Author: claimsbot

1. A computer-implemented system that facilitates data handling, comprising:
a data component for providing a comprehensive collection of correlated data; and
a data selection component for dynamically selecting and elevating a subset of the collection of correlated data for presentation based in part on user activity.
2. The system of claim 1, wherein the correlated data of the data component is defined by a data catalog that specifies data elements and metadata associated with the data elements, and data element relationships.
3. The system of claim 1, wherein the subset of correlated data is related to a launched application that is part of the user activity.
4. The system of claim 1, further comprising an interface component for receiving and presenting the subset of correlated data to the user based on the user activity.
5. The system of claim 4, wherein the interface component presents the subset of correlated data automatically based on one or more of content, workflow process, and user settings.
6. The system of claim 1, wherein the subset of correlated data is relevant to the user activity that is currently being processed.
7. The system of claim 1, further comprising a data catalog for organizing, correlating, and storing data elements and metadata based on at least one of the user and user context.
8. The system of claim 1, further comprising a criteria component for providing criteria that is processed by the data selection component as a basis for selecting the subset of correlated data.
9. The system of claim 8, wherein the criteria component detects display capabilities of a device, and the data selection component selects the subset of correlated data based on the device capabilities.
10. The system of claim 1, wherein the data selection component dynamically selects and elevates data related to the selected subset of correlated data, the related data elevated for presentation to the user.
11. A computer-implemented method of handling data, comprising:
specifying application data as data elements;
associating metadata with the data elements, the metadata associated with user activity;
correlating the data elements and metadata for storage as a data catalog of data element relationships and attributes; and
dynamically elevating a subset of the data elements as data relevant to an application activity.
12. The method of claim 11, further comprising presenting the subset of data elements in a form that is dynamically selected and populated with the subset of data, the subset of data presented as data relevant to activity information associated with interacting with an application.
13. The method of claim 11, wherein the subset of data elements is related to one or more applications a user has open.
14. The method of claim 11, further comprising:
elevating a second subset of data elements of another data catalog, wherein the subset and second subset of data elements are associated corresponding different applications; and
inserting the subset and the second subset of data elements into a single form for presentation at a presentation surface based on the application activity.
15. The method of claim 11, wherein the metadata includes information about at least one of a user, worker usage, point in workflow, and data exceptions.
16. The method of claim 11, further comprising inserting the subset of data elements into a dynamic form for presentation at a display surface, the form manipulable by the user and the data elements dynamically presented based on the form manipulation.
17. The method of claim 11, wherein the subset of data elements includes at least one of structured data and unstructured data for elevation as part of the relevant data and presented dynamically in a form at a point in a workflow.
18. The method of claim 11, further comprising elevating additional subsets of relevant data elements from respective different devices and presenting the subset and the additional subsets on a presentation surface.
19. The method of claim 11, further comprising presenting the elevated subset of data elements on a display surface via a dynamic form that is editable and adaptable at design time and runtime.
