Author: claimsbot

What is claimed is:

1. A thermally protected electrical power distribution circuit comprising:
an electrical power conductor surrounded by insulation, said insulation having a maximum safe temperature rating of less than 150 F.; and
a thermal tracking plug coupled to said wire proximate said insulation, said thermal tracking plug having an electrical plug prong configured for insertion in an electrical power receptacle, a spring, and a joinder element holding said spring against one of said electrical power conductor and said electrical plug prong so that said spring, said electrical plug prong and said electrical power conductor are electrically and thermally in series, said joinder element having a liquidus temperature less than 150 F.
2. A circuit as claimed in claim 1 wherein:
said electrical power conductor is a first electrical power conductor, said spring is a first spring, said electrical plug prong is a first electrical plug prong, and said joinder element is a first joinder element;
said circuit additionally comprises a second electrical power conductor surrounded by insulation having a maximum safe temperature rating of less than 150 F., and said second electrical power conductor being associated with said first electrical power conductor in a circuit;
said thermal tracking plug additionally comprises a second an electrical plug prong configured for insertion in an electrical power receptacle, a second spring, and a second joinder element holding said spring against one of said second electrical power conductor and said second electrical plug prong so that said second spring, said second electrical plug prong and said second electrical power conductor are electrically and thermally in series, said second joinder element having a liquidus temperature less than 150 F.
3. A circuit as claimed in claim 1 wherein:
said electrical power conductor is of a gauge and composition configured to exhibit a predetermined temperature increase when conducting a predetermined amount of electrical current;
said spring is of a composition and is dimensioned so that said spring exhibits approximately said predetermined temperature increase when conducting said predetermined amount of electrical current; and
said joinder element is of a composition and is dimensioned so that said joinder element exhibits approximately said predetermined temperature increase when conducting said predetermined amount of current.
4. A circuit as claimed in claim 1 wherein said joinder element has a solidus temperature greater than 133 F.
5. A circuit as claimed in claim 1 wherein said joinder element comprises a composition of greater than 40% bismuth, less than 30% lead, and less than 15% tin.
6. A circuit as claimed in claim 1 wherein:
said electrical power conductor and said joinder element exhibit first and second conductivities, respectively, with said second conductivity being less than 20% of said first conductivity;
said electrical power conductor is of a gauge which causes said electrical power conductor to exhibit a predetermined temperature increase when conducting a predetermined amount of electrical current; and
said joinder element is dimensioned to exhibit substantially said predetermined temperature increase when conducting said predetermined amount of electrical current.
7. A circuit as claimed in claim 1 wherein said spring comprises an alloy which is greater than 0.25% beryllium and between 0.45% and 0.65% combined nickel, cobalt and iron.
8. A circuit as claimed in claim 1 wherein:
said electrical power conductor and said spring exhibit first and second conductivities, respectively, with said second conductivity being less than 70% of said first conductivity;
said electrical power conductor is of a gauge which causes said electrical power conductor to exhibit a predetermined temperature increase when conducting a predetermined amount of electrical current; and
said spring is dimensioned to exhibit substantially said predetermined temperature increase when conducting said predetermined amount of electrical current.
9. A thermally protected electrical power distribution circuit comprising:
an electrical power conductor surrounded by insulation, said electrical power conductor having a predetermined maximum safe temperature rating; and
a thermal tracking plug coupled to said wire proximate said insulation, said thermal tracking plug having an electrical plug prong configured for insertion in an electrical power receptacle, a spring electrically and thermally coupled to said electrical plug prong, and a joinder element holding said spring against said electrical power conductor, said joinder element having a melting temperature approximately equal to said predetermined maximum safe temperature rating.
10. A circuit as claimed in claim 9 wherein:
said electrical power conductor is a first electrical power conductor, said spring is a first spring, said electrical plug prong is a first electrical plug prong, and said joinder element is a first joinder element;
said circuit additionally comprises a second electrical power conductor surrounded by insulation having substantially said predetermined maximum safe temperature rating, and said second electrical power conductor being associated with said first electrical power conductor in a circuit; and
said thermal tracking plug additionally comprises a second electrical plug prong configured for insertion in an electrical power receptacle, a second spring electrically and thermally coupled to said second electrical plug prong, and a second joinder element holding said second spring against said second electrical power conductor, said second joinder element having a melting temperature approximately equal to said predetermined maximum safe temperature rating.
