1. A controller for an outside condenser unit of an air conditioner capable of operating in a full capacity mode and at least one reduced capacity mode, the controller comprising:
a communication means for receiving information relating to the operation of other air conditioning components separate from the outside condenser unit;
a processor for controlling the operation of a condenser fan and a compressor in a full capacity mode of operation and in at least one reduced capacity mode of operation, wherein the processor receives operating condition information relating to the operation of the other air conditioning system components and responsively operates the compressor in a full capacity mode or a reduced capacity mode based on the received information.
2. The controller of claim 1, wherein the communication means comprises a peer-to-peer network connection that enables receiving information from at least an indoor blower controller and sending information to at least an indoor blower controller.
3. The controller of claim 2 where in response to receiving information that the indoor blower is only able to operate at a reduced blower speed, the processor controls the operation of the compressor in at least one reduced capacity mode of operation.
4. The controller of claim 2 where in response to receiving information that the indoor blower is not able to operate, the processor shuts down the operation of the compressor.
5. The controller of claim 2 wherein the processor switches the operation of the compressor to at least one reduced capacity mode of operation when the line voltage level is below a predetermined level.
6. The controller of claim 5 wherein the controller communicates a low voltage fault at the compressor motor via the communication means to at least one of a thermostat or an indoor blower controller.
7. The controller of claim 5 wherein the controller communicates a reduced capacity mode of operation of the compressor via the communication means to at least one of a thermostat or an indoor blower controller.
8. The controller of claim 2 further comprising a sensor for sensing the current in the condenser fan motor.
9. The controller of claim 2 further comprising a sensor for sensing the current in the compressor motor.
10. The controller of claim 9 further comprising a sensor for sensing the compressor discharge temperature.
11. The controller of claim 10 where in response to the controller sensing a high discharge temperature and a low compressor motor current, the controller communicates a signal indicating a low refrigerant charge to at least one of the thermostat or the indoor blower controller.
12. The controller of claim 2 further comprising an outside temperature sensor, wherein the controller communicates the sensed outside temperature value to at least one of a thermostat or an indoor blower controller.
13. The controller of claim 9, wherein the processor responsively switches the operation of the compressor to at least one reduced capacity mode of operation when the current sensed in the compressor motor remains above a predetermined level for at least a predetermined time.
14. The controller of claim 13, wherein the at least one reduced capacity mode of operation comprises cycling the compressor on at full capacity for a predetermined minimum time period and off for a predetermined time period.
15. The controller of claim 2, wherein the controller communicates at least one of a compressor motor winding open circuit fault, a compressor motor locked rotor fault, a compressor excessive run time fault, a compressor motor protector trip cycle fault, a condenser fan motor open circuit fault, or a condenser fan motor locked rotor circuit fault to a thermostat.
