Author: claimsbot

1. A method of manufacturing a downhole tool part for drilling subterranean material, comprising:
fabricating a model having an external peripheral shape of a downhole tool part;
positioning at least one bit body element at the external periphery of the model;
applying a mold material to at least a portion of the external periphery of the model and at least a portion of the at least one bit body element;
permitting the mold material to harden to form a mold about the model;
eliminating the model from within the mold and leaving the at least one bit body element within the mold; and
casting a composite matrix material within the mold to form the downhole tool part and incorporate the at least one bit body element into the downhole tool part.
2. The method as recited in claim 1, further comprising providing a particulate material within the mold prior to casting the composite matrix material within the mold.
3. The method as recited in claim 2, further comprising selecting the particulate material to comprise at least one constituent selected from the group consisting of:
monotungsten carbide (WC), ditungsten carbide (W2C), macro-crystalline tungsten carbide, cobalt, titanium carbide, tantalum carbide, metal borides, metal oxides, metal nitrides, polycrystalline diamond compact (PDC), thermally stable polycrystalline diamond (TSP), cubic boron nitride (CBN), polycrystalline cubic boron nitride (PCBN), tungsten, iron, nickel, titanium and boron carbide.
4. The method as recited in claim 3, further comprising selecting the particulate material to increase at least one of wear resistance, strength and toughness of a selective surface of the downhole tool part formed from casting the composite matrix material within the mold.
5. The method as recited in claim 1, wherein eliminating the model from within the mold includes at least one of burning, melting, vaporizing and dissolving the model.
6. The method as recited in claim 1, further comprising selecting the composite matrix material to comprise tungsten carbide and cobalt.
7. The method as recited in claim 6, further comprising selecting the composite matrix material to have a tungsten carbide content of about 25 atomic percent and a cobalt content of about 75 atomic percent.
8. The method as recited in claim 6, further comprising selecting the composite matrix material to have a cobalt content equal to or greater than about 70 atomic percent.
9. The method as recited in claim 1, further comprising selecting the at least one bit body element to comprise at least one of a cutting element, a bearing structure, a gage trimmer, a nozzle and a cutting control structure.
10. The method as recited in claim 9, further comprising selecting the at least one bit body element to comprise tungsten carbide and cobalt.
11. The method as recited in claim 10, further comprising selecting the at least one bit body element to have a cobalt content less than 20 weight percent.
12. The method as recited in claim 1, further comprising casting the composite matrix material under vacuum conditions.
13. The method as recited in claim 1, further comprising casting the composite matrix material in a protective atmosphere.
14. The method as recited in claim 13, further comprising selecting the protective atmosphere to comprise one of an inert atmosphere and a reducing atmosphere.
15. The method as recited in claim 1, further comprising casting the composite matrix material in air.
16. The method as recited in claim 1, further comprising selecting the composite matrix material to comprise a eutectic composition of at least two constituents selected from the group consisting of monotungsten carbide (WC), ditungsten carbide (W2C), cobalt, tungsten, iron, nickel, titanium and boron carbide.
17. The method as recited in claim 16, further comprising casting the composite matrix material at or above a eutectic temperature of the eutectic composition of the composite matrix material.
18. A method of manufacturing a downhole tool part for drilling subterranean material, comprising:
fabricating a model having an external peripheral shape of a downhole tool part;
positioning at least one bit body element at the external periphery of the model;
applying a mold material to at least a portion of the external periphery of the model and at least a portion of the at least one bit body element;
permitting the mold material to harden to form a mold about the model;
eliminating the model from within the mold and leaving the at least one bit body element within the mold; and
casting a composite matrix material within the mold to form the downhole tool part and incorporate the at least one bit body element into the downhole tool part, the composite matrix material comprising a eutectic composition of at least two constituents selected from the group consisting of monotungsten carbide (WC), ditungsten carbide (W2C), cobalt, tungsten, iron, nickel, titanium, and boron carbide.
19. The method as recited in claim 18, further comprising casting the composite matrix material at or above a eutectic temperature of the eutectic composition of the composite matrix material.
