Author: claimsbot

1. A method for the real-time preparation at a pharmacy work station of a label for a pharmacy vial, the label containing customer-specific drug and dosage information printed thereon and one or more warnings thereon specific to the drug being prescribed, the method comprising the steps of:
connecting computer means and database means with a printer so as to supply a real-time electronic data input to the printer of the customer-specific drug and dosage information and the one or more drug-specific warnings;
providing a plurality of blank forms each of which has an upper surface and a lower surface with an adhesive backing on the lower surface, the upper surface of each form containing a printable portion for receiving printing from the printer of the customer-specific drug and dosage information and the one or more warnings from the database means, respectively, on the upper surface thereof;
(a) passing each form through the printer and printing the customer-specific drug and dosage information on a first area of the printable portion; and
(b) any drug-specific warnings on a second area of the printable portion; and then adhering the printed form to the pharmacy vial.
2. The method recited in claim 1, further comprising the step of processing each form so that the first and second areas are removable together from a backing sheet.
3. The method recited in claim 2, further comprising the step of processing each form so that at least one warning is removable from the printable portion and readily separated therefrom.
4. The method recited in claim 1, further comprising the steps of:
storing icons representative of warnings; and
printing at least one icon with a corresponding warning.
5. The method recited in claim 1 further comprising the step of removably attaching the second area along a side of the first area such that the removal of the first area permits the simultaneous removal of at least a part of the second area.
6. The method recited in claim 1 further comprising the step of printing text on the second area in a direction generally lateral to the direction of printing along the first area.
7. The method recited in claim 1 further comprising the step of forming the first and second areas.
8. The method recited in claim 1 wherein the second area comprises two or more individual warning labels, further comprising the steps of partially perforating the warning label section to form a tear line between adjacent warning labels, whereby two or more adjacent individual warning labels may be removed together from the backing sheet and either (a) affixed together onto the drug container or (b) removed together and then separated, or (c) separated from each other as one or more individual labels.
9. The method recited in claim 8 further comprising the steps of extending a sheet of printable paper from the vial label and warning label sections, and printing patient advisory leaflet data contained in the database means onto an outer surface of the paper sheet during printing.
10. The method recited in claim 1, wherein the database means comprises a first database and a supplemental database, and loading the drug-specific warning information in the supplemental database.
11. A method for preparing a container useful in dispensing drugs by a pharmacist, in which the container includes an outer surface provided with a main label section for receiving specific drug or patient information and a warning label section for receiving one or more warnings specific to the drug or patient information to be received on the main label section, the method comprising the steps of:
providing means for imprinting numerals and letters on the main label section and on the warning label section;
connecting computer means and database means with the imprinting means to supply a real-time electronic data input to the imprinting means of the customer-specific drug and dosage information and the drug-specific warning information;
passing the main label section and the warning label section through the imprinting means and imprinting\u2014
(a) the customer-specific drug and dosage information on the main label section; and
(b) any drug-specific warning information on the warning label section.
12. The method recited in claim 11, further comprising the step of forming the main label section and the warning label section on a printable paper sheet.
13. The method recited in claim 12, further comprising the step of fixing the paper sheet containing the main label section and the warning label section on a backing sheet with a releasable adhesive.
14. The method recited in claim 11, wherein the database means comprises a first database and a supplemental database, and loading the drug-specific warning information in the supplemental database.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. An insert-molded product having plural metal inserts (14A, 14B) embedded at least at first and second specified depths in a resin molded member (16), substantially identical synthetic resin caps (17) fit respectively on each of said inserts (14A, 14B), each of said caps (17) having at least first and second receiving surfaces (14A, 33B) offset from one another by a distance corresponding to a difference between the first and second specified depths.
2. The insert-molded product of claim 1, wherein at least one of the receiving surfaces (33A, 33B) of each of said caps (17) is exposed externally on the resin molded member (16).
3. The insert-molded product of claim 2, wherein a fusing portion (34) projects out on each of said caps (17), the fusing portions (34) being dimensioned to be melted during insert molding to join integrally with the resin molded member (16).
4. The insert-molded product of claim 3, wherein the fusing portion (34) surrounds the receiving surfaces (33A, 33B) of each of said caps (17).
5. The insert-molded product of claim 1, wherein the first receiving surfaces (33A) surrounds the second receiving surface (33B).
6. The insert-molded product of claim 1, wherein each of said caps (17) has a tubular side wall and an end wall extending across one end of the tubular side wall, the receiving surfaces (33A, 33B) projecting from the end wall.
7. The insert-molded product of claim 1, wherein the metal inserts (14A, 14B, 35) comprise nuts (14A, 14B) having an open end and a closed end, the caps (17) being mounted respectively over the closed ends of the nuts (14A, 14B).
8. The insert-molded product of claim 7, wherein the open end of each of said nuts (14A, 14B) is exposed externally on the resin molded member (16).
9. The insert-molded product of claim 8, wherein the resin molded member (16) comprises a case (12) of an electronic control unit.
