What is claimed is:
1. A semiconductor light emitting device comprising:
a semiconductor light emitting element (1, 1, 1);
a resin stem (10) having a first lead (21), a second lead (22) and a resin portion (10A) partly covering said first and second leads, one end of said first lead and one end of said second lead being externally extended from said resin portion, and said resin portion having a recess containing said semiconductor light emitting element, the other end of said first lead electrically connected to a first electrode of said semiconductor light emitting element, and the other end of said second lead electrically connected to a second electrode of said semiconductor light emitting element;
a light-transmissive resin (5) filling said recess of said resin stem; and
a projection (9) made of a light-transmissive resin to cover the entire upper surface of said resin stem, said projection being extended down onto side surfaces of said resin stem to a predetermined distance from said upper surface to continuously cover the upper part of the side surfaces all around.
2. The semiconductor light emitting device according to claim 1 wherein said projection (9) forms a lens having a vertical axis aligned with a vertical axis of said resin stem (10), these center axes being aligned with a vertical axis of said semiconductor light emitting element (1).
3. The semiconductor light emitting device according to claim 2 wherein said resin stem (10) has at least one through hole (15) in the bottom of said recess.
4. The semiconductor light emitting device according to claim 2 wherein said resin stem (10) has at least one through hole (14) extending from the upper surface to the lower surface thereof.
5. The semiconductor light emitting device according to claim 2 further comprising a fluorescent element for converting light emanating from said semiconductor light emitting element (1, 1, 1) into different wavelength light.
6. The semiconductor light emitting device according to claim 5 wherein said fluorescent element is contained in said resin portion (10A) of said resin stem (10).
7. The semiconductor light emitting device according to claim 5 wherein said fluorescent element is applied onto inner wall surfaces (8) of said recess of said resin stem (10).
8. The semiconductor light emitting device according to claim 5 wherein said fluorescent element is contained in a mounting adhesive applied onto the bottom surface of said semiconductor light emitting element (1, 1, 1).
9. The semiconductor light emitting device according to claim 5 wherein said fluorescent element is contained in said light-transmissive resin (5) filling said recess.
10. The semiconductor light emitting device according to claim 5 wherein said fluorescent element is contained in said light-transmissive resin forming said projection (9).
11. A semiconductor light emitting device comprising:
a semiconductor light emitting element (1, 1, 1);
a resin stem (10) having a first lead (21), a second lead (22) and a resin portion (10A) partly covering said first and second leads, one end of said first lead and one end of said second lead being externally extended from said resin portion, and said resin portion having a recess containing said semiconductor light emitting element, the other end of said first lead electrically connected to a first electrode of said semiconductor light emitting element, and the other end of said second lead electrically connected to a second electrode of said semiconductor light emitting element;
a light-transmissive resin (5) filling said recess of said resin stem; and
a projection (9) made of a light-transmissive resin to cover the entire upper surface of said resin stem, said projection being extended down onto side surfaces of said resin stem to a predetermined distance from said upper surface to continuously cover the upper part of the side surfaces all around;
wherein said recess of said resin stem (10) is longer in a first horizontal direction in which said first and second leads (21, 22) extend than in a second horizontal direction normal to said first horizontal direction.
12. The semiconductor light emitting device according to claim 11 wherein said first electrode of said semiconductor light emitting element (1) is connected to said first lead (21) by a bonding wire (4), and said second electrode of said semiconductor light emitting element is connected to said second lead (22) by a bonding wire (4).
13. The semiconductor light emitting device according to claim 12 wherein said projection (9) forms a lens having a vertical axis aligned with a vertical axis of said resin stem (10), these center axes being aligned with a vertical axis of said semiconductor light emitting element (1).
14. The semiconductor light emitting device according to claim 13 further comprising a fluorescent element for converting light emanating from said semiconductor light emitting element (1, 1, 1) into different wavelength light.
15. The semiconductor light emitting device according to claim 11 wherein the center of a horizontal cross-sectional configuration of said recess of said resin stem (10) is offset from the center of a horizontal cross-sectional configuration of said resin stem.
16. The semiconductor light emitting device according to claim 15 wherein said second electrode of said semiconductor light emitting element (1) is connected to said second lead (22) by a bonding wire (4), and the center of a horizontal cross-sectional configuration of said recess of said resin stem (10) is offset from the center of a horizontal cross-sectional configuration of said resin stem toward the externally extending direction of said second lead.
17. The semiconductor light emitting device according to claim 16 wherein said projection (9) forms a lens having a vertical axis aligned with a vertical axis of said resin stem (10), these center axes being aligned with a vertical axis of said semiconductor light emitting element (1).