20. A computer-executable system for handling data, comprising:
computer-implemented means for decomposing a document into a collection of correlated data elements having relationships and associated metadata;
computer-implemented means for monitoring content of user activity;
computer-implemented means for selecting a subset of the data elements of the document based on the user activity;
computer-implemented means for dynamically elevating the subset of the data elements as data relevant to the user activity;
computer-implemented means for inserting the elevated subset into a form for presentation the subset of data elements; and
computer-implemented means for dynamically adjusting presentation of the elevated subset based on a change in the form.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

What is claimed is:

1. An NOx sensor control circuit unit adapted for use by connection to an NOx sensor, said NOx sensor comprising:
a first processing chamber isolated from surroundings, wherein a measurement gas containing NOx and oxygen is introduced into the first processing chamber via a first diffusion-controlling passage;
a second processing chamber isolated from surroundings, wherein a gas contained in the first processing chamber is introduced into the second processing chamber via a second diffusion-controlling passage;
an oxygen concentration detection element formed of an oxygen-ion conductive solid electrolyte sandwiched between porous electrodes and adapted to measure the oxygen concentration of gas contained in the first processing chamber;
a first pump element formed of an oxygen-ion conductive solid electrolyte sandwiched between porous electrodes and adapted to pump out oxygen from the first processing chamber;
a second pump element formed of an oxygen-ion conductive solid electrolyte sandwiched between porous electrodes and adapted to pump out oxygen from the second processing chamber; and
a heating element for heating the first pump element, the oxygen concentration detection element and the second pump element,
said NOx sensor control circuit unit comprising:
a first pump element control circuit for controlling a voltage applied to the first pump element to thereby control the partial pressure of oxygen in the first processing chamber such that an output voltage from the oxygen concentration detection element becomes substantially constant;
a first pump current detection circuit for detecting a first pump current flowing through the first pump element and for outputting a first pump current detection signal indicative of the detected current flowing through the first pump element;
a second pump element control circuit for applying a constant voltage to the second pump element in a direction so as to pump out oxygen from the second processing chamber;
a second pump current detection circuit for detecting a second pump current flowing through the second pump element and for outputting a second pump current detection signal indicative of the detected current flowing through the second pump element; and
a heating control circuit for controlling said heating element,

wherein the first pump current detection signal is used to determine the oxygen concentration of the measurement gas, and the first pump current detection signal and the second pump current detection signal are used to determine the NOx concentration of the measurement gas.
2. The NOx sensor control circuit unit according to claim 1, further comprising integration means for integrating the first pump element control circuit, the first pump current detection circuit, the second pump element control circuit and the second pump current detection circuit.
3. The NOx sensor control circuit unit according to claim 1, further comprising a microprocessor comprising heating control instruction means for instructing said heating control circuit to control heating performed by the heating element such that the temperature of the first pump element, the temperature of the oxygen concentration detection element and the temperature of the second pump element approach a target temperature.
4. The NOx sensor control circuit unit according to claim 1, further comprising an AD converter circuit for converting into digital signals the first pump current detection signal output from said first pump current detection circuit and the second pump current detection signal output from said second pump current detection circuit.
5. The NOx sensor control circuit unit according to claim 3, further comprising an AD converter circuit for converting into digital signals the first pump current detection signal output from said first pump current detection circuit and the second pump current detection signal output from said second pump current detection circuit.
6. The NOx sensor control circuit unit according to claim 5, wherein said microprocessor further comprises oxygen concentration information generation means for generating information regarding the oxygen concentration of the measurement gas based on the first pump current detection signal which has undergone AD conversion by said AD converter circuit and NOx concentration information generation means for generating information regarding the NOx concentration of the measurement gas based on the first pump current detection signal and the second pump current detection signal which have undergone AD conversion by said AD converter circuit.
7. The NOx sensor control circuit unit according to claim 6, wherein said microprocessor outputs digital signals, and said NOx sensor control circuit unit further comprises a DA converter circuit for converting to an analog signal a digital signal related to at least any of the oxygen concentration information, the NOx concentration information, air-fuel ratio information generated on the basis of the oxygen concentration information, and excess-oxygen ratio information generated on the basis of the oxygen concentration information, among digital signals output from said microprocessor, and for outputting a converted analog signal.
8. The NOx sensor control circuit unit according to claim 7, further comprising a display device for displaying at least any of the oxygen concentration of the measurement gas, the NOx concentration of the measurement gas, the air-fuel ratio, and the excess-oxygen ratio on the basis of a digital signal related to at least any of the oxygen concentration information, the NOx concentration information, the air-fuel ratio information generated on the basis of the oxygen concentration information, and the excess-oxygen ratio information generated on the basis of the oxygen concentration information, among the digital signals output from said microprocessor.
9. The NOx sensor control circuit unit according to claim 6, wherein said NOx sensor further comprises a temperature detection section for detecting the temperature of at least any of the first pump element, the oxygen concentration detection element, the second pump element and the heating element, and
wherein said microprocessor comprises means for performing temperature correction for information regarding the concentration of an object component selected from the group consisting of oxygen concentration information and NOx concentration information, said microprocessor generating oxygen concentration information corrected for temperature and NOx concentration information corrected for temperature on the basis of temperature detected by said temperature detection section, the first pump current detection signal and the second pump current detection signal.
