u2032,6\u2032-hexahydro-3,4\u2032bipyridinyl-3\u2032-carboxylic acid 2-chloro-5-(3-methoxy-propyl)-benzyl-cyclopropyl-amide, in free or pharmaceutically acceptable salt form; and
(3R,4S)-6-2-(2,6-dichloro-4-methyl-phenoxy)-ethoxy-1\u2032,2\u2032,3\u2032,4\u2032,5\u2032,6\u2032-3,4\u2032bipyridinyl-3\u2032-carboxylic acid 2-chloro-5-(2-methoxy-ethyl)-benzyl-cyclopropyl-amide in free or pharmaceutically acceptable salt form.
13. A compound according to claim 1, selected from the group consisting of:
(3R,4S)-4-{4-2-(2,6-dichloro-4-methyl-phenoxy)-ethoxy-phenyl}-piperidine-3-carboxylic acid {2-chloro-5-(2,2-difluoro-ethylamino)-methyl-benzyl}-cyclopropyl-amide, in free or pharmaceutically acceptable salt form;
(3R,4S)-4-{4-2-(2,6-dichloro-4-methyl-phenoxy)-ethoxy-phenyl}-piperidine-3-carboxylic acid {2-chloro-5-(3,3,3-trifluoro-propionylamino)-methyl-benzyl}-cyclopropyl-amide, in free or pharmaceutically acceptable salt form;
(3R,4S)-4-{4-2-(2,6-dichloro-4-methyl-phenoxy)-ethoxy-phenyl}-piperidine-3-carboxylic acid {2-chloro-5-(cyclopropylmethyl-amino)-methyl-benzyl}-cyclopropyl-amide, in free or pharmaceutically acceptable salt form;
(3R,4S)-4-{4-2-(2,6-dichloro-4-methyl-phenoxy)-ethoxy-phenyl}-piperidine-3-carboxylic acid 5-(acetylamino-methyl)-2-chloro-benzyl-cyclopropyl-amide, in free or pharmaceutically acceptable salt form;
(3R,4S)-4-{4-2-(2,6-dichloro-4-methyl-phenoxy)-ethoxy-phenyl}-piperidine-3-carboxylic acid 2-chloro-5-(2-methylamino-ethyl)-benzyl-cyclopropyl-amide, in free or pharmaceutically acceptable salt form;
(3R,4S)-4-{4-2-(2,6-dichloro-4-methyl-phenoxy)-ethoxy-phenyl}-piperidine-3-carboxylic acid (2-chloro-5-methylaminomethyl-benzyl)-cyclopropyl-amide, in free or pharmaceutically acceptable salt form;
(3R,4S)-4-{4-2-(2,6-dichloro-4-methyl-phenoxy)-ethoxy-phenyl}-piperidine-3-carboxylic acid {2-chloro-5-2-(3,3,3-trifluoro-propionylamino)-ethyl-benzyl}-cyclopropyl-amide, in free or pharmaceutically acceptable salt form;
(3R,4S)-4-{4-2-(2,6-dichloro-4-methyl-phenoxy)-ethoxy-phenyl}-piperidine-3-carboxylic acid 2-chloro-5-(2-ethylamino-ethyl)-benzyl-cyclopropyl-amide, in free or pharmaceutically acceptable salt form;
(3R,4S)-4-{4-2-(2,6-dichloro-4-methyl-phenoxy)-ethoxy-phenyl}-piperidine-3-carboxylic acid 5-(2-acetylamino-ethyl)-2-chloro-benzyl-cyclopropyl-amide, in free or pharmaceutically acceptable salt form;
(3R,4S)-4-{4-2-(2,6-dichloro-4-methyl-phenoxy)-ethoxy-phenyl}-piperidine-3-carboxylic acid {2-chloro-5-(2-fluoro-ethylamino)-methyl-benzyl}-cyclopropyl-amide, in free or pharmaceutically acceptable salt form;
(3R,4S)-4-{4-2-(2,6-dichloro-4-methyl-phenoxy)-ethoxy-phenyl}-piperidine-3-carboxylic acid (2-chloro-5-ethylaminomethyl-benzyl)-cyclopropyl-amide, in free or pharmaceutically acceptable salt form;
(3R,4S)-4-{4-2-(2,6-dichloro-4-methyl-phenoxy)-ethoxy-phenyl}-piperidine-3-carboxylic acid (2-chloro-5-cyclopropylaminomethyl-benzyl)-cyclopropyl-amide, in free or pharmaceutically acceptable salt form; and
(3R,4S)-4-{4-2-(2,6-dichloro-4-methyl-phenoxy)-ethoxy-phenyl}-piperidine-3-carboxylic acid 2-chloro-5-(2-cyclopropylamino-ethyl)-benzyl-cyclopropyl-amide, in free or pharmaceutically acceptable salt form.
14. A pharmaceutical composition comprising a compound according to claim 1 and a pharmaceutically acceptable carrier material.
15. A compound according to claim 1, for use as a medicament.
16. Use of a compound according to claim 1 for the preparation of a pharmaceutical composition for the treatment or prophylaxis of diseases such as or related to hypertension, congestive heart failure, pulmonary hypertension, renal insufficiency, renal ischemia, renal failure, renal fibrosis, cardiac insufficiency, cardiac hypertrophy, cardiac fibrosis, myocardial ischemia, cardiomyopathy, glomerulonephritis, renal colic, complications resulting from diabetes such as nephropathy, vasculopathy and neuropathy, glaucoma, elevated intra-ocular pressure, atherosclerosis, restenosis post angioplasty, complications following vascular or cardiac surgery, erectile dysfunction, hyperaldosteronism, lung fibrosis, scleroderma, anxiety, cognitive disorders, complications of treatments with immunosuppressive agents, and other diseases known to be related to the renin-angiotensin system.
17. A compound according to claim 14 for use as a medicament.