Author: claimsbot

1. An integrated circuit memory comprising:
a plurality of storage elements arranged in rows and columns;
a plurality of word lines, each word line connected to a respective row of storage elements and being connected to a respective address decoder;
a plurality of address lines extending from address circuitry to said address decoders, each address decoder being connected to a certain combination of said address lines representing a certain address value to which the address decoder responds to assert its associated word line,
wherein said address decoders are connected to said address lines in a manner such that only one of said address lines is connected to adjacent ones of said address decoders.
2. An integrated circuit memory according to claim 1 wherein said address decoders are connected to said address lines such that the average propagation delay of said address lines is substantially equal.
3. An integrated circuit memory according to claim 1, wherein the address lines are organised in pairs, each pair having a true address line and a complementary address line.
4. An integrated circuit memory according to claim 1, wherein said address lines extend substantially perpendicular to said word lines.
5. An integrated circuit memory according to claim 1, wherein the address decoders are connected such that all address lines except one are alternated between successive decoders.
6. A method of manufacturing an integrated circuit memory comprising: a plurality of storage elements arranged in rows and columns; a plurality of word lines, each word line connected to a respective row of storage elements and being connected to a respective address decoder; and a plurality of address lines extending from address circuitry to said address decoders, the method comprising:
connecting each of said address decoders to a certain combination of address lines representing a certain address value to which that address decoder responds, wherein said connecting step is carried out so as to connect only one of said address lines to adjacent ones of the address decoders.
7. A method according to claim 6, which comprises the step of determining the average propagation delay for the address lines prior to implementing the connecting step.
8. A method of manufacturing an integrated circuit memory according to claim 7, wherein said address decoders are connected whereby the average propagation delay of said address lines is substantially equal.
9. A method of determining the connections between a plurality of address decoders and a plurality of address lines in a memory array, said method comprising:
denoting n pairs of address bits, wherein the nth pair of address bits are the least significant bits of an address word;
defining n operations of said n pairs of address bits, each operation changing the value of the address word when performed on said address word, wherein each Kth operation, where K is an integer between 1 and n, comprises incrementing the Kth pair of address bits by one term of a 2 bit Gray code and inverting the remaining pairs of address bits;
performing said n operations in a predetermined sequence wherein operation (K1) is performed every 4K operations, otherwise operation 1 is performed, where K increments from 1 to (n1), whereby a sequence of address words is generated wherein only a single bit has the same value for adjacent address words in said generated sequence of address words.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. (canceled)
2. A protective cover for a limb comprising:
a tubular member having a proximal end and a distal end;
a plurality of tubular extensions disposed on the distal end of the tubular member wherein the tubular extensions have a first end and a second end wherein the first end of the tubular extensions is closed and the second end of the tubular extensions is in fluid communication with the tubular member;
a limb opening disposed at the proximal end of the tubular member wherein the limb opening has an inner circumference;
an adhesive strip disposed on the inner circumference of the limb opening; and
a layer of non-adhesive material removably attached to the adhesive strip.
3. The protective cover of claim 2, wherein the protective cover is water-impermeable.
4. The protective cover of claim 2, wherein the protective cover is disposable.
5. The protective cover of claim 2, wherein the protective cover is plastic.
6. The protective cover of claim 2, wherein the tubular extensions are adapted for encasing the fingers and thumb of the hand.
7. The protective cover of claim 2, wherein the tubular extensions are adapted for encasing the toes of the foot.
8. The protective cover of claim 2, wherein the adhesive strip adheres to a subject’s skin.
9. The protective cover of claim 2, wherein the adhesive strip is water-resistant.

What is claimed is:

1. A laser processing apparatus for performing light ablation process using laser beam from a laser oscillator continuously emitting light pulse having large spatial and temporal energy concentration at pulse emission time of 1 pico second or less, comprising:
beam dividing means for dividing laser beam from said laser oscillator into plural beams, and optical systems provided separately for each of said divided beams, wherein
plural processing portions are processed together by irradiating laser to plural processing portions at a time through said optical systems.
2. A laser processing apparatus according to claim 1, wherein said beam dividing means is means for dividing the energy intensity of said laser beam into plural stages, and said energy intensity is equally divided by Nth power of 2 (N being an integer) or divided by an arbitral ratio of energy intensity into multiple stages, not necessarily limited to said equal division.
3. A laser processing apparatus according to claim 1, wherein said beam dividing means is provided with a wavelength plate for changing the states of light polarization and a polarization beam splitter, and structured to divide said laser beam by separating laser beam from said laser oscillator to vertically polarized wave and horizontally polarized wave by use of said means.
4. A laser processing apparatus according to claim 1, wherein said beam dividing means is structured to divide said laser beam by separating laser beam from said laser oscillator by use of a beam splitter for non-polarized light.
5. A laser processing apparatus according to claim 1, wherein said laser oscillator continuously emitting light pulse of large spatial and temporal energy concentration at pulse emission time of 1 pico second or less is a laser oscillator having a space compression device for light propagation.
6. A laser processing apparatus according to claim 5, wherein said space compression device for light propagation comprises means for generating chirped pulse and vertical mode synchronizing means utilizing light wavelength dispersion characteristics.
7. A laser processing apparatus according to claim 1, wherein said laser beam emitted at pulse emission time of 1 pico second or less is laser being oscillated in single mode for the horizontal mode therefor.
8. A laser processing method for performing light ablation process using laser beam from a laser oscillator continuously emitting light pulse having large spatial and temporal energy concentration at pulse emission time of 1 pico second or less, comprising the following steps of:
dividing laser beam from said laser oscillator into plural beams; and
processing plural processing portions altogether by irradiating laser to plural processing portions simultaneously through individual optical system per divided beam.
9. A laser processing method according to claim 8, wherein said laser beam division is provided with a step to separate energy intensity of said laser beam into plural stages, and effectuated by equally dividing said energy intensity to Nth power of 2 (N being integer) or multiply dividing said energy intensity by arbitral energy intensity coefficient, not necessarily limited to said equal division.
10. A laser processing method according to claim 8, wherein said laser beam division is effectuated by the separation of vertically polarized wave and horizontally polarized wave using wavelength plate for changing the states of polarization and polarized light beam splitter.
11. A laser processing method according to claim 8, wherein said laser beam division is effectuated by separating laser beam from said laser oscillator by use of a beam splitter for non-polarized light.
12. A laser processing method according to claim 8, wherein said processing of plural processing portions altogether is a processing of a work piece of one and the same material in one and the same processing shape or a processing of work pieces of different materials in different processing shapes.
13. A laser processing method according to claim 8, wherein said laser oscillator continuously emitting light pulse of large spatial and temporal energy concentration at pulse emission time of 1 pico second or less is a laser oscillator having a space compression device for light propagation.
14. A laser processing method according to claim 13, wherein said space compression device for light propagation comprises means for generating chirped pulse and vertical mode synchronizing means utilizing light wavelength dispersion characteristics.
15. A laser processing method according to claim 8, wherein said laser beam emitted at pulse emission time of 1 pico second or less is laser being oscillated in single mode for the horizontal mode therefor.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A glass coating method comprising coating a glass bottle with a glass coating agent while maintaining the temperature of the glass 450 to 750\xb0 C. to form a metal oxide layer on the surface of the glass, wherein said glass coating agent comprises a metallic compound represented by formula (I):
R1k-mM(OCOR2)m\u2003\u2003(I)

wherein M represents a metal atom selected from the group consisting of tin, titanium, indium, silicon, zirconium, and aluminum;
R1 represents a straight-chain, branched, or cyclic alkyl, alkenyl, or aryl group having 1 to 6 carbon atoms;
R2 represents a branched alkyl group having 3 to 6 carbon atoms;
k is a number representing the valence of the metal atom M, and
m is 2, and
wherein said glass coating agent is in the form of a liquid, in the form of a dispersion or solution in a solvent, or in the form of a gas.
2. A glass coating method comprising coating a glass plate with a glass coating agent while maintaining the temperature of the glass at 450 to 750\xb0 C. to form a metal oxide layer on the surface of the glass, wherein said glass coating agent comprises a metallic compound represented by formula (1):
R1k-mM(OCOR2)m\u2003\u2003(I)

wherein M represents a metal atom selected from the group consisting of tin, titanium, indium, silicon, zirconium, and aluminum;
R1 represents a straight-chain, branched, or cyclic alkyl, alkenyl, or aryl group having 1 to 6 carbon atoms;
R2 represents a branched alkyl group having 3 to 6 carbon atoms;
k is a number representing the valence of the metal atom M, and
m is 2, and
wherein said glass coating agent is in the form of a liquid, in the form of a dispersion or solution in a solvent, or in the form of a gas.
3. A glass coating method according to claim 1, wherein the metallic compound is dibutyltin dipivalate, dibutyltin diisobutylate, dibutyltin dineoheptate, dibutyltin diisolactate, monobutyltin tripivalate, monomethyltin tripivalate, monobutyltin triisobutylate, dimethyltin dipivalate, dimethyltin diisobutylate, stannous pivalate, stannic pivalate, tributylsilyl pivalate, triisopropylsilyl pivalate, triisopropylsilyl isobutylate, dibutylsilyl dipivalate, diisopropylsilyl dipivalate, diphenylsilyl dipivalate, monophenylsilyl tripivalate, dimethyltitanium dipivalate, monobutylindium dipivalate, or diethylzirconium dipivalate.
4. A glass coating method according to claim 2, wherein the metallic compound is dibutyltin dipivalate, dibutyltin diisobutylate, dibutyltin dineoheptate, dibutyltin diisolactate, monobutyltin tripivalate, monomethyltin tripivalate, monobutyltin triisobutylate, dimethyltin dipivalate, dimethyltin diisobutylate, stannous pivalate, stannic pivalate, tributylsilyl pivalate, triisopropylsilyl pivalate, triisopropylsilyl isobutylate, dibutylsilyl dipivalate, diisopropylsilyl dipivalate, diphenylsilyl dipivalate, monophenylsilyl tripivalate, dimethyltitanium dipivalate, monobutylindium dipivalate, or diethylzirconium dipivalate.
5. A glass coating method according to claim 1, wherein the metallic compound is dibutyltin dipivalate.
6. A glass coating method according to claim 2, wherein the metallic compound is dibutyltin dipivalate.
7. A glass coating method according to claim 1, wherein said glass bottles are continuously coated with said coating agent by CVD while carrying the glass bottles at given intervals and constant speed on a conveyor belt.
8. A glass coating method according to claim 2, wherein said glass plates are continuously coated with said coating agent by CVD while carrying the glass plates at given intervals and constant speed on a conveyor belt.