Author: claimsbot

1. A semiconductor device package comprising:
a containment body defining an interior cavity and an exterior with a plurality of electrical contacts each extending from the interior cavity to the exterior; and
a semiconductor die housed within the interior cavity with a plurality of wire bonds flexibly connecting the semiconductor die to the electrical contacts, wherein the semiconductor is free to move within the interior cavity of the containment body accommodated by flexure of the wire bonds to mitigate packaging stress and strain between the containment body and the semiconductor.
2. A semiconductor device package as recited in claim 1, wherein the interior cavity includes a plurality of interior surfaces and the semiconductor die includes a plurality of die surfaces, each opposed to a respective one of the interior surfaces of the interior cavity, wherein the respective interior surfaces of the interior cavity and the die surfaces are configured and adapted to move relative to one another even when in contact with one another.
3. A semiconductor device package as recited in claim 1, wherein the interior cavity includes a plurality of interior surfaces and a clearance space is defined between the semiconductor die and the interior surfaces, and wherein the clearance space is at least partially filled with a lubricious fluid to facilitate any contacting surfaces between the semiconductor die and the surfaces of the interior cavity moving freely relative to one another.
4. A semiconductor device package as recited in claim 1, wherein there is a clearance between the interior cavity and the semiconductor die sufficient to allow for at least three axes of translational movement of the semiconductor die relative to the interior cavity.
5. A semiconductor device package as recited in claim 4, wherein the clearance is dimensioned to limit movement of the semiconductor die in all three axes relative to the interior cavity so as to maintain positional and spatial alignment and orientation of the semiconductor die relative to external contaiment features to a predetermined degree to protect the wire bonds from damage due to over flexure.
6. A semiconductor device package as recited in claim 1, wherein the containment body includes a base mounted to a cap, wherein the base includes the electrical contacts and at least one surface of the interior cavity, and wherein the cap includes at least one surface of the interior cavity.
7. A semiconductor device package as recited in claim 6, wherein the semiconductor die includes a MEMS pressure sensor, and wherein at least one of the base and cap of the containment body includes an aperture therethrough from the interior cavity to the exterior, the aperture being covered by a diaphragm for communication of ambient pressure to the MEMS pressure sensor.
8. A semiconductor device package comprising:
a containment body defining an interior cavity and an exterior with a plurality of electrical contacts each extending from the interior cavity to the exterior; and
a semiconductor die in electrical communication with the electrical contacts of the containment body by way of a plurality of flexible wire bonds, wherein the wire bonds are the only fixed connection between the containment body and the semiconductor die, wherein the semiconductor die is free to move within the interior cavity of the containment body accommodated by flexure of the wire bonds to mitigate packaging stress and strain between the containment body and the semiconductor die.
9. A semiconductor device package as recited in claim 8, wherein the interior cavity includes a plurality of interior surfaces and the semiconductor die includes a plurality of die surfaces, each opposed to a respective one of the interior surfaces of the interior cavity, wherein the respective interior surfaces of the interior cavity and die surfaces are configured and adapted to move relative to one another even when in contact with one another.
10. A semiconductor device package as recited in claim 8, wherein the interior cavity includes a plurality of interior surfaces and a clearance space is defined between the semiconductor die and the interior surfaces, and wherein the clearance space is at least partially filled with a lubricious fluid to facilitate any contacting surfaces between the semiconductor die and the surfaces of the interior cavity moving freely relative to one another.
11. A semiconductor device package as recited in claim 8, wherein there is a clearance between the interior cavity and the semiconductor die sufficient to allow for at least three axes of translational movement of the semiconductor die relative to the interior cavity.
12. A semiconductor device package as recited in claim 11, wherein the clearance is dimensioned to limit movement of the semiconductor die in all three axes relative to the interior cavity so as to maintain positional and spatial alignment and orientation of the semiconductor die relative to external contaiment features to a predetermined degree to protect the wire bonds from damage due to over flexure
13. A semiconductor device package as recited in claim 8, wherein the containment body includes a base mounted to a cap, wherein the base includes the electrical contacts and at least one surface of the interior cavity, and wherein the cap includes at least one surface of the interior cavity.
14. A semiconductor device package as recited in claim 13, wherein the semiconductor die includes a MEMS pressure sensor, and wherein at least one of the base and cap of the containment body includes an aperture therethrough from the interior cavity to the exterior, the aperture being covered by a diaphragm for communication of ambient pressure to the MEMS pressure sensor.
15. A semiconductor device package comprising:
a containment body defining an interior cavity and an exterior with a plurality of electrical contacts each extending from the interior cavity to the exterior; and
a semiconductor die housed within the interior cavity wherein the semiconductor die is detached from the interior cavity and is free of adherence thereto to mitigate packaging stress and strain between the containment body and the semiconductor die.
