Author: claimsbot

1-42. (canceled)
43. A biocompatible cohesive biopolymer gel comprising a coprecipitate of at least one fibrillar protein and at least one sulfated polysaccharide.
44. The biocompatible cohesive biopolymer gel of claim 43 wherein the coprecipitate is formed in the absence of an exogenous cross-linking agent in the presence of a volatile organic solvent.
45. The biocompatible cohesive biopolymer gel of claim 43 wherein the coprecipitate is formed at a pH of at least 2 pH units above or below neutral pH.
46. The biocompatible cohesive biopolymer gel of claim 45 wherein the coprecipitate is formed at an acidic pH, between pH of about 2.0 and pH of about 5.0.
47. The biocompatible cohesive biopolymer gel of claim 45 wherein the coprecipitate is formed at a basic pH between pH of about 9.0 and pH of about 12.0.
48. The biocompatible cohesive biopolymer gel of claim 43 wherein the protein is selected from the group consisting of collagen, elastin, fibrin, albumin and gelatin.
49. The biocompatible cohesive biopolymer gel of claim 48 wherein the protein is gelatin.
50. The biocompatible cohesive biopolymer gel of claim 43 wherein the sulfated polysaccharide is selected from the group consisting of dextran sulfate, chondroitin sulfate, heparin, heparan sulfate, keratan sulfate, dermatan sulfate, algal sulfated polyglycan, or a synthetic sulfated polysaccharide.
51. The biocompatible cohesive biopolymer gel of claim 50 wherein the sulfated polysaccharide is dextran sulfate.
52. The biocompatible cohesive biopolymer gel of claim 51 wherein the dextran sulfate has a molecular weight in a range of from about 4,000 Dalton to about 500,000 Daltons.
53. The biocompatible cohesive biopolymer gel of claim 52 wherein the dextran sulfate is selected from
(a) a high molecular weight dextran sulfate having a molecular weight in a range of from about 300,000 Dalton to about 500,000 Dalton; and
(b) a low molecular polymer dextran sulfate having a molecular weight in a range of from about 5,000 Dalton to about 10,000 Dalton.
54. The biocompatible cohesive biopolymer gel of claim 43 wherein the cohesive biopolymer comprises gelatin and dextran sulfate.
55. The biocompatible cohesive biopolymer gel of claim 54 comprising 30% to 70% of dextran sulfate.
56. The biocompatible cohesive biopolymer gel of claim 54 comprising 30% to 70% of gelatin.
57. The biocompatible cohesive biopolymer gel of claim 54 comprising about 50% gelatin and about 50% dextran sulfate.
58. The biocompatible cohesive biopolymer gel of claim 43 further comprising at least one substance selected from anticoagulants, adhesive molecules, growth factors, enzymes, antioxidants, antifibrotic substances, positively charged molecules, a peptide rich in positively charged amino acids, and nutritional elements.
59. The biocompatible cohesive biopolymer gel of claim 44 further comprising bridges formed by subsequent addition of a cross-linking agent to the coprecipitate formed.
60. The biocompatible cohesive biopolymer gel of claim 59 wherein the cross-linking agent is selected from the group consisting of a monosaccharide: ribose, glucose, mannose and xylose; factor XIII; lysyloxidase; a carbodiimide; and an oxidizing agent.
61. The biocompatible cohesive biopolymer gel of claim 43 further comprising at least one bioactive compound selected from the group consisting of a hormone, a growth factor, a proteolytic enzyme, an anti-fibrotic agent, a coagulative agent, an extracellular matrix component, an anti oxidant, a natural or synthetic polymer.
62. The biocompatible cohesive biopolymer gel of claim 43 wherein the coprecipitate is formed into fibers, sheets, sponges, fabrics or tubes.
63. The biocompatible cohesive biopolymer gel of claim 43 wherein the coprecipitate is formed as a coating for a stent, wherein the stent is selected from a vascular stent and a tracheal stent.