20. The method as recited in claim 18, further comprising forming the downhole tool part to comprise a drill bit body.
21. The method as recited in claim 18, further comprising forming the downhole tool part to comprise a roller cone.
22. The method as recited in claim 21, further comprising selecting the at least one bit body element to comprise at least one of a cutting insert and a bearing element.
23. The method as recited in claim 22, further comprising selecting the at least one bit body element to comprise a cutting insert including tungsten carbide and cobalt.
24. The method as recited in claim 23, further comprising selecting the cutting insert to have a cobalt content less than 20 weight percent.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A communication system, comprising:
a main signal line including a first signal and a second signal, said first signal and second signal at different frequencies, wherein the second signal includes data from an earth formation;
a second signal line coupled to the main signal line, said second signal line capable of receiving the first signal;
a third signal line coupled to the main signal line, said third signal line capable of receiving the second signal; and
one or more electronic devices coupled to the third signal line, said electronic devices capable of processing the data from the second signal.
2. The communication system of claim 1, further comprising one or more electronic devices coupled to the second signal line, wherein the first signal includes data from an earth formation, said electronic devices capable of processing the data from the first signal.
3. The communication system of claim 2, wherein the electronic devices are at least one of a processor, sensor, memory, or actuator.
4. The communication system of claim 1, further comprising a plurality of communication links, wherein the main signal line, the second signal line, and the third signal line couple to each other through the communication link.
5. The communication system of claim 4, further comprising a plurality of connection modules that each contain the main signal line, wherein two or more of the connection modules attach to a communication link.
6. The communication system of claim 5, wherein the connection modules attach together to form a tool string.
7. The communication system of claim 6, wherein each of the plurality of connection modules is a pin or box.
8. The communication system of claim 5, further comprising a system power return coupled to each of the plurality of connection modules.
9. The communication system of claim 4, wherein each of the communication links further comprises:
a low pass filter coupled to the main signal line;
a high pass filter coupled to the main signal line; and
a modulator and demodulator coupled to the high pass filter.
10. The communication system of claim 1, wherein the first signal is a power and low speed signal.
11. The communication system of claim 1, wherein the second signal is a high speed signal.

1. A method for installing a door into a doorframe having a top and a bottom, the method comprising:
providing a door assembly including a door panel with an external surface, a lock assembly mounted in the door panel and having a mortise lockbody with duplicate lock hardware located symmetrically about a horizontal axis, the lockbody further comprising dual dead bolts, a hinge z-bar, and a latch z-bar, the hinge z-bar pivotally mounted to a first side of the door panel and the latch z-bar removably secured to a second side of the door panel;
orienting the door assembly by rotating the door panel, lock assembly, hinge z-bar and latch z-bar together for either a right hinge or a left hinge operation;
attaching a bottom expander to a bottom side of the door panel, the bottom expander attachable in a selected position on the door panel
setting the door assembly in the doorframe and securing the hinge z-bar and the latch z-bar to the doorframe and releasing the latch z-bar from the second side of the door panel such that the door panel is free to swing between a closed position and an open position;
securing a header frame to the top of the doorframe;
securing a top mounting frame to the top of the doorframe, the top mounting frame extending above the door panel
inserting a key cylinder into one of two symmetrical key cylinder receiving members on the mortise lockbody mounted in the door panel, and operating the key cylinder to extend both dead bolts in coordination;
aligning one or more jamb bracket bases onto the doorframe in a desired position by matching a guide indicia on the jamb bracket base to the hinge z-bar;
mounting one or more closers to each jamb bracket base and attaching the closers to the door panel, the closers being of variable length but releasably secured at an installation length;
releasing the one or more closers; and
adjusting the position of the bottom expander relative to the doorframe to lightly contact the bottom side of the doorframe.
2. The method of claim 1 further comprising inserting a handle spindle into a one of a pair of spindle receiving lumens in the mortise lockbody mounted in the door panel and attaching handles to the handle spindle.
3. The method of claim 1, wherein the hinge and latch z-bars are fixedly secured to the doorframe.
4. The method of claim 1, wherein the door panel and the header frame and the top mounting frame forms a seal with the top of the doorframe when the door panel is in the closed position.
5. The method of claim 1, wherein the door panel and the bottom expander forms a seal with the bottom of the doorframe when the door panel is in the closed position.
