Author: claimsbot

1. TAP removal and replacement circuitry comprising:
A. a test data input lead;
B. a test data output lead;
C. a test clock input lead;
D. a test mode select input lead;
E. TAP domain selection circuitry having inputs coupled to the test data input lead, the test clock input lead, and the test mode select lead, having a remove select input, and having a test data output, a remove control output, and a control output bus; and
E. multiplexer control circuitry having an input connected to the test mode select input lead, a remove control input connected to the remove control output of the TAP domain selection circuitry, control inputs connected with the control output bus, and a remove select output connected to the remove select input of the TAP domain selection circuitry.
2. The circuitry of claim 1 including an integrated circuit having plural TAP domains, and the TAP removal and replacement circuitry being connected between the plural TAP domains and the test data output lead.
3. The circuitry of claim 1 including an integrated circuit having plural TAP domains, and the test access port removal and replacement circuitry is connected between the test data input lead and the plural TAP domains.
4. The circuitry of claim 1 including a test reset input lead and the TAP domain selection circuitry having an input connected to the test reset input lead.
5. The circuitry of claim 1 including:
i. plural TAP domains each having a test data input selectively coupled to the test data input lead, a test data output selectively coupled to the test data output lead, a test clock input selectively coupled to the test clock input lead, and a test mode select input selectively coupled to the test mode select input lead;
ii. input linking circuitry connected to the test data input lead, the test clock input lead, and the test mode select input lead and connected to the test data input, test clock input, and the test mode input of each of the plural TAP domains, the input linking circuitry having control inputs connected to the control output bus; and
iii. output linking circuitry connected to the test data output of each TAP domain and having a test data output connected to the test data output lead, the output linking circuitry having control inputs connected to the control output bus.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. An apparatus for placing products into blisters of a blister band moved in a forward motion direction along a blistering machine, with blisters made in an upper surface of said blister band and made accessible from top, the apparatus having at least one work unit, situated above said blister band, the work unit including:
a carriage carried by a support, connected to a bearing structure of said blistering machine, with the carriage capable of sliding, with respect to the support, parallel to the blister band forward motion direction;
at least one hopper, carried by said carriage, fed with products and feeding said products to at least one discharge conduit fastened to said carriage, the discharge conduit having a lower end situated directly above the upper surface of said blister band and aligned with respect to a corresponding longitudinal row of blisters made in the latter;
first means for operating said carriage between two extreme positions, a rear position and a fore position, by a forward stroke and return stroke, with the forward stroke being operated in step relation with advancement of said blister band, so as to center the lower end of said discharge conduit with respect to a corresponding blister of said row, situated below and to maintain this centering for a prefixed period of time;
at least one moving assembly, connected to said carriage and carrying a strip interposed between said lower end of at least one discharge conduit and the upper surface of the blister band, and extending forward with respect to the band forward motion direction, said strip having at least one hole, which is aligned with the longitudinal row of blisters and whose size allows single products to pass therethrough;
second means for moving said strip parallel to the blister band forward motion direction, in step relation with the operation of said carriage, thus performing a forward stroke and a return stroke, between two extreme positions, a rest position and a working position, with the rest position preventing the lowermost product of the pile of products contained in said conduit from falling, and with the working position, defined by said forward stroke, allowing the centering of the hole with the lower end of said conduit, situated above, and consequently, allowing the said lowermost product to fall into said blister, during said time period.
2. An apparatus, as claimed in claim 1, further including a least two work units, provided with hoppers containing different kinds of products, which can be fed by means of respective discharge conduits to corresponding blisters of said blister band.
3. An apparatus, as claimed in claim 2, wherein the length of the strips of said work units is such as to cover longitudinally and continuously the filling area of said blister band.
4. An apparatus, as claimed in claim 2, wherein the carriages of said work units are moved in synchrony.
5. An apparatus, as claimed in claim 3, wherein the carriages of said work units are moved in synchrony and said strips are also moved in synchrony.
6. An apparatus, as claimed in claim 2, wherein the carriages of said work units are moved asynchronously.
7. An apparatus, as claimed in claim 3, wherein the carriages of said work units are moved asynchronously and said strips are moved asynchronously.
8. An apparatus, as claimed in claim 1, wherein said strip matches with the upper surface of said blister band.
9. An apparatus, as claimed in claim 3, wherein said strips match with the upper surface of said blister band.
10. An apparatus, as claimed in claim 1, wherein the hopper of said at least one work unit includes at least two separate chambers fed with different products and feeding these products to corresponding discharge conduits.
11. An apparatus, as claimed in claim 1, wherein the moving assembly carrying said strip also carries a first arm, with an upstream end of the strip fastened to said arm.
12. An apparatus, as claimed in claim 11, wherein said moving assembly supports a second arm, situated downstream of the first arm, with respect to the blister band forward motion direction, and having suction means for raising, when operated, the strip below when the work unit in cleaning andor maintenance configuration.
13. An apparatus, as claimed in claim 3, wherein the length of said strips is such, as to cause partial superimposing of the strips, at least in a configuration of minimum mutual distance between the respective units.
