Author: claimsbot

What is claimed:

1. A self-contained excavation apparatus for forming a hole within a surrounding formation, said apparatus comprising:
a cutting head;
a compartment for storing drilling fluid;
means for pressurizing the drilling fluid;
means for directing the pressurized drilling fluid toward the surrounding formation during penetration of the cutting head into the formation; and
means for securing the cutting head within the hole formed in the surrounding formation to hinder vertical pull out of the cutting head from the hole.
2. A self-contained excavation apparatus as defined in claim 1 wherein:
the cutting head is located at an end of a vertical excavation tube; and
the means for securing the cutting head within the hole includes a recessed area formed within an outer surface of the excavation tube, the recessed area defining a horizontal anchor shelf adapted to engage surrounding formation material following compaction of the formation material within the recessed area.
3. A self-contained excavation apparatus as defined in claim 2, further comprising:
vertical sweep faces formed within the recessed area at opposite ends of the horizontal anchor shelf, the vertical sweep faces adapted to sweep the compacted formation material and sever the engagement between the horizontal anchor shelf and the compacted formation material upon lateral movement of the excavation tube.
4. A self-contained excavation apparatus as defined in claim 3 wherein the vertical excavation tube is adapted to support a beach umbrella.
5. A self-contained excavation apparatus for forming a hole within a surrounding formation, said apparatus comprising:
a cutting head formed at one end of an excavation tube, the cutting head including a stepped cutting edge defining vertical sweep faces for clearing obstructions in the formation as the excavation tube is rotated about a vertical axis;
a compartment for storing drilling fluid;
means for pressurizing the drilling fluid; and
means for directing the pressurized drilling fluid toward the surrounding formation during penetration of the cutting head into the formation.
6. A self-contained excavation apparatus as defined in claim 5, further comprising:
means for securing the excavation tube within the hole formed in the surrounding formation to hinder vertical pull out of the excavation tube from the hole.
7. A self-contained excavation apparatus as defined in claim 6 wherein the excavation tube is adapted to support a beach umbrella.
8. A self-contained excavation apparatus for forming a hole within a surrounding formation, said apparatus comprising:
a cutting head;
a compartment for storing drilling fluid;
means for pressurizing the drilling fluid;
means for limiting a maximum pressure that can be applied to the drilling fluid; and
means for directing the pressurized drilling fluid toward the surrounding formation during penetration of the cutting head into the formation.
9. A self-contained excavation apparatus as defined in claim 8, wherein the means for pressurizing the drilling fluid includes a pressure limit chamber having a check valve separating the pressure limit chamber from the drilling fluid compartment.
10. A self-contained excavation apparatus as defined in claim 9, wherein the pressure limit chamber includes a floating piston having straight intake ports to help prevent debris from clogging the intake ports.
11. A self-contained excavation apparatus as defined in claim 8, wherein the means for directing the pressurized drilling fluid toward the surrounding formation includes a self-cleaning valve.
12. A self-contained excavation apparatus as defined in claim 8 wherein the cutting head is formed at one end of an excavation tube adapted to support a beach umbrella.
13. A method of anchoring a self-contained excavation apparatus in a surrounding formation, comprising the steps of:
storing drilling fluid within a compartment of the self-contained excavation apparatus;
pressurizing the drilling fluid;
applying a drilling force to a cutting head at one end of the self-contained excavation apparatus to penetrate the surrounding formation;
directing the pressurized drilling fluid toward the surrounding formation during penetration of the cutting head into the formation to form a slurry of excavated formation material; and
compacting excavated formation material into a recessed area formed in the end of the self-contained excavation apparatus adjacent the cutting head to hinder vertical pull out of the cutting head from the formation.
14. A method as defined in claim 13, wherein the recessed area defines a horizontal anchor shelf adapted to engage the surrounding formation.
15. A method as defined in claim 14, wherein the recessed area further defines vertical sweep faces at opposite ends of the horizontal anchor shelf, said method further comprising the step of:
moving the self-contained excavation apparatus in a lateral direction to sweep the compacted formation material and sever the engagement between the horizontal anchor shelf and the surrounding formation.
16. A method as defined in claim 15, further comprising the step of:
securing a beach umbrella to an end of the self-contained excavation apparatus opposite the cutting head.
17. A method of anchoring a self-contained excavation apparatus in a surrounding formation, comprising the steps of:
storing drilling fluid within a compartment of the self-contained excavation apparatus;
pressurizing the drilling fluid;
applying a drilling force to a cutting head at one end of the self-contained excavation apparatus to penetrate the surrounding formation, the cutting head including a stepped cutting edge defining vertical sweep faces;
directing the pressurized drilling fluid toward the surrounding formation during penetration of the cutting head into the formation to form a slurry of excavated formation material; and
rotating the self-contained excavation apparatus about a vertical axis to clear obstructions in the formation with the vertical sweep faces of the cutting head.
18. A method as defined in claim 17, further comprising the step of:
compacting excavated formation material into a recessed area formed in the end of the self-contained excavation apparatus adjacent the cutting head to hinder vertical pull out of the cutting head from the formation.
19. A method as defined in claim 18, further comprising the step of:
securing a beach umbrella to an end of the self-contained excavation apparatus opposite the cutting head.
20. A method of anchoring a self-contained excavation apparatus in a surrounding formation, comprising the steps of:
storing drilling fluid within a compartment of the self-contained excavation apparatus;
pressurizing the drilling fluid;
limiting a maximum pressure that can be applied to the drilling fluid;
applying a drilling force to a cutting head at one end of the self-contained excavation apparatus to penetrate the surrounding formation; and
directing the pressurized drilling fluid toward the surrounding formation during penetration of the cutting head into the formation to form a slurry of excavated formation material.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A quantitative liquid dispenser, comprising:
a container having plural equidistant graduations located on an inner wall thereof, a cylinder mounted at a central portion of a bottom thereof and connected therewith, and a closure mounted between said container and said cylinder;
a regulator cock having a plate, a pillar extended from a bottom end of said plate, a guiding hole centrally penetrating through said pillar and said plate, and a corkscrew guiding block positioned inside said guiding hole, wherein said pillar is perforated into said cylinder of said container;
an upper cover having an outlet mounted thereon, a guiding pillar downwardly extended from a bottom thereof, and a safety cover connected thereto through a rim thereof, wherein said guiding pillar has plural equidistant corkscrew guiding troughs respectively mounted at two sides thereof and is perforated into said guiding hole of said regulator cock;
thereby forming said quantitative liquid dispenser through assembling thereof.
2. The quantitative liquid dispenser according to claim 1, wherein said closure is suitable for bottles with different standards so as to lock and fix thereof.
3. The quantitative liquid dispenser according to claim 1, wherein said safety cover is covered with said outlet.
4. The quantitative liquid dispenser according to claim 1, wherein said corkscrew guiding troughs of said upper cover are employed to guide said corkscrew guiding block of said regulator cock so as to downwardly and upwardly move said regulator cock along said guiding pillar.
5. The quantitative liquid dispenser according to claim 1, wherein said corkscrew guiding block of said regulator cock is engaged with one of said corkscrew guiding troughs of said upper cover.