16. A semiconductor device package as recited in claim 15, wherein the interior cavity includes a plurality of interior surfaces and the semiconductor die includes a plurality of die surfaces, each opposed to a respective one of the interior surfaces of the interior cavity, wherein the interior surfaces of the interior cavity and the respective die surfaces are configured and adapted to move relative to one another even when in contact with one another.
17. A semiconductor device package as recited in claim 15, wherein the interior cavity includes a plurality of interior surfaces and a clearance space is defined between the semiconductor die and the interior surfaces, and wherein the clearance space is at least partially filled with a lubricious fluid to facilitate any contacting surfaces between the semiconductor die and the surfaces of the interior cavity moving freely relative to one another.
18. A semiconductor device package as recited in claim 15, wherein there is a clearance between the interior cavity and the semiconductor die sufficient to allow for at least three axes of translational movement of the semiconductor die relative to the interior cavity, and wherein the clearance is dimensioned to limit movement of the semiconductor die in all three axes relative to the interior cavity so as to maintain positional and spatial alignment and orientation of the semiconductor die relative to external containment features.
19. A semiconductor device package as recited in claim 15, wherein the containment body includes a base mounted to a cap, wherein the base includes at least one surface of the interior cavity, and wherein the cap includes at least one surface of the interior cavity.
20. A semiconductor device package as recited in claim 15, wherein the semiconductor die includes a MEMS pressure sensor, and wherein at least one of the base and cap of the containment body includes an aperture therethrough from the interior cavity to the exterior, the aperture being covered by a diaphragm for communication of ambient pressure to the MEMS pressure sensor.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A media over packet networking appliance comprising:
A. a network interface;
B. an audio transducer; and
C. at least one integrated circuit assembly coupling the audio transducer to the network interface, the at least one integrated circuit assembly providing media over packet transmissions and including a processor circuit and a packet network path diversity software stack, the packet network path diversity software stack including instructions implementing a process of sending real-time information including:
i. generating in the integrated circuit assembly first packets containing the real-time information, and also containing a first particular address of the destination, and further containing a second particular address of a first proxy computer;
ii. generating dependent packets containing information dependent on the real-time information, and also containing the first particular address of the destination, and further containing a third particular address of a second proxy computer; and
iii. sending the first packets and the dependent packets.
2. The media over packet networking appliance of claim 1 further including a speech encoder coupled to the processor circuit.
3. The media over packet networking appliance of claim 1 further including a speech encoder and wherein the packet network path diversity software stack includes an interface block and a networking block establishing two or more software objects respectively representing diverse network connections, the interface block coupling the speech encoder concurrently to the processor circuit.
4. The media over packet networking appliance of claim 1 further including a voice over packet control coupled to the processor circuit.
5. The media over packet networking appliance of claim 1 further including a feeder software block coupled to the networking block wherein the feeder software block couples to two or more software objects when the software objects are established.
6. The media over packet networking appliance of claim 5 further including a decoder coupled to the feeder software block to receive packets of real time information and dependent packets dependent on the real time information.
7. The media over packet networking appliance of claim 1 wherein the integrated circuit assembly comprises a digital signal processor and the packet network path diversity software stack comprises a block of software instructions executable at least in part by the digital signal processor.
8. The media over packet networking appliance of claim 1 wherein the integrated circuit assembly comprises processor circuitry and a non-volatile memory storing instructions establishing the packet network path diversity software stack for execution by the processor circuitry.
9. The media over packet networking appliance of claim 1 further including a television set enclosure holding a television electronics and display assembly and a user interface both coupled to the integrated circuit assembly.
10. The media over packet networking appliance of claim 1 wherein the network interface includes a wireless interface unit coupled to the integrated circuit assembly.
11. The media over packet networking appliance of claim 1 further including a set top box enclosure and wherein the network interface includes a cable modem coupled to the integrated circuit assembly.
12. The media over packet networking appliance of claim 1 further including a wearable mobile enclosure holding a user interface coupled to the integrated circuit assembly.
13. The media over packet networking appliance of claim 1 further including a home appliance enclosure holding a tactile user interface coupled to the integrated circuit assembly.
14. The media over packet networking appliance of claim 1 further including an automotive accessory enclosure holding a user interface coupled to the integrated circuit assembly.
15. The media over packet networking appliance of claim 1 further including a compressed-image packet interface coupled to the integrated circuit assembly and an image display coupled to the integrated circuit assembly.

