Author: claimsbot

1. A conductive adhesive material comprising electrically-conductive particles and a polymer material in which the particles are dispersed, at least outer surfaces of the particles being formed of a fusible material, the polymer material having a fluxing capability for reducing metal oxides on the outer surfaces of the particles while being heated to a temperature at which the fusible material is at least partially molten, whereby heating the conductive adhesive material to at least partially melt the fusible material metal and reduce metal oxides on the particles enables metallurgical bonding of the particles.
2. The conductive adhesive material according to claim 1, wherein the particles are entirely formed of the fusible material.
3. The conductive adhesive material according to claim 1, wherein the fusible material is present as an outer coating on the particles, the particles further comprising a core material.
4. The conductive adhesive material according to claim 3, wherein the core material is nonmetallic.
5. The conductive adhesive material according to claim 3, wherein the core material is a second metal with a solidus or melting temperature that is higher than the solidus or melting temperature of the fusible material.
6. The conductive adhesive material according to claim 1, wherein the polymer material has a cure temperature below a temperature at which the fusible material begins to melt.
7. The conductive adhesive material according to claim 1, wherein the conductive adhesive material has metallurgical joint formation parameters that include a thermal cycle with a temperature range and time range required for the fusible material to metallurgically bond the particles together, and wherein the polymer material is characterized by cure kinetics that enable the polymer material to cure within the temperature and time ranges of the thermal cycle.
8. The conductive adhesive material according to claim 7, wherein the fusible material has a liquidus temperature below the temperature range of the thermal cycle.
9. The conductive adhesive material according to claim 7, wherein the fusible material has a liquidus temperature above the temperature range of the thermal cycle.
10. A conductive adhesive material comprising electrically-conductive particles and an epoxy adhesive in which the particles are dispersed, each of the particles having an outer surface formed of a fusible metal with a melting or solidus temperature, the epoxy adhesive having a fluxing capability for reducing metal oxides on the outer surfaces of the particles while being heated to a temperature at which the fusible metal is at least partially molten, whereby heating the conductive adhesive material to at least partially melt the fusible metal and simultaneously reduce metal oxides on the particles enables metallurgical bonding of the particles.
11. The conductive adhesive material according to claim 10, wherein the particles are entirely formed of the fusible metal.
12. The conductive adhesive material according to claim 10, wherein the fusible metal is present as an outer coating on the particles, the particles further comprising a metallic core material having a solidus or melting temperature that is higher than a solidus or melting temperature of the fusible metal.
13. The conductive adhesive material according to claim 10, wherein the fusible metal is completely molten at a curing temperature of the epoxy adhesive.
14. The conductive adhesive material according to claim 10, wherein the fusible metal has a liquidus temperature above a curing temperature of the epoxy adhesive.
15. The conductive adhesive material according to claim 10, wherein the conductive adhesive material has metallurgical joint formation parameters that include a thermal cycle with a temperature range and time range required for the fusible metal to metallurgically bond the particles together, and wherein the epoxy adhesive is characterized by cure kinetics that enable the epoxy adhesive to cure within the temperature and time ranges of the thermal cycle.
16. The conductive adhesive material according to claim 10, wherein the epoxy adhesive has a cure temperature below a temperature at which the fusible metal begins to melt.
17. A method of forming an electrical interconnect with a conductive adhesive material, the method comprising the steps of: forming the conductive adhesive material of a polymer material in which electrically-conductive particles are dispersed, at least outer surfaces of the particles being formed of a fusible material, the polymer material having a fluxing capability to reduce metal oxides on the particles when the polymer material is heated;
dispensing the conductive adhesive material so that the conductive adhesive material is between a pair of electrically-conductive members;
heating the conductive adhesive material to a temperature sufficient to cause metal oxides on the particles to be reduced and at least partially melt the fusible material; and
cooling the conductive adhesive material to yield the electrical interconnect, the particles being metallurgically bonded to the electrically-conductive members.
18. The method according to claim 17, wherein the particles are entirely formed of the fusible material.
19. The method according to claim 17, wherein the fusible material is present as an outer coating on the particles, the particles further comprising a core material.
20. The method according to claim 19, wherein the core material is nonmetallic.
21. The method according to claim 19, wherein the core material is a second metal with a solidus or melting temperature that is higher than a solidus or melting temperature of the fusible material.
22. The method according to claim 17, wherein the heating step comprises a single heat treatment during which the fusible material is at least partially melted and the polymer material is cured.