64. The biocompatible cohesive biopolymer gel of claim 43 wherein the coprecipitate is formed into a scaffold.
65. The biocompatible cohesive biopolymer gel of claim 64 wherein the scaffold encloses hyaluronic acid-laminin gel.
66. The biocompatible cohesive biopolymer gel of claim 43 wherein the coprecipitate is formed into a scaffold for enclosing neuronal cells.
67. The biocompatible cohesive biopolymer gel of claim 66 wherein the scaffold enclosing neuronal cells further encloses hyaluronic acid-laminin gel.
68. The biocompatible cohesive biopolymer gel of claim 43 formed into a scaffold for use as a cell bearing implant.
69. An implant comprising a biocompatible cohesive biopolymer gel according to claim 43.
70. A method for preparing a biocompatible cohesive biopolymer gel suitable as an implant in a human or animal, which comprises:
providing a solution of a fibrillar protein;
providing a solution of sulfated polysaccharide;
combining the two solutions at a pH of at least 2 pH units above or below neutral pH in the absence of an exogenous cross-linking agent to form a coprecipitate of cohesive gel; and
precipitating the cohesive gel with a volatile organic solvent.
71. The method of claim 70 wherein the fibrillar protein is gelatin.
72. The method of claim 70 wherein the sulfated polysaccharide is dextran sulfate.
73. The method of claim 72 wherein the dextran sulfate has a molecular weight in a range of from about 4,000 Dalton to about 500,000 Daltons.
74. The method of claim 73 wherein the dextran sulfate is selected from
(a) a high molecular weight dextran sulfate having a molecular weight in a range of from about 300,000 Dalton to about 500,000 Dalton; and
(b) a low molecular polymer dextran sulfate having a molecular weight in a range of from about 5,000 Dalton to about 10,000 Dalton.
75. The method of claim 70 wherein the pH is an acidic pH between pH of about 2.0 and pH of about 5.0.
76. The method of claim 70 wherein the pH is a basic pH between pH of about 9.0 and pH of about 12.0.
77. The method of claim 70 wherein the volatile organic solvent is an alcohol.
78. The method of claim 70 further comprising forming the gel into fibers by a process selected from the group consisting of dry extrusion, gel extrusion, melt extrusion, solution extrusion, spinning extrusion, spraying of nanofibrils and combinations thereof.
79. The method of claim 70 further comprising shaping the biocompatible cohesive biopolymer gel.
80. The method of claim 70 further comprising incorporating a bioactive substance into the biopolymer.
81. A kit for carrying out extemporaneously a method according to claim 70, the kit comprising at least one dose of each constituent solution necessary to obtain the coprecipitate which forms the biocompatible cohesive biopolymer gel.
82. A composition for sustained release of a bioactive substance comprising a bioactive substance within a biocompatible cohesive biopolymer gel according to claim 43.
83. A method for repairing a lesion in a tissue, comprising applying the biocompatible cohesive biopolymer gel of claim 43 at a site of the lesion.
84. The method of claim 83 wherein the lesion is a tracheal lesion.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. An apparatus for measuring at least one parameter of a process flow flowing within a pipe, the apparatus comprising:
at least two strain sensors disposed at different axial locations along the pipe, each of the strain sensors providing a respective pressure signal indicative of a pressure disturbance within the pipe at a corresponding axial position; and
a signal processor, responsive to said pressure signals, which selectively provides one of a first signal related to a velocity of a pressure field moving with the process flow and a second signal related to a speed of sound propagating through the process flow or both in response to a configuration signal.
2. The apparatus of claim 1, wherein the processing unit includes a convective flow logic that determines the first signal and an acoustic flow logic that determines the second signal.
3. The apparatus of claim 2, wherein the convective flow logic includes an array processor that determines power in the k-\u03c9 plane.
4. The apparatus of claim 2, wherein the acoustic flow logic includes an array processor that determines power in the k-\u03c9 plane.
5. The apparatus of claim 2, wherein the convective flow logic includes a convective ridge identifier that determines the convective ridge in the k-\u03c9 plane.
