Author: claimsbot

1. An actuator for use in a fluid distribution system for the distribution of fluid in at least one selected pattern, the actuator comprising:
a. an engagement mechanism to engage at least one blade of the fluid distribution system to position or reposition the blade; and
b. a shape memory alloy wire connected to the engagement mechanism and capable of causing the engagement mechanism to change position,
wherein the shape memory alloy wire is capable of expanding or contracting based on the temperature of the fluid in the distribution system, such that when the shape memory alloy wire contracts, the engagement mechanism is moved to a first position and when the shape memory alloy wire expands, the engagement mechanism is moved to a second position.
2. The actuator of claim 1, further comprising a bias apparatus in cooperation with the engagement mechanism to cause the engagement mechanism to return to the second position when the shape memory wire expands.
3. The actuator of claim 2, wherein the bias apparatus comprises a spring in cooperation with the engagement mechanism.
4. The actuator of claim 1, wherein the blade of the fluid distribution system is a straight blade.
5. The actuator of claim 1, wherein the blade of the fluid distribution system is a curved blade.
6. The actuator of claim 1, wherein the shape memory alloy wire expands when the temperature of the fluid in the distribution system decreases below a first selected temperature.
7. The actuator of claim 1, wherein the shape memory alloy wire contracts when the temperature of the fluid in the distribution system increases above a second selected temperature.
8. The actuator of claim 1, wherein the shape memory alloy wire comprises nitinol, copperzincaluminum, copperaluminumnickel, silvercadmium, goldcadmium, coppertin, copperzinc, indiumtitanium, nickelaluminum, ironplatinum, manganesecopper, ironmanganesesilicon, or other nickeltitanium alloys.
9. The actuator of claim 8, wherein the shape memory alloy wire comprises nitinol.
10. The actuator of claim 1, further comprising means for causing the engagement mechanism to move when the shape memory alloy wire expands.
11. A diffuser for use in a fluid distribution system for the distribution of fluid in. at least one selected pattern, comprising:
a. at least one blade for directing the flow of fluid; and
b. at least one shape memory alloy wire in direct or indirect cooperation with the blade and capable of causing the blade to change position in response to a temperature change in the fluid.
12. The diffuser of claim 11, further comprising at least one actuator, the actuator comprising an engagement mechanism for engaging the blade to position or reposition the blade; wherein the shape memory alloy wire is connected to the engagement mechanism and is capable of causing the engagement mechanism to change position.
13. The diffuser of claim 12, wherein the shape memory alloy wire is capable of expanding or contracting based on the temperature of the fluid in the distribution system, such that when the shape memory alloy wire contracts, the engagement mechanism is moved to a first position which moves the blade to a corresponding first position, and when the shape memory alloy wire expands, the engagement mechanism is moved to a second position which moves the blade to a corresponding second position.
14. The diffuser of claim 13, further comprising a bias apparatus in cooperation with the engagement mechanism to cause the engagement mechanism to return to the second position when the shape memory wire expands.
15. The diffuser of claim 14, wherein the bias apparatus comprises a spring in cooperation with the engagement mechanism.
16. The diffuser of claim 11, wherein the shape memory alloy wire is connected directly to the blade.
17. A fluid distribution system for distributing fluid into a space, comprising a diffuser comprising at least one blade and at least one actuator, the actuator comprising:
a. an engagement mechanism for engaging the blade to position or reposition the blade; and
b. a shape memory alloy wire connected to the engagement mechanism and capable of causing the engagement mechanism to change position.
18. The system of claim 17, wherein the shape memory alloy wire is capable of expanding or contracting based on the temperature of the fluid in the distribution system, such that when the shape memory alloy wire contracts, the engagement mechanism is moved to a first position which moves the blade to a corresponding first position, and when the shape memory alloy wire expands, the engagement mechanism is moved to a second position which moves the blade to a corresponding second position.
19. An actuator for use in a fluid distribution system for the distribution of fluid, the actuator comprising:
a. an engagement mechanism to engage at least one blade of the fluid distribution system to position or reposition the blade; and
b. means for automatically changing the position of the blade based on the temperature of the fluid without manual adjustment of the position of the blade and without an outside power source providing power to sense temperature of the fluid or to change the position of the blade.
20. The actuator of claim 19, wherein the means for automatically changing the position of the blade comprises means to cause a non-gradual change in the position of the blade.