23. The method according to claim 17, wherein the heating step comprises a first joint formation heat treatment during which the fusible material is at least partially melted, and a second and longer heat treatment at a lower temperature and during which the polymer material is cured.
24. The method according to claim 17, wherein the fusible material is completely melted during the heating step.
25. The method according to claim 17, wherein the fusible material is only partially melted during the heating step.
26. The method according to claim 17, wherein the fusible material has a liquidus temperature above the temperature to which the conductive adhesive material is heated during the heating step, such that the fusible material is only partially melted during the heating step.
27. The method according to claim 17, wherein following the cooling step the particles are metallurgically bonded together.
28. The method according to claim 17, wherein the electrically-conductive members are spaced apart so that after the cooling step the particles are not metallurgically bonded together but at least one of the particles is metallurgically bonded to each of the electrically-conductive members.
29. A method of bonding an electrical component to a surface with a conductive adhesive material, the method comprising the steps of:
forming the conductive adhesive material to comprise electrically-conductive particles and an epoxy adhesive in which the particles are dispersed, each of the particles having an outer surface formed of a fusible metal with a melting or solidus temperature, the epoxy adhesive having a fluxing capability for reducing metal oxides on the outer surfaces of the particles when heated;
dispensing the conductive adhesive material so that the conductive adhesive material is between an electrically-conductive member of the electrical component and an electrically-conductive member on the surface;
heating the conductive adhesive material to cause metal oxides on the particles to be reduced, to at least partially melt the fusible metal, and to cure the epoxy adhesive; and then
cooling the conductive adhesive material to metallurgical bond the particles to the electrically-conductive members of the electrical component and the surface.
30. The method according to claim 29, wherein the particles are entirely formed of the fusible metal.
31. The method according to claim 29, wherein the fusible metal is present as an outer coating on the particles, the particles further comprising a core with a solidus or melting temperature that is higher than a solidus or melting temperature of the fusible metal.
32. The method according to claim 29, wherein the heating step comprises a single heat treatment during which the fusible metal is at least partially melted and the epoxy adhesive is cured.
33. The method according to claim 29, wherein the heating step comprises a first joint formation heat treatment during which the fusible metal is at least partially melted, and a second and longer heat treatment at a lower temperature and during which the epoxy adhesive is cured.
34. The method according to claim 29, wherein following the cooling step the particles are metallurgically bonded together.
35. The method according to claim 29, wherein the electrically-conductive members of the electrical component and the surface are spaced apart so that after the cooling step the particles are not metallurgically bonded together but at least one of the particles is metallurgically bonded to each of the electrically-conductive members of the electrical component and the surface.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method for rotating a source image by a first non-zero angle, comprising:
defining a template for the source image, the template representing a rotation of the source image about an axis of the source image by a second angle, where the second angle is the negative of the first non-zero angle that the source image is to be rotated;
determining overlap between the template and the source image;
separating the template into a plurality of strips covering at least the area of overlap between the template and the source image;
for each strip:
identifying an initial pixel in the source image within the strip and storing the image data of the initial pixel;
storing the image data of all remaining pixels within both the strip and the overlap in a database format in which the all remaining pixels is defined by a Y and X offset from the initial pixel, wherein said storing the image data of all remaining pixels within both the strip and the overlap further comprises:
determining the initial pixel with coordinates in the source image as Ymin and Xmin; establishing an origin pixel as having Y=Ymin and X=Xmin;
obtaining the image data sequentially for the origin pixel and each horizontally adjacent pixel from the origin pixel until the end of the overlap is reached,
storing the image data in a database format in which each horizontally adjacent pixel is defined by the offset from Ymin and an offset from Xmin;
incrementing the Ymin by one if there are any remaining pixel rows within both the strip and the overlap; and
repeating at least the establishing, obtaining, storing and incrementing until all of the pixels within both the strip and the overlap are stored;
constructing a desired rotated image from the source image,
for each pixel in the rotated destination image, identifying at least one pixel from the source image that corresponds to the source image as rotated per the first angle, the identifying comprising:
identifying the strip that corresponds to the target section of the source image; and
using the X and Y offset data to locate the image data in the database format.
2. The method of claim 1, wherein the initial pixel with each strip is the highest Y coordinate and leftmost X coordinate within each strip.
3. The method of claim 1, wherein the each of the strips at least partially overlaps with adjacent strips.
4. The method of claim 1, wherein the strips are substantially parallel.
5. The method of claim 1, wherein the strips are substantially rectangular.
6. The method of claim 1, wherein the image data for portions of the strips that do not overlap the source image are ignored.