6. The apparatus of claim 2, wherein the acoustic flow logic includes an acoustic ridge identifier that determines the acoustic ridge in the k-\u03c9 plane.
7. The apparatus of claim 2, wherein the convective flow logic includes a first analyzer that determines a slope of the convective ridge to determine one of the velocity, the mach number, and volumetric flow rate of the process flow.
8. The apparatus of claim 2, wherein the acoustic flow logic includes a second analyzer that determines a slope of the acoustic ridge, to determine one of steam quality or \u201cwetness\u201d, vapormass ratio, liquidsolid ratio, volumetric flow rate, mass flow rate, average size of suspended particles, density, gas volume fraction, and enthalpy of the flow.
9. The apparatus of claim 1, wherein the process flow is one of a single phase fluid and a multi-phase mixture.
10. The apparatus of claim 1, wherein the pressure signals are indication of acoustic pressures propagating within the flow and unsteady pressures convecting with the flow.
11. The apparatus of claim 10, wherein the unsteady pressures convecting with the flow are indication of vortical disturbances within the flow.
12. The apparatus of claim 1, wherein the signal processor determines the slope of at least one acoustic ridge in the k-\u03c9 plane to determine the speed of sound propagating through the flow, and the slope of a convective ridge in the k-\u03c9 plane to determine the velocity of the flow.
13. The apparatus of claim 1, wherein the at least two strain sensors include one of 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19 and 20 pressure sensors.
14. The apparatus of claim 2, further including a control logic that selectively provides a control signal which activates or deactivates each of the convective flow logic and acoustic flow logic in response to the configuration signal.
15. The apparatus of claim 2, further including a control logic that selectively provides at least one output signal of at least one of the convective flow logic and acoustic flow logic in response to the configuration signal.
16. The apparatus of claim 1, wherein the signal processor selectively provides a diagnostic signal indicative of the health of process flow loop in response to a configuration signal.
17. The apparatus of claim 16, wherein the signal processor includes a diagnostic logic that determines the diagnostic signal.
18. The apparatus of claim 16, wherein the signal processor compares an input evaluation signal based on the pressure signal against a diagnostic criteria to determine the diagnostic signal.
19. The apparatus of claim 18, wherein the diagnostic criteria is based on a signature in at least one of the frequency domain, time domain, spatial domain, wave-number, and k-\u03c9 domain.
20. The apparatus of claim 18, wherein the evaluation signal is an acoustic signature within the process flow.
21. The apparatus of claim 20, wherein the acoustic signature includes the acoustic signature of a mechanical device of the process flow loop.
22. The apparatus of claim 1, wherein the strain sensors include pressure sensors.
23. The apparatus of claim 1, wherein the second signal is indicative of acoustic pressures propagating axially in one-dimensional through the process fluid.
24. A method of measuring at least one parameter of a process flow flowing within a pipe, the method comprising:
providing respective pressure signals of a pressure disturbance at different axial locations along the pipe; and
processing said respective pressure signals and selectively providing one of velocity of a pressure field moving with the process flow and a speed of sound propagating through the process flow or both in response to a configuration signal.
25. The method of claim 24, wherein the processing includes array processing of the pressure signals to determine power in the k-\u03c9 plane.
26. The method of claim 25, wherein the processing includes determining the convective ridge in the k-\u03c9 plane.
27. The method of claim 25, wherein the processing includes determining the acoustic ridge in the k-\u03c9 plane.
28. The method of claim 26, wherein the processing includes determining a slope of the convective ridge to determine one of the velocity, the mach number, and volumetric flow rate of the process flow.
29. The method of claim 27, wherein the processing includes determining a slope of the acoustic ridge to determine one of steam quality or \u201cwetness\u201d, vapormass ratio, liquidsolid ratio, volumetric flow rate, mass flow rate, average size of suspended particles, density, gas volume fraction, and enthalpy of the flow.