1. A method to determine signal propagation time between nodes in an ad-hoc communications network, said nodes being adapted to transmit and receive signals to and from other nodes in said ad-hoc network, the method comprising:
controlling a first node of said plurality to receive at least one signal communicated from a second node, and to calculate a response based on said signal;
controlling said first node to calculate an auto-correlation function of said response, and to calculate an approximate peak value of a quadratic approximation based on said auto-correlation function;
controlling said first node to determine a signal sampling phase offset between said response and said approximate peak value and in response, to calculate an actual peak value of said response; and
controlling said first node to calculate an actual reception time for said at least one signal at said first node based on said actual peak value, and to determine, based on said actual reception time, a signal propagation time.
2. A method as claimed in claim 1, further comprising:
controlling said first node to calculate said response based on an application of a square-root raised-cosine pulse shaping and chip-matched filter on a direct sequence spreading waveform of said signal to produce at least one square-root raised cosine function.
3. A method as claimed in claim 2, wherein:
said response comprises a superposed multiplication of each said square-root raised cosine function.
4. A method as claimed in claim 1, further comprising: controlling said first node to calculate said auto-correlation function of said response wherein said auto-correlation function is based on the following equation:
p
RC

\u2061

(
t
)
=
cos
\u2061

(

\u03c0\u03b1
\u2061
t

2
\u2062

T
c
)
(

1
–
2
\u2062

\u03b1
\u2061

(

t

2
\u2062

T
c
)
2
)
\u2062
sin
\u2061

(

\u03c0
\u2061

(

t

2
\u2062

T
c
)
)
(

\u03c0
\u2061

(

t

2
\u2062

T
c
)
)
2
wherein Tc is a chip period value and \u03b1 is an alpha filter parameter.
5. A method as claimed in claim 1, further comprising:
controlling said first node to calculate said approximate peak value of said quadratic approximation wherein said quadratic approximation is based on the following equation:
Y=A(t2)+B(t)+C.
6. A method as claimed in claim 1, further comprising:
controlling said first node to calculate said approximate peak value of said quadratic approximation wherein said approximate peak value is based on the following equation:
\u03b4
=
–