10. The NOx sensor control circuit unit according to claim 9, wherein the oxygen concentration detection element comprises an internal resistance that varies with the element temperature to thereby serve as said temperature detection section,
said NOx sensor control circuit unit further comprising an internal-resistance measurement control circuit for measuring the internal resistance of the oxygen concentration detection element.
11. The NOx sensor control circuit unit according to claim 10, wherein, on the basis of a measured internal resistance, said heating control instruction means implemented by said microprocessor instructs said heating control circuit to control heating performed by the heating element such that the first pump element, the oxygen concentration detection element and the second pump element are heated to a target temperature.
12. An NOx sensor control circuit unit according to claim 10, wherein said internal-resistance measurement control circuit comprises an internal-resistance detection current application circuit for applying a constant internal-resistance detection current to the oxygen concentration detection element.
13. The NOx sensor control circuit unit according to claim 12, wherein said microprocessor comprises internal-resistance information detection means for detecting a resistance detection voltage applied to the oxygen concentration detection element while the internal-resistance detection current is flowing through the oxygen concentration detection element as information regarding the internal resistance of the oxygen concentration detection element.
14. The NOx sensor control circuit unit according to claim 12, wherein said internal-resistance measurement control circuit further comprises a modification current application circuit for applying a modification current to the oxygen concentration detection element in a direction opposite that of the internal-resistance detection current, after applying the internal-resistance detection current to the oxygen concentration detection element so as to measure the internal resistance of the oxygen concentration detection element.
15. An NOx sensor system, comprising:
an NOx sensor comprising:
a first processing chamber isolated from surroundings, wherein a measurement gas containing NOx and oxygen is introduced into the first processing chamber via a first diffusion-controlling passage;
a second processing chamber isolated from surroundings, wherein a gas contained in the first processing chamber is introduced into the second processing chamber via a second diffusion-controlling passage;
an oxygen concentration detection element formed of an oxygen-ion conductive solid electrolyte sandwiched between porous electrodes and adapted to measure the oxygen concentration of gas contained in the first processing chamber;
a first pump element formed of an oxygen-ion conductive solid electrolyte sandwiched between porous electrodes and adapted to pump out oxygen from the first processing chamber; and
a second pump element formed of an oxygen-ion conductive solid electrolyte sandwiched between porous electrodes and adapted to pump out oxygen from the second processing chamber; and
an NOx sensor control circuit unit connected to said NOx sensor comprising:
a first pump element control circuit for controlling a voltage applied to the first pump element to thereby control the partial pressure of oxygen in the first processing chamber such that an output voltage from the oxygen concentration detection element becomes substantially constant;
a first pump current detection circuit for detecting a first pump current flowing through the first pump element and for outputting a first pump current detection signal indicative of the detected current flowing through the first pump element; and
a second pump element control circuit for applying a constant voltage to the second pump element in a direction so as to pump out oxygen from the second processing chamber;
a second pump current detection circuit for detecting a second pump current flowing through the second pump element and for outputting a second pump current detection signal indicative of the detected current flowing through the second pump element.
16. The NOx sensor system according to claim 15, further comprising:
a standard characteristics information storage section for storing predetermined standard characteristics information representing correlations among the first pump current, the second pump current and the NOx concentration of the measurement gas;
a correction data storage element for storing correction data for making the previously measured characteristics of said NOx sensor equal to the standard characteristics, which characteristics represent correlations among the first pump current, the second pump current, and the NOx concentration of the measurement gas; and
a microprocessor comprising NOx concentration information generation means for generating information regarding the NOx concentration of the measurement gas based on the first pump current detection signal and the second pump current detection signal,
wherein said NOx concentration information generation means implemented by said microprocessor detects a signal indicative of the first pump current and a signal indicative of the second pump current, corrects the detected values on the basis of the correction data, and generates information regarding the NOx concentration of the measurement gas based on the standard characteristics information.