11. A circuit as claimed in claim 9 wherein:
said electrical power conductor is of a gauge and composition configured to exhibit a predetermined temperature increase when conducting a predetermined amount of electrical current;
said spring is of a composition and is dimensioned so that said spring exhibits approximately said predetermined temperature increase when conducting said predetermined amount of electrical current; and
said joinder element is of a composition and is dimensioned so that said joinder element exhibits approximately said predetermined temperature increase when conducting said predetermined amount of current.
12. A circuit as claimed in claim 9 wherein said joinder element has a liquidus temperature less than 150 F. and a solidus temperature greater than 133 F.
13. A circuit as claimed in claim 9 wherein said joinder element comprises a composition of greater than 40% bismuth, less than 30% lead, and less than 15% tin.
14. A circuit as claimed in claim 9 wherein:
said electrical power conductor and said joinder element exhibit first and second conductivities, respectively, with said second conductivity being less than 20% of said first conductivity;
said electrical power conductor is of a gauge which causes said electrical power conductor to exhibit a predetermined temperature increase when conducting a predetermined amount of electrical current; and
said joinder element is dimensioned to exhibit substantially said predetermined temperature increase when conducting said predetermined amount of electrical current.
15. A circuit as claimed in claim 9 wherein said spring comprises an alloy which is greater than 0.25% beryllium and between 0.45% and 0.65% combined nickel, cobalt and iron.
16. A circuit as claimed in claim 9 wherein:
said electrical power conductor and said spring exhibit first and second conductivities, respectively, with said second conductivity being less than 70% of said first conductivity;
said electrical power conductor is of a gauge which causes said electrical power conductor to exhibit a predetermined temperature increase when conducting a predetermined amount of electrical current; and
said spring is dimensioned to exhibit substantially said predetermined temperature increase when conducting said predetermined amount of electrical current.
17. A thermally protected electrical power distribution circuit comprising:
an electrical power conductor surrounded by insulation having a predetermined maximum safe temperature rating, said electrical power conductor being of a gauge and composition configured to exhibit a predetermined temperature increase when conducting a predetermined amount of electrical current;
a spring of a composition and dimensioned so that said spring exhibits approximately said predetermined temperature increase when conducting said predetermined amount of electrical current; and
a joinder element holding said spring against said electrical power conductor, said joinder element being of a composition and being dimensioned so that said joinder element exhibits approximately said predetermined temperature increase when conducting said predetermined amount of current.
18. A circuit as claimed in claim 17 additionally comprising:
a plug body surrounding a portion of said conductor, said spring, and said joinder element; and
a plug prong electrically and thermally coupled to said spring, said plug prong extending outside said plug body and being configured for insertion in an electrical power receptacle.
19. A circuit as claimed in claim 17 wherein said joinder element has a liquidus temperature less than 150 F. and a solidus temperature greater than 133 F.
20. A circuit as claimed in claim 17 wherein:
said electrical power conductor and said joinder element exhibit first and second conductivities, respectively, with said second conductivity being less than 20% of said first conductivity;
said electrical power conductor is of a gauge which causes said electrical power conductor to exhibit a predetermined temperature increase when conducting a predetermined amount of electrical current; and
said joinder element is dimensioned to exhibit substantially said predetermined temperature increase when conducting said predetermined amount of electrical current.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A rectifier circuit comprising:
a diode;
a first depletion-mode transistor connected to a cathode of said diode;
at least one second depletion-mode transistor in parallel with said first depletion-Mode transistor and configured to supply a pre-determined current to said cathode of said diode when said rectifier circuit is in reverse blocking mode;
wherein a sum of a leakage current of said first depletion-mode transistor and said pre-determined current of said at least one second depletion-mode transistor is greater than a leakage current of said diode in said reverse blocking mode.
2. The rectifier circuit of claim 1, wherein a pinch off voltage of said at least one second depletion-mode transistor is more negative than a pinch off voltage of said first depletion-mode transistor.
