Author: claimsbot

1. A seed of the hybrid corn variety CH760284, produced by crossing a first plant of variety CV700979 with a second plant of variety CV785802, wherein representative seed of said varieties CV700979 and CV785802 have been deposited under ATCC Accession numbers PTA-11782 and PTA-10142, respectively.
2. A plant of the hybrid corn variety CH760284 grown from the seed of claim 1.
3. A plant part of the plant of claim 2.
4. The plant part of claim 3, further defined as an ear, ovule, pollen or cell.
5. A composition comprising the seed of claim 1 comprised in plant seed growth media.
6. The composition of claim 5, wherein the growth media is soil or a synthetic cultivation medium.
7. The seed of claim 1, further comprising at least a first transgene.
8. The seed of claim 7, wherein the transgene confers a trait selected from the group consisting of male sterility, herbicide tolerance, insect resistance, disease resistance, waxy starch, modified fatty acid metabolism, modified phytic acid metabolism, modified carbohydrate metabolism and modified protein metabolism.
9. A method of producing hybrid corn seed comprising crossing a plant of variety CV700979 with a plant of variety CV785802, wherein representative seed of variety CV700979 and variety CV785802 have been deposited under ATCC Accession numbers PTA-11782 and PTA-10142, respectively.
10. A seed of the hybrid corn variety CH760284 comprising at least a first single locus conversion, produced by crossing a first plant of variety CV700979 with a second plant of variety CV785802, wherein representative seed of said varieties CV700979 and CV785802 have been deposited under ATCC Accession numbers PTA-11782 and PTA-10142, respectively, and wherein one or both of the first plant and second plant comprises the single locus conversion.
11. The seed of claim 10, wherein the single locus conversion confers a trait selected from the group consisting of male sterility, herbicide tolerance, insect resistance, disease resistance, waxy starch, modified fatty acid metabolism, modified phytic acid metabolism, modified carbohydrate metabolism and modified protein metabolism.
12. A plant grown from the seed of claim 10.
13. A method of introducing a heritable trait into hybrid corn variety CH760284 comprising the steps of:
(a) introducing at least a first heritable trait into at least one inbred corn variety selected from the group consisting of variety CV700979 and variety CV785802 to produce a plant of the first inbred corn variety that heritably carries the trait, wherein the heritable trait is introduced into said first inbred corn variety by backcrossing and wherein representative samples of seed of variety CV700979 and variety CV785802 have been deposited under ATCC Accession numbers PTA-11782 and PTA-10142, respectively; and
(b) crossing a plant of the first inbred corn variety that heritably carries the trait with a plant of a different variety selected from said group consisting of CV700979 and CV785802 to produce a plant of hybrid corn variety CH760284 comprising the heritable trait.
14. The method of claim 13, wherein the trait is selected from the group consisting of male sterility, herbicide tolerance, insect resistance, disease resistance, waxy starch, modified fatty acid metabolism, modified phytic acid metabolism, modified carbohydrate metabolism and modified protein metabolism.
15. The method of claim 14, further comprising repeating step (a) at least once to introduce at least a second heritable trait into hybrid corn variety CH760284, wherein the second heritable trait is selected from the group consisting of male sterility, herbicide tolerance, insect resistance, disease resistance, waxy starch, modified fatty acid metabolism, modified phytic acid metabolism, modified carbohydrate metabolism and modified protein metabolism.
16. A plant produced by the method of claim 13, wherein said plant comprises the heritable trait and otherwise comprises essentially all of the morphological and physiological characteristics of hybrid corn variety CH760284.
17. A method of producing a corn plant derived from the hybrid corn variety CH760284, wherein the method comprises crossing the plant of claim 2 with a second corn plant to produce a progeny corn plant derived from the hybrid corn variety CH760284.
18. The method of claim 17, further comprising the steps of:
(a) crossing the progeny corn plant derived from the hybrid corn variety CH760284 with itself or a second plant to produce a seed of a progeny plant of a subsequent generation;
(b) growing a progeny plant of a subsequent generation from the seed and crossing the progeny plant of a subsequent generation with itself or a second plant; and
(c) repeating steps (a) and (b) for at least an additional 3-10 generations to produce a corn plant further derived from the hybrid corn variety CH760284.
19. The method of claim 18, further comprising the step of:
(d) crossing the corn plant further derived from the hybrid corn variety CH760284 with a second, distinct corn plant.
20. A method of producing a commodity plant product comprising obtaining the plant of claim 2 or a part thereof and producing said commodity plant product therefrom.
21. The method of claim 20, wherein the commodity plant product is grain, starch, seed oil, corn syrup or protein.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