18. The semiconductor light emitting device according to claim 17 further comprising a fluorescent element for converting light emanating from said semiconductor light emitting element (1, 1, 1) into different wavelength light.
19. A semiconductor light emitting device comprising:
a semiconductor light emitting element (1, 1, 1);
a resin stem (10) having a first lead (21), a second lead (22) and a resin portion (10A) partly covering said first and second leads, one end of said first lead and one end of said second lead being externally extended from said resin portion, and said resin portion having a recess containing said semiconductor light emitting element, the other end of said first lead electrically connected to a first electrode of said semiconductor light emitting element, and the other end of said second lead electrically connected to a second electrode of said semiconductor light emitting element;
a light-transmissive resin (5) filling said recess of said resin stem; and
a projection (9) made of a light-transmissive resin to cover the entire upper surface of said resin stem, said projection being extended down onto side surfaces of said resin stem to a predetermined distance from said upper surface to continuously cover the upper part of the side surfaces all around;
wherein inner side surfaces (8) of said recess serve as reflective surfaces.
20. The semiconductor light emitting device according to claim 19 wherein said resin portion (10A) of said resin stem (10) is made from a thermoplastic resin not less than 65 weight % and a filler agent not more than 35 weight %, said filler agent being a high reflective material containing titanium oxide, silicon oxide, andor aluminum oxide, and titanium oxide occupying 10 to 15 weight %.
21. The semiconductor light emitting device according to claim 20 wherein said projection (9) forms a lens having a vertical axis aligned with a vertical axis of said resin stem (10), these center axes being aligned with a vertical axis of said semiconductor light emitting element (1).
22. The semiconductor light emitting device according to claim 21 further comprising a fluorescent element for converting light emanating from said semiconductor light emitting element (1, 1, 1) into different wavelength light.
23. A method for manufacturing a semiconductor light emitting device comprising the steps of:
forming a resin stem (10) by integrally molding a lead frame (2) having first and second leads (21, 22) and a resin portion (10A) such that said first and second leads are positioned in an end-to-end alignment in a recess formed in the upper surface of said resin portion;
mounting a semiconductor light emitting element (1, 1, 1) having first and second electrodes in said recess, and electrically connecting said first lead to said first electrode and said second lead to said second electrode;
injecting a fluid-state thermosetting resin (12) into an encapsulating case mold (11);
dipping the upper surface of said resin stem and upper parts of side surfaces continuous from the upper surface into said fluid-state resin in said encapsulating case mold; and
hardening said fluid-state resin to form a projection (9) of a light-transmissive resin on said resin stem,
said projection covering the entire upper surface of said resin stem, and extended down onto side surfaces of said resin stem to a predetermined distance from said upper surface to continuously cover the upper part of the side surfaces all around.
24. The method for manufacturing a semiconductor light emitting device according to claim 23 wherein said resin stem (10) is oriented upside down when dipped into said second fluid-state resin (12) within said encapsulating case mold (11).
25. The method for manufacturing a semiconductor light emitting device according to one of claim 24 wherein said resin stem (10) is dipped into said second fluid-state resin (12) within said encapsulating case mold (11) to a depth where said lead frame (2) contacts the edge of the cavity of said encapsulating case mold (11).
26. The method for manufacturing a semiconductor light emitting device according to claim 24 wherein said encapsulating case mold (11) has a stopper (13) along the edge of the cavity thereof, said resin stem (10) being dipped into said second fluid-state resin (12) within said encapsulating case mold (11) to a depth where said lead frame (2) contacts said stopper.
27. The method for manufacturing a semiconductor light emitting device according to claim 24 wherein said resin stem (10) has a stopper, said resin stem (10) being dipped into said second fluid-state resin (12) within said encapsulating case mold (11) to a depth where said stopper contacts the edge of the cavity of said encapsulating case mold (11).
28. The method for manufacturing a semiconductor light emitting device according to claim 24 wherein said lead frame (2) includes plural pairs of said first and second leads (21, 22).
29. The method for manufacturing a semiconductor light emitting device according claim 24 wherein said encapsulating case mold (11) is a part of a case mold chain which includes a plurality of said encapsulating case molds aligned in a row.
30. The method for manufacturing a semiconductor light emitting device according to claim 29 wherein a plurality of said resin stems (10) are formed for individual lead pairs (21, 22) of said lead frame (2), and are dipped into corresponding individuals of said encapsulating case molds of said case mold chain (11).
