Author: claimsbot

1. A long acting curcumin derivative, wherein the long acting curcumin derivative has the following structural formula:
wherein:
R1 and R2 are hydrogen or methoxyl; and
R3 and R4 are each nonyl.
2. A method of treating depression in a subject comprising administering a long acting curcumin derivative according to claim 1 to said subject.
3. The method according to claim 2, wherein said long acting curcumin derivative comprises a pharmaceutically acceptable carrier and is in a formulation selected from the group consisting of a powder, tablet, pellet, capsule, micro-capsule, granule and a liquid derivative.
4. The method according to claim 2, wherein a long acting curcumin derivative is in a formulation selected from the group consisting of a beverage, food, food additive and health care product.
5. The method of claim 3, wherein said pharmaceutically acceptable carrier comprises an excipient, additive or flavor.
6. A method of treating a tumor in a subject comprising administering the long acting curcumin derivative according to claim 1 to said subject wherein the tumor is selected from the group consisting of leukaemia, cervical cancer, renal cancer, breast cancer, gastric cancer, colonic cancer, lung cancer cells, liver cancer, prostate cancer, esophageal cancer, myeloma, glioma, melanoma, lymphoma, bladder cancer, adenocarcinoma, ovarian cancer and skin cancer.
7. The method according to claim 6, wherein said long acting curcumin derivative comprises a pharmaceutically acceptable carrier in a formulation selected from the group consisting of a powder, tablet, pellet, capsule, micro-capsule, granule and a liquid derivative.
8. The method according to claim 6, wherein said long acting curcumin derivative is in a formulation selected from the group consisting of an antitumor beverage, food, food additives and health care product.
9. The method of claim 7, wherein said pharmaceutically acceptable carrier comprises an excipient, additive or flavor.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A cryopreparation chamber (100) for preparing and manipulating a sample for electron microscopy, the cryopreparation chamber (100) being cooled by a first cryogen, wherein the cryopreparation chamber (100) comprises:
a first chamber portion (101); and
a second chamber portion (102) configured to be detachably placeable on the first chamber portion (101) during cryopreparation of the sample in the first chamber portion, the second chamber portion (102) including an outer wall (106) having an access port (107) through which a specimen holder (108) for an electron microscope can be inserted from a point external to the cryopreparation chamber (100) into the cryopreparation chamber (100).
2. The cryopreparation chamber as recited in claim 1, wherein the second chamber portion (102) includes at least two components (102a,102b) which are reversibly placeable on the first chamber portion (101) in a sideways direction, the access port (107) being provided in one (102a) of the at least two components.
3. The cryopreparation chamber as recited in claim 2, wherein the at least two components (102a,102b) are pivotably connected to each other.
4. The cryopreparation chamber as recited in claim 2, wherein the second chamber portion (102) includes exactly two components (102a,102b).
5. The cryopreparation chamber as recited in claim 1, wherein the second chamber portion (102) has substantially the shape of a cylindrical tube.
6. The cryopreparation chamber as recited in claim 1, wherein the access port (107) of the second chamber portion (102) is adapted for insertion of a side-entry goniometer into the cryopreparation chamber.
7. The cryopreparation chamber as recited in claim 1, wherein the first chamber portion (101) includes a cooling bath (103) for the first cryogen.
8. The cryopreparation chamber as recited in claim 7, wherein the first chamber portion (101) further includes a cooling bath (104) for a second cryogen for freezing electron microscopic samples.
9. The cryopreparation chamber as recited in claim 8, wherein at least a lower portion of the cooling bath (104) for the second cryogen is disposed in the cooling bath (103) for the first cryogen.
10. The cryopreparation chamber as recited in claim 9, further comprising a sleeve (118) surrounding the cooling bath (103) for the first cryogen and the cooling bath (104) for the second cryogen, said sleeve (118) being open at a top thereof and capable of being reversibly lowered from an upper position to a lower position.