What is claimed is:

1. An electroless plating apparatus comprising:
a substrate holding unit configured to hold a substrate;
a plate disposed to face the substrate held by said substrate holding unit;
a treatment liquid jetting portion formed in said plate and configured to jet a treatment liquid;
a bubble discharge portion formed in said plate and configured to discharge a bubble in the treatment liquid held between said plate and the substrate; and
an interval adjusting unit configured to vary an interval between said plate and the substrate.
2. The electroless plating apparatus as set forth in claim 1,
wherein said bubble discharge portion has an opening formed on said plate and a pipe connected to the opening.
3. The electroless plating apparatus as set forth in claim 2,
wherein said plate has a slope formed thereon in a direction toward the opening.
4. The electroless plating apparatus as set forth in claim 3,
wherein the slope has an angle of 2 or more relative to a surface of said plate.
5. The electroless plating apparatus as set forth in claim 2,
wherein said plate has a groove formed thereon and the opening is disposed in the groove.
6. The electroless plating apparatus as set forth in claim 5,
wherein the groove has a slope on a side face thereof in a direction toward the opening.
7. The electroless plating apparatus as set forth in claim 6,
wherein the slope has an angle of 2 or more relative to a surface of said plate.
8. The electroless plating apparatus as set forth in claim 2, further comprising:
a gasliquid separator connected to the pipe.
9. The electroless plating apparatus as set forth in claim 2, further comprising:
a pressure reducing unit configured to reduce a pressure in the pipe.
10. The electroless plating apparatus as set forth in claim 2, further comprising:
a rinsing liquid injecting unit configured to inject a rinsing liquid into the pipe.
11. An electroless plating method, comprising:
placing a plate and a substrate to be adjacent to and face each other, the plate including a treatment liquid jetting portion configured to jet a treatment liquid and a bubble discharge portion configured to discharge a bubble in the treatment liquid;
jetting the treatment liquid from the treatment liquid jetting portion to form a layer of the treatment liquid between the plate and the substrate; and
discharging the bubble in the layer of the treatment liquid from the bubble discharge portion during the supply of the treatment liquid.
12. The electroless plating method as set forth in claim 11,
wherein the bubble discharge portion has an opening formed on the plate and a pipe connected to the opening.
13. The electroless plating method as set forth in claim 12,
wherein the plate has a slope formed thereon in a direction toward the opening.
14. The electroless plating method as set forth in claim 13,
wherein the slope has an angle of 2 or more relative to a surface of the plate.
15. The electroless plating method as set forth in claim 12,
wherein the plate has a groove formed thereon and the opening is disposed in the groove.
16. The electroless plating as set forth in claim 15,
wherein the groove has a slope on a side face thereof in a direction toward the opening.
17. The electroless plating method as set forth in claim 16,
wherein the slope has an angle of 2 or more relative to a surface of the plate.
18. The electroless plating method as set forth in claim 12, further comprising
separating gas and liquid from each other by a gasliquid separator connected to the pipe.
19. The electroless plating method as set forth in claim 12, further comprising:
reducing a pressure in the pipe by a pressure reducing unit.
20. The electroless plating method as set forth in claim 12, further comprising:
injecting a rinsing liquid into the pipe by a rinsing liquid injecting unit.

What is claimed is:

