Author: claimsbot

1. A method for manufacturing a conductor part for a connector unit, wherein the conductor part comprises a conductive core, an insulating sleeve and at least a first conductive layer arranged between the conductive core and the insulating sleeve, wherein the method comprises:
equipping at least one section of a radially inner surface of the insulating sleeve with the first conductive layer;
equipping at least one section of a radially outer surface of the insulating sleeve with at least a second conductive layer, wherein the second conductive layer is a metal layer or a conductive plastic layer; and
inserting the conducting core in the insulating sleeve before or after the equipping of the radially inner surface or the radially outer surface of the insulating sleeve with the first conductive layer or the second conductive layer, respectively.
2. The method of claim 1, wherein the equipping of the at least one section of the radially outer surface of the insulating sleeve comprises plating the metal layer onto the at least one section of the radially outer surface of the insulating sleeve, spraying the second conductive layer onto the at least one section of the radially outer surface of the insulating sleeve, or a combination thereof.
3. The method of claim 1, wherein the equipping of the at least one section of the radially inner surface of the insulating sleeve comprises plating the first conductive layer on the at least one section of the radially inner surface of the insulating sleeve, the equipping of the at least one section of the radially inner surface of the insulating sleeve comprises spraying the first conductive layer onto the at least one section of the radially inner surface of the insulating sleeve, the first conductive layer is a metal layer or a conductive plastic layer, or any combination thereof.
4. The method of claim 1, further comprising filling at least a radial space between the conductive core and the first conductive layer at the radially inner surface of the insulating sleeve with at least a mediator layer,
wherein the mediator layer has a material of a grease or an adhesive.
5. The method of claim 1, wherein the equipping of the at least one section of the radially inner surface of the insulating sleeve comprises connecting the first conductive layer to the at least one section of the radially inner surface of the insulating sleeve by an interference fit.
6. The method of claim 5, further comprising:
heating the insulating sleeve so that a diameter of the insulating sleeve expands;
inserting a tube out of a conductive material into an expanded diameter of the insulating sleeve;
connecting the insulating sleeve to the tube by cooling down the heated insulating sleeve, thus providing a fixed connection between the tube and the insulating sleeve, wherein the tube represents the first conductive layer.
7. The method of claim 5, further comprising providing another section of the radially inner surface of the insulating sleeve with at least one further conductive layer.
8. The method of claim of claim 7, wherein the at least one further conductive layer is a metal layer.
9. A conductor part of a connector unit for connecting at least two connected parts, wherein the conductor part comprises:
a conductive core;
an insulating sleeve;
at least a first conductive layer arranged between the conductive core and the insulating sleeve, wherein the first conductive layer is arranged at at least one section of an inner surface of the insulating sleeve;
at least a second conductive layer arranged at at least one section of an outer surface of the insulating sleeve, wherein the second conductive layer is a metal layer, a conductive plastic layer, or a combination thereof.
10. The conductor part of claim 9, wherein the first conductive layer is a metal layer, a conductive plastic layer, or a combination thereof.
11. The conductor part of claims 9, wherein the first conductive layer has a same base material as the insulating sleeve.
12. The conductor part of claim 11, wherein the first conductive layer is a layer out of a polymer material or a thermoset polymer material.
13. The conductor part of claim 11, wherein the inner surface of the insulating sleeve is a radially inner surface and comprises another section,
wherein the other section comprises at least one further conductive layer, and
wherein the at least one further conductive layer is a metal layer.
14. The conductor part of claim 9, wherein the first conductive layer and the second conductive layer have a thickness between 1 \u03bcm and 20 mm, when the first conductive layer and the second conductive layer are metal layers, the first conductive layer and the second conductive layer have a thickness between 1 \u03bcm and 40 \u03bcm, when the first conductive layer and the second conductive layer are conductive plastic layers, the first conductive layer and the second conductive layer have a thickness between 1 mm and 20 mm.
15. The conductor part of claim 14, wherein the first conductive layer and the second conductive layer have a thickness of between 5 \u03bcm and 15 mm.
16. The conductor part of claim 15, wherein the first conductive layer and the second conductive layer have a thickness of between 10 \u03bcm and 10 mm.