14. An apparatus, as claimed in claim 1, wherein the support of each of said units moves vertically, for raising the respective unit with respect to the blister band, when the unit is inoperative.
15. An apparatus, as claimed in claim 1, wherein said hopper slides vertically with respect to the carriage and that said discharge conduit, fastened to the carriage, is freely introduced into a hole made in the bottom of the hopper, with means being provided for operating the hopper to move vertically with a vibratory motion, so as to allow the products contained therein to be enter to the discharge conduit.
16. An apparatus, as claimed in claim 1, wherein the fore stroke of said moving assembly is discordant with respect to the blister band forward motion direction.
17. An apparatus, as claimed in claim 2, wherein said units are carried by only one support.
18. An apparatus, as claimed in claim 1, wherein said moving assembly is carried, sliding, by guides made in the carriage, parallel to the band forward motion direction.

1. A semiconductor device comprising:
a first gate electrode over a surface of a substrate, the first gate electrode extending in a first direction parallel to the surface of the substrate;
a first gate insulating film covering a top surface and side surfaces of the first gate electrode;
an oxide semiconductor film covering the first gate electrode with the first gate insulating film interposed between the top surface of the first gate electrode and the oxide semiconductor film and between the side surfaces of the first gate electrode and the oxide semiconductor film;
a second gate insulating film covering the oxide semiconductor film; and
a second gate electrode over the second gate insulating film, the second gate electrode extending in a second direction parallel to the surface of the substrate,
wherein the second direction is substantially perpendicular to the first direction.
2. The semiconductor device according to claim 1, further comprising an insulating film over the second gate insulating film and the second gate electrode.
3. The semiconductor device according to claim 1, further comprising a capacitor, the capacitor comprising:
a lower electrode film comprising the same material as the first gate electrode; and
an upper electrode film comprising the same material as the second gate electrode.
4. The semiconductor device according to claim 3,
wherein the capacitor comprises an insulating film between the lower electrode film and the upper electrode film, and
wherein the insulating film comprises the same material as the first gate insulating film or the second gate insulating film.
5. The semiconductor device according to claim 3, wherein a height of the lower electrode film is larger than a width of the lower electrode film.
6. A semiconductor device comprising:
a first gate electrode over a surface of a substrate, the first gate electrode extending in a first direction parallel to the surface of the substrate;
a first gate insulating film covering a top surface and side surfaces of the first gate electrode;
an oxide semiconductor film covering the first gate electrode with the first gate insulating film interposed between the top surface of the first gate electrode and the oxide semiconductor film and between the side surfaces of the first gate electrode and the oxide semiconductor film;
a source electrode and a drain electrode electrically connected to the oxide semiconductor film;
a second gate insulating film covering the oxide semiconductor film, the source electrode, and the drain electrode; and
a second gate electrode over the second gate insulating film, the second gate electrode extending in a second direction parallel to the surface of the substrate,
wherein the second direction is substantially perpendicular to the first direction.
7. The semiconductor device according to claim 6, wherein the second gate electrode is provided between the source electrode and the drain electrode.
8. The semiconductor device according to claim 6, further comprising an insulating film over the second gate insulating film and the second gate electrode.
9. The semiconductor device according to claim 6, further comprising a capacitor, the capacitor comprising:
a lower electrode film comprising the same material as the first gate electrode; and
an upper electrode film comprising the same material as the second gate electrode.
10. The semiconductor device according to claim 9,
wherein the capacitor comprises an insulating film between the lower electrode film and the upper electrode film, and
wherein the insulating film comprises the same material as the first gate insulating film or the second gate insulating film.
11. The semiconductor device according to claim 9, wherein a height of the lower electrode film is larger than a width of the lower electrode film.
12. A semiconductor device comprising:
a first gate electrode over a surface of a substrate, the first gate electrode extending in a first direction parallel to the surface of the substrate;
an oxide semiconductor film covering a top surface and side surfaces of the first gate electrode, the oxide semiconductor film extending in the first direction as a channel length direction;
a source electrode and a drain electrode electrically connected to the oxide semiconductor film; and
a second gate electrode over the oxide semiconductor film, the second gate electrode extending in a second direction parallel to the surface of the substrate,
wherein the second direction is substantially perpendicular to the first direction.
13. The semiconductor device according to claim 12, further comprising an insulating film over the second gate electrode.
14. The semiconductor device according to claim 12, further comprising a capacitor, the capacitor comprising:
a lower electrode film comprising the same material as the first gate electrode; and
an upper electrode film comprising the same material as the second gate electrode.
15. The semiconductor device according to claim 14,
wherein the capacitor comprises an insulating film between the lower electrode film and the upper electrode film.
16. The semiconductor device according to claim 14, wherein a height of the lower electrode film is larger than a width of the lower electrode film.
