1461135276-2a10c51e-a563-4501-bc16-e4b8d14dfdeb

1. A touch pad module suitable for an electronic device, the touch pad module comprising:
a circuit board, having a first surface and a recessed area below the first surface;
a trigger element standing on the first surface of the circuit board across the recessed area; and
a gap exists between the trigger element and the first surface of the circuit board, and an amount of deformation of the trigger element towards the recessed area is larger than the gap;
wherein when the trigger element deforms by an external force, at least a part of the trigger element is located in the recessed area; and
wherein the recessed area includes a through hole, and when the trigger element is deformed by the external force, a bottom portion of the trigger element is located in the through hole.
2. The touch pad module as claimed in claim 1, wherein the circuit board further comprises:
a ground area surrounding the recessed area, wherein the trigger element is in constant contact with the ground area; and
a touch and press operation area disposed in the recessed area, wherein when the trigger element being is deformed by the external force, the trigger element contacts the touch and press operation area to electrically conduct the ground area and the touch and press operation area.
3. The touch pad module as claimed in claim 2, wherein the circuit board further comprises an airflow passage connected between the recessed area and a lateral surface of the circuit board.
4. The touch pad module as claimed in claim 2, wherein the circuit board further comprises:
a through hole located in the recessed area, the touch and press operation area surrounding the through hole.
5. The touch pad module as claimed in claim 1, wherein the circuit board further comprises:
a ground area surrounding the recessed area, and
the trigger element being constantly contacted to the ground area; and
a touch and press operation area disposed between the ground area and the recessed area and surrounding the recessed area, wherein when the trigger element is deformed by the external force, the trigger element and the touch and press operation area are in contact with each other to electrically conduct the ground area and the touch and press operation area.
6. The touch pad module of claim 5, wherein the ground area and the touch and press operation area are located on one same plane of the circuit board.
7. The touch pad module as claimed in claim 1, wherein the trigger element is a metal reed.
8. An electronic device, comprising:
a housing, having an opening;
a touch pad, disposed in the housing, a touch surface of the touch pad exposing the housing from the opening;
a circuit board, disposed in the housing and having a first surface and a recessed area below the first surface; and
a trigger element, standing on the first surface of the circuit board across a top of the recessed area, and disposed between the touch pad and the circuit board; and
a gap exists between the trigger element and the first surface of the circuit board, and an amount of deformation of the trigger element towards the recessed area is larger than the gap;
wherein when the trigger element deforms by an external force, at least a part of the trigger element is located in the recessed area; and
wherein the recessed area includes a through hole, and when the trigger element is deformed by the external force, a bottom portion of the trigger element is located in the through hole.
9. The electronic device as claimed in claim 8, wherein the circuit board further comprises:
a ground area surrounding the recessed area, wherein the trigger element is in constant contact with the ground area; and
a touch and press operation area, located in the recessed area, wherein when the trigger element is deformed by the external force, the trigger element contacts the touch and press operation area to electrically conduct the ground area and the touch and press operation area.
10. The electronic device as claimed in claim 9, wherein the circuit board further comprises an airflow passage, connected between the recessed area and a lateral surface of the circuit board.
11. The electronic device as claimed in claim 9, wherein the circuit board further comprises:
a through hole, located in the recessed area, the touch and press operation area surrounding the through hole.
12. The electronic device as claimed in claim 8, wherein the circuit board further comprises:
a ground area, surrounding the recessed area, and the trigger element being constantly contacted against the ground area; and
a touch and press operation area disposed between the ground area and the recessed area and surrounding the recessed area, wherein when the trigger element is deformed by the external force, the trigger element and the touch and press operation area are in contact with each other to electrically conduct the ground area and the touch and press operation area.
13. The electronic device as claimed in claim 12, wherein the ground area and the touch and press operation area are located on one same plane of the circuit board.
14. The electronic device as claimed in claim 8, wherein the trigger element is a metal reed.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

What is claimed is:

1. A heat insulator apparatus for a vehicle floor, comprising:
a plurality of heat insulating plates interposed between a vehicle floor and an exhaust part disposed below the vehicle floor in such a manner that the mutually adjoining heat insulating plates forms a gap therebetween to thereby form an air passage therebetween, for preventing the heat of the exhaust part from being transmitted to the vehicle floor,
wherein at least one of the heat insulating plates is formed such that an air entrance portion of the air passage is narrowed.
2. The heat insulator apparatus as set forth in claim 1, wherein at least one of the heat insulating plates encloses an upper portion of the exhaust part, and is extended by a predetermined distance backwardly from an exit portion of the exhaust part.
3. The heat insulator apparatus as set forth in claim 2, wherein the heat insulating plate extended backwardly is disposed in a side close to the exhaust part.
4. The heat insulator apparatus as set forth in claim 1, wherein the heat insulating plate has a narrow portion formed in a step-shape in cross section at a front end portion thereof.