17. The NOx sensor system according to claim 15, wherein said NOx sensor further comprises a heating element for heating the first pump element, the oxygen concentration detection element and the second pump element, and said NOx sensor control circuit unit further comprises a heating control circuit for controlling said heating element.

1. An electronic module comprising:
a first component disposed over a second component;
a plurality of electrical connect structures disposed between and electrically connecting the first component and the second component;
a heat distributor disposed between the first component and the second component, the heat distributor comprising a thermally conductive material and extending laterally beyond an edge of at least the first component to facilitate conduction of heat laterally out from between the first component and the second component past the edge of the first component, the heat distributor comprising a plurality of openings sized and positioned to allow the plurality of electrical connect structures to pass therethrough without electrically contacting the heat distributor, the heat distributor being electrically isolated from the plurality of electrical connect structures; and
wherein the heat distributor comprises a wire mesh structure disposed between the first component and the second component and extending laterally beyond the edge of the first component to facilitate conduction of heat laterally out from between the first component and the second component past the edge of the first component.
2. The electronic module of claim 1, further comprising a thermally conductive enclosure sized and configured to facilitate sealing at least the first component and the heat distributor within the electronic module, the heat distributor physically contacting the thermally conductive enclosure to facilitate conduction of heat from between the first component and the second component laterally outwards to the thermally conductive enclosure of the electronic module.
3. The electronic module of claim 2, wherein the thermally conductive enclosure comprises a thermally conductive cover disposed over the first component, and wherein the electronic module further comprises a heat sink coupled to the thermally conductive cover.
4. The electronic module of claim 1, wherein the heat distributor is fabricated and disposed to conduct heat laterally out from between the first component and the second component beyond the edge of at least the first component in at least a first direction and a second direction.
5. The electronic module of claim 4, wherein the first direction and the second direction are opposite directions.
6. The electronic module of claim 1, wherein the heat distributor extends beyond the edge of at least the first component in four directions to facilitate conduction of heat laterally outwards in the four directions, past the edge of the first component, from between the first component and the second component.
7. The electronic module of claim 1, wherein the wire mesh structure comprises a plurality of parallel-extending wires extending laterally beyond the edge of the first component to facilitate conduction of heat laterally out from between the first component and the second component past the edge of the first component.
8. The electronic module of claim 7, wherein the plurality of parallel-extending wires comprises a first plurality of parallel-extending wires, and wherein the heat distributor further comprises a second plurality of parallel-extending wires, the second plurality of parallel-extending wires intersecting the first plurality of parallel-extending wires.
9. An electronic module comprising:
a first component disposed over a second component, at least the first component being a chip;
a plurality of electrical connect structures disposed between and electrically connecting the first component and the second component;
a thermally conductive enclosure enclosing at least the first component within the electronic module;
a heat distributor disposed between the first component and the second component, the heat distributor comprising a thermally conductive material and extending laterally beyond an edge of at least the first component to facilitate conduction of heat laterally out from between the first component and the second component past the edge of the first component, the heat distributor comprising a plurality of openings sized and positioned to allow the plurality of electrical connect structures to pass therethrough without electrically contacting the heat distributor, the heat distributor being electrically isolated from the plurality of electrical connect structures; and
wherein the heat distributor comprises a plurality of parallel-extending wires extending laterally beyond the edge of the first component to facilitate conduction of heat laterally outwards from between the first component and the second component past the edge of the first component to the thermally conductive enclosure.
10. The electronic module of claim 9, wherein the thermally conductive enclosure comprises a sidewall, and the heat distributor physically contacts the sidewall of the thermally conductive enclosure to facilitate conduction of heat from between the first component and the second component laterally outwards to the sidewall of the thermally conductive enclosure.
11. The electronic module of claim 9, wherein the first component comprises a first chip, the plurality of electrical connect structures comprise a first plurality of electrical connect structures, and the heat distributor comprises a first heat distributor, and wherein the electronic module further comprises a second chip disposed over the first chip, a second plurality of electrical connect structures disposed between and electrically connecting the first chip and the second chip, and a second heat distributor disposed between the first chip and the second chip, the second heat distributor comprising a thermally conductive material and extending laterally beyond an edge of the first chip and an edge of the second chip to facilitate conduction of heat laterally out from between the first chip and the second chip past the edge of the first chip and the edge of the second chip, the second heat distributor comprising a plurality of openings sized and positioned to allow the second plurality of electrical connect structures to pass therethrough without electrically contacting the second heat distributor, the second heat distributor being electrically isolated from the second plurality of electrical connect structures.