6. The method of claim 1 further including removably securing a top spacer to the top mounting frame to position the top mounting frame relative to the door panel.
7. The method of claim 6 further comprising removing the top spacer from the top mounting frame after installation of the top mounting frame.
8. The method of claim 1 further including removably securing a bottom spacer to the bottom expander to position the door panel and bottom expander relative to the bottom of the doorframe.
9. The method of claim 8 further comprising removing the bottom spacer from the bottom expander after positioning the door panel and bottom expander.
10. The method of claim 1 wherein the step of securing a header frame to the top of the doorframe includes covering a gap between the door panel and the top of the doorframe.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A circuit comprising:
a first integrated circuit having a first circuit and a first inductive interface; and
a second integrated circuit, coupled to the first integrated circuit, the second integrated circuit having a second circuit and a second inductive interface, wherein the first inductive interface and the second inductive interface are aligned to magnetically communicate first signals between the first circuit and the second circuit and wherein the second inductive interface is coupled to engage in near field communications with a remote device, wherein the near field communications include second signals.
2. The circuit of claim 1 wherein the first signals is magnetically communicated in a first frequency band and the near field communications are communicated in a second frequency band that is different from the first frequency band.
3. The circuit of claim 1 wherein the first inductive interface includes a first coil and the second inductive interface includes a second coil.
4. The circuit of claim 3 wherein the second coil responds to both magnetic communication of the first signals and the near field communications.
5. The circuit of claim 1 wherein the second inductive interface serially engages in magnetic communication of the first signals and the near field communications.
6. The circuit of claim 1 wherein the second inductive interface contemporaneously engages in magnetic communication of the first signals and the near field communications.
7. An integrated circuit comprising:
a first integrated circuit die having a first circuit and a first inductive interface; and
a second integrated circuit die, coupled to the first integrated circuit die, the second integrated circuit having a second circuit and a second inductive interface, wherein the first inductive interface and the second inductive interface are aligned to magnetically communicate first signals between the first circuit and the second circuit and wherein the second inductive interface is coupled to engage in near field communications with a remote device, wherein the near field communications include second signals.
8. The integrated circuit of claim 7 wherein the first signals is magnetically communicated in a first frequency band and the near field communications are communicated in a second frequency band that is different from the first frequency band.
9. The integrated circuit of claim 7 wherein the first inductive interface includes a first coil and the second inductive interface includes a second coil.
10. The integrated circuit of claim 9 wherein the second coil responds to both magnetic communication of the first signals and the near field communications.
11. The integrated circuit of claim 7 wherein the second inductive interface serially engages in magnetic communication of the first signals and the near field communications.
12. The integrated circuit of claim 7 wherein the second inductive interface contemporaneously engages in magnetic communication of the first signals and the near field communications.
13. The integrated circuit of claim 7 further comprising:
a substrate coupled to support the first integrated circuit die and the second integrated circuit die, the substrate including a magnetic communication path aligned with the first inductive interface and the second inductive interface, to magnetically communicate the first signals between the first circuit and the second circuit.
14. A method comprising:
magnetically communicating first signals between a first integrated circuit and a second interface circuit via a first inductive interface and a second inductive interface; and
engaging in near field communications via the second inductive interface with a remote device, wherein the near field communications include second signals.
15. The method of claim 14 wherein the first signals are magnetically communicated in a first frequency band and the near field communications are communicated in a second frequency band that is different from the first frequency band.
16. The method of claim 14 wherein the engaging in the near field communications is performed serially to the magnetic communication of the first signals.
17. The method of claim 14 wherein the engaging in the near field communications is performed contemporaneously to the magnetic communication of the first signals.
18. A method comprising:
magnetically communicating first signals between a first integrated circuit die and a second interface circuit die via a first inductive interface and a second inductive interface; and
engaging in near field communications via the second inductive interface with a remote device, wherein the near field communications include second signals.
19. The method of claim 18 wherein the first signals are magnetically communicated in a first frequency band and the near field communications are communicated in a second frequency band that is different from the first frequency band.
20. The method of claim 18 wherein the engaging in the near field communications is performed serially to the magnetic communication of the first signals.
21. The method of claim 18 wherein the engaging in the near field communications is performed contemporaneously to the magnetic communication of the first signals.