1461134103-174dcf71-5c45-45f4-aae8-594c50d81cc9

1. A bracket assembly configured for supporting a connector of a shift cable assembly on a transmission, the bracket assembly comprising:
a first section defining a groove configured for receiving the connector;
a second section pivotably attached to the first section;
wherein the second section is pivotable relative to the first section between an open position and a closed position;
wherein the second section is configured for capturing the connector within the groove when the connector is received within the groove and the second section is in the closed position; and
wherein the second section is configured to allow the connector to be removed from the groove when the second section is in the open position.
2. A bracket assembly, as set forth in claim 1, wherein the second section is configured to be fastened to the first section when the second section is in the closed position to prevent pivoting of the second section relative to the first section.
3. A bracket assembly, as set forth in claim 1, wherein the first section includes a first flange defining the groove;
wherein the second section includes a second flange; and
wherein the second flange is configured for supporting the connector of the shift cable assembly when the connector is received in the groove and the second section is in the closed position such that the connector is retained within the groove.
4. A bracket assembly, as set forth in claim 3, wherein the second flange and the first flange are generally planar when the second section is in the closed position; and
wherein the second flange presents a support surface configured to be positioned against the connector when the shift cable assembly is positioned within the groove and the second section is in the closed position.
5. A bracket assembly, as set forth in claim 3, wherein the base portion defines at least one first attachment hole configured for receiving a fastener to attach the base portion to the transmission;
wherein the second section further includes a leg portion;
wherein the leg portion and the base portion each define a second attachment hole; and
wherein the second attachment holes are configured for receiving a fastener therethrough when the second attachment holes are aligned with one another when the second section is in the closed position to retain the second section in the closed position.
6. A bracket assembly, as set forth in claim 5, further comprising:
a weld nut operatively attached to the base portion such that the base portion is disposed between the weld nut and the leg portion when the second section is in the closed position; and
a fastener extending through each of the second attachment holes and the weld nut to secure the second section in the closed position.
7. A bracket assembly, as set forth in claim 5, wherein the first flange extends from the base portion and the second flange extends generally perpendicularly from the leg portion such that the first flange and the second flange are in spaced and generally parallel relationship to one another when the second section is in the closed position.
8. A bracket assembly, as set forth in claim 5, further comprising a rivet pivotally connecting the first section and the second section.
9. A transmission comprising:
a housing;
a shift cable assembly including:
a cable portion;
a connecting rod; and
a connector; and

a bracket assembly including:
a first section connected to the housing;
wherein the first section defines a groove and the connector is disposed in the groove;
a second section pivotably attached to the first section;
wherein the second section is pivotable relative to the first section between an open position and a closed position;
wherein the second section captures the connector within the groove when the second section is in the closed position; and
wherein the second section allows the connector to be removed from the groove when the second section is in the open position.
10. A transmission assembly, as set forth in claim 9, wherein the first section includes a first flange defining the groove;
wherein the second section includes a second flange; and
wherein the second flange supports the connector of the shift cable assembly when the second section is in the closed position.
11. A transmission, as set forth in claim 10, wherein the second flange and the first flange are generally planar when the second section is in the closed position; and
wherein the second flange presents a support surface positioned against the connector when the second section is in the closed position.
12. A transmission, as set forth in claim 10, wherein the base portion is fastened to the housing; and
wherein the leg portion and the base portion are fastened to one another when the second section is in the closed position.
13. A transmission, as set forth in claim 12, further comprising:
a weld nut operatively attached to the base portion such that the base portion is disposed between the weld nut and the leg portion when the second section is in the closed position; and
a fastener extending through each of the leg portion, the base portion, and the weld nut to secure the second section in the closed position.
14. A transmission, as set forth in claim 10, wherein the first flange and the second flange extend from the respective base portion and leg portion in spaced and generally parallel relationship to one another when the second section is in the closed position such that the support surface extends in generally perpendicular relationship to the first flange.