17. The conductor part of claim 14, wherein when the first conductive layer and the second conductive layer are metal layers, the first conductive layer and the second conductive layer have a thickness between 5 \u03bcm and 35 \u03bcm.
18. The conductor part of claim 17, wherein when the first conductive layer and the second conductive layer are metal layers, the first conductive layer and the second conductive layer have a thickness between 10 \u03bcm and 30 \u03bcm.
19. The conductor part of claim 14, wherein when the first conductive layer and the second conductive layer are conductive plastic layers, the first conductive layer and the second conductive layer have a thickness between 1.5 mm and 10 mm.
20. The conductor part of claim 19, wherein when the first conductive layer and the second conductive layer are conductive plastic layers, the first conductive layer and the second conductive layer have a thickness between 2 mm and 5 mm.
21. The conductor part of claim 9, wherein the second conductive layer is the metal layer, and
wherein the metal layer is made of copper, a copper alloy, an aluminum, a nickel-cobalt ferrous alloy, molybdenum, titanium, or nickel.
22. The conductor part of claim 9, wherein the conductive core is made of copper, a copper alloy, aluminum, a nickel-cobalt ferrous alloy, or molybdenum.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A semiconductor device comprising a power supply, a first capacitor and a second capacitor, each of the first and second capacitors including first and second electrodes, the first electrode of the first capacitor and the first electrode of the second capacitor being connected in common and being supplied with a first voltage from the power supply, the second electrode of the first capacitor being supplied with a second voltage from the power supply, the second voltage being different from the first voltage, and the second electrode of the second capacitor being supplied with the first voltage.
2. The semiconductor device according to claim 1, further comprising a third capacitor including a first electrode connected in common to the first electrodes of the first and second capacitors and applied with the first voltage, and a second electrode applied with a third voltage that is different from the first and second voltages.
3. The semiconductor device according to claim 1, wherein the semiconductor device includes a memory array region having a plurality of memory cells and a peripheral region free from memory cells, and the first and second capacitors are provided in the peripheral region.
4. The semiconductor device according to claim 1, wherein the first voltage is about a half of the second voltage.
5. The semiconductor device according to claim 2, wherein the first voltage is about a half of the second voltage, and the third voltage is a ground voltage.
6. The semiconductor device according to claim 2, further comprising a fourth capacitor including a first electrode connected in common to the first electrodes of the first, second and third capacitors and applied with the first voltage, and a second electrode applied with the first voltage.
7. A semiconductor device comprising:
a power supply;
a memory cell array region including a plurality of memory cells each of which includes a memory cell capacitor; and
a peripheral region including first and second compensation capacitors, each of the first and second compensation capacitors being the same in structure as the memory cell capacitor; wherein,
the first compensation capacitor includes first and second electrodes, the second compensation capacitor including third and fourth electrodes, the first electrode of the first compensation capacitor and the third and fourth electrodes of the second compensation capacitor are commonly supplied with a first voltage from the power supply, and the second electrode of the first compensation capacitor being supplied with a second voltage, which is different from the first voltage from the power supply.
8. The semiconductor device according to claim 7, further comprising:
a first line connected to the first electrode of the first compensation capacitor and the third and fourth electrodes of the second compensation capacitor in common to supply the first voltage to the first, third and fourth electrodes; and
a second line connected to the second electrode of the first compensation capacitor to supply the second voltage to the second electrode.
9. The semiconductor device according to claim 7, wherein the peripheral region further includes a third compensation capacitor which is the same in structure as the memory cell capacitor, and the third compensation capacitor including a fifth electrode supplied with the first voltage and a sixth electrode supplied with a third voltage which is different from the first and second voltages.
10. The semiconductor device according to claim 9, further comprising:
a first line connected to the first electrode of the first compensation capacitor, the third and fourth electrodes of the second compensation capacitor and the fifth electrode of the third compensation capacitor in common to supply the first voltage to the first, third, fourth and fifth electrodes;
a second line connected to the second electrode of the first compensation capacitor to supply the second voltage to the second electrode; and
a third line connected to the sixth electrode of the third compensation capacitor to supply the third voltage to the sixth electrode.