10. The insert-molded product of claim 9, further comprising at least one busbar (25) insert molded in the case (12) and contacting at least one of the nuts
A).
11. The insert-molded product of claim 10, wherein the busbar (35) has a thickness substantially equal to a difference between the specified depths.
12. An insert-molded case (12) for an electronic control unit, comprising:
a plurality of nuts (14A, 14B) having opposite first and second ends and an external surface extending between the ends, the first end of each of said nuts (14A, 14B) being closed and an internally threaded cavity extending into the second end;
resin caps (17) having opposite first and second ends, the first end of each of the caps (17) being closed and a hollow interior extending into the second end of the cap (17), the hollow interior of the caps (17) being fit respectively over the closed first ends of the nuts (14A) and portions of the external surface thereof;
a metal collar (23) spaced from the nuts (14A, 14B), the collar (23) having opposite first and second ends and an opening extending therethrough;
a busbar (25) having a first portion mounted on the first end of the collar (23) and second portion mounted on the second end of a first of the nuts (14A), a first hole (26) extending through the first portion of the busbar (25) and aligned with the opening of the collar (23) and a second hole (26) extending through the second end of the busbar (25) and aligned with the cavity of the first nut (14A); and
a unitary matrix of resin (16) surrounding parts of the nuts (14A, 14B), the cap (17), the collar (23) and the busbar (25) so that at least the holes (26) of the busbar (25) and the closed ends of the caps (17) are exposed from the resin (16).
13. The insert molded case (12) of claim 12, wherein the first end of the cap (17) has at least first and second receiving surfaces (33A, 33B) offset axially from one another by a distance corresponding to a thickness of the busbar.
14. The insert molded case (12) of claim 13, wherein a fusing portion (34) projects out on each of said caps (17), the fusing portions (34) being joined integrally with the resin molded member (16).
15. The insert molded case (12) of claim 13, wherein the second end of the collar (23) is exposed from the resin (16).
16. The insert molded case (12) of claim 13, further comprising a cover (13) mounted to a second of the nuts (14B).

1. An electro-optic device, comprising:
a plurality of pixel electrodes arranged in a matrix, the plurality of pixel electrodes including a first pixel electrode and a second pixel electrode that is closest to the first pixel electrode, a space being formed between the first pixel electrode and the second pixel electrode;
an electro-optic layer located over the first pixel electrode, second pixel electrode and the space, the electro-optic layer including a plurality of charged particles; and
an opposed electrode located over the electro-optic layer and facing the first pixel electrode, the second pixel electrode and the space,
wherein the plurality of charged particles includes first particles which are positively charged and second particles which are negatively charged, and
wherein dG is equal to or greater than 110, and is equal to or less than 310 when d is a distance between a first edge of the first pixel electrode and a second edge of the second pixel electrode, the first edge being closer to the second pixel electrode than any other edge of the first pixel electrode, and the second edge being closer to the first pixel electrode than any other edge of the second pixel electrode, and G is a gap formed between the opposed electrode and at least one of the first pixel electrode and the second pixel electrode.
2. The electro-optic device according to claim 1,
wherein the electro-optic layer includes a dispersion medium dispersing the first particles and the second particles.
3. The electro-optic device according to claim 2,
wherein the electro-optic layer includes a plurality of microcapsules, and
wherein each of the plurality of microcapsules encapsulates the dispersion medium, the first particles, and the second particles.
4. The electro-optic device according to claim 3,
wherein the electro-optic layer includes a binder that fixes the positions of the microcapsules.
5. The electro-optic device according to claim 1,
wherein the first particles exhibit black in color, and the second particles exhibit white in color.
6. The electro-optic device according to claim 1, further comprising:
a first substrate; and
a second substrate facing the first substrate
wherein the plurality of pixel electrodes are disposed between the first substrate and the electro-optic layer and the opposed electrode is disposed between the second substrate and the electro-optic layer.
7. The electro-optic device according to claim 1,
wherein the distance d is in a range from 5 \u03bcm to 15 \u03bcm.
8. The electro-optic device according to claim 1,
wherein the opposed electrode has light permeability.
9. The electro-optic device according to claim 8,
wherein the opposed electrode is made of ITO.
10. The electro-optic device according to claim 1,
wherein each of the plurality of the pixel electrodes is rectangular in shape.
11. The electro-optic device according to claim 1, further comprising:
a plurality of scanning lines extending in a first direction;
a plurality of data lines extending in a second direction intersecting with the first direction; and
a plurality of switching elements, each of the plurality of switching elements controlling conductivity between one of the plurality of data lines and one of the plurality of pixel electrodes according a scanning signal supplied through one of the plurality of scanning lines.
12. The electro-optic device according to claim 11,
wherein the plurality of switching elements includes a first switching element electrically connected to the first pixel electrode and a second switching element electrically connected to the second pixel electrode, and
wherein one of the plurality of scanning lines is electrically connected to the first switching element and the second switching element.