15. A transmission, as set forth in claim 10, further comprising a rivet pivotally connecting the first section and the second section.
16. A transmission, as set forth in claim 10, wherein the connector defines a depression extending about an exterior thereof; and
wherein the depression of the connector and the groove of the first flange cooperate with one another such that the first flange and the connector are intermeshed with one another.
17. A transmission, as set forth in claim 16, wherein the first flange defines a recess opening to the groove;
wherein the connector includes an attachment clip having a spring portion and a tab extending from the spring portion;
wherein the spring portion is disposed adjacent the depression;
wherein the spring portion extends into the groove and the tab extends into the recess such that the connector is retained to the bracket assembly.
18. A vehicle comprising:
a transmission including:
a housing;
a rotor shaft rotatably disposed in the housing;
a lever assembly operatively connected to the rotor shaft;
a shifter configured for being moved to select a desired operating mode of the vehicle;

a shift cable assembly operatively connected to the lever assembly, wherein the shift cable assembly includes:
a cable portion;
a connecting rod; and
a connector operatively disposed between the cable portion and the connecting rod;
wherein the cable portion is operatively connected to the shifter;
wherein the connecting rod is operatively connected to the lever assembly;

a bracket assembly operatively connected to the housing, wherein the bracket assembly includes:
a first section connected to the housing;
wherein the first section defines a groove and the connector is disposed in the groove;
a second section pivotably attached to the first section;
wherein the second section is pivotable relative to the first section between an open position and a closed position;
wherein the second section captures the connector within the groove when the second section is in the closed position; and
wherein the second section allows the connector to be removed from the groove when the second section is in the open position.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method for characterizing a live-cell, the method comprising:
providing the system of claim 1 having a live-cell immobilized on the sensor’s surface;
contacting the immobilized cell with a first fluorescent-labeled stimulus;
detecting the effect of the first fluorescent-labeled stimulus contact on a selected cellular target by interrogating the sensor for evanescent-wave label-free light and evanescent-wave excited-fluorescent label-emitted light; and
comparing the sensor’s evanescent wave label-free light and evanescent wave excited-fluorescent label-emitted light in the presence and absence of a second stimulus.
2. The method of claim 1, wherein the fluorescent-labeled stimulus has an affinity for at least one target associated with the live-cell immobilized on the sensor’s surface.
3. The method of claim 1, wherein interrogating the sensor excites the fluorescent-labeled stimulus having an association with the basal cell membrane surface of the immobilized live-cell on the surface of the sensor.
4. The method of claim 1, wherein interrogating the sensor provides evanescent-wave label-free light associated with a dynamic mass redistribution event of the immobilized live-cell.
5. The method of claim 1, wherein interrogating the sensor for evanescent-wave fluorescence and evanescent-wave label-free light is accomplished sequentially, simultaneously, or a combination thereof.
6. The method of claim 1, wherein the sensor is a resonant waveguide grating biosensor, a surface plasmon resonance, a photonic crystal biosensor, or a resonant mirror.
7. A method for characterizing a live-cell, the method comprising:
providing the system of claim 1 having a live-cell immobilized on the sensor’s surface, the live-cell having a fluorescent target;
contacting the immobilized cell with a stimulus;
detecting the stimulus induced changes on the fluorescent target by interrogating the sensor for evanescent-wave fluorescence light; and
detecting the stimulus induced changes in the evanescent-wave label-free light.
8. The method of claim 7, wherein the live-cell having a fluorescent target is accomplished with a gene expression vector which expresses a fluorescent protein.
9. The method of claim 8, wherein the live-cell having a fluorescent target is accomplished with transfection, insertion of a lipid target into the cell surface membrane, or combination thereof.
10. A method to enhance detection of a single resonant wavelength of an evanescent-wave label-free signal and an evanescent-wave excited-fluorescence signal from a single sensor, the method comprising:
measuring the evanescent-wave excited-fluorescence signal of a specific target having a fluorescent label, and measuring the label-free dynamic mass redistribution signal upon stimulation; and
correlating the measured fluorescence signal from the target and the label-free dynamic mass redistribution signal.