31. A method for manufacturing a semiconductor light emitting device comprising the steps of:
forming a resin stem (10) by integrally molding a lead frame (2) having first and second leads (21, 22) and a resin portion (10A) such that said first and second leads are positioned in an end-to-end alignment in a recess formed in the upper surface of said resin portion;
mounting a semiconductor light emitting element (1, 1, 1) having first and second electrodes in said recess, and electrically connecting said first lead to said first electrode and said second lead to said second electrode;
injecting a first fluid-state thermosetting resin (5) into said recess to embed said semiconductor light emitting element and said first and second leads;
injecting a second fluid-state thermosetting resin (12) into an encapsulating case mold (11);
dipping said resin stem into said second fluid-state resin within said encapsulating case mold by bringing said first fluid-state resin into touch with the second fluid-state resin in said encapsulating case mold;
hardening said first and second fluid-state resins to form a light-transmissive resin encapsulating element (5) in said recess and a projection (9) of a light-transmissive resin on said resin stem,
said projection covering the entire upper surface of said resin stem, and extended down onto side surfaces of said resin stem to a predetermined distance from said upper surface to continuously cover the upper part of the side surfaces all around.
32. The method for manufacturing a semiconductor light emitting device according to claim 31 wherein said resin stem (10) is oriented upside down when dipped into said second fluid-state resin (12) within said encapsulating case mold (11).
33. The method for manufacturing a semiconductor light emitting device according claim 32 wherein said resin stem (10) is dipped into said second fluid-state resin (12) within said encapsulating case mold (11) to a depth where said lead frame (2) contacts the edge of the cavity of said encapsulating case mold (11).
34. The method for manufacturing a semiconductor light emitting device according to claim 32 wherein said encapsulating case mold (11) has a stopper (13) along the edge of the cavity thereof, said resin stem (10) being dipped into said second fluid-state resin (12) within said encapsulating case mold (11) to a depth where said lead frame (2) contacts said stopper.
35. The method for manufacturing a semiconductor light emitting device according to claim 32 wherein said resin stem (10) has a stopper, said resin stem (10) being dipped into said second fluid-state resin (12) within said encapsulating case mold (11) to a depth where said stopper contacts the edge of the cavity of said encapsulating case mold (11).
36. The method for manufacturing a semiconductor light emitting device according to claim 32 wherein said lead frame (2) includes plural pairs of said first and second leads (21, 22).
37. The method for manufacturing a semiconductor light emitting device according to claim 32 wherein said encapsulating case mold (11) is a part of a case mold chain which includes a plurality of said encapsulating case molds aligned in a row.
38. The method for manufacturing a semiconductor light emitting device according to claim 37 wherein a plurality of said resin stems (10) are formed for individual lead pairs (21, 22) of said lead frame (2), and are dipped into corresponding individuals of said encapsulating case molds of said case mold chain (11).
39. The method for manufacturing a semiconductor light emitting device according to claim 31 wherein said first fluid-state resin (5) and said second fluid-state resin (12) are different resin materials.
40. The method for manufacturing a semiconductor light emitting device according to claim 31 wherein ultraviolet rays are irradiated onto said resin stem before said fluid-state resin (5) is injected into said recess (7) of said resin stem.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
What is claimed is:
1. A dosing pump for dispensing two or more liquids, gels, slurries andor pastes and adapted to be connected to two or more containers for said two or more liquids, gels, slurries andor pastes, which comprises an operating button, and two or more liquid, gel, slurry andor paste dispensing assemblies, each liquid, gel, slurry andor paste dispensing assembly being in mechanical contact with an actuator, wherein said actuator is in further mechanical contact with an operating button and is simultaneously or nearly simultaneously actuated by movement of said operating button, wherein each liquid, gel, slurry andor paste dispensing assembly further comprises:
a) a dispensing element;
b) a cylindrical chamber in flow communication with the dispensing element;
c) a piston or bellows sealingly and slidably mounted within said cylindrical chamber;
having a stroke for motion between a rest position and a dispensing position at corresponding opposite rest and dispensing ends of the stroke;
d) an inlet valve means in fluid connection with an outlet valve means,
wherein said inlet valve means is in fluid connection with a container containing liquids, gels, slurries andor pastes; and
wherein said outlet valve means is in fluid connection with said dispensing element; and
wherein said inlet valve means and said outlet valve means are disposed in three plates situated between said corresponding container and said cylindrical chamber, and designated upper, middle, and lower plates, the upper plate being farthest from said containers, the middle plate being intermediate in distance from said containers, and the lower plate being closest to said containers; and
wherein said inlet valve means is a trampoline valve situated between said container and said piston or bellows; and
wherein said trampoline valve is in open position when said piston or bellows is urged in the direction of the rest position, thereby providing fluid communication between said inlet valve means, said cylindrical chamber and said container; thereby drawing by vacuum pressure liquid, gel, slurry andor paste from said corresponding container to said corresponding cylindrical chamber; and which is in closed position when said piston or bellows is urged in the direction of the dispensing position; and
wherein said outlet valve means forms a part of said upper plate, and comprises a vent which is in open position when said piston or bellows is urged in the direction of the dispensing position, and which is in closed position when said piston or bellows is urged in the direction of the dispensing position thereby providing fluid communication between said cylindrical chamber, said outlet valve means and said dispensing element; thereby dispensing liquid, gel slurry andor paste from said dispensing element by mechanical force;
wherein two or more said containers each comprises:
a) a rigid outer layer having a vent therein;
b) a thin inner layer adjacent to but not adhesively bonded to said outer layer,
wherein said inner layer forms a hermetic seal between said outer layer and said dosing pump; and
wherein said inner layer contains said liquid, gel slurry andor paste, and separates from said outer layer when said liquid, gel slurry andor paste is suctioned from said two or more containers, said inner layer being collapsed andor drawn toward said dosing pump.