30. The method of claim 24, wherein the process flow is one of a single phase fluid and a multi-phase mixture.
31. The method of claim 24, wherein the pressure signals are indication of acoustic pressures propagating within the flow and unsteady pressures convecting with the flow.
32. The method of claim 31, wherein the unsteady pressures convecting with the flow are indication of vortical disturbances within the flow.
33. The method of claim 24, wherein the processing includes determining the slope of at least one acoustic ridge in the k-\u03c9 plane to determine the speed of sound propagating through the flow, and the slope of a convective ridge in the k-\u03c9 plane to determine the velocity of the flow.
34. The method of claim 24, wherein the respective pressure signals are provided at at least 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19 and 20 axial locations along the pipe.
35. The method of claim 24, wherein the processing includes selectively providing a control signal which activates or deactivates each of convective array processing and acoustic array processing in response to the configuration signal.
36. The method of claim 24, further providing at least one output related to at least one of the velocity and speed of sound in response to the configuration signal.
37. The method of claim 24, wherein the processing selectively provides a diagnostic metric indicative of the health of a process flow loop in response to a configuration signal.
38. The method of claim 37, wherein the processing includes comparing an input evaluation signal based on the pressure signal against a diagnostic criteria to determine the diagnostic metric.
39. The method of claim 38, wherein the diagnostic criteria is based on a signature in at least one of the frequency domain, time domain, spatial domain, wave-number, and k-\u03c9 domain.
40. The method of claim 38, wherein the evaluation signal is an acoustic signature within the process flow.
41. The method of claim 40, wherein the acoustic signature includes the acoustic signature of a mechanical device of the process flow loop.
42. The method of claim 24, wherein the speed of sound is indicative of acoustic pressures propagating axially in one-dimensional through the process fluid.

1. A downhole apparatus comprising:
a first tubular member disposed in a well bore;
a second tubular member disposed in the well bore;
an expansion device coupled to the second tubular member; and
a connection coupled between the first and second tubular members comprising a retention mechanism that is releasable in response to radial expansion and plastic deformation of the second tubular member by the expansion device.
2. The apparatus of claim 1 wherein the retention and release mechanism comprises a radially releasable collet connection.
3. The apparatus of claim 2 wherein a collet finger of the collet connection radially expands in response to the radial expansion force of the expansion device.
4. The apparatus of claim 3 further including a sliding member disposed between the expansion device and the collet finger.
5. The apparatus of claim 1 wherein the retention and release mechanism comprises a series of collet fingers on the second tubular member interlocked with latches on the first tubular member.
6. The apparatus of claim 5 further comprising a slider coupled between the collet fingers and the latches.
7. The apparatus of claim 6 wherein the slider prevents relative rotation between the tubular members.
8. The apparatus of claim 6 wherein the slider comprises splines received in aligned slots of the tubular members.
9. The apparatus of claim 8 wherein the splines move in the aligned slots in response to axial displacement of the expansion device during radial expansion and plastic deformation.
10. The apparatus of claim 1 wherein the first tubular member is a tubing string removable to the surface of the well bore and the second tubular member is an expandable casing installable in the well bore.
11. A downhole apparatus comprising:
a first downhole tubular member;
a radially expandable second downhole tubular member; and
a releasable connection coupled between the first and second tubular members configured to receive an expansion device from the radially expandable second tubular member.
12. The apparatus of claim 11 wherein the releasable connection comprises a collet connection between the first and second tubular members.
13. The apparatus of claim 12 wherein the collet connection is releasable in response to a radial expansion force of the expansion device.
14. The apparatus of claim 11 further comprising a sliding member coupled to the collet connection.
15. The apparatus of claim 14 wherein the sliding member is moveable in response to axial displacement of the expansion device.
16. The apparatus of claim 15 wherein the sliding member activates the collect connection.
17. The apparatus of claim 14 wherein the sliding member includes splines interlocking with slots in the collet connection.
18. A method of releasing two downhole tubular members comprising:
coupling the two tubular members with a releasable connection;
displacing an expansion device through one of the tubular members to radially expand and plastically deform the tubular member; and
releasing the connection between the two tubular members by displacing the expansion device therethrough.