1. A method of producing a flocked transfer comprising:
(a) supplying a flocked release sheet comprising a release sheet, a release adhesive adhered to the release sheet, and a plurality of flock fibers, with the flock fibers being adhered to the release sheet by the release adhesive;
(b) supplying a pre-formed, solid, and self-supporting thermoplastic adhesive sheet;
(c) thereafter contacting the flocked release sheet with the pre-formed, solid, and self-supporting thermoplastic adhesive sheet, with the flock fibers being substantially perpendicular to an adjacent surface of the thermoplastic adhesive sheet and the flock being positioned between the release sheet and release adhesive on the one hand and the thermoplastic adhesive sheet on the other; and
(d) while the flocked release sheet is in contact with the thermoplastic adhesive sheet, heating and applying pressure to the pre-formed, solid, and self-supporting thermoplastic sheet to soften the thermoplastic adhesive and embed ends of the flock fibers in the thermoplastic adhesive sheet, thereby adhering the thermoplastic adhesive sheet to the flock of the flocked release sheet.
2. The method of claim 1, wherein the step of heating the thermoplastic adhesive sheet comprises heating the thermoplastic adhesive sheet to a temperature at which the thermoplastic adhesive sheet becomes tacky, but below a temperature at which the thermoplastic adhesive sheet begins to soften or physically adhere and wherein the thermoplastic adhesive sheet is later adhered to a substrate.
3. The method of claim 1, wherein the step of heating the thermoplastic adhesive sheet comprises heating the thermoplastic adhesive sheet to a temperature at which the thermoplastic adhesive sheet softens and wherein the thermoplastic adhesive sheet is in contact with a substrate during heating and is adhered permanently to the substrate after heating.
4. The method of claim 3 wherein the thermoplastic adhesive sheet has upper and lower portions, wherein the upper portion is contacted with the substrate, wherein the lower portion is contacted with the flock and is positioned between the flock and upper portion, and wherein at least one of the melting point and viscosity of the upper portion is higher than the at least one of the melting point and viscosity of the lower portion.
5. The method of claim 4, wherein the upper portion has a higher melting point than the lower portion.
6. The method of claim 1, wherein the thermoplastic adhesive sheet is at least one of a thermoplastic polyurethane blank and a thermoplastic polyester blank having a substantially uniform thickness.
7. The method of claim 1, wherein at least most of the flock is in direct contact with the thermoplastic adhesive sheet.
8. The method of claim 1, wherein there is no binder adhesive in contact with the thermoplastic adhesive sheet.
9. The method of claim 1, wherein the release sheet and thermoplastic adhesive sheet are on opposing surfaces of the flock.
10. The method of claim 1, wherein the heating step is performed substantially in the absence of a binder adhesive positioned between the thermoplastic adhesive sheet and the flock.
11. The method of claim 1, wherein, after step (d), an embedded length of a flock fiber is positioned in the adhesive and wherein, for most of the flock fibers, the embedded flock length used for the thermoplastic adhesive sheet is less than the embedded flock length used for a screen printed latex.
12. The method of claim 1, further comprising:
before step (d), precutting the thermoplastic adhesive sheet to a desired shape of a transfer formed in step (d).
13. The method of claim 1, further comprising thereafter adhering the thermoplastic adhesive sheet to a substrate to adhere the flock to the substrate.
14. The method of claim 13, wherein the step of heating the thermoplastic adhesive sheet and the step of adhering the thermoplastic adhesive sheet to the substrate are performed substantially simultaneously in a single operation.
15. The method of claim 13, further including, before step (d), a step of cutting the thermoplastic adhesive sheet to a desired shape.
16. The method of claim 12, wherein the interface between the thermoplastic adhesive sheet and the substrate is at least substantially free of a binder adhesive.
17. The method of claim 1, wherein the flock comprises a plurality of fibers substantially perpendicular to the release sheet, and wherein at least substantially all of the flock fibers that are substantially perpendicular to the release sheet contact the thermoplastic adhesive sheet.