1. An antenna module, suitable for an electronic system, the electronic system comprising a metal shielding case, the antenna module comprising:
s a waterproof protective cover removably assembled on an opening of the metal shielding case, the water-proof protective cover having a housing slot;
a transparent cap mounted on the waterproof protective cover;
a printed circuit board, a first part of the printed circuit board being inserted into the housing slot, a second part of the printed circuit being located within the metal shielding case;
a wireless communication unit disposed on the second part of the printed circuit board; and
an antenna unit disposed on the first part of the printed circuit board and electrically connected with the wireless communication unit.
2. The antenna module as claimed in claim 1, further comprising a sealing ring, wherein the sealing ring is hold between the waterproof protective cover and the metal shielding case when the waterproof protective cover is assembled on the opening of the metal shielding case.
3. The antenna module as claimed in claim 1, wherein the antenna module further comprises a light-emitting unit configured for generating an indicative light representing a system condition of the electronic system, and the indicative light is projected through the transparent cap.
4. The antenna module as claimed in claim 3, wherein the light-emitting unit disposed on the first part of the printed circuit board.
5. The antenna module as claimed in claim 3, wherein the transparent cap comprises a light-guiding cap and at least one light-guiding plugs, and the light-guiding plugs is inserted into the waterproof protective cover for holding the transparent cap and bypassing the indicative light.
6. The antenna module as claimed in claim 1, wherein the wireless communication unit is electrically connected to a mainboard of the electronic system.
7. An electronic system, comprising:
a metal shielding case;
a mainboard disposed within the metal shielding case;
an electronic circuit disposed on the mainboard;
an antenna module, a part of the antenna module being exposed outside the metal shielding case, the antenna module comprising:
a waterproof protective cover removably assembled on an opening of the metal shielding case, the water-proof protective cover having a housing slot;
a transparent cap mounted on the waterproof protective cover;
a printed circuit board, a first part of the printed circuit board being inserted into the housing slot, a second part of the printed circuit being located within the metal shielding case;
a wireless communication unit disposed on the second part of the printed circuit board, the wireless communication unit being electrically connected to the mainboard of the electronic system; and
an antenna unit disposed on the first part of the printed circuit board and electrically connected with the wireless communication unit, the antenna unit being located outside a shielding space formed by the metal shielding case.
8. The electronic system as claimed in claim 7, wherein the antenna module further comprises a sealing ring, and the sealing ring is hold between the waterproof protective cover and the metal shielding case when the waterproof protective cover is assembled on the opening of the metal shielding case.
9. The electronic system as claimed in claim 7, wherein the antenna module further comprises a light-emitting unit disposed on the first part of the printed circuit board.
10. The electronic system as claimed in claim 9, wherein the light-emitting unit is configured for generating an indicative light representing a system condition of the electronic system, the indicative light is projected through the transparent cap.
11. The electronic system as claimed in claim 9, wherein the transparent cap comprises a light-guiding portion, and the light-guiding portion is inserted into the waterproof protective cover for holding the transparent cap and bypassing the indicative light.
12. The electronic system as claimed in claim 9, wherein the electronic system is installed outdoors.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