16. An interactive system for controlling the operation of a heating, ventilation, and air conditioning system having a plurality of components, the interactive system comprising at least one controller for operating a first component of the heating, ventilation, and air conditioning system, the controller modifying the operation of the first component in response to information received about the operation of a second component of the heating, ventilation, and air conditioning system.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A polyhydroxyamide of the following formula I or formula II:
42
in which:
a0 or 1, with the proviso that, if a is 0, c must be 1,
b0-100,
c0-50, with the proviso that, if c is 0, a must be 1,
d1-100,
e0-100,
f0-100,
g0-50,
h0-100,
k0-100,
m0-100,
n0-50,
p0 or 1;
43
in which:
q1-100,
r1-100,
s0-100,
t0-100,
u0-100,
v0-50,
w0-100,
x0-100,
y0-100,
z0-50;
X, independently of one another, are:
44
in which R1 in each case may be identical to or different from R2, and 0-100 and 0-100, and not simultaneously being 0;
R1 and R2 are:
substituted or unsubstituted alkylene, arylene or cycloalkylene groups;
Q is O, S andor NH;
A1 andor A2, where A1 may be identical to or different from A2 if A1 andor A2 are bonded to Q or NH, are:
H, substituted or unsubstituted alkylcarbonyl, alkenylcarbonyl, cycloalkenylcarbonyl, arylcarbonyl, aralkylcarbonyl, aralkenylcarbonyl or aralkynylcarbonyl, it being possible for the carbonyl group to be bonded to the aromatic or to the alkyl or alkenyl or alkynyl group;
A1 andor A2, where A1 may be identical to or different from A2 if A1 andor A2 are bonded to CO, are:
hydroxyl, substituted or unsubstituted alkoxy, alkenyloxy, aryloxy, cycloalkenyloxy, amino, alkylamino, alkenylamino, arylamino, arylalkenyloxy, arylalkylamino;
A3 is:
H, substituted or unsubstituted alkylcarbonyl, alkenylcarbonyl, cycloalkenylcarbonyl, arylcarbonyl, aralkylcarbonyl, aralkenylcarbonyl or aralkynylcarbonyl, it being possible for the carbonyl group to be bonded to the aromatic or to the alkyl or alkenyl or alkynyl group;
Y1 and Y2, where Y1 may be identical to or different from Y2, are:
substituted or unsubstituted aryl, a substituted or unsubstituted polynuclear aromatic hydrocarbon compound, substituted or unsubstituted alkyl, alkenyl, alkynyl, aryl or aralkyl, aralkenyl, aralkynyl;
Z1 and Z2, where Z1 may be identical to or different from Z2, are:
aryl, aralkyl, aralkenyl, aralkynyl, heteroaryl or a polynuclear aromatic hydrocarbon compound.
2. The polyhydroxyamide as claimed in claim 1, characterized in that, in formula I, b0-20, c0-10, d4-40, e0-20, f0-20, g0-10, h0-20, k0-20, m0-20 andor n0-10;
and, in formula II, q3-40, r1-40, s0-40, t0-20, u0-20, v0-10, w0-20, x0-20, y0-20 andor z0-10.
3. The polyhydroxyamide as claimed in claim 1 or 2, characterized in that, in X, 0-10 andor 0-10.
4. The polyhydroxyamide as claimed in one or more of the preceding claims, characterized in that R1 andor R2 have the following meaning:
(CH2)102
1-20
45
where 0-20, 0-20, and R3 and R4: H, (CH2)CH3; 0-10 or OH, and R3 and R4 cannot simultaneously be OH
46
5. The polyhydroxyamide as claimed in one or more of the preceding claims, characterized in that Q is O andor NH.
6. The polyhydroxyamide as claimed in one or more of the preceding claims, characterized in that A1 andor A2, if A1 andor A2 are bonded to Q or NH, and A3 have the following meaning:
47
in which 0-10 and WCN, C(CH3)3, (CH2)CH3, (CF2)CF3, O(CH2)100 CH3, O(CF2)CF3,
CHCH2, CCH or
48
7. The polyhydroxyamide as claimed in one or more of the preceding claims, characterized in that, if A1 andor A2 are bonded to CO, A1 andor A2 have the following meaning:
49
in which 0-10 and WCN, C(CH3)3, (CH2)CH3, (CF2)CF3, O(CH2)CH3, O(CF2)CF3,
CHCH2, CCH or
50
8. The polyhydroxyamide as claimed in one or more of the preceding claims, characterized in that Y1 and Y2 have the following meaning, it being possible for Y1 to be identical to or different from Y2:
51
(CH2)R6(CH2)
(1-10)
if R6CH2, then 0-10
9. The polyhydroxyamide as claimed in one or more of the preceding claims, characterized in that R5 is H, CN, C (CH3)3, (CH2)CH3, (CF2)CF3, O(CH2)CH3, O(CF2)CF3 andor is:
52
in which 0-10 and WCN, C(CH3)3, (CH2)CH3, (CF2)CF3, O(CH2)CH3, O(CF2)CF3,
CHCH2, CCH or
53
10. The polyhydroxyamide as claimed in one or more of the preceding claims, characterized in that R6 is O, CO, NR7, S, SO2, S2, CH2 andor is:
CC CC
54
11. The polyhydroxyamide as claimed in one or more of the preceding claims, characterized in that R7 is H andor is:
55
12. The polyhydroxyamide as claimed in one or more of the preceding claims, characterized in that R8 is an alkyl radical having 1 to 10 carbon atoms or an aryl radical.