1461135265-ac72dc12-244e-4be1-ad30-96db2f2f811b

1. A method for automatically setting an operating parameter of an analytical instrument, comprising:
automatically determining if the analytical instrument is mounted on a stand;
if the analytical instrument is determined to be mounted on the stand, operating the analytical instrument according to a first operating parameter; and
if the analytical instrument is determined not to be mounted on the stand, operating the analytical instrument according to a second operating parameter different than the first operating parameter.
2. A method according to claim 1, wherein determining if the analytical instrument is mounted on the stand comprises determining if the analytical instrument is mounted on a stand that is capable of cooling at least a portion of the analytical instrument.
3. A method according to claim 1, wherein determining if the analytical instrument is mounted on the stand comprises determining if the analytical instrument is mounted on a stand that is capable of providing electrical power to the analytical instrument.
4. A method according to claim 1, wherein, according to the first operating parameter, the analytical instrument is operated at a higher power rating than according to the second operating parameter.
5. A method according to claim 1, wherein determining if the analytical instrument is mounted on the stand comprises scanning for a contactless memory associated with the stand.
6. A method according to claim 5, wherein the scanning for the contactless memory comprises scanning for a radio-frequency identification (RF-ID) tag.
7. A method according to claim 5, wherein the scanning for the contactless memory comprises scanning a barcode.
8. A method according to claim 5, wherein the scanning for the contactless memory comprises reading a magnetic stripe.
9. A method for automatically preventing unsafe operation of an analytical instrument that can operate in at least two different modes, the method comprising:
automatically determining if the analytical instrument is mounted on a stand;
if the analytical instrument is determined to be mounted on the stand, operating the analytical instrument according to a first of the at least two different modes only if a safety device on the stand has been activated; and
if the analytical instrument is determined not to be mounted on the stand, operating the analytical instrument according to a second of the at least two different modes.
10. A method according to claim 9, wherein:
operating the analytical instrument according to the first mode comprises operating a source for producing a beam of penetrating radiation at a first power level; and
operating the analytical instrument according to the second mode comprises operating the source for producing a beam of penetrating radiation at a second power level less than the first power level.
11. A method according to claim 10, wherein the source for producing a beam of penetrating radiation comprises an x-ray tube.
12. A method according to claim 10, wherein the source for producing a beam of penetrating radiation comprises a laser.
13. A method according to claim 10, wherein the source for producing a beam of penetrating radiation comprises a spark source.
14. A method according to claim 9, wherein the safety device comprises a closeable cover.
15. A method according to claim 9, wherein determining if the analytical instrument is mounted on the stand comprises scanning for a contactless memory associated with the stand.
16. A method according to claim 15, wherein the scanning for the contactless memory comprises scanning for a radio-frequency identification (RF-ID) tag.
17. A method according to claim 15, wherein the scanning for the contactless memory comprises scanning a barcode.
18. A method according to claim 15, wherein the scanning for the contactless memory comprises reading a magnetic stripe.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A transposing apparatus comprising a computer that controls a computing device having a plurality of computing elements arranged into a matrix formation and memory devices each connected to each computing element, the computing device executing an electromagnetic field analysis process on latticed three-dimensional analysis subject data present in a three-dimensional coordinate system, the computer configured to:
detect the number of lined-up lattices in a direction of a first axis of the three-dimensional coordinate system, the number of lined-up lattices in a direction of a second axis of the coordinate system, and the number of lined-up lattices in a direction of a third axis of the coordinate system, through detection on the three-dimensional analysis subject data;
transpose a group of lattices of the three-dimensional analysis subject data, based on the detected numbers of lined-up lattices and on the number of lined-up computing elements in a row direction and the number of lined-up computing elements in a column direction among the computing elements; and
output to the computing device, the three-dimensional analysis subject data transposed.
2. The transposing apparatus according to claim 1, wherein
the computer, when the least number of lined-up lattices among the respective numbers of lattices is larger than the number of lined-up computing elements in the row direction and the number of lined-up computing elements in the column direction, transposes a group of lattices of the three-dimensional analysis subject data so that a direction of a lineup of lattices of the three-dimensional analysis subject data in which number of lattices is greatest becomes a direction of an axis not corresponding to the row direction or the column direction, among directions of the first axis, the second axis, and the third axis.
3. The transposing apparatus according to claim 2, wherein
the computer transposes a group of lattices of the three-dimensional analysis subject data so that a direction of a lineup of lattices of the three-dimensional analysis subject data in which number of lattices is least becomes a direction of an axis corresponding to a lineup direction in which the number of lined-up computing elements is least among the number of lined-up computing elements in the row direction and the number of lined-up computing elements in the column direction, among directions of the first axis, the second axis, and the third axis.