1
2
\u2062

(
y
+

–

y
–
y
+

+

y
–

–

2
\u2062

y
0
)
wherein y\u2212, y+ and Y0 are a first, second and third equidistant point located on said quadratic approximation.
7. A method as claimed in claim 1, further comprising:
controlling said first node to calculate said sampling phase offset wherein said sampling phase offset is based on the following equation:
\u03b4\u2032=\u03b4(a\u2212b|\u03b4|)
wherein \u03b4 is said approximate peak value of said quadratic approximation, and \u03b4\u2032 is said sampling phase offset; and
controlling said first node to calculate said actual peak value of response based on said approximate peak value and said sampling phase offset.
8. A system to determine signal propagation time between nodes in an ad-hoc communications network, said nodes being adapted to transmit and receive signals to and from other nodes in said ad-hoc network, the system comprising:
a controller, adapted to control a first node of said plurality to receive at least one signal communicated from a second node, and to calculate a response based on said signal;
said controller being further adapted to control said first node to calculate an auto-correlation function of said response, and to calculate an approximate peak value of a quadratic approximation based on said auto-correlation function;
said controller being further adapted to control said first node to determine a signal sampling phase offset between said response and said approximate peak value and in response, to calculate an actual peak value of said response; and
said controller being further adapted to control said first node to calculate an actual reception time for said at least one signal at said first node based on said actual peak value, and to determine, based on said actual reception time, a signal propagation time.
9. A system as claimed in claim 8, wherein: said controller is adapted to control said first node to calculate said response based on an application of a square-root raised-cosine pulse shaping and chip-matched filter on a direct sequence spreading waveform of said signal to produce at least one square-root raised cosine function.
10. A system as claimed in claim 9, wherein:
said response comprises a superposed multiplication of each said square-root raised cosine function.
11. A system as claimed in claim 8, wherein:
said controller is adapted to control said first node to calculate said auto-correlation function of said response wherein said auto-correlation function is based on the following equation:
p
RC

\u2061

(
t
)
=
cos
\u2061

(

\u03c0\u03b1
\u2061
t

2
\u2062

T
c
)
(

1
–
2
\u2062

\u03b1
\u2061

(

t

2
\u2062

T
c
)
2
)
\u2062
sin
\u2061

(

\u03c0
\u2061

(

t

2
\u2062

T
c
)
)
(

\u03c0
\u2061

(

t

2
\u2062

T
c
)
)
2
wherein Tc is a chip period value and \u03b1 is an alpha filter parameter.
12. A system as claimed in claim 8, wherein:
said controller is adapted to control said first node to calculate said approximate peak value of said quadratic approximation wherein said quadratic approximation is based on the following equation:
Y=A(t2)+B(t)+C.
13. A system as claimed in claim 8, wherein:
said controller is adapted to control said first node to calculate said approximate peak value of said quadratic approximation wherein said approximate peak value is based on the following equation:
\u03b4
=
–

1
2
\u2062

(
y
+

–

y
–
y
+

+

y
–

–

2
\u2062

y
0
)
wherein y\u2212, y+ and y0 are a first, second and third equidistant point located on said quadratic approximation.
14. A system as claimed in claim 8, wherein:
said controller is adapted to control said first node to calculate said sampling phase offset wherein said sampling phase offset is based on the following equation:
\u03b4\u2032=\u03b4(a\u2212b|\u03b4|)
wherein \u03b4 is said approximate peak value of said quadratic approximation, and \u03b4\u2032 is said sampling phase offset; and
controlling said first node to calculate said actual peak value of said response based on said approximate peak value and said sampling phase offset.
15. A computer-readable medium of instructions, adapted to determine signal propagation time between nodes in an ad-hoc communications network, said nodes being adapted to transmit and receive signals to and from other nodes in said ad-hoc network, comprising:
a first set of instructions, adapted to control a first node of said plurality to receive at least one signal communicated from a second node, and to calculate a response based on said signal;
a second set of instructions, adapted to control said first node to calculate an auto-correlation function of said response, and to calculate an approximate peak value of a quadratic approximation based on said auto-correlation function;
a third set of instructions, adapted to control said first node to determine a signal sampling phase offset between said response and said approximate peak value and in response, to calculate an actual peak value of response; and
a fourth set of instructions, adapted to control said first node to calculate an actual reception time for said at least one signal at said first node based on said actual peak value, and to determine a signal propagation time based on said actual reception time.
16. A computer-readable medium of instructions as claimed in claim 15, wherein:
said first set of instructions is adapted to control said first node to calculate said response based on an application of a square-root raised-cosine pulse shaping and chip-matched filter on a direct sequence spreading waveform of said signal to produce at least one square-root raised cosine function.
17. A computer-readable medium of instructions as claimed in claim 16, wherein:
said response comprises a superposed multiplication of each said square-root raised cosine function.
18. A computer-readable medium of instructions as claimed in claim 15, wherein:
said second set of instructions is adapted to control said first node to calculate said auto-correlation function of said response wherein said auto-correlation function is based on the following equation:
p
RC