11. The method of claim 10, wherein correlating the fluorescence signal and the label-free dynamic mass redistribution signal comprises, at least one of:
comparing the kinetic profiles of both signals;
comparing the modulation profiles of both signals by alteration of signaling cascades;
comparing the impact of a gene alteration on the cellular response;
or a combination thereof.
12. A method for dual-detection of ion-channel activity in a live-cell, the method comprising:
providing a biosensor having at least one live-cell immobilized on the biosensor surface;
furnishing the immobilized cell with a membrane-potential sensitive dye;
contacting the immobilized cell having the membrane-potential sensitive dye with a stimulus; and
detecting the stimulus-induced optical label-free signal and evanescent wave excited fluorescence signal.
13. A method for dual-detection of ion-channel activity in a live-cell, the method comprising:
providing a biosensor having at least one live-cell immobilized on the biosensor surface;
furnishing the immobilized live-cell with a membrane-potential sensitive dye and a fluorescent lipid;
contacting the immobilized cell having the dye and the lipid with a stimulus; and
detecting the stimulus-induced optical label-free signal and evanescent wave excited fluorescence signal, the fluorescence signal changes in relation to a change in fluorescent resonant energy transfer between the dye and the lipid.
14. A method dual-detection of ion-channel activity in a live-cell, the method comprising:
providing a bio sensor having at least one live-cell immobilized on the biosensor surface;
furnishing the immobilized cell with a membrane-potential sensitive dye and a quencher lipid;
contacting the immobilized cell having the dye and the quencher lipid with a stimulus; and
detecting the stimulus-induced optical label-free signal and evanescent wave excited fluorescence signal, the detected fluorescence signal changes in relation to a change in distance between the quencher lipid and the membrane-potential sensitive dye.

1461134094-b02631f0-8ba8-4264-9d17-fb596c98b244

1. A substrate comprising a trench structure including a trench cavity, wherein the trench cavity includes a growth-blocking material on less than an entirety of any one surface in said trench cavity.
2. The substrate of claim 1, wherein the material comprises an oxide layer.
3. The substrate of claim 2, wherein the oxide layer comprises silicon dioxide.
4. The substrate of claim 1, wherein the trench cavity has a height to width aspect ratio that is less than 1.
5. The substrate of claim 1, wherein the trench cavity has a width in a range of from 15 to 60 \u03bcm.
6. The substrate of claim 1, further comprising a bridged lateral overgrowth formation overlying the trench cavity.
7. The substrate of claim 6, wherein the bridged lateral overgrowth formation has a defect density that is below 5\xd7105 defects cm\u22122.
8. The substrate of claim 6, wherein the bridged lateral overgrowth formation comprises a III-nitride.
9. The substrate of claim 6, wherein the bridged lateral overgrowth formation comprises GaN.
10. The substrate of claim 1, wherein the trench cavity has a depth in a range of from about 1 \u03bcm to about 5 \u03bcm.
11. A microelectronic device comprising the substrate of claim 1.
12. A microelectronic device comprising the substrate of claim 6.
13. The microelectronic device of claim 11, as selected from the group consisting of laser diodes, HEMTs, and UV LEDs.
14. A method of making a microelectronic device structure, comprising:
depositing an oxide layer on a substrate;
depositing a photoresist layer on the oxide layer;
patterning, exposing and developing the photoresist layer, and etching the oxide layer, to expose a surface of the substrate;
etching the exposed surface of the substrate to form a trench cavity therein;
depositing a patterned material supportive of a coalescent Pendeo layer thereon, on at least a portion of an inside surface of the trench cavity.
15. The method of claim 14, further comprising growing lateral epitaxial growth projections from side surfaces of the trench cavity toward and into contact with one another to form a bridged lateral overgrowth formation overlying the trench cavity above the patterned material.