2. A pump in accordance with claim 1 which comprises two liquid, gel, slurry andor paste dispensing assemblies.
3. A pump in accordance with claim 1, wherein each said liquid, gel, slurry andor paste dispensing assembly comprises a piston sealably and slidably mounted within said cylindrical chamber.
4. A pump in accordance with claim 3, which further comprises a spring means for returning each piston to its corresponding rest position after said piston has been moved to its corresponding dispensing position.
5. A pump in accordance with claim 1, wherein said actuator is rigidly and mechanically connected to said operating button.
6. A pump in accordance with claim 1, which further comprises a covering which is contiguously disposed with said operating button and which adjoins a top plate which carries said dispensing assemblies.
7. A pump in accordance with claim 1, wherein said inlet valve means and said outlet valve means and a channel which communicates therebetween is embedded in a valve plate which is disposed below a top plate, which carries said liquid, gel, slurry andor paste dispensing assemblies, and wherein said inlet means is axially aligned with said piston or bellows.
8. A valve arrangement for a dosing pump for dispensing two or more liquids, gels, slurries andor pastes which comprises:
a) an inlet valve means adapted to receive a liquid, gel, slurry andor paste by vacuum pressure;
b) an outlet valve means adapted to receive a liquid, gel, slurry andor paste by mechanical pressure;
c) and a channel which is in fluid connection between said inlet valve means and said outlet valve means
and where a), b) and c) are all disposed in one or more plates.
9. A valve arrangement in accordance with claim 8, wherein said inlet valve means is a trampoline valve and said outlet valve means is a duckbilled valve.
10. A valve arrangement in accordance with claim 8, which is formed by one shot bi-injection.
11. A valve arrangement in accordance with claim 8, which further comprises a solid piston or bellows sealingly and slidably mounted within a cylindrical chamber, and wherein said cylindrical chamber is in fluid communication with said trampoline valve, and wherein said valve arrangement has a stroke for motion between a rest position and a dispensing position at corresponding opposite rest and dispensing ends of the stroke; and wherein said valve arrangement is for transporting two or more liquids, gels, slurries andor pastes; and wherein at no point during or between said rest and dispensing positions does said two or more liquids, gels, slurries, andor pastes travel through said solid piston or bellows.
12. A pump in accordance with claim 1, wherein one container contains an oxidative hair dye and another said container contains a developing solution
13. A pump in accordance with claim 9, which comprises non-corrosive materials.
14. A pump in accordance with claim 1, wherein each inlet valve means is a flap valve.
15. A pump in accordance with claim 1 wherein each inlet valve means is a trampoline valve.
16. A pump in accordance with claim 1 wherein each outlet valve means is a duckbilled valve.
17. A pump in accordance with claim 1 wherein said inlet valve means said outlet valve means and the channel therebetween are all embedded in a valve plate.
18. A pump in accordance with claim 1 wherein said inlet valve means said outlet valve means and the channel therebetween are all embedded in an upper plate.
19. A pump in accordance with claim 1, wherein said inlet valve means, said outlet valve means and the channel therebetween are all embedded partly in an upper valve plate and partly in a lower plate.
20. A method for dispensing a liquid, gel, slurry andor paste which comprises dispensing said liquid andor paste through a dosing pump according to claim 1.