21. The actuator of claim 19, wherein the means for automatically changing the position of the blade comprises a shape memory alloy wire connected to the blade or to the engagement mechanism and capable of causing the blade to change position.
22. A method of automatically switching a diffuser between vertical fluid flow pattern and horizontal fluid flow pattern, comprising:
a. having blade position of the diffuser biased to one of the vertical fluid flow pattern or the horizontal fluid flow pattern;
b. sensing the temperature of the fluid with a shape memory alloy wire;
c. actuating a change of blade position to the opposite of the bias position by the shape memory alloy wire in response to the temperature of the fluid.
23. The method of claim 22, further comprising actuating a change of blade position back to the bias position in response to the temperature of the fluid.
24. The method of claim 22, wherein actuating a change of blade position comprises changing the blade position non-gradually.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. An image forming apparatus comprising:
an image bearing member configured to carry and convey an image;
a first image forming unit configured to form a first image in a first color on the image bearing member;
a second image forming unit configured to form a second image in a second color different from the first color on the image bearing member;
a measurement unit configured to detect positions of measurement images formed on the image bearing member by the first image forming unit and the second image forming unit;
a correction unit configured to correct a position of the first image and a position of the second image based on the positions detected by the measurement unit;
a detection unit configured to detect a temperature of the image forming apparatus; and
a determining unit configured to determine timing for causing the first image forming unit and the second image forming unit to form the measurement images based on the temperature detected by the detection unit,
wherein the timing determined by the determining unit includes:
a first timing for the first image forming unit and the second image forming unit to form the measurement images prior to the first image forming unit and the second image forming unit forming an image according to a print instruction, and
a second timing for the first image forming unit and the second image forming unit to form the measurement images after the first image forming unit and the second image forming unit formed the image according to the print instruction.
2. The image forming apparatus according to claim 1,
wherein the determining unit determines the timing based on a difference between a previous temperature detected by the detection unit when the positions are detected by the measurement unit and a current temperature detected by the detection unit.
3. The image forming apparatus according to claim 2,
wherein, in a case where the difference is greater than a first threshold value and smaller than a second threshold value, the second timing is determined by the determining unit, and the first and second image forming units form a second measurement image,
wherein, in a case where the difference is greater than the second threshold value and smaller than a third threshold value, the first timing is determined by the determining unit, and the first and second image forming units form a first measurement image,
wherein, in a case where the difference is greater than the third threshold value, the first timing is determined by the determining unit, and the first and second image forming units form the second measurement image, and
wherein time taken for the first measurement image on the image bearing member to pass a measurement region of the measurement unit is shorter than time taken for the second measurement image on the image bearing member to pass the measurement region.
4. The image forming apparatus according to claim 3,
wherein the correction unit corrects a position of the first image and a position of the second image in a conveyance direction of the image bearing member based on the detected positions of the first measurement image, and
wherein the correction unit corrects a position of the first image and a position of the second image in a direction orthogonal to the conveyance direction of the image bearing member.
5. The image forming apparatus according to claim 2,
wherein the determining unit does not form the measurement images in a case where the difference is smaller than the first threshold value.
6. The image forming apparatus according to claim 3,
wherein, in a case where the difference is greater than the first threshold value and smaller than the second threshold value, the second timing is determined by the determining unit, and
wherein, in a case where the difference is greater than the second threshold value, the first timing is determined by the determining unit.

1. An induction heater, comprising:
an inverter body having an inlet formed in a bottom surface thereof;
an inverter circuit board provided within the inverter body;
an inverter heat dissipater mounted in the inverter body and contacting the bottom surface of the inverter body such that an inlet of the inverter heat dissipater is connected to the inlet of the inverter body, wherein the inverter heat dissipater is configured to blow air to a front and a rear of the inverter circuit board, the inverter heat dissipater comprising:
an inverter heat dissipation blower configured to blow air into at least one of a first inverter heat dissipation space formed between the inverter body and the inverter circuit board or a second inverter heat dissipation space formed between the inverter body and the inverter circuit board; and
an inverter guide provided between the inverter body and the inverter circuit board and configured to guide air blown by the inverter heat dissipation blower to the inverter circuit board; and

a heat sink provided on a top surface of the inverter circuit board, wherein the heat sink dissipates heat from the inverter circuit board, and wherein an outlet divider divides an outlet of the inverter heat dissipation blower so that more air is blown into the first inverter heat dissipation space than into the second inverter heat dissipation space, and
wherein the inverter guide comprises a plurality of guide ribs each having an end portion thereof that is closest to the heat sink bent toward the heat sink.