7. The method of claim 1, wherein the image data for portions of the strips that do not overlap the source image are stored in memory as representative of dead zone data.
8. A method for rotating a source image by a first non-zero angle, comprising:
defining a template for the source image, the template representing a rotation of the source image about an axis of the source image by a second angle, where the second angle is the negative of the first non-zero angle that the source image is to be rotated;
determining overlap between the template and the source image;
separating the template into a plurality of strips covering at least the area of overlap between the template and the source image;
for each strip:
determining the initial pixel with coordinates in the source image of the corresponding strip as Ymin and Xmin, wherein the initial pixel with each strip is the highest Y coordinate and leftmost X coordinate within each strip;
establishing an origin pixel as having Y=Ymin and X=Xmin;
obtaining the image data sequentially for the origin pixel and each horizontally adjacent pixel from the origin pixel until the end of the overlap is reached;
storing the image data in a database format in which each horizontally adjacent pixel is defined by the offset from Y and an offset from X;
incrementing the Ymin by one if there are any remaining pixel rows within both the corresponding strip and the overlap; and
repeating at least the establishing, obtaining, storing and incrementing until all of the pixels within both the strip and the overlap are stored;

for each pixel in the rotated destination image, identifying at least one pixel from the source image that corresponds to the source image as rotated per the first angle, the identifying comprising:
identifying the strip that corresponds to the target section of the source image;
using the X and Y offset data to locate the image data in the database format.
9. The method of claim 8, wherein the each of the strips at least partially overlaps with adjacent strips.
10. The method of claim 8, wherein the strips are substantially parallel.
11. The method of claim 8, wherein strips are substantially rectangular.
12. The method of claim 8, wherein the image data for portions of the strips that do not overlap the source image are ignored.
13. The method of claim 8, wherein the image data for portions of the strips that do not overlap the source image are stored in memory as representative of dead zone data.

1. A mounting assembly for a backplane communication system, the mounting assembly comprising:
a retention collet including a collet base and a coupling arm that extends from the collet base, the collet base having a passage therethrough, wherein the collet base is configured to be mounted to a backplane such that the passage extends through the backplane and the coupling arm extends away from the backplane; and
a spacer member having a member cavity that receives the coupling arm when the spacer member is mounted to the backplane, the coupling arm being held in a locked position when engaged by a guide pin that has been inserted through the passage of the collet base and into the member cavity, the retention collet and the spacer member being interlocked when the coupling arm is in the locked position.
2. The mounting assembly of claim 1, wherein the coupling arm has an inner surface and an outer surface that face in generally opposite directions, the inner surface configured to extend along and directly engage the guide pin when the coupling arm is in the locked position, the outer surface configured to directly engage an interior surface of the spacer member that defines the member cavity.
3. The mounting assembly of claim 1, wherein the spacer member has an interior surface that defines the member cavity, the coupling arm being deflected in a first lateral direction by the interior surface as the spacer member is mounted to the backplane and, subsequently, pressed in a different second lateral direction as the guide pin is inserted into the member cavity.
4. The mounting assembly of claim 1, wherein the spacer member includes an interior surface that defines the member cavity, the coupling arm and the interior surface being shaped relative to each other such that spacer member is forced toward the backplane as the coupling arm is pressed against the interior surface by the guide pin.
5. The mounting assembly of claim 1, wherein the spacer member has an interior surface that defines the member cavity and that includes a blocking portion, the guide pin advancing in a loading direction when the guide pin is inserted into the member cavity, the interior surface along the blocking portion at least partially facing in the loading direction.
6. The mounting assembly of claim 5, wherein the coupling arm has an outer surface including a driving area, the driving area being pressed against the blocking portion of the interior surface when the guide pin engages the coupling arm, wherein the driving area and the blocking portion are shaped relative to each other such that spacer member is forced toward the backplane as the driving area is pressed against the blocking portion.
7. The mounting assembly of claim 1, wherein the retention collet includes a plurality of the coupling arms, the coupling arms being positioned about a collet axis extending through the passage, the coupling arms extending generally parallel to the collet axis.
8. The mounting assembly of claim 7, wherein each of the coupling arms is deflected toward the collet axis by an interior surface of the spacer member that defines the member cavity as the spacer member is mounted to the backplane.
9. The mounting assembly of claim 7, wherein the coupling arms include at least three coupling arms that are distributed circumferentially about the collet axis.
