Author: claimsbot

1. An article of manufacture comprising at least one of hardware logic and a non-transitory computer readable storage medium having code that is implemented at an initiator node including an initiator adaptor to communicate with a target node, wherein the code is executed by the at least one of hardware logic and a processor to perform:
communicating with the target node using a first communication protocol that uses an interface protocol to communicate using a second communication protocol to establish a connection for the second communication protocol;
creating, with the interface protocol, data structures to enable communication with the target node to establish the connection with the target node for the second communication protocol;
invoking an extension layer for the second communication protocol;
passing the data structures to the extension layer to use to communicate with the target node using the second communication protocol;
receiving a message including a direct reference to a memory location to invalidate from the target node through an initiator adaptor, wherein the direct reference is compatible with the second communication protocol, and wherein the initiator adaptor does not enable direct invalidating of the reference;
invoking the initiator adaptor to invalidate the direct reference in response to determining that the direct reference does match one reference in a map;
invalidating at least one direct reference indicated in the map associated with an indirect reference included in the invalidate message in response to determining that the direct reference does match one reference in the map or that the direct reference is not provided; and
issuing, by the extension layer, an invocation to terminate the interface protocol, wherein the extension layer uses the data structures created by the interface protocol to communicate with the target node.
2. The article of manufacture of claim 1, wherein the communications with the target node to establish the connection are made through a socket layer.
3. The article of manufacture of claim 1, wherein the first communication protocol comprises a networking layer implemented in an remote network interface card (RNIC) adaptor used to communicate with the target node, wherein the second communication protocol comprises the remote direct memory access (RDMA) protocol, and wherein the extension layer comprises an iSER layer to handle communication with the target node using the RDMA protocol.
4. The article of manufacture of claim 1, wherein the first communication protocol comprises a socket layer, wherein the second communication protocol comprises the RDMA protocol, wherein the interface protocol comprises an SDP layer or TCP layered over IPoIB (RC), wherein the extension layer comprises an iSER layer to handle communication with the target node using the RDMA protocol, and wherein an InfiniBand adaptor is used to communicate with the target node.
5. The article of manufacture of claim 1, wherein the extension layer is invoked upon receiving a last response to establish the connection from the target node, wherein the invocation to terminate the interface protocol is issued in response to invoking the extension layer.
6. The article of manufacture of claim 5, wherein the invocation to terminate the interface protocol is issued in response to the sending of the last response message to the target node using the interface protocol in addition to invoking the extension layer.
7. The article of manufacture of claim 1, wherein the extension layer performs the operations of invoking the adaptor to invalidate the direct reference and invalidating the at least one reference associated with the indirect reference in the invalidate message.
8. The article of manufacture of claim 7, wherein the extension layer comprises an iSER layer, wherein the target node includes an RNIC or InfiniBand adaptor, and wherein the invoked initiator adaptor comprises an RNIC or InfiniBand adaptor.
9. The article of manufacture of claim 8, wherein the extension layer is invoked in response to receiving a last login request from the initiator node.
10. The article of manufacture of claim 9, wherein the target node further performs:
sending a final login response to the initiator node using the first communication protocol, wherein the data structures are passed to the extension layer after sending the final login response.
11. The article of manufacture of claim 1, wherein the indirect reference comprises an initiator task tag (ITT), and wherein the direct reference comprises an STag or R_Key.
12. A system implemented within an initiator node to communicate with a target node, comprising:
a non-transitory computer readable storage medium;
an initiator adaptor;
a circuitry at the initiator node, which is in communication with the non-transitory computer readable storage medium, enabled to:
use a first communication protocol to use an interface protocol to communicate with the target node using a second communication protocol to establish a connection for the second communication protocol;
create, with the interface protocol, data structures in the non-transitory computer readable storage medium to enable communication with the target node to establish the connection with the target node for the second communication protocol;
invoke an extension layer for the second communication protocol;
pass the data structures to the extension layer to use to communicate with the target node using the second communication protocol;
receive a message including a direct reference to a memory location to invalidate from the target node through the initiator adaptor, wherein the direct reference is compatible with the second communication protocol, and wherein the initiator adaptor does not enable direct invalidating of the reference;
invoke the initiator adaptor to invalidate the direct reference in response to determining that the direct reference does match one reference in a map in the non-transitory computer readable storage medium;
invalidate at least one direct reference indicated in the map associated with an indirect reference included in the invalidate message in response to determining that the direct reference does match one reference in the map or that the direct reference is not provided; and
issue, by the extension layer, an invocation to terminate the interface protocol, wherein the extension layer uses the data structures created by the interface protocol to communicate with the target node.
13. The system of claim 12, wherein the communications with the target node to establish the connection are made through a socket layer.
14. The system of claim 12, wherein the first communication protocol comprises a networking layer implemented in an remote network interface card (RNIC) adaptor used to communicate with the target node, wherein the second communication protocol comprises the remote direct memory access (RDMA) protocol, and wherein the extension layer comprises an iSER layer to handle communication with the target node using the RDMA protocol.