11. The cryopreparation chamber as recited in claim 10, wherein the sleeve (118) is in its upper position when the second chamber portion (102) is not placed thereon, and when the second chamber portion (102) is placed thereon, the sleeve (118) is in its lowered position.
12. The cryopreparation chamber as recited in claim 11, wherein the sleeve (118) has substantially the shape of a cylindrical tube.
13. The cryopreparation chamber as recited in claim 10, wherein the sleeve (118) is spring-mounted.
14. A cryopreparation device (200) for cryopreparing a sample for an electron microscope, the cryopreparation device comprising a cryopreparation chamber (100) cooled by a first cryogen, wherein the cryopreparation chamber (100) comprises:
a first chamber portion (101);
a second chamber portion (102) configured to be detachably placeable on the first chamber portion (101) during cryopreparation of the sample in the first chamber portion, the second chamber portion (102) including an outer wall (106) having an access port (107) through which a specimen holder (108) for an electron microscope can be inserted from a point external to the cryopreparation chamber (100) into the cryopreparation chamber (100).
15. The cryopreparation device as recited in claim 14, wherein the first chamber portion (101) includes a cooling bath (103) for the first cryogen and a cooling bath (104) for a second cryogen for freezing electron microscopic samples.
16. The cryopreparation device as recited in claim 15, wherein at least a lower portion of the cooling bath (104) for the second cryogen is disposed in the cooling bath (103) for the first cryogen.
17. The cryopreparation device as recited in claim 16, further comprising a sleeve (118) surrounding the cooling bath (103) for the first cryogen and the cooling bath (104) for the second cryogen, said sleeve (118) being open at a top thereof and capable of being reversibly lowered from an upper position to a lower position.
18. The cryopreparation device as recited in claim 17, wherein the sleeve (118) is in its upper position when the second chamber portion (102) is not placed thereon, and when the second chamber portion (102) is placed thereon, the sleeve (118) is in its lowered position.
19. The cryopreparation device as recited in claim 18, wherein the sleeve (118) has substantially the shape of a cylindrical tube.
20. The cryopreparation device as recited in claim 17, wherein the sleeve (118) is spring-mounted.

1. A method for manufacturing a stacked electronic component, comprising:
adhering a first electronic component having first electrode pads on a substrate having electrode portions;
connecting a first portion of the electrode portions and the first electrode pads via first bonding wires;
adhering a second electronic component having second electrode pads on the first electronic component by using an adhesive layer structure including a first layer disposed at the first electronic component side and a second layer disposed at the second electronic component side; and
connecting a second portion of the electrode portions and the second electrode pads via second bonding wires,
wherein the first and second layers are made of a same material of thermosetting insulating resin, and the second layer has a modulus of elasticity larger than that of the first layer;
wherein the first layer softens or melts at an adhesive temperature of the second electronic component, and has a viscosity within a range of 1 kPa\xb7s or more and 100 kPa\xb7s or less at the adhesive temperature, and the second layer maintains a layered shape for the adhesive temperature of the second electronic component, and has a viscosity of a range of 130 kPa\xb7s or more at the adhesive temperature; and
wherein ends of the first bonding wires connected to the second electrode pads are taken into a cured resin layer of the first layer, and a cured resin layer of the second layer is disposed between the first bonding wires and the second electronic component so as to prevent contact of the first bonding wires and the second electronic component.
2. The manufacturing method according to claim 1,
wherein the second electronic component has a portion protruding outside from an outer periphery of the first electronic component, and the first layer is filled between the protruding portions of the second electronic component and the substrate by softened or melted at the adhesive temperature of the second electronic component.
3. The manufacturing method according to claim 1,
wherein the first and second electronic components are constituted by at least one selected from a semiconductor element and a package component including a semiconductor element.
4. The manufacturing method according to claim 1,
wherein the first layer substantially covers the first electronic component, and the second layer substantially covers the second electronic component.