17. The semiconductor device according to claim 12, wherein the second direction is a channel width direction.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A modular system for forming a rigid structure, the system comprising:
a first panel that includes a first edge and a first attachment member;
a second panel that includes a second edge and a second attachment member, wherein the second edge is configured and arranged to mate with the first edge of the first panel forming a hinge that couples the first and the second panels and enables a relative rotation about a rotation axis through the hinge, defining a relative angle between the first and the second panels; and
a fixing member that is configured and arranged to couple to each of the first and the second attachment members when the relative angle between the first and the second panels is substantially equivalent to a first angle, fixing the relative angle at the first angle and forming at least part of the rigid structure, wherein the first angle is greater than 90\xb0 and less than 180\xb0.
2. The system of claim 1, the second panel further includes a third attachment member and the fixing member is further configured and arranged to couple to each of the first and the third attachment members when the relative angle between the first and the second panels is substantially equivalent to a second angle, fixing the relative angle at the second angle.
3. The system of claim 1, wherein the first panel further includes a first channel that is substantially orthogonal to the first edge and the first attachment member is positioned within the first channel.
4. The system of claim 1, the first edge of the first panel includes a male coupler and the second edge of the second panel includes a female coupler, wherein the female coupler is configured and arranged to receive the male coupler and when received, the male and the female couplers form the hinge that couples the first and second panels.
5. The system of claim 1, the first panel further includes a third attachment member, wherein the first attachment member is positioned a first distance from the first edge, the second attachment member is positioned a second distance from the second edge, and the third attachment member is positioned a third distance from the first edge.
6. The system of claim 1, the fixing member includes a first coupler that is configured and arranged to receive the first attachment member of the first panel and a second coupler that is configured and arranged to receive the second attachment member of the second panel.
7. The system of claim 1, further comprising a planar member that includes a footprint that is substantially equivalent to a footprint of the first panel, wherein the first panel includes a coupler that is configured and arranged to couple the planar member to the first panel.
8. A kit for constructing a three-dimensional (3D) structure, the kit comprising:
a first substantially planar member that includes a first fastener and a first edge;
a second substantially planar member that includes a second fastener, a third fastener, and a second edge, wherein the second planar member is configured and arranged to rotatably couple to the first planar member along an interface between the first edge of the first planar member and the second edge of the second planar member, forming at least part of the 3D structure that includes a relative angle between the coupled first and second planar members; and
a connector member, wherein when the connector member is connected to each of the first fastener of the of the first planar member and the second fastener of the second planar member, the relative angle between the coupled first and second planar members is fixed at a first angle and when the connector member is connected to each of the first fastener and the third fastener of the second planar member, the relative angle is fixed at a second angle.
9. The kit of claim 8, wherein the first fastener of the first planar member is a bar fastener.
10. The kit of claim 8, wherein the connector member is configured and arranged to provide tactile feedback when connecting to the first fastener of the first planar member.
11. The kit of claim 8, wherein the first edge of the of the first planar member includes a first notch, the second edge of the second planar member includes a second notch, and the connector member includes a reinforcing lip, wherein the first and the second notches form an aperture along the interface between the first and the second edges and the aperture is configured and arranged to receive the reinforcing lip when the relative angle between the coupled first and second planar members is substantially equivalent to 180\xb0 and when received by the aperture, the reinforcing lip reinforces the 3D structure.
12. The kit of claim 8, the second planar member further includes a fastener aperture, wherein each of the second and the third fasteners are positioned within the fastener aperture.
13. The kit of claim 8, the second planar member further includes a first marking positioned adjacent the second fastener and a second marking positioned adjacent the third fastener, wherein the first marking indicates the first angle and the second marking indicates the second angle.
14. The kit of claim 8, the first planar member further includes a reinforcing rib that is transverse to the first edge and reinforces the first planar member.
15. A modular assembly, the assembly comprising:
a first substantially rectangular module that includes a first edge;
a second substantially rectangular module that includes a second edge;
a hinge that is configured and arranged to rotatably couple the first and the second rectangular modules along the first and the second edges; and
a locking device configured and arranged to inhibit a relative rotation about the hinge and between the first and the second rectangular modules when the locking device is coupled to each of the first and the second rectangular modules and,
wherein the locking device locks a relative angle between the first and the second rectangular modules at a first angle when coupled to each of the first and the second rectangular modules in a first configuration and locks the relative angle at a second angle when coupled to each of the first and the second rectangular modules in a second configuration.
16. The assembly of claim 15, the hinge is further configured and arranged to provide tactile feedback when the first and second rectangular modules are coupled or de-coupled.
17. The assembly of claim 15, further comprising a graphic component that is configured and arranged to be attached to the first rectangular module.
18. The assembly of claim 15, wherein each of the first and the second rectangular modules are constructed from a plastic material.
19. The assembly of claim 15, wherein the hinge includes a male connector positioned along the first edge of the first rectangular module and a female connector positioned along the second edge of the second rectangular module.
20. The assembly of claim 15, wherein the first and the second configurations of the locking device coupled to the first and the second rectangular modules is based on the relative positions of a plurality of attachment members included in the first rectangular module and a second plurality of attachment members included in the second rectangular module.