15. The system of claim 12, wherein the first communication protocol comprises a socket layer, wherein the second communication protocol comprises the RDMA protocol, wherein the interface protocol comprises an SDP layer or TCP layered over IPoIB (RC), wherein the extension layer comprises an iSER layer to handle communication with the target node using the RDMA protocol, and wherein an InfiniBand adaptor is used to communicate with the target node.
16. The system of claim 12, wherein the extension layer is invoked upon receiving a last response to establish the connection from the target node, wherein the invocation to terminate the interface protocol is issued in response to invoking the extension layer.
17. The system of claim 16, wherein the invocation to terminate the interface protocol is issued in response to the sending of the last response message to the target node using the interface protocol in addition to invoking the extension layer.
18. The system of claim 12, wherein the extension layer performs the operations of invoking the adaptor to invalidate the direct reference and invalidating the at least one reference associated with the indirect reference in the invalidate message.
19. The system of claim 12, wherein the extension layer comprises an iSER layer, wherein the target node includes an RNIC or InfiniBand adaptor, and wherein the invoked initiator adaptor comprises an RNIC or InfiniBand adaptor.
20. The system of claim 19, wherein the extension layer is invoked in response to receiving a last login request from the initiator node.
21. The system of claim 20, wherein the target node further performs:
sending a final login response to the initiator node using the first communication protocol, wherein the data structures are passed to the extension layer after sending the final login response.
22. The system of claim 12, wherein the indirect reference comprises an initiator task tag (ITT), and wherein the direct reference comprises an STag or R_Key.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. An organometallic compound having the formula (R1YCR2PR3)nM+mL1(m-n)L2p, wherein R1, R2 and R3 are independently chosen from H, (C1-C6)alkyl, (C2-C6)alkenyl, (C2-C6)alkynyl and aryl; Y\u2550N or P; M=a metal; L1=an anionic ligand; L2=a neutral ligand; m=the valence of M; n=1-6; p=0-3; and wherein m\u2267n.
2. The compound of claim 1 wherein L1 is chosen from hydride, halide, azide, alkyls, alkenyl, alkynyl, carbonyl, amido, alkylamido, dialkylamido, dialkylamidoalkyl, imido, hydrazido, phosphido, nitrosyl, nitryl, nitrate, nitrile, alkoxy, dialkylaminoalkoxy, alkoxyalkyldialkylamino, siloxy, diketonates, ketoiminates, cyclopentadienyls, silyls, pyrazolates, and amidinates.
3. The compound of claim 1 wherein L2 is chosen from CO, NO, alkenes, dienes, trienes, alkynes, and aromatic compounds.
4. The compound of claim 1 wherein M is chosen from a Group 2 to Group 16 metal.
5. A composition comprising the compound of claim 1 and an organic solvent.
6. A method of depositing a film comprising the steps of: providing a substrate in a vapor deposition reactor; conveying as a precursor the organometallic compound of claim 1 in a gaseous form to the reactor; and depositing a film including the metal on the substrate.
7. A method of depositing a film comprising the steps of: providing a substrate in a reactor; conveying the composition of claim 5 into the reactor using direct liquid injection; and depositing a film comprising the metal on the substrate.
8. A method of depositing a film comprising the steps of: providing a substrate in a vapor deposition reactor; conveying as a first precursor the organometallic compound of claim 1 in a gaseous form to the reactor; chemisorbing the first precursor compound on the surface of the substrate; removing any non-chemisorbed first precursor compound from the reactor; conveying a second precursor in a gaseous form to the reactor; reacting the first and second precursors to form a film on the substrate; and removing any unreacted second precursor.
9. The method of claim 8 wherein the second precursor is selected from oxygen, ozone, water, peroxide, alcohols, nitrous oxide and ammonia.
10. A delivery device for delivering a precursor in the vapor phase to a vapor deposition reaction comprising the compound of claim 1.
11. A method for preparing phosphoamidine compounds comprising reacting a nitrile compound with a primary phosphine in the presence of a metal trifluoromethanesulfonate catalyst.
12. The process of claim 11 further comprising a reacting a primary amine with the nitrile compound and the primary phosphine.

1. A method for cooling a downhole gas generator, the method comprising the steps of:
providing the downhole gas generator comprising:
a combustion housing forming a combustion chamber having a combustion end and an exhaust end;
a plurality of annular cooling jacket segments surrounding the combustion housing, each of the plurality of annular cooling jacket segments having an inlet port and an outlet port; and
a plurality of apertures through the combustion housing allowing water to flow from the plurality of annular cooling jacket segments into the combustion chamber;

providing a flow of a fuel and an oxidizing agent into the combustion chamber for combustion;
providing a flow of water into the inlet ports, and out of the outlet ports, of each of the plurality of annular cooling jacket segments, for cooling the downhole gas generator;
regulating the flow of water into the inlet ports, and out of the outlet ports, of each of the plurality of annular cooling jacket segments, to provide optimal cooling of the downhole gas generator, and to also optimize the flow of water through the plurality of apertures of the combustion housing and into the combustion chamber, to minimize heat damage to the combustion housing.