19. The method of claim 18 further comprising:
coupling the two tubular members with a releasable connection by engaging a collet connection; and
releasing the collet connection by radially expanding collet fingers in response to the displacement of the expansion device.
20. The method of claim 18 further comprising:
installing against a well bore the radially expanded and plastically deformed tubular member; and
removing to the surface of the well bore with the expansion device the released other tubular member.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method of manufacturing an organic light emitting diode (OLED) display, comprising:
sequentially layering a polycrystalline silicon layer, a gate insulating layer, and a first metal layer on the substrate main body;
forming a polycrystalline silicon layer pattern, a gate insulating layer pattern, and a first conductive layer pattern, by patterning the polycrystalline silicon layer, the gate insulating layer, and the first metal layer, the polycrystalline silicon layer pattern comprising an active layer and a first capacitor electrode, and the first conductive layer pattern comprising a gate electrode and a second capacitor electrode disposed on the gate insulating pattern;
forming an interlayer insulating layer on the first conductive layer pattern;
patterning the interlayer insulating layer to form an interlayer insulating layer pattern, the patterning comprising forming contact holes that expose the active layer and the first capacitor electrode; and
forming a second conductive layer pattern on the interlayer insulating layer pattern and in the contact holes,
wherein the gate insulating layer pattern is formed in a same pattern as the polycrystalline silicon layer pattern.
2. The method of claim 1, wherein the polycrystalline silicon layer pattern, the gate insulating layer pattern, and the first conductive layer pattern are formed together through a photolithography process using a double exposure or halftone exposure process.
3. The method of claim 1, wherein:
the contact holes expose the second capacitor electrode and the gate electrode; and
the contact holes that expose the active layer extend through the gate insulating layer pattern.
4. The method of claim 1, wherein the second conductive layer pattern comprises a source electrode and a drain electrode that are connected to the active layer through corresponding ones of the contact holes.
5. The method of claim 1, wherein the first conductive layer pattern further comprises:
a data line; and
a common power line.
6. The method of claim 1, wherein the forming of the second conductive layer pattern comprises:
sequentially layering a transparent conductive layer and a second metal layer on the interlayer insulating layer;
forming a source electrode, a drain electrode, and a pixel electrode by patterning the transparent conductive layer and the second metal layer, the source and drain electrodes comprising portions of the transparent conductive layer and the second metal layer, and the pixel electrode comprising a portion of the transparent conductive layer.
7. The method of claim 6, further comprising doping an n-type or p-type impurity into the polycrystalline silicon layer, before forming the second conductive layer pattern.
8. The method of claim 1, wherein the forming of the second conductive layer pattern comprises:
sequentially layering a transparent conductive layer and a second metal layer on the interlayer insulating layer pattern; and
forming a source electrode, a drain electrode, and a pixel electrode that include the transparent conductive layer, by patterning the transparent conductive layer and the second metal layer together.
9. The method of claim 8, further comprising doping an n-type or p-type impurity on an area of a portion of the polycrystalline silicon layer pattern after forming the second conductive layer pattern.
10. The method of claim 8, further comprising:
forming the pixel definition film having an opening exposing a portion of the pixel electrode on the second conductive layer pattern;
forming an organic emission layer on the pixel electrode; and
forming a common electrode on the organic emission layer.
11. The method of claim 10, wherein the second conductive layer pattern comprises:
a gate line; and
a connection line that contacts the gate electrode and the second capacitor electrode through corresponding ones of the contact holes.
12. The method of claim 10, wherein the forming of the interlayer insulating layer comprises:
forming a first interlayer insulating layer on the first conductive layer pattern; and
forming a second interlayer insulating layer on the first interlayer insulating layer,
wherein a refractive index of the second interlayer insulating layer is different than a refractive index of the first interlayer insulating layer.
13. The method of claim 12, wherein the first and second interlayer insulating layers comprise an inorganic film, an organic film, or a combination thereof.