3. The rectifier circuit of claim 1, wherein said at least one second depletion-mode transistor is configured to supply said pre-determined current while said first depletion-mode transistor is OFF.
4. The rectifier circuit of claim 1; wherein said pre-determined current is greater than said leakage current of said first depletion-mode transistor.
5. The rectifier circuit of claim 1, wherein said first depletion-mode transistor has a larger gate periphery than said at least one second depletion-mode transistor.
6. The rectifier circuit of claim 1, wherein said first depletion-mode transistor and said at least one second depletion-mode transistor have a common substrate.
7. The rectifier circuit of claim 6, wherein said common substrate comprises silicon.
8. The rectifier circuit of claim 1, wherein said first depletion-mode transistor, said at least one second depletion-mode transistor and said diode have a common substrate.
9. The rectifier circuit of claim 1, wherein said diode is in parallel with at least one enhancement-mode transistor.
10. The rectifier circuit of claim 1, wherein said diode is a body diode of an enhancement-mode transistor.
11. The rectifier circuit of claim 10, wherein said first depletion-mode transistor, said at least one second depletion-mode transistor, said diode and said enhancement-mode transistor have a common substrate.
12. The rectifier circuit of claim 1, wherein said diode is a Schottky diode.
13. The rectifier circuit of claim 1, wherein said diode is a PN junction diode.
14. The rectifier circuit of claim 1, wherein said first depletion-mode transistor comprises a Schottky gate.
15. The rectifier circuit of claim 1, wherein said first depletion-mode transistor and said at least one second depletion-mode transistors have respective first gate dielectric thickness and second gate dielectric thickness.
16. The rectifier circuit of claim 1, wherein said first depletion-mode transistor and said at least one second depletion-mode transistors have respective first barrier layer thickness and second barrier layer thickness.
17. The rectifier circuit of claim 1, wherein said first depletion-mode transistor is isolated from said at least one second depletion-mode transistor.
18. The rectifier circuit of claim 1, wherein said first depletion-mode transistor and said at least one second depletion-mode transistor comprise III-nitride high electron mobility transistors.

1. A system for testing a software application comprising:
a processor;
a testing runtime executing on the processor, the testing runtime directing the software application to perform operations based on a test definition and storing results related to performance of operations of the software application;
at least one variation data provider identified by the test definition and executing on the processor, each variation data provider generating a plurality of variations for a predetermined scope from a template and a plurality of values associated with a parameter, the template being a set of operations including the parameter, wherein each variation uses a different one of the plurality of values for the parameter, and wherein the variation data provider supplies the plurality of variations to the testing runtime and the scope of each of the plurality of variations is identified, the scope being used by the system to determine a sequence to run the variations in to ensure that all possible combinations are automatically evaluated.
2. The system of claim 1, wherein the test definition is a test script identifying the software application, the variation data provider and a variation data set containing the plurality of values associated with the parameter.
3. The system of claim 1 further comprising:
a variation data set containing the plurality of values associated with the parameter.
4. The system of claim 1 wherein the template is a set of operations including a first parameter and a second parameter and the plurality of values includes first values associated with the first parameter and second values associated with the second parameter, the test definition further comprising:
a parallel indication to the variation data provider to iterate in parallel through the first values and second values to generate the plurality of variations.
5. The system of claim 1 wherein the template is a set of operations including a first parameter and a second parameter and the plurality of values includes first values associated with the first parameter and second values associated with the second parameter, the test definition further comprising:
a serial indication to the variation data provider to iterate in series through the first values and second values to generate the plurality of variations.
6. The system of claim 1 further comprising:
a variation data set executing on the processor generating the plurality of values associated with the parameter and supplying the values to the variation data provider in response to get next value requests from the variation data provider.
7. The system of claim 3 wherein the variation data set is embedded in the test definition and supplied to the variation data provider by the runtime.
8. The system of claim 1 further comprising:
an adapter layer, executing on the processor, coupling the testing runtime and the variation data provider and causing the runtime to configure the software application to an initial state prior to delivering each variation to the testing runtime.
