1. A subterranean tool configured to operate at elevated temperatures, in excess of about 115 degrees Celsius, downhole in a well traversing a formation, comprising:
a downhole telemetry cartridge configured or designed for downhole use at temperatures in excess of about 115 degrees Celsius; and
at least one downhole light source optically connected to the telemetry cartridge, wherein
the light source comprises one or more remotely pumped lasers, the downhole remotely pumped lasers being optically connected, via one or more optical fibers, to a surface pump laser.
2. A subterranean tool according to claim 1, wherein
the downhole remotely pumped lasers comprise a waveguide laser.
3. A subterranean tool according to claim 1, further comprising:
a downhole optical sensor cartridge comprising an optical sensor.
4. A subterranean tool according to claim 1, wherein
the optical fiber comprises one or more of a single-mode optical fiber and a multi-mode optical fiber, the optical fiber transmitting data to and from downhole electronics and a surface data acquisition system.
5. A subterranean tool according to claim 1, wherein
the surface pump laser has a wavelength in the range of about 1480 nm.
6. A subterranean tool according to claim 1, wherein
the one or more remotely pumped lasers comprise a rare earth dopant having erbium (Er) ions.
7. A subterranean tool according to claim 6, wherein
the surface pump laser has a wavelength in the range of about 980 nm.
8. A subterranean tool according to claim 1, wherein
the one or more remotely pumped lasers have a modulated laser output in the range of about 1530-1580 nm.
9. A subterranean tool according to claim 1, wherein
the one or more remotely pumped lasers comprise neodymium ions, the surface pump laser has a wavelength in the range of about 880 nm, and the one or more remotely pumped lasers emit in the range of about 1055-1080 nm.
10. A subterranean tool according to claim 1, wherein
the output of the remotely pumped lasers is modulated to encode for downhole data.
11. A subterranean tool according to claim 1, wherein
at least one of the frequency, intensity, phase and state of polarization of the output of the remotely pumped lasers is modulated to encode for downhole data.
12. A subterranean tool according to claim 1, wherein
the one or more remotely pumped laser is coated with a sensing material that is responsive to change in a magnetic field based on measurements of downhole parameters.
13. A subterranean tool according to claim 12, wherein
the sensing material coating comprises a magno-strictive material.
14. A subterranean tool according to claim 1, wherein
the subterranean tool comprises a plurality of downhole shuttles.
15. A subterranean tool according to claim 14, wherein
the subterranean tool comprises a plurality of downhole remotely pumped lasers structured and arranged in the plurality of shuttles;
each downhole remotely pumped laser being configured or designed to emit at a wavelength that is different from the wavelength of other lasers of the plurality of lasers.
16. A subterranean tool according to claim 15, wherein
at least one optical fiber optically connects more than one remotely pumped lasers to corresponding pump lasers at the surface;
each surface pump laser being configured or designed to emit at a wavelength that is different from the wavelength of other surface pump lasers.
17. A downhole telemetry system, comprising:
a surface data acquisition unit comprising a surface telemetry unit;
a downhole optical telemetry cartridge comprising a downhole electro-optic unit;
at least one fiber optic interface between the surface data acquisition unit and the downhole optical telemetry cartridge;
a downhole tool; and
a downhole electrical tool bus operatively connected between the downhole electro-optic unit and the downhole tool, wherein
the downhole electro-optic unit comprises:
a remotely pumped laser optically connected, via an optical fiber, to a surface pump laser,
the downhole optical telemetry cartridge being configured or designed to operate downhole, within a borehole, at temperatures in excess of about 115 degrees Celsius.
18. A subterranean tool configured to operate at elevated temperatures, in excess of about 115 degrees Celsius, downhole in a well traversing a formation, comprising:
a downhole telemetry cartridge configured or designed for downhole use at temperatures in excess of about 115 degrees Celsius;
at least one downhole light source optically connected to the telemetry cartridge, wherein
the light source comprises one or more remotely pumped lasers, the downhole remotely pumped lasers being optically connected, via at least one optical fiber, to a surface pump laser; and
at least one sensor or transducer configured or designed for sensing parameters of the formation and changing a predetermined characteristic of the one or more remotely pumped lasers based on the sensed parameters.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An implantable device comprising:
a substrate at least a portion of which is electrically conductive;
a flexible assembly at least a portion of which is electrically conductive; and
at least one deposited platinum rivet that bonds the substrate and the flexible assembly.
2. The implantable device according to claim 1, wherein the platinum rivet is greater than one micron thick.
3. The implantable device according to claim 1, wherein the platinum rivet has a Vickers hardness greater than ten.
4. The implantable device according to claim 1, wherein a biocompatible adhesive further bonds the substrate and the flexible assembly.
5. The implantable device according to claim 1, wherein the deposited rivet is formed by electrochemical deposition.
6. The implantable device according to claim 1, wherein the flexible assembly comprises polyimide.
7. The implantable device according to claim 1, wherein the substrate comprises a biocompatible ceramic.
8. The implantable device according to claim 7, wherein the biocompatible ceramic comprises alumina.
9. The implantable device according to claim 1, wherein the substrate is rigid.
10. The implantable device according to claim 1, wherein the substrate is an electrically insulated integrated circuit.
11. The implantable device according to claim 1, wherein the flexible assembly is a thin film integrated circuit.
12. The implantable device according to claim 1, wherein at least a part of the substrate forms an electronics control unit; and the electronics control unit encapsulates electronics.
13. The implantable device according to claim 1, wherein the platinum rivet does not contain lead.
14. The implantable device according to claim 1, wherein the platinum layer consists essentially of pure platinum.