\u2061

(
t
)
=
cos
\u2061

(

\u03c0\u03b1
\u2061
t

2
\u2062

T
c
)
(

1
–
2
\u2062

\u03b1
\u2061

(

t

2
\u2062

T
c
)
2
)
\u2062
sin
\u2061

(

\u03c0
\u2061

(

t

2
\u2062

T
c
)
)
(

\u03c0
\u2061

(

t

2
\u2062

T
c
)
)
2
wherein Tc is a chip period value and \u03b1 is an alpha filter parameter.
19. A computer-readable medium of instructions as claimed in claim 15, wherein:
said second set of instructions is adapted to control said first node to calculate said approximate peak value of said quadratic approximation wherein said quadratic approximation is based on the following equation:
Y=A(t2)+B(t)+C.
20. A computer-readable medium of instructions as claimed in claim 15, wherein:
said second set of instructions is adapted to control said first node to calculate said approximate peak value of said quadratic approximation wherein said approximate peak value is based on the following equation:
\u03b4
=
–

1
2
\u2062

(
y
+

–

y
–
y
+

+

y
–

–

2
\u2062

y
0
)
wherein y\u2212, y+and Y0 are a first, second and third equidistant point located on said quadratic approximation.
21. A computer-readable medium of instructions as claimed in claim 15, wherein:
said third set of instructions is adapted to control said first node to calculate said sampling phase offset wherein said sampling phase offset is based on the following equation:
\u03b4\u2032=\u03b4(a\u2212b|\u03b4|)
wherein \u03b4 is said approximate peak value of said quadratic approximation, and \u03b4\u2032 is said sampling phase offset; and
said third set of instructions being further adapted to control said first node to calculate said actual peak value of said response based on said approximate peak value and said sampling phase offset.
22. A method as claimed in claim 1, wherein said response is a raised-cosine filtered pulse response.
23. A system as claimed in claim 8, wherein said response is a raised-cosine filtered pulse response.
24. A computer-readable medium of instructions as claimed in claim 15, wherein said response is a raised-cosine filtered pulse response.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A mobile terminal comprising:
a short range communication module; and
a controller configured to:
pair with a plurality of short range portable wireless devices communicatively coupled with the mobile terminal, wherein the plurality of short range portable wireless devices comprise a first short range portable wireless device and a second short range portable wireless device;
simultaneously forward multi-media data to the first short range portable wireless device and the second short range portable wireless device when the multi-media data is processed by the mobile terminal;
forward a notification of an incoming call to the first short range portable wireless device in response to a receipt of the incoming call; and
establish a voice communication link with the first short range portable wireless device to process the incoming call in response to an input thereof, wherein the second short range portable wireless device is configured to seamlessly process the multi-media data while the first short range portable wireless device is in the voice communication link with the mobile terminal.
2. The mobile terminal of claim 1, wherein the controller is preconfigured to establish the voice communication link with the first short range portable wireless device among the plurality of short range portable wireless devices.
3. The mobile terminal of claim 2, wherein the controller is further configured to establish an additional voice communication link with the second short range portable wireless device to process the incoming call in response to an input thereof.
4. The mobile terminal of claim 2, wherein the controller is further configured to establish an additional voice communication link with the second short range portable wireless device to process an additional incoming call in response to an input thereof.
5. The mobile terminal of claim 2, wherein the controller is further configured to switch the voice communication link from the first short range portable wireless device to the second short range portable wireless device in response to an input thereof.
6. The mobile terminal of claim 1, wherein the controller is preconfigured to forgo the voice communication link with the second short range portable wireless device.
7. The mobile terminal of claim 1, further comprising a display unit.
8. The mobile terminal of claim 7, wherein the controller is further configured to display on the display unit information related to the incoming call and the first short range portable wireless device.
9. The mobile terminal of claim 7, wherein the controller is further configured to display on the display unit an option to switch the call to at least one of the plurality of short range portable wireless devices sans the first short range portable wireless device.