2. The method of claim 1, further comprising the step of operably positioning the downhole gas generator in a borehole.
3. The method of claim 1, further comprising the step of regulating the flow of water into the inlet ports and out of the outlet ports to force water through the plurality of apertures and into the combustion chamber to optimize steam generation by the downhole gas generator.
4. The method of claim 1, further comprising the steps of:
providing a plurality of temperature sensors;
positioning the plurality of temperature sensors to determine a plurality of temperatures of the combustion housing, at least one temperature being determined in at least one location of the combustion housing within each of the plurality of annular cooling jacket segments; and
utilizing the temperatures sensed to operably control the flow of water into each of the inlet ports and out of each of the outlet ports.
5. A method for cooling a downhole gas generator, the method comprising the steps of:
providing the downhole gas generator comprising:
a combustion housing forming a combustion chamber having a combustion end and an exhaust end;
a plurality of annular cooling jacket segments surrounding the combustion housing, each of the plurality of annular cooling jacket segments having an inlet port and an outlet port;
a plurality of temperature sensors operably positioned to sense temperatures of the combustion housing adjacent each of the annular cooling jacket segments; and
a plurality of apertures through the combustion housing allowing water to flow from the plurality of annular cooling jacket segments into the combustion chamber;

providing a flow of water into the inlet ports, and out of the outlet ports, of each of the plurality of annular cooling jacket segments, for cooling the downhole gas generator;
regulating the flow of water into the inlet ports, and out of the outlet ports, of each of the plurality of annular cooling jacket segments, responsive to the temperatures sensed by the plurality of temperature sensors, to provide optimal cooling of the downhole gas generator, and to also optimize the flow of water through the plurality of apertures of the combustion housing and into the combustion chamber, to minimize heat damage to the combustion housing.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A load module for a power module, said power module including a housing assembly, said load module including:
an epoxy body;
a number of elongated conductive strands;
each said conductive strand partially disposed in said epoxy body;
each said conductive strand including a conductive member and a limited insulator; and
wherein each said limited insulator is disposed on selected portions of an associated conductive member.
2. The load module of claim 1 wherein said epoxy body is a thermally conductive material.
3. The load module of claim 2 wherein:
each conductive strand is electrically insulated over substantially its entire length; and
each conductive strand is thermally conductively coupled to said epoxy body.
4. The load module of claim 1 wherein each said limited insulator disposed on a limited portion of each said conductive member whereby each said conductive member includes a number of bare portions and a number of insulated portions.
5. The load module of claim 4 wherein:
each said conductive strand includes an embedded portion and an exposed portion;
wherein each said conductive strand bare portion is substantially coextensive with each said conductive strand embedded portion;
wherein each said conductive strand insulated portion is substantially coextensive with each said conductive strand exposed portion; and
wherein each said conductive strand bare portion is directly coupled to said epoxy body.
6. The load module of claim 5 wherein:
each conductive strand includes an exit interface disposed at the surface of said epoxy body; and
wherein each said conductive strand insulated portion extends into said epoxy body at each said conductive strand exit interface.
7. A power module comprising:
a housing assembly defining an enclosed space;
a load module, said load module disposed in said housing assembly;
said load module including an epoxy body and a number of elongated conductive strands;
each said conductive strand partially disposed in said epoxy body;
each said conductive strand including a conductive member and a limited insulator; and
wherein each said limited insulator is disposed on selected portions of an associated conductive member.
8. The power module of claim 7 wherein said epoxy body is a thermally conductive body.
9. The power module of claim 8 wherein:
each conductive strand is electrically insulated over substantially its entire length; and
each conductive strand is thermally conductively coupled to said epoxy body.
10. The power module of claim 8 wherein said epoxy body is directly coupled to said housing assembly.
11. The power module of claim 8 wherein:
said housing assembly includes a number of generally planar sidewalls;
said epoxy body is a generally planar body including a planar outer surface; and
wherein said epoxy body planar outer surface is directly coupled to one said housing assembly.
12. The power module of claim 7 wherein each said limited insulator disposed on a limited portion of each said conductive member whereby each said conductive member includes a number of bare portions and a number of insulated portions.
13. The power module of claim 12 wherein:
each said conductive strand includes an embedded portion and an exposed portion;
wherein each said conductive strand bare portion is substantially coextensive with each said conductive strand embedded portion;
wherein each said conductive strand insulated portion is substantially coextensive with each said conductive strand exposed portion; and
wherein each said conductive strand bare portion is directly coupled to said epoxy body.
14. The power module claim 13 wherein:
each conductive strand includes an exit interface disposed at the surface of said epoxy body; and
wherein each said conductive strand insulated portion extends into said epoxy body at each said conductive strand exit interface.