10. The mounting assembly of claim 1, wherein the retention collet extends between a leading end and a trailing end, the collet base having an exterior surface that defines an outer diameter of the collet base, the outer diameter being greatest along a flange portion of the collet base that includes the trailing end.
11. A backplane communication system comprising:
a backplane having a mounting hole and a mating window extending through the backplane;
a retention collet including a collet base and a coupling arm that extends from the collet base, the collet base being secured to the backplane such that the coupling arm is proximate to the mounting hole and extends away from the backplane; and
a connector assembly configured to be mounted to the backplane, the connector assembly including an electrical connector that is configured to be positioned proximate to the mating window of the backplane and a spacer member coupled to the electrical connector, the spacer member having a member cavity that receives the coupling arm of the retention collet when the connector assembly is mounted to the backplane, the coupling arm being held in a locked position when engaged by a guide pin that has been inserted through the mounting hole and into the member cavity, the retention collet and the spacer member being interlocked when the coupling arm is in the locked position.
12. The backplane communication system of claim 11, wherein the backplane comprises a printed circuit board.
13. The backplane communication system of claim 11, wherein the collet base includes a passage extending therethrough along a collet axis, the coupling arm extending generally parallel to the collet axis, the guide pin configured to be inserted through the passage.
14. The backplane communication system of claim 11, further comprising the guide pin and a daughter card assembly that includes the guide pin.
15. The backplane communication system of claim 11, wherein the coupling arm has an inner surface and an outer surface that face in generally opposite directions, the inner surface configured to extend along and directly engage the guide pin when the coupling arm is in the locked position, the outer surface configured to directly engage an interior surface of the spacer member that defines the member cavity.
16. The backplane communication system of claim 11, wherein the spacer member has an interior surface that defines the member cavity, the coupling arm being deflected in a first lateral direction by the interior surface as the spacer member is mounted to the backplane and, subsequently, pressed in a different second lateral direction as the guide pin is inserted into the member cavity.
17. The backplane communication system of claim 11, wherein the spacer member includes an interior surface that defines the member cavity, the coupling arm and the interior surface being shaped relative to each other such that spacer member is forced toward the backplane as the coupling arm is pressed against the interior surface by the guide pin.
18. The backplane communication system of claim 11, wherein the retention collet includes a plurality of the coupling arms extending generally parallel to one another.
19. The backplane communication system of claim 18, wherein each of the coupling arms is configured to be deflected by an interior surface of the spacer member that defines the member cavity.
20. The backplane communication system of claim 18, wherein the coupling arms include at least three coupling arms.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A modular air conditioning unit, comprising:
a chassis having an outside surface, comprising
an evaporator coil air intake opening;
a treated air discharge opening; and
a condenser coil air flow opening; and

an air conditioning system located within the chassis, comprising
a condenser coil unit,
an evaporator coil unit, and
a blower, including
an air intake opening, and
an air discharge opening in fluid communication with the treated air discharge opening,
wherein the air intake opening is in fluid communication with the evaporator coil unit.
2. The modular air conditioning unit of claim 1, further comprising a plenum located between the evaporator coil unit and the air intake opening of the blower.
3. The modular air conditioning unit of claim 1, wherein the condenser coil unit comprises a plurality of spaced apart condenser coil arrays.
4. The modular air conditioning unit of claim 1, wherein the evaporator coil unit comprises a plurality of spaced apart evaporator coil arrays.
5. The modular air conditioning unit of claim 1, wherein the chassis further comprises:
a blower motor frame, and
a blower motor attached to the motor frame in mechanical connection with the blower.
6. The modular air conditioning unit of claim 1, wherein the treated air discharge opening further comprises an adjustable treated air passage, comprising a plurality of discharge holes.
7. The modular air conditioning unit of claim 1, further comprising:
a condenser fan mount located within the chassis; and
a condenser fan attached to the condenser fan mount in to fluid communication with the condenser coil unit.
8. The modular air conditioning unit of claim 1, further comprising a condenser coil air filter frame located between the condenser coils and an outside surface of the chassis, and an evaporator coil air filter frame located between the evaporator coils and the outside surface of the chassis.
9. The modular air conditioning unit of claim 1, further comprising at least one of wheels, casters, lifting points, forklift engagement points, handles, and skids located on the outside surface of the chassis.
10. The modular air conditioning unit of claim 1, further comprising a control display located on the outside surface of the chassis.
11. The modular air conditioning unit of claim 9, wherein the control display is connected to controls of at least one of treated air discharge temperature, pressure, humidity, and timed operation.
12. A method of treating air comprising the step of using the device of claim 1.