18. The method of claim 1, in step (d), the pressure ranges from about 40 to about 50 psi.
19. The method of claim 1, wherein the thermoplastic adhesive, after step (d), is free of a powdered hot melt adhesive.
20. A method for continuously producing an article of manufacture having a flocked surface, the method comprising:
(a) providing a flocked release sheet comprising a release sheet on the release sheet and a release agent and a plurality of flock fibers attached to the release agent, wherein the flock fibers are formed in a desired pattern on the release sheet and are substantially perpendicular to the release sheet;
(b) providing a pre-formed, solid, and self-supporting thermoplastic adhesive sheet;
(c) providing a substrate;
(d) thereafter contacting the substrate, thermoplastic adhesive sheet, and flocked release sheet together, with the thermoplastic adhesive sheet being positioned between the flocked release sheet and the substrate and a free surface of the flock being in contact with the thermoplastic adhesive sheet, to produce a pre-assembly, wherein at least substantially all of the flock fibers that are substantially perpendicular to the release sheet contact the thermoplastic adhesive sheet; and
(e) heating while applying pressure to the pre-assembly to tackify the thermoplastic adhesive and thereby adhere the free surface of the flock and the substrate to the thermoplastic adhesive sheet to form an article of manufacture, wherein at least substantially all of the flock fibers are embedded in the thermoplastic adhesive sheet.
21. The method of claim 20, wherein the thermoplastic adhesive sheet has a substantially uniform thickness.
22. The method of claim 20, wherein the thermoplastic adhesive sheet is a thermoplastic polyester andor a thermoplastic polyurethane.
23. The method of claim 20, wherein at least most of the flock fibers are in direct contact with the thermoplastic adhesive sheet.
24. The method of claim 20, wherein there is no binder adhesive required to be in contact with the thermoplastic adhesive sheet.
25. The method of claim 20, wherein the release sheet and thermoplastic adhesive sheet are on opposing surfaces of the flock.
26. The method of claim 20, further comprising: applying heat to
the pre-assembly to adhere the flock to the substrate; and removing the release sheet from the flock to produce a flocked substrate.
27. The method of claim 20, wherein the thermoplastic adhesive sheet comprises upper and low portions, the upper portion being in contact with the flock, and wherein at least one of the following statements is true:
(i) the upper portion has a higher melting point than the lower portion; and
(ii) when melted, the upper portion has a higher viscosity than the lower portion.
28. The method of 20, wherein the pressure applied to the pre-assembly ranges from about 40 to about 50 psi.
29. The method of claim 20, wherein the article of manufacture is free of a powdered hot melt adhesive.
30. A method for forming a transfer, comprising:
(a) forming a flocked release sheet, the flocked release sheet comprising a release sheet, flock fibers, and a release agent positioned between the release sheet and flock, wherein the release agent adheres the flock to the release sheet;
(b) contacting a pre-formed, solid, and self-supporting thermoplastic adhesive sheet to the exposed ends of the flock of the flocked release sheet, wherein the thermoplastic adhesive sheet is formed before step (b); and
(c) while the thermoplastic adhesive sheet is in contact with the flock, heating and applying pressure to the flocked release sheet and thermoplastic adhesive sheet to render the thermoplastic adhesive sheet tacky and embed ends of the flock fibers in the thermoplastic adhesive sheet, thereby adhering the flocked release sheet to the thermoplastic adhesive sheet and providing a transfer comprising the thermoplastic adhesive sheet and flocked release sheet.
31. The method of claim 30, wherein step (c) is performed substantially in the absence of a binder adhesive positioned between the thermoplastic adhesive sheet and the flock and wherein the thermoplastic adhesive sheet has a substantially uniform thickness before and after steps (b) and (c).
32. The method of claim 30, further comprising:
(d) thereafter contacting the thermoplastic adhesive sheet with a substrate; and
(e) while the thermoplastic adhesive sheet is contacted with the substrate, heating and applying pressure to the transfer to adhere the transfer to the substrate, wherein, in the contacting step (d), the interface between the thermoplastic adhesive sheet and the substrate is at least substantially free of a binder adhesive.
33. The method of claim 32, wherein, after step (c), an embedded length of a flock fiber is positioned in the thermoplastic adhesive sheet and wherein, for most of the flock fibers, the embedded flock length used for the thermoplastic adhesive sheet is less than the embedded flock length used for a screen-printed latex.
34. The method of claim 32, wherein the thermoplastic adhesive sheet is partially melted in the heating step (e).
35. The method of claim 32, wherein the thermoplastic adhesive sheet has upper and lower portions, wherein the upper portion is contacted with the substrate, wherein the lower portion is contacted with the flock and is positioned between the flock and upper portion, and wherein at least one of the melting point and viscosity of the upper portion is higher than the at least one of the melting point and viscosity of the lower portion.