10. The mobile terminal of claim 9, further comprising a touch screen integrated to the display unit, wherein the touch screen is configured to receive an input selecting the at least one of the plurality of short range portable wireless devices sans the first short range portable wireless device.
11. The mobile terminal of claim 10, further comprising an input unit, wherein the controller is further configured to process the input for connecting the voice communication link with the first short range portable wireless device when the input is received via the input unit.
12. The mobile terminal of claim 11, wherein the input comprises a touch on the touch screen.
13. The mobile terminal of claim 11, wherein the input is generated by an acknowledge signal forwarded from the first short range portable wireless device.
14. The mobile terminal of claim 1, wherein the notification comprises an alert sound.
15. The mobile terminal of claim 1, wherein the plurality of short range portable wireless devices comprise a BLUETOOTH device.
16. A method performed by a mobile terminal communicating with short range wireless devices, the method comprising:
pairing with a plurality of short range portable wireless devices communicatively coupled with the mobile terminal, wherein the plurality of short range portable wireless devices comprise a first short range portable wireless device and a second short range portable wireless device;
simultaneously forwarding multi-media data to the first short range portable wireless device and the second short range portable wireless device when the multi-media data is processed by the mobile terminal;
forwarding a notification of an incoming call to the first short range portable wireless device in response to a receipt of the incoming call; and
establishing a voice communication link with the first short range portable wireless device in response to an input thereof to process the incoming call, wherein the second short range portable wireless device is configured to seamlessly process the multi-media data while the first short range portable wireless device is in the voice communication link with the mobile terminal.
17. The method of claim 16, wherein the mobile terminal is preconfigured to establish the voice communication link with the first short range portable wireless device among the plurality of short range portable wireless devices.
18. The method of claim 17, further comprising establishing an additional voice communication link with the second short range portable wireless device to process the incoming call in response to an input thereof.
19. The method of claim 17, further comprising switching the voice communication link from the first short range portable wireless device to the second short range portable wireless device in response to an input thereof.
20. The method of claim 17, further comprising establishing an additional voice communication link with the second short range portable wireless device to process an additional incoming call in response to an input thereof.
21. The method of claim 16, wherein the mobile terminal is preconfigured to forgo the voice communication link with the second short range portable wireless device.
22. The method of claim 16, further comprising displaying information related to the incoming call and the first short range portable wireless device.
23. The method of claim 16, further comprising displaying an option to switch the call to at least one of the plurality of short range portable wireless devices sans the first short range portable wireless device.
24. The method of claim 23, further comprising receiving an input selecting the at least one of the plurality of short range portable wireless devices sans the first short range portable wireless device.
25. The method of claim 24, further comprising processing the input for connecting the voice communication link with the first short range portable wireless device when the input is received via the input unit.
26. The method of claim 16, wherein the input comprises a touch input applied on the mobile terminal.
27. The method of claim 16, wherein the input is generated by an acknowledge signal forwarded from the first short range portable wireless device.
28. The method of claim 16, wherein the notification comprises an alert sound.
29. The method of claim 16, further comprising displaying information related to an outgoing call and the plurality of short range portable wireless devices when a phone number is entered or a contact is selected to place the outgoing call.
30. The method of claim 16, further comprising:
displaying a list of short range portable wireless devices available for connecting an outgoing call; and
establishing a communication link with at least one of the short range portable wireless devices in the list to process the outgoing call when the at least one of the short range portable wireless devices is selected from the list.
31. The method of claim 16, wherein the plurality of short range portable wireless devices comprise a BLUETOOTH device.