16. A method of forming a trench lateral epitaxial overgrowth substrate on a base member, comprising:
depositing an oxide layer on the base member;
depositing a photoresist layer on the oxide layer;
patterning, exposing and developing the photoresist layer, and etching the oxide layer, to expose a surface of the base member;
etching the exposed surface of the base member to form a trench cavity therein;
depositing a patterned material supportive of a coalescent Pendeo layer thereon, on at least a portion of an inside surface of the trench cavity; and
growing lateral epitaxial growth projections from side surfaces of the trench cavity toward and into contact with one another to form a bridged lateral overgrowth formation overlying the trench cavity above the patterned material.
17. The method of claim 16, wherein said base member is heteroepitaxial.
18. A trench cavity structure adapted for lateral epitaxial overgrowth, comprising a trench cavity having floor and sidewall internal surfaces, and a growth-blocking material deposited on floor and lower sidewall internal surfaces, wherein said growth-blocking material on said lower sidewall surfaces is at a height greater than the thickness of the growth-blocking material deposited on the floor of said trench cavity, with upper sidewall internal surfaces being devoid of said growth-blocking material thereon, so that the growth-blocking material deposited on the floor of the trench cavity prevents vertical growth, and so that the lateral epitaxial overgrowth comprises laterally inwardly directed growth of projections from both upper sidewall internal surfaces of said trench cavity into contact with one another to form a bridge structure.
19. The trench cavity structure of claim 18, wherein the growth-blocking material comprises an oxide layer.
20. The trench cavity structure of claim 18, wherein the growth-blocking layer comprises silicon dioxide.
21. A method of making a microelectronic device assembly, comprising:
forming a first coalesced Pendeo layer of GaN on a heteroepitaxial substrate;
growing a layer of GaN on the coalesced Pendeo layer, by MOCVD;
growing a layer of GaN on the MOCVD layer of GaN, by HVPE;
forming a second coalesced Pendeo layer of GaN, on the HVPE layer of GaN;
growing a layer of GaN on the second coalesced Pendeo layer of GaN, by MOCVD; and
forming a microelectronic device structure on andor in the MOCVD layer of GaN on the second coalesced Pendeo layer of GaN.
22. The method of claim 21, wherein the second coalesced Pendeo layer of GaN is grown as pitched stripes on said HVPE layer of GaN.
23. The method of claim 21, wherein the second coalesced Pendeo layer of GaN is grown on said HVPE layer of GaN after masking of said HVPE layer with SiO2 stripes.
24. A microelectronic device assembly, comprising:
a first Pendeo layer of GaN;
a first MOCVD layer of GaN on the first Pendeo layer of GaN;
an HVPE layer of GaN on the first MOCVD layer of GaN;
a second Pendeo layer of GaN on the HVPE layer of GaN;
a second MOCVD layer of GaN on the second Pendeo layer of GaN; and
a microelectronic device structure on andor in the second MOCVD layer of GaN.
25. A microelectronic device assembly, comprising:
a sapphire substrate;
GaN pedestals on said sapphire substrate, defining a trench cavity, wherein the sapphire substrate constitutes a floor portion of the trench cavity, and includes convex shoulders adjacent to the GaN pedestals; and
a growth-blocking layer on said convex shoulders, whereby said growth-blocking layer suppresses vertical and angular growth from said convex shoulders, to accommodate lateral epitaxial overgrowth across the trench cavity above said convex shoulders.
26. A microelectronic device assembly, comprising a trench cavity having floor and sidewall internal surfaces, a growth-blocking material deposited on floor and lower sidewall internal surfaces, wherein said growth-blocking material on said lower sidewall surfaces is at a height greater than the thickness of the growth-blocking material deposited on the floor of said trench cavity, with upper sidewall internal surfaces being devoid of said growth-blocking material thereon, and laterally inwardly extended growth projections that extend from both upper sidewall internal surfaces of said trench cavity and contact with one another at their lateral inward extremeties to form a bridge structure above the floor of the cavity.