2. The induction heater of claim 1, wherein the first inverter heat dissipation space is provided between a top surface of the inverter circuit board and the inverter body, and wherein the second inverter heat dissipation space is provided between a bottom surface of the inverter circuit board and the inverter body.
3. The induction heater of claim 2, wherein a first portion of an outlet of the inverter heat dissipation blower is configured to blow air into the first inverter heat dissipation space, and a second portion of the outlet of the inverter heat dissipation blower is configured to blow air into the second inverter heat dissipation space.
4. The induction heater of claim 3, wherein the outlet divider divides the outlet of the inverter heat dissipation blower into the first and second portions.
5. The induction heater of claim 2, wherein the inverter body comprises a plurality of outlets configured to guide air blown by the inverter heat dissipation blower out of the inverter body, the plurality of outlets comprising a first inverter body outlet configured to discharge air from the first inverter heat dissipation space and a second inverter body outlet configured to discharge air from the second inverter heat dissipation space.
6. The induction heater of claim 2, wherein the inverter body comprises an outlet configured to guide air blown by the inverter heat dissipation blower out of the inverter body, the outlet comprising a first portion configured to discharge air from the first inverter heat dissipation space and a second portion configured to discharge air from the second inverter heat dissipation space.
7. The induction heater of claim 2, wherein the inverter body has a substantially rectangular inner space, and the inverter heat dissipation blower is provided at a corner of the rectangular inner space of the inverter body.
8. The induction heater of claim 2, wherein the inverter body comprises:
an outlet provided on a side of the inverter body, wherein the inlet of the inverter body is configured to guide air blown by the inverter heat dissipation blower into the inverter body and the outlet of the inverter body is configured to guide air blown by the inverter heat dissipation blower to an outside of the inverter body.
9. The induction heater of claim 1, wherein the inverter guide is configured to support the inverter circuit board.
10. The induction heater of claim 1, wherein the inverter circuit board comprises both a first inverter circuit board and a second inverter circuit board provided within the inverter body, and the wherein the heat sink comprises:
a first heat sink provided on the first inverter circuit board and configured to dissipate heat from the first inverter circuit board; and
a second heat sink provided on the second inverter circuit board and configured to dissipate heat from the second inverter circuit board, the first and second heat sinks being provided in a space between the first inverter circuit board and the second inverter circuit board proximate each other.
11. The induction heater of claim 10, wherein the inverter heat dissipation blower comprises:
a first inverter heat dissipation blower configured to blow air to the first inverter circuit board, wherein the first inverter heat dissipation blower corresponds to the first heat sink; and
a second inverter heat dissipation blower configured to blow air to the second inverter circuit board, wherein the second inverter heat dissipation blower corresponds to the second heat sink.
12. The induction heater of claim 11, wherein the inverter guide comprises:
a first inverter guide configured to guide the air blown by the first inverter heat dissipation blower to the first inverter circuit board, but not to the first heat sink; and
a second inverter guide configured to guide the air blown by the second inverter heat dissipation blower to the second inverter circuit board, but not to the second heat sink.
13. The induction heater of claim 10, wherein the inverter heat dissipation blower is configured to blow air to the first and second inverter circuit boards, wherein the inverter heat dissipation blower corresponds to both the first and second heat sinks.
14. The induction heater of claim 1, further comprising one or more induction coils provided on the inverter body, wherein the induction coils generate an induction field.
15. An induction heater, comprising:
an inverter circuit board;
an inverter body which defines a space configured to receive the inverter circuit board, the inverter body having an inlet formed in a bottom surface thereof;
a heat sink provided on a top surface of the inverter circuit board, wherein the heat sink dissipates heat from the inverter circuit board, and wherein an outlet divider divides an outlet of an inverter heat dissipation blower so that more air is blown into a first inverter heat dissipation space than into a second inverter heat dissipation space, the first and second inverter heat dissipation spaces each being formed between the inverter circuit board and the inverter body; and
an inverter heat dissipater mounted in the inverter body and contacting the bottom surface of the inverter body such that an inlet of the inverter heat dissipater is connected to the inlet of the inverter body, wherein the inverter heat dissipater is configured to blow both a main air stream to a first portion of the inverter circuit board and a sub-air stream to a second portion of the inverter circuit board,
wherein the inverter heat dissipater includes an inverter guide provided between the inverter body and the inverter circuit board and configured to guide air blown by an inverter heat dissipation blower to the inverter circuit board, and
wherein the inverter guide comprises a plurality of guide ribs each having an end thereof that is closest to the heat sink bent toward the heat sink.