12. The electronic module of claim 11, wherein the thermally conductive enclosure comprises a sidewall, and the first heat distributor and the second heat distributor each physically contact the sidewall of the thermally conductive enclosure to facilitate conduction of heat from between the first chip and the second chip, and from between the first chip and the second component laterally outwards to the sidewall of the thermally conductive enclosure.
13. The electronic module of claim 9, wherein the plurality of parallel-extending wires are part of a wire mesh structure disposed between the first component and the second component and extending laterally beyond the edge of the first component to facilitate conduction of heat laterally outwards from between the first component and the second component past the edge of the first component to the thermally conductive enclosure.
14. The electronic module of claim 9, wherein the plurality of parallel-extending wires comprises a first plurality of parallel-extending wires, and wherein the heat distributor further comprises a second plurality of parallel-extending wires, the second plurality of parallel-extending wires intersecting the first plurality of parallel-extending wires.
15. A method of fabricating an electronic module, the method comprising:
providing a first component with a plurality of electrical connect structures;
associating a heat distributor with the first component, the heat distributor comprising a thermally conductive material and extending laterally beyond an edge of the first component to facilitate conduction of heat laterally out away from the first component, the heat distributor comprising a plurality of openings sized and positioned to allow the plurality of electrical connect structures to pass therethrough without electrically contacting the heat distributor;
positioning the first component and associated heat distributor over a second component, with the heat distributor disposed between the first component and the second component and the plurality of electrical connect structures passing through the heat distributor and electrically connecting the first component to the second component, the heat distributor being electrically isolated from the plurality of electrical connect structures; and
wherein the first component comprises a chip and the second component a substrate, and wherein the associating, comprises placing the chip and the heat distributor into a first fixture, and the positioning comprises placing the substrate into a second fixture and aligning the first fixture to the second fixture, the method further comprising re-flowing the plurality of electrical connect structures to attach the plurality of electrical connect structures to the second component to form electrical connection between the first component and the second component, and injecting a thermal interface material as underfill between the first component and the heat distributor and between the heat distributor and the second component, the thermal interface material electrically isolating the plurality of electrical connect structures from the heat distributor.
16. The method of claim 15, further comprising attaching the plurality of electrical connect structures to the second component to form the electrical connection between the first component and the second component, and injecting a thermal interface material as underfill between the first component and the heat distributor and between the heat distributor and the second component, the thermal interface material electrically isolating the plurality of electrical connect structures from the heat distributor.
17. The method of claim 15, further comprising using a thermally conductive enclosure to enclose at least the first component and the heat distributor within the electronic module, the using comprising physically contacting the heat distributor to a sidewall of the thermally conductive enclosure to facilitate conduction of heat from between the first component and the second component laterally outwards to the sidewall of the thermally conductive enclosure.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A balloon catheter comprising:
a flexible outer shaft having a proximal end, a distal end, an inner surface, an outer surface, and an outer diameter;
an inner shaft having a thin wall with an inner surface and an outer surface, wherein said inner surface of said inner shaft comprises a crescent shaped inflation lumen and wherein a guide wire lumen is formed between said outer surface of said inner shaft and said inner surface of said outer shaft; wherein said inner shaft is radially collapsible to enlarge said guide wire lumen;
a balloon mounted to said distal end of said outer shaft, wherein an interior of said balloon is in fluid communication with said inflation lumen;
a hatch disposed in said outer shaft proximal of said balloon, an outer surface of said hatch is recessed from said outer surface of said outer shaft, wherein said hatch is removable to create a guide wire port; and
a bifurcate hub mounted to said proximal end of said outer shaft.
2. The balloon catheter of claim 1, wherein said outer surface of said hatch is protruding from said outer surface of said outer shaft.