5. The manufacturing method according to claim 1,
wherein the first and second layers have a room temperature modulus of elasticity in a range of 500 MPa or more and 1200 MPa or less.
6. The manufacturing method according to claim 1,
wherein the adhesive layer has a modulus of elasticity at 175\xb0 C. of 40 MPa or more after cure, and a modulus of elasticity at 260\xb0 C. of 1 MPa or more after cure.
7. The manufacturing method according to claim 1,
wherein the first and second layers are made of an epoxy resin.
8. The manufacturing method according to claim 1,
wherein the second electronic component has a surface area the same as or larger than a surface area of the first electronic component.
9. A method for manufacturing a stacked electronic component, comprising:
adhering a first electronic component having first electrode pads on a substrate having electrode portions;
connecting a first portion of the electrode portions and the first electrode pads via first bonding wires;
adhering a second electronic component having second electrode pads on the first electronic component by using an adhesive layer structure having a first layer disposed adjacent to the first electronic component and a second layer disposed adjacent to the second electronic component; and
connecting a second portion of the electrode portions and the second electrode pads via second bonding wires,
wherein the first and second layers are made of a same material of thermosetting insulating resin, and the second layer has a modulus of elasticity larger than that of the first layer; and
wherein the first and second layers have a room temperature modulus of elasticity in a range of 500 MPa or more and 1200 MPa or less.
10. The manufacturing method according to claim 9, wherein the first layer substantially covers the first electronic component, and the second layer substantially covers the second electronic component.
11. The manufacturing method according to claim 9,
wherein ends of the first bonding wires connected to the second electrode pads are taken into a cured resin layer of the first layer, and a cured resin layer of the second layer is disposed between the first bonding wires and the second electronic component so as to prevent contact of the first bonding wires and the second electronic component.
12. The manufacturing method according to claim 9,
wherein the second electronic component has a surface area the same as or larger than a surface area of the first electronic component.
13. The manufacturing method according to claim 9,
wherein the first and second layers are made of an epoxy resin.
14. The manufacturing method according to claim 9,
wherein the first and second electronic components are constituted by at least one selected from a semiconductor element and a package component including a semiconductor element.
15. A method for manufacturing a stacked electronic component, comprising:
adhering a first electronic component having first electrode pads on a substrate having electrode portions;
connecting a first portion of the electrode portions and the first electrode pads via first bonding wires;
adhering a second electronic component having second electrode pads on the first electronic component by using an adhesive layer structure having a first layer disposed adjacent to the first electronic component and a second layer disposed adjacent to the second electronic component; and
connecting a second portion of the electrode portions and the second electrode pads via second bonding wires,
wherein the first and second layers are made of a same material of thermosetting insulating resin, and the second layer has a modulus of elasticity larger than that of the first layer; and
wherein the adhesive layer has a modulus of elasticity at 175\xb0 C. of 40 MPa or more after cure, and a modulus of elasticity at 260\xb0 C. of 1 MPa or more after cure.
16. The manufacturing method according to claim 15,
wherein the first layer substantially covers the first electronic component, and the second layer substantially covers the second electronic component.
17. The manufacturing method according to claim 15,
wherein ends of the first bonding wires connected to the second electrode pads are taken into a cured resin layer of the first layer, and a cured resin layer of the second layer is disposed between the first bonding wires and the second electronic component so as to prevent contact of the first bonding wires and the second electronic component.
18. The manufacturing method according to claim 15,
wherein the second electronic component has a surface area the same as or larger than a surface area of the first electronic component.
19. The manufacturing method according to claim 15,
wherein the first and second layers are made of an epoxy resin.