4. The transposing apparatus according to claim 1, wherein
the computer, when the greatest number of lined-up lattices among the respective numbers of lattices is smaller than the number of lined-up computing elements in the row direction and the number of lined-up computing elements in the column direction, transposes a group of lattices of the three-dimensional analysis subject data so that a direction of a lineup of lattices of the three-dimensional analysis subject data in which the number of lattices is greatest becomes a direction of an axis corresponding a lineup direction in which the number of lined-up computing elements is greatest among the number of lined-up computing elements in the row direction and the number of lined-up computing elements in the column direction, among directions of the first axis, the second axis, and the third axis.
5. The transposing apparatus according to claim 4, wherein
the computer transposes a group of lattices of the three-dimensional analysis subject data so that a direction of a lineup of lattices of the three-dimensional analysis subject data in which number of lattices is least becomes a direction of an axis not corresponding to the row direction or the column direction, among directions of the first axis, the second axis, and the third axis.
6. The transposing apparatus according to claim 1, wherein
the computer, when a first number of lined-up computing elements selected as a larger number of computing elements among the number of grouped computing elements in the row direction and the number of grouped computing elements in the column direction is larger than the least number of lined-up lattices among the respective numbers of lined-up lattices and a second number of lined-up computing elements selected as a smaller number of computing elements among the number grouped computing elements in the row direction and the number of grouped computing elements in the column direction is smaller than the greatest number of lined-up lattices among the respective numbers of lined-up lattices, transposes a group of lattices of the three-dimensional analysis subject data so that a direction of a lineup of lattices of the three-dimensional analysis subject data becomes a direction of an axis corresponding to a lineup direction in which computing elements of the first number of lined-up computing elements are lined up, among directions of the first axis, the second axis, and the third axis, the number of the lineup of lattices being the number of lined-up lattices close to the first number of lined-up computing elements among the greatest number of lined-up lattices and a middle number of lined-up lattices equal to or less than the greatest number of lined-up lattices and equal to or larger than the least number of lined-up lattices.
7. The transposing apparatus according to claim 6, wherein
the computer transposes a group of lattices of the three-dimensional analysis subject data so that a direction of a lineup of lattices of the three-dimensional analysis subject data becomes a direction of an axis corresponding to a lineup direction in which computing elements of the second number of lined-up computing elements are lined up, among directions of the first axis, the second axis, and the third axis, the number of the lineup of lattices being the number of lined-up lattices close to the second number of lined-up computing elements among the middle number of lined-up lattices and the least number of lined-up lattices.
8. A transposing method executed by a computer that controls a computing device having a plurality of computing elements arranged into a matrix formation and memory devices each connected to each computing element, the computing device executing an electromagnetic field analysis process on latticed three-dimensional analysis subject data present in a three-dimensional coordinate system, the transposing method comprising:
detecting the number of lined-up lattices in a direction of a first axis of the three-dimensional coordinate system, the number of lined-up lattices in a direction of a second axis of the coordinate system, and the number of lined-up lattices in a direction of a third axis of the coordinate system, through detection on the three-dimensional analysis subject data;
transposing a group of lattices of the three-dimensional analysis subject data, based on the detected numbers of lined-up lattices and on the number of lined-up computing elements in a row direction and the number of lined-up computing elements in a column direction among the computing elements; and
outputting to the computing device, the three-dimensional analysis subject data transposed.
9. A computer-readable recording medium storing a transposing program causing a computer that controls a computing device having a plurality of computing elements arranged into a matrix formation and memory devices each connected to each computing element, the computing device executing an electromagnetic field analysis process on latticed three-dimensional analysis subject data present in a three-dimensional coordinate system, to execute a process comprising:
detecting the number of lined-up lattices in a direction of a first axis of the three-dimensional coordinate system, the number of lined-up lattices in a direction of a second axis of the coordinate system, and the number of lined-up lattices in a direction of a third axis of the coordinate system, through detection on the three-dimensional analysis subject data;
transposing a group of lattices of the three-dimensional analysis subject data, based on the detected numbers of lined-up lattices and on the number of lined-up computing elements in a row direction and the number of lined-up computing elements in a column direction among the computing elements; and
outputting to the computing device, the three-dimensional analysis subject data transposed.