What is claimed is:

1. A semiconductor device comprising:
a chip;
an opened fuse formed on the chip and having an end;
an output pad formed on the chip and connected to the end of the opened fuse; and
a package encapsulating the chip and having an output lead, wherein the output lead is electrically connected to the output pad.
2. The semiconductor device of claim 1, further comprising a probing pad formed on the chip, wherein the opened fuse has another end connected to the probing pad.
3. The semiconductor device of claim 2, wherein the output pad has a first exposed portion and the probing pad has a second exposed portion and the first exposed portion is located closer to the opened fuse than the second exposed portion.
4. The semiconductor device of claim 1, wherein the output pad is formed irregularly on the chip.
5. The semiconductor device of claim 1, wherein the output pad is located at a central portion of the chip.
6. The semiconductor device of claim 1, wherein the chip has an internal circuit located adjacent to the output pad and the internal circuit is a circuit selected from the group consisting of an inputoutput circuit, a power source line, a ground line and a control circuit.
7. The semiconductor device of claim 2, wherein the probing pad is located at a peripheral area of the chip.
8. The semiconductor device of claim 1, wherein the output pad is connected to the output lead through a conductive bump.
9. The semiconductor device of claim 1, wherein the output pad is connected to the output lead through a conductive wire.
10. The semiconductor device of claim 1, wherein the package is a flip chip type package.
11. A semiconductor chip comprising:
a fuse formed on the chip and having two ends;
an output pad formed on the chip and connected to an end of the fuse; and
a probing pad formed on the chip and connected to the other end of the fuse,
wherein the output pad has a first exposed portion and the probing pad has a second exposed portion and the first exposed portion is located closer to the fuse than the second exposed portion.
12. The semiconductor device of claim 11, wherein the output pad is located at a central portion of the chip.
13. The semiconductor device of claim 11, wherein the chip has an internal circuit located adjacent to the output pad and the internal circuit is a circuit selected from the group consisting of an inputoutput circuit, a power source line, a ground line and a control circuit.
14. The semiconductor device of claim 11, wherein the probing pad is located at a peripheral area of the chip.
15. A method of fabricating a semiconductor device comprising:
providing chips having a plurality of probing pads, a plurality of output pads and a plurality of fuses, wherein each of the plurality of probing pads is connected to a corresponding one of the plurality of output pads though a corresponding one of the plurality of fuses;
cutting all of the plurality of fuses in a portion of the chips; and
encapsulating the portion of the chips using a package having a plurality of output leads, wherein each of the output leads is electrically connected to each of the output pads.
16. The method of the semiconductor device of claim 15, wherein the cutting is performed by a laser beam.
17. The method of the semiconductor device of claim 15, further comprising electrically testing the chips to identify the portion of the chips, wherein the testing is performed by contacting a plurality of probing tips on to the plurality of probing pads.
18. The method of the semiconductor device of claim 15, wherein the portion of the chips consists of good chips and repairable chips.
19. The method of the semiconductor device of claim 18, further comprising repairing the repairable chips, wherein the cutting is performed during the repairing.
20. A method of fabricating a semiconductor device comprising:
providing a plurality of chips having a probing pad, a output pad and a fuse, wherein the probing pad is electrically connected to the output pad though the fuse;
electrically testing the plurality of chips to identify a portion of the chips; and
cutting the fuse of the portion of the chips by a laser beam.
21. The method of the semiconductor device of claim 20, wherein the output pad has a first exposed portion and the probing pad has a second exposed portion and the first exposed portion is located closer to the fuse than the second exposed portion does to the fuse.
22. A method of fabricating a semiconductor device comprising:
providing a wafer;
forming a first layer on the wafer;
forming a second layer on the first layer; and
patterning the second layer, thereby exposing a portion of the first layer and forming a first pad and an second pad, wherein the first pad is electrically connected to the second pad through the exposed portion of the first layer.
23. The method of the semiconductor device of claim 22, wherein the first pad is a probing pad and the second pad is an output.
24. The method of the semiconductor device of claim 23, further comprising:
electrically testing the wafer by using the probing pad; and
cutting the exposed portion of the first layer by a laser beam.
25. The method of the semiconductor device of claim 23, further comprising:
forming a passivation layer on the probing pad and the output pad; and
pattering the passivation layer, thereby exposing a portion of the probing pad and a portion of the output pad, wherein the exposed portion of the first layer is closer to the exposed portion of the output pad than the exposed portion of the probing pad.
26. The method of the semiconductor device of claim 23, wherein the first layer is a barrier metal layer.
27. The method of the semiconductor device of claim 23, wherein the first layer comprises:
a titanium layer formed on the wafer; and
a titanium nitride layer formed on the titanium layer.
28. The method of the semiconductor device of claim 23, wherein the second layer comprises an aluminum alloy layer.