20. The manufacturing method according to claim 15,
wherein the first and second electronic components are constituted by at least one selected from a semiconductor element and a package component including a semiconductor element.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A pulse generator, for delivering electrical stimulation to a patient, comprising:
a battery operable to power the pulse generator;
circuitry for generating and delivering electrical pulses to tissue of the patient according to a plurality of controllable output levels; and
a voltage conversion module operable to convert from a voltage level from the battery to a variable converted voltage level for provision to the circuitry for generating and delivering, wherein the voltage conversion module comprises a plurality of capacitive voltage multipliers including at least one fractional capacitive voltage multiplier, and the voltage conversion module including a voltage combining element that combines the voltages output from the plurality of capacitive voltage multipliers to produce the converted voltage level.
2. The pulse generator of claim 1, wherein the voltage conversion module provides converted voltage levels in \xbc increments of the voltage level from the battery.
3. The pulse generator of claim 1, wherein the voltage conversion module comprises a logic element for receiving multiple control bits, the control bits identifying a desired voltage level for the converted voltage level.
4. The pulse generator of claim 1, wherein the voltage conversion module comprises:
switching circuitry that is operable to controllably arrange a plurality of capacitors into a stacked circuit configuration to achieve a desired fractional voltage level.
5. The pulse generator of claim 4, wherein the switching circuitry of the voltage conversion module is implemented in at least one integrated circuit disposed between a plurality of capacitors.
6. The pulse generator of claim 4, wherein lower voltage capacitors are disposed at a bottom portion of the stacked circuit configuration and higher voltage capacitors are disposed at a top portion of the stacked circuit configuration.
7. The pulse generator of claim 1, wherein the voltage conversion module is operable to partition a plurality of controllable switches to minimize a number of components of the voltage conversion module experiencing high voltage levels.
8. The pulse generator of claim 1 further comprising:
control circuitry for causing delivery of multiple pulses to tissue of the patient in succession, the control circuitry (i) causing the converted voltage level to equal a first voltage level before causing the circuitry for delivering to deliver a first electrical pulse at a first amplitude; and shortly thereafter (ii) causing the converted voltage level to equal a second voltage level before causing the circuitry for delivering to deliver a second electrical pulse at a second amplitude.
9. The pulse generator of claim 8, wherein at least one storage capacitor in the plurality of capacitive voltage multipliers is not discharged between the first and second electrical pulses.
10. The pulse generator of claim 1, wherein at least one capacitor in the voltage conversion module is used in a charge phase, a pump phase, and a source phase.
11. The pulse generator of claim 1, wherein the battery is a rechargeable battery.
12. The pulse generator of claim 1, wherein the pulse generator device is a neurostimulator device.
13. A method of operating a pulse generator for delivering electrical stimulation to a patient, the method comprising:
powering the pulse generator using a battery;
generating electrical pulses according to a plurality of controllable output levels;
delivering the generated electrical pulses to tissue of the patient; and
converting from a voltage level from the battery to a variable converted voltage level for use by the generating, wherein the converting includes (i) multiplying the voltage level from the battery by multiple capacitive multipliers including at least one fractional capacitive multiplier and (ii) combining voltages output from the multiple capacitive multipliers to produce the converted voltage level.
14. The method of claim 13, wherein the converting is performed in \xbc increments of the voltage level from the battery.
15. The method of claim 13, further comprising:
communicating multiple control bits to identify a desired voltage level for the converted voltage level.
16. The method of claim 13, wherein the converting comprises:
configuring switching circuitry between a plurality of capacitors to achieve the converted voltage level.
17. The method of claim 16, wherein a plurality of switches are controlled to create a stacked circuit configuration of capacitors to achieve a desired fractional voltage level.
18. The method of claim 13 further comprising:
causing the converted voltage level to equal a first voltage level before causing the generation and delivery of a first electrical pulse at a first amplitude, and shortly thereafter causing the converted voltage level to equal a second voltage level before causing the generation and delivery of a second electrical pulse at a second amplitude.
19. The method of claim 18, wherein at least one storage capacitor in the plurality of capacitive voltage multipliers is not discharged between the first and second electrical pulses.
20. The method of claim 13, wherein at least one capacitor in the multiple capacitive voltage multipliers is used in a charge phase, a pump phase, and a source phase.