16. The induction heater of claim 15, wherein the first portion of the inverter circuit board comprises a front of the inverter circuit board, and the second portion of the inverter circuit board comprises a rear of the inverter circuit board.
17. The induction heater of claim 16, wherein the inverter heat dissipater is configured to support the inverter circuit board.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A support element for a semiconductor device, the support element including at least one surface having a subregion for receiving the semiconductor device, wherein the support element comprises at least one fluid-tight boundary which is formed as an elevation arranged on the surface and at least partly surrounds the subregion of the surface, and wherein the support element further comprises means for analyzing at least one of chemical and organic substances arranged within the fluid-tight boundary.
2. The support element as claimed in claim 1, wherein the fluid-tight boundary is formed as a closed frame arranged on the surface.
3. The support element as claimed in claim 1, wherein the fluid-tight boundary is formed in a U-shaped manner.
4. The support element as claimed in claim 1, wherein the fluid-tight boundary comprises a polymer applied to the surface of the support element.
5. The support element as claimed in claim 1, further comprising a fluid introduced within the fluid-tight boundary.
6. The support element as claimed in claim 1, further comprising at least one contacting pad arranged on the surface of the support element outside the subregion surrounded by the fluid-tight boundary.
7. The support element as claimed in claim 1, further comprising a plastic casing encapsulating at least a portion of the support element located outside the subregion surrounded by the fluid-tight boundary.
8. The support element as claimed in claim 7, wherein the plastic casing is non-transparent.
9. The support element as claimed in claim 1, further comprising a substantially opaque fluid arranged within the fluid-tight boundary.
10. The support element as claimed in claim 1, wherein the support element comprises one of a semiconductor substrate, a semiconductor chip, and a semiconductor wafer.
11. A semiconductor component comprising:
a support element for supporting a semiconductor device, the support element including at least one surface having a subregion for receiving the semiconductor device, and at least one fluid-tight boundary which is formed as an elevation arranged on the surface and at least partly surrounds the subregion of the surface,
wherein the semiconductor device is arranged in the subregion of the surface of the support element, wherein an area covered by the semiconductor device is smaller than the subregion, such that the semiconductor device is arranged completely within the fluid-tight boundary, and wherein the support element further comprises at least one contacting pad arranged on the surface of the support element outside the subregion and within the fluid-tight boundary.
12. The semiconductor component as claimed in claim 11, wherein the semiconductor device is adhesively bonded to the surface of the support element by an adhesive fluid arranged within the fluid-tight boundary.
13. The semiconductor component as claimed in claim 11, wherein the semiconductor component is substantially surrounded by plastic.
14. The semiconductor component as claimed in claim 13, wherein the plastic is substantially non-transparent.
15. The semiconductor component as claimed in claim 11, wherein a substantially opaque fluid is arranged within the fluid-tight boundary.
16. The semiconductor component as claimed in claim 11, wherein the support element comprises one of a semiconductor chip, a semiconductor substrate, and a semiconductor wafer.
17. A semiconductor component comprising:
a support element for supporting a semiconductor device, the support element including a surface having a subregion for receiving the semiconductor device, and a fluid-tight boundary arranged on the surface and at least partly surrounding the subregion of the surface, wherein the semiconductor device is arranged in the subregion of the surface of the support element, and wherein the semiconductor device comprises a semiconductor laser arranged to emit a beam through the support element, wherein an intermediate space between the semiconductor laser and the support element is filled with an immersion adhesive.
18. A semiconductor component comprising:
a support element for supporting a semiconductor device, the support element including a surface having a subregion for receiving the semiconductor device, and a fluid-tight boundary which is arranged on the surface and at least partly surrounds the subregion of the surface, wherein the semiconductor device is arranged in the subregion of the surface of the support element such that it rests substantially on the fluid-tight boundary, and wherein a cavity which is closed off in a substantially fluid-tight manner is formed within the fluid-tight boundary between the surface of the support element and the semiconductor device, wherein the semiconductor device has at least one opening through which fluids can flow into the cavity andor out of the cavity.
19. The semiconductor component as claimed in claim 18, wherein at least one of the semiconductor device and the support element comprises means for performing fluid analysis.