9. A computer storage medium having computer-executable instructions for performing a method comprising:
a) initializing software on a computer system;
b) initializing a variation data provider;
c) requesting from the variation data provider, a variation comprising at least one operation to be performed by the software, wherein the operation belongs to a predetermined scope of operation, the scope being used in determining the sequence of variations;
d) receiving a variation from the variation data provider, the variation including an initial configuration for the software and a set of one or more operations;
e) configuring the software to the initial configuration;
f) directing the software to perform the set of one or more operations;
g) recording information describing the performance of the software of the set of one or more operations;
h) repeating c) through g) wherein a different variation is received from the variation data provider each time until the variation data provider returns a message indicating there are no further variations.
10. A computer storage medium as defined in claim 9 further comprising computer-executable instructions for performing:
reading a test script identifying the software and the variation data provider to be initialized.
11. A computer storage medium as defined in claim 10 wherein the test script further identifies a variation data set supplying a set of values for varying one or more parameters in a template set of operations in the variation data provider.
12. A computer storage medium as defined in claim 9 wherein the set of one or more operations has a first parameter and the different variations are the set of one or more operation substituting a different value for the first parameter.
13. A computer storage medium as defined in claim 12 wherein the different values for the first parameter are obtained from a variation data set stored in a separate location from the variation data provider.
14. A computer storage medium as defined in claim 12 wherein the different values for the first parameter are obtained from a variation data set embedded in the variation data provider.
15. A computer storage medium having computer-executable instructions for performing a method comprising:
a) initializing software on a computer system;
b) initializing a first variation data provider and a second variation data provider and an adapter layer;
c) identifying the scope of each variation data provider to the adapter layer;
d) requesting from the adapter layer, a variation comprising at least one operation to be performed by the software;
e) receiving a variation from the adapter layer, the variation including an initial configuration for the software and a set of one or more operations, wherein a first value in the set of one or more operations is provided by the first variation data provider and a second value in the set of one or more operations is provided by the second variation data provider;
f) configuring the software to the initial configuration;
g) directing the software to perform the set of one or more operations;
h) recording information describing the performance of the software of the set of one or more operations;
i) repeating d) through h) wherein a different variation is received from the adapter layer each time until the variation data provider returns a message indicating there are no further variations.
16. A computer storage medium as defined in claim 15 wherein the set of one or more operations has a first parameter associated with a first variation data provider and a second parameter associated with a second variation data provider and wherein the different variations are the set of one or more operations substituting a different value for at least one of the first parameter and the second parameter and further comprising computer-executable instructions for performing:
evaluating by the adapter layer, the scope of each variation data provider;
determining, based on the scope, what sequence to vary the values for the at least one of the first parameter and the second parameter; and
monitoring the sequence to determine a next variation.
17. A computer storage medium as defined in claim 15 further comprising computer-executable instructions for performing:
reading a test script, the test script identifying the software, the first variation data provider, and the second variation data provider to be initialized and associating a first scope with the first variation data provider and a second scope with the second variation data provider.
18. A computer storage medium having computer-executable instructions for performing a method comprising:
receiving a request for a variation from a testing runtime executing a test script directing the testing of a software application;
delivering to the testing runtime, in response to the request, a revert command, directing the testing runtime to configure the software application to the initial configuration;
storing a template set of operations, the template set of operations including one or more operations to be performed by the software application, at least one operation having a parameter requiring a value;
generating one or more variations based on the template set of operations by obtaining a next value from a variation data set and using the next value as the parameter, each variation relates to a predetermined scope wherein at least two or more scopes are a part of a hierarchical organization, wherein the predetermined scope comprises one of a Global scope, a Suite scope, a Class scope, and a Method scope;
delivering to the testing runtime, in response to the request, the variation to the testing runtime; and
executing each variation, wherein for each iteration of a variation related to an outer scope all inner scope variations are executed.
19. A computer storage medium as defined in claim 18 further comprising computer-executable instructions for performing:
storing an identification of the variation data set containing values associated with a parameter and an initial configuration for the software application.