27. A microelectronic device assembly, comprising:
a heteroepitaxial substrate;
III-V nitride pedestals on said heteroepitaxial substrate, defining a trench cavity, wherein the substrate constitutes a floor portion of the trench cavity, and includes convex shoulders adjacent to the pedestals; and
a growth-blocking layer on said convex shoulders, whereby said growth-blocking layer suppresses vertical and angular growth from said convex shoulders, to accommodate lateral epitaxial overgrowth across the trench cavity above said convex shoulders.
28. The microelectronic device assembly of claim 27, wherein the heteroepitaxial substrate comprises a material selected from among sapphire, SiC, Si and AlN.
29. The substrate of claim 1, wherein the growth-blocking material includes spaced-apart elements on said surface.
30. The substrate of claim 1, wherein said trench cavity comprises a first sidewall, a second sidewall and a floor.
31. The substrate of claim 30, wherein said any one surface comprises surface of said floor.
32. The substrate of claim 30, wherein said any one surface comprises a sidewall surface.
33. The substrate of claim 30, wherein said growth-blocking material is on less than an entirety of surfaces of each of the first and second sidewalls.
34. The substrate of claim 30, wherein said growth-blocking material is on less than an entirety of surfaces of each of the first and second sidewalls and said floor.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A surface cleaning device comprising:
a cleaning chamber adapted to receive goods to be cleaned;
at least one tank for receiving a cleaning medium;
a cleaning medium circuit comprising a supply device that conveys the cleaning medium from the at least one tank to the cleaning chamber and a return device returning the cleaning medium from the cleaning chamber to the at least one tank;
an analytical device for measuring contamination of the cleaning medium.
2. The surface cleaning device according to claim 1, wherein the analytical device is connected by a bypass to the cleaning medium circuit.
3. The surface cleaning device according to claim 1, wherein the analytical device is connected to the supply device.
4. The surface cleaning device according to claim 1, wherein the analytical device is connected to the return device.
5. The surface cleaning device according to claim 1, wherein the analytical device is connected to the tank.
6. The surface cleaning device according to claim 1, further comprising a valve that controls a flow rate of the cleaning medium through the analytical device.
7. The surface cleaning device according to claim 1, wherein the analytical device comprises a measuring device and an evaluation device connected to the measuring device.
8. The surface cleaning device according to claim 7, wherein the evaluation device comprises a computer that controls the measuring device.
9. The surface cleaning device according to claim 7, wherein the measuring device has a flow passage through which the cleaning medium is passed for performing a measurement.
10. The surface cleaning device according to claim 9, wherein the flow passage is arranged at least partially between a light source and a measuring unit of the measuring device.
11. The surface cleaning device according to claim 10, wherein the light source is a white light source.
12. The surface cleaning device according to claim 7, wherein the measuring device has an area sensor for simultaneously recording a plurality of measured values.
13. The surface cleaning device according to claim 12, wherein the area sensor is a sensor for recording a plurality of pixels.
14. The surface cleaning device according to claim 10, wherein the measuring device comprises a camera.
15. The surface cleaning device according to claim 7, wherein the evaluation device continuously computes, using measured values provided by the measuring device, the contamination of the cleaning medium based on at least one calibration value that is saved by software or hardware.
16. The surface cleaning device according to claim 1, wherein the analytical device is adapted to measure turbidity of the cleaning medium.
17. The surface cleaning device according to claim 1, wherein the analytical device is adapted to measure the contamination of the cleaning medium by spectral analysis.
18. The surface cleaning device according to claim 1, wherein the analytical device is adapted to perform image evaluation.
19. The surface cleaning device according to claim 1, wherein the analytical device is adapted to evaluate color distribution or brightness distribution.
20. The surface cleaning device according to claim 1, wherein the analytical device is adapted to evaluate color distribution and brightness distribution.
21. The surface cleaning device according to claim 1, wherein the analytical device is adapted to evaluate fluorescent goods to be cleaned.
22. The surface cleaning device according to claim 21, further comprising a device for illuminating the fluorescent goods.