36. The method of claim 35 wherein the upper portion has a higher melting point than the lower portion, and wherein each of steps (d) and (e) occurs after each steps (b) and (c).
37. The method of claim 30, further comprising:
before step (b), precutting the thermoplastic adhesive sheet to a desired final shape of the transfer.
38. The method of claim 30, wherein a first surface of the thermoplastic adhesive sheet in contact with the flock and a second opposing surface are each at least substantially free of a binder adhesive.
39. The method of claim 30, wherein the flock comprises a plurality of fibers substantially perpendicular to the release sheet, and wherein at least substantially all of the flock fibers that are substantially perpendicular to the release sheet contact the thermoplastic adhesive sheet.
40. The method of claim 30, wherein the pressure applied to the flocked release sheet and thermoplastic adhesive sheet ranges from about 40 to about 50 psi.
41. The method of claim 30, wherein the transfer is free of a powdered hot melt adhesive.
42. A method of producing a flocked transfer assembly, comprising:
providing a release agent on the release sheet;
flocking a plurality of flock fibers on the release agent in a desired pattern to form a flocked release sheet, having a free surface of the flock, wherein the release agent holds the flock to the release sheet, and wherein the flock fibers are substantially perpendicular to the upper and lower surfaces and to the release sheet;
providing a pre-formed, solid and self-supporting thermoplastic adhesive sheet;
contacting the free surface of the flock with the thermoplastic adhesive sheet such that at least most of a free surface of the flock is in direct physical contact with the thermoplastic adhesive sheet;
heating and applying pressure to the flocked release sheet and thermoplastic adhesive sheet to render the thermoplastic adhesive tacky and embed at least most of the flock fibers in the thermoplastic adhesive, thereby adhering the thermoplastic adhesive sheet to the free surface of the flock to produce a flocked transfer assembly; and
subsequently adhering the flocked transfer assembly to a substrate.
43. The method of claim 42, wherein the pressure applied to the flocked release and thermoplastic adhesive sheets ranges from about 40 to about 50 psi.
44. The method of claim 42, wherein the flocked transfer assembly is free of a powdered hot melt adhesive.
45. A method of producing an article of manufacture having a flocked surface, comprising:
supplying a flocked surface comprising flock;
supplying a pre-formed solid, and self-supporting thermoplastic adhesive sheet having a substantially uniform thickness and substantially flat upper and lower surfaces;
thereafter contacting the thermoplastic adhesive sheet with the flock; and
while the flocked surface is in contact with the thermoplastic adhesive sheet, heating and applying pressure to the thermoplastic adhesive sheet to soften the adhesive and embed at least most of the flock fibers in the thermoplastic adhesive, thereby binding the thermoplastic adhesive sheet to the flock of the flocked surface.
46. The method of claim 45, wherein the flocked surface comprises a release sheet and a release agent in contact with a first side of the flocked surface, and wherein the thermoplastic adhesive sheet is in contact with an opposing second side of the flocked surface.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A collision safety control device of a vehicle comprising:
first and second harness portions, first and second cab ground portions mutually connected through a cab of the vehicle, and a first frame ground portion in a first portion of a frame of the vehicle on a driver’s seat side,
third and fourth harness portions, third and fourth cab ground portions mutually connected through the cab, and a second frame ground portion in a second portion of the frame on a passenger’s seat side; wherein,
a fifth harness portion is connected to the first and the third harness portions and to the collision safety control device,
the first harness portion is connected to the cab at the first cab ground portion,
the second harness portion is connected to the cab at the second cab ground portion and to the first portion of the frame at the first frame ground portion,
the third harness portion is connected to the cab at the third cab ground portion,
the fourth harness portion is connected to the cab at the fourth cab ground portion and to the second portion of the frame at the second frame ground portion
the first, the second and the fifth harness portions form a first ground line from the collision safety control device to the first portion of the frame,
the third, the fourth and the fifth harness portions form a second ground line from the collision safety control device to the second portion of the frame,
the first portion of the frame and the second portion of the frame are separated by a first width, and
the first ground line and the second ground line are mutually separated by a second width that is greater than the first width.