13. The electro-optic device according to claim 11,
wherein the plurality of switching elements includes a first switching element electrically connected to the first pixel electrode and a second switching element electrically connected to the second pixel electrode, and
wherein one of the plurality of data lines is electrically connected to the first switching element and the second switching element.
14. The electro-optic device according to claim 11, further comprising:
a plurality of power supply lines;
a plurality of capacitors, each of the plurality of capacitors being disposed between one of the plurality of pixel electrodes and one of the plurality of power supply lines.
15. The electro-optic device according to claim 1,
wherein the first particles and the second particles positioned between the opposed electrode and the space move depending on an electric field caused by a difference in electric potentials of the opposed electrode and the first pixel electrode, or a difference in electric potentials of the opposed electrode and the second pixel electrode.
16. The electro-optic device according to claim 1,
wherein the first particles and the second particles positioned between the opposed electrode and the space move depending on an electric field caused by a difference in electric potentials of the first pixel electrode and the second pixel electrode.
17. An electronic instrument comprising the electro-optic device according to claim 1.
18. An electro-optic device, comprising:
pixel electrodes in a matrix, the pixel electrodes including a first pixel electrode and a second pixel electrode disposed adjacent the first pixel electrode with a space therebetween;
an electro-optic layer disposed over the first pixel electrode, second pixel electrode and the space, the electro-optic layer including charged particles; and
an opposed electrode disposed over the electro-optic layer and facing the first pixel electrode, the second pixel electrode and the space,
wherein the charged particles include positively charged first particles and negatively charged second particles, and
wherein 310 \u2267dG \u2267110, d being a distance between a first edge of the first pixel electrode and a second edge of the second pixel electrode, the first edge being adjacent the second edge, and G being a gap between the opposed electrode and at least one of the first and second pixel electrodes.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method for altering the semiconductor characteristics of a semiconductor element formed on a substrate, the method comprising:
directing an energy beam at the semiconductor element, wherein the energy beam is substantially absorbed by a first portion of the semiconductor element;
thinning the substrate under the semiconductor element; and
the step of directing an energy beam at the semiconductor element including directing the energy beam at the first portion of the semiconductor element through the substrate, wherein the energy beam is substantially transmitted through the substrate;
wherein the semiconductor element comprises:
a source region;
a drain region;
a channel region between the source region and the drain region;
a gate oxide formed over the channel region; and
a gate formed over the gate oxide, wherein the first portion of the semiconductor element comprises the gate and wherein the energy beam is substantially transmitted through the channel region; and

wherein the energy beam causes the source region and the drain region to merge so as to form an always-on current path in the semiconductor element.
2. The method of claim 1, wherein the energy beam is produced by a CO2 laser.
3. The method of claim 1, wherein the energy beam is produced by a YAG laser.
4. The method of claim 3, wherein the energy beam has a wavelength of greater than 1.2 \u03bcm.
5. The method of claim 1, wherein the energy beam is produced by a laser ablation system for repairing defects in photomasks.
6. The method of claim 1, further comprising:
forming a passivation layer over the semiconductor element on the substrate, and
mounting a support structure on the passivation layer.
7. The method of claim 6, wherein the support structure comprises an unprocessed wafer having an oxide layer, and wherein mounting the support structure comprises covalently bonding the oxide layer of the unprocessed wafer to the passivation layer.
8. The method of claim 6, wherein the support structure comprises a processed wafer having an oxide layer, and wherein mounting the support structure comprises covalently bonding the oxide layer of the processed wafer to the passivation layer.
9. The method of claim 6, wherein mounting the support structure comprises using an adhesive to attach the support structure to the passivation layer.
10. The method of claim 6, wherein thinning the backside of the processed wafer comprises a grinding operation.
11. The method of claim 6, wherein thinning the backside of the processed wafer comprises a chemical-mechanical polishing (CMP) operation.
12. The method of claim 6, wherein thinning the backside of the processed wafer comprises an etch process.
13. The method of claim 1, wherein thinning the backside of the processed wafer comprises:
forming a resist layer on the backside of the processed wafer, the resist layer comprising an aperture under the transistor; and
etching the processed wafer through the aperture.
14. The method of claim 13, wherein etching the processed wafer comprises performing an anisotropic etch process.
15. The method of claim 13, wherein etching the processed wafer comprises performing an isotropic etch process.
16. The method of claim 1, wherein the substrate comprises a silicon wafer.
17. The method of claim 1, wherein the substrate comprises a gallium arsenide wafer.
18. The method of claim 1, wherein the substrate comprises an insulating plate.
19. The method of claim 1, wherein the substrate comprises an amorphous silicon layer.
20. The method of claim 1, wherein the gate comprises a metal layer.
21. The method of claim 1, wherein the gate comprises a first silicide layer.
22. The method of claim 21, wherein the source region comprises a second silicide layer, and wherein the drain comprises a third suicide layer, the first, second, and third silicide layers being formed using a salicide process, wherein the first portion of the semiconductor element comprises the second and third silicide layers.
23. The method of claim 22, wherein the first, second, and third silicide layers comprise titanium silicide.