1. An interface apparatus for mediating the sendingreceiving of signals between a plurality of devices that are mutually connected by a signal line having at least one pair of signal transmission lines, the interface apparatus comprising:
a signal relay section for relaying electric signals that are transferred via the signal line between the devices;
a connection determination section for determining, on the basis of signal voltage in each signal transmission line of the signal line, whether or not the devices are connected; and
a connection control section for incapacitating, when it has been determined by the connection determination section that the devices are connected, the signal relay section until the devices move to a state in which it is possible to mutually sendreceive the signals.
2. An interface apparatus for mediating the sendingreceiving of signals between a plurality of devices that are mutually connected by a signal line having at least one pair of signal transmission lines, the interface apparatus comprising:
a signal relay section for relaying electric signals that are transferred via the signal line between the devices;
a connection determination section for determining, on the basis of signal voltage in each signal transmission line of the signal line, whether or not the devices are connected; and
a connection control section for stopping, when it has been determined by the connection determination section that the devices are connected, power supply to the signal relay section until the devices move to a state in which it is possible to mutually sendreceive the signals.
3. An interface apparatus for mediating the sendingreceiving of signals between a plurality of devices that are mutually connected by a signal line having at least one pair of signal transmission lines, the interface apparatus comprising:
a signal relay section for relaying, when a differential voltage is within a predetermined value range, electric signals that are transferred via the signal line between the devices, the differential voltage value being a difference in respective signal voltages in the pair of signal transmission lines;
a connection determination section for determining, on the basis of the signal voltage in each signal transmission line of the signal line, whether or not the devices are connected; and
a connection control section for setting, when it has been determined by the connection determination section that the devices are connected, the differential voltage in each signal transmission line of the signal line to be outside the predetermined value range until the devices move to a state in which it is possible to mutually sendreceive the signals.
4. The interface apparatus of claim 1, wherein each of the signal relay section, the connection determination section and the connection control section has a specification that conforms to the USB standard.
5. The interface apparatus of claim 2, wherein each of the signal relay section, the connection determination section and the connection control section has a specification that conforms to the USB standard.
6. The interface apparatus of claim 3, wherein each of the signal relay section, the connection determination section and the connection control section has a specification that conforms to the USB standard.
7. The interface apparatus of claim 1, wherein the signal line comprises a USB cable.
8. The interface apparatus of claim 2, wherein the signal line comprises a USB cable.
9. The interface apparatus of claim 3, wherein the signal line comprises a USB cable.
10. The interface apparatus of claim 1, wherein the devices include a host PC and at least one peripheral device, the at least one peripheral device conducting initialization processing immediately after power has been supplied thereto, with the peripheral device being unable to send signals to or receive signals from the host PC for a predetermined period of time until the initialization processing has been concluded.
11. The interface apparatus of claim 2, wherein the devices include a host PC and at least one peripheral device, the at least one peripheral device conducting initialization processing immediately after power has been supplied, with the peripheral device being unable to send signals to or receive signals from the host PC for a predetermined period of time until the initialization processing has been concluded.
12. The interface apparatus of claim 3, wherein the devices include a host PC and at least one peripheral device, the at least one peripheral device conducting initialization processing immediately after power has been supplied thereto, with the peripheral device being unable to send signals to or receive signals from the host PC for a predetermined period of time until the initialization processing has been concluded.
13. The interface apparatus of claim 1, wherein the interface apparatus is disposed in one of the devices.
14. The interface apparatus of claim 2, wherein the interface apparatus is disposed in one of the devices.
15. The interface apparatus of claim 3, wherein the interface apparatus is disposed in one of the devices.
16. The interface apparatus of claim 1, wherein the devices include a host PC and a peripheral device for sending signals to and receiving signals from the host PC, with the interface apparatus being disposed in the peripheral device.
17. The interface apparatus of claim 2, wherein the devices include a host PC and a peripheral device for sending signals to and receiving signals from the host PC, with the interface apparatus being disposed in the peripheral device.
18. The interface apparatus of claim 3, wherein the devices include a host PC and a peripheral device for sending signals to and receiving signals from the host PC, with the interface apparatus being disposed in the peripheral device.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1-2. (canceled)
3. An assembly method of a plurality of types of vehicle bodies for assembling main parts and subparts onto vehicle bodies on a single main line while conveying the vehicle bodies comprising the steps of:
assembling in a main process first main parts, which are common to all types of vehicle bodies, and second main parts, which are not common to all types of vehicles but whose assembly can be accommodated by absorbing a difference in assembly man-hours depending on the vehicle type;
assembling in a subprocess third main parts, which are not common to all types of vehicles and whose assembly cannot be accommodated by absorbing the difference in man-hour due to the vehicle type, as a unit of parts;
supplying to the main process first subparts, which can be assembled synchronously with the main line, after assembled in a sub-main process;
storing after sub-assembling in a non-synchronous process subparts, which cannot be assembled synchronously with the main line, and said third main parts, whose assembly cannot be accommodated by absorbing deviation due to the vehicle type; and
supplying said sub-assembled parts to the sub-main process and to the main process.
4. A method for assembling a plurality of types of vehicle bodies according to claim 1, wherein, the differences in assembly man-hours of the second main parts due to difference in the vehicle type, whose assembly can be accommodated while conveying on the main line, are absorbed by methods such as use of the assembly jigs, improvement of the assembly operation, and adoption of an automatic process and unification of specifications.
5. (canceled)