20. A computer storage medium as defined in claim 18 wherein the template set of operations has more than one parameter and the variation data set includes a set of values associated with each parameter and wherein generating a variation further comprises:
determining which value to use for each parameter based on previous variations delivered to the testing runtime, an iteration identifier, and a scope associated with each parameter.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A backlight module comprising:
a bottom plate having a plurality of lighting areas thereon;
a plurality of light source sets disposed on the lighting areas respectively; and
at least one partition wall disposed on the bottom plate and located between each two adjacent light areas, wherein the partition wall includes:
a first light-penetrable supporting wall having a wall surface vertical to the bottom plate and disposed along an edge of the lighting area; and
a light reflective layer formed on the wall surface.
2. The backlight module of claim 1, wherein the partition wall further comprises a second light-penetrable wall positioned abreast with the first light-penetrable wall, the light reflective layer is disposed between the first light-penetrable wall and the second light-penetrable wall.
3. The backlight module of claim 1, wherein the lighting areas and the partition wall are disposed in parallel or in an array on the bottom plate.
4. The backlight module of claim 3, wherein the partition wall has a lattice structure.
5. The backlight module of claim 1, wherein the wall surface of the first light-penetrable wall has a microstructure.
6. The backlight module of claim 5, wherein the microstructure comprises an etched microstructure or a printed microstructure.
7. The backlight module of claim 2, wherein a wall surface of the second light-penetrable wall contacting with the light reflective layer has a microstructure.
8. The backlight module of claim 1, wherein the light reflective layer includes a reflective coating.
9. The backlight module of claim 8, wherein the reflective coating includes a magnesia compound film or a titania compound film.
10. The backlight module of claim 1, wherein the light reflective layer includes a diffusion reflective layer or a silver reflective layer.
11. The backlight module of claim 1, wherein at least a trough is formed on the bottom plate, located between the adjacent lighting areas, and one end of the partition wall is disposed in the trough.
12. The backlight module of claim 1, wherein the first light-penetrable wall is made of materials selected from polymethylmethacrylate (PMMA), Polycarbonate (PC), glass material, and the combination thereof.
13. The backlight module of claim 2, wherein the second light-penetrable wall is made of materials selected from polymethylmethacrylate (PMMA), Polycarbonate (PC), glass material, and the combination thereof.
14. The backlight module of claim 1, wherein a thickness of the first light-penetrable wall is greater than 0.2 mm.
15. The backlight module of claim 12, wherein a thickness of the first light-penetrable wall is less than 3 mm.
16. The backlight module of claim 2, wherein a thickness of the second light-penetrable wall is in a range of about 0.2 mm to about 3 mm.
17. A liquid crystal display comprising the backlight module of claim 1.
18. A manufacturing method of backlight module comprising:
providing a bottom plate;
disposing a plurality of light source sets on the bottom plate to form a plurality of lighting areas;
providing a first light-penetrable wall;
forming a light reflective layer on a wall surface of the first light-penetrable wall to form a partition wall; and
disposing the partition wall between each two adjacent lighting areas.
19. The manufacturing method of claim 18, wherein the step of forming a light reflective layer on a wall surface of the first light-penetrable wall further includes providing a second light-penetrable wall to dispose the light reflective layer between the first light-penetrable wall and the second light-penetrable wall.
20. The manufacturing method of claim 18, wherein the plurality of lighting areas in parallel or in an array on the bottom plate.
21. The manufacturing method of claim 18, wherein the step of disposing the partition wall includes forming the partition walls in a lattice structure.
22. The manufacturing method of claim 18, wherein the step of providing the first light-penetrable wall includes forming a microstructure on the wall surface.
23. The manufacturing method of claim 22, wherein the step of forming the microstructure includes forming the microstructure by means of etching or printing.
24. The manufacturing method of claim 18, wherein the step of forming the light reflective layer on the wall surface of the first light-penetrable wall includes adhering or sputtering the light reflective layer on the wall surface or coating the wall surface with the light reflective layer.
25. The manufacturing method of claim 18, wherein the step of disposing the partition wall comprises:
forming at least one trough on the bottom plate and between each two adjacent lighting areas; and
inserting a bottom end of the partition wall in the trough.