13. The polyhydroxyamide as claimed in one or more of the preceding claims, characterized in that Z1 and Z2, where Z1 may be identical to or different from Z2, are:
56
14. A polybenzoxazole, characterized in that it was obtained by cyclization of hydroxyamide units of a polyhydroxyamide as claimed in one or more of the preceding claims.
15. An electronic component which has a coat of a polybenzoxazole as claimed in claim 14.
16. The electronic component as claimed in claim 15, characterized in that it is a memory chip, logic chip, flip chip, flash memory, multichip module, circuit board, microprocessor or embedded DRAM.
17. A process for the preparation of polyhydroxyamides as claimed in one or more of claims 1-13, characterized in that a compound of the formula Z1(NH2)2(OH)2 andor Z2(NH2)2(OH)2 is reacted with a compound of the formula Y1(COCl)2 andor Y2(COCl)2, the product obtained is then reacted with a compound of the formula X(QOH)2 or X(QNH2)2, and then optionally the product obtained is reacted with a precursor compound for formula A1, A2 andor A3,
Z1, Z2, Y1, Y2, A1, A2, A3 and X being defined as in claims 1-13.
18. A process for the preparation of polybenzoxazoles, characterized in that polyhydroxyamides as claimed in one or more of claims 1-13 are subjected to a thermal treatment.
19. The process as claimed in claim 18, characterized in that the thermal treatment is effected at 250-450 C., preferably at 300-400 C., most preferably at 300-350 C.
20. The process as claimed in claim 18 or 19, characterized in that the thermal treatment is effected for 0.5-3 hours, preferably 1-3 hours, most preferably 1-2 hours.
21. A process for coating substrates, characterized in that polyhydroxyamides as claimed in one or more of claims 1-13 are applied to the substrate to be coated, and the coated substrate is then heated in order to form a polybenzoxazole coat on the substrate.
22. The process as claimed in claim 21, characterized in that the polyhydroxyamides are dissolved in an organic solvent before application to the substrate.
23. The process as claimed in claim 22, characterized in that the organic solvent is acetone, cyclohexanone, diethylene glycol monoethyl ether, diethylene glycol diethyl ether, N-methylpyrrolidone, -butyrolactone, ethyl lactate, tetrahydrofuran, methyl acetate or a mixture thereof.
24. The process as claimed in claim 21, 22 or 23, characterized in that the polyhydroxyamide is applied to the substrate and a spin-coating treatment is then carried out.
25. The process as claimed in one or more of claims 21-24, characterized in that the substrate is a silica, silicon nitride, titanium, titanium nitride, tantalum or tantalum nitride surface.
26. The process as claimed in one or more of claims 21-25, characterized in that the substrate is part of an electronic component.
27. The use of a polybenzoxazole as claimed in claim 14 as an insulating coat andor protective coat for electronic components.
28. A composition comprising a polyhydroxyamide as claimed in one or more of claims 1-13 and an organic solvent, preferably acetone, cyclohexanone, diethylene glycol monoethyl ether, diethylene glycol diethyl ether, N-methylpyrrolidone, -butyrolactone, ethyl lactate, tetrahydrofuran, methyl acetate or a mixture thereof.
29. The composition as claimed in claim 28, characterized in that it has a polyhydroxyamide content, based on the total composition, of 10-50% by weight, preferably 20-40% by weight, more preferably about 20% by weight.