1. A method of electrical interconnection for a microelectronic circuit having a substrate with bond pads for electronic connection to the microelectronic circuit, the method comprising:
forming a bundle of microfilaments, wherein at least two of the microfilaments include an electrically-conductive portion extending along their lengths; and
bonding the at least two microfilaments to the microelectronic circuit substrate at corresponding bond pads to form electrical connections between the electrically-conductive portions of the at least two microfilaments and the corresponding bond pads.
2. The method of claim 1 further comprising positioning the at least two microfilaments to make contact between a side surface of the microfilament and the microelectronic circuit substrate.
3. The method of claim 1 further comprising connecting the at least two microfilaments to a second electronic component.
4. The method of claim 1 further comprising forming a connector at an end of the bundle.
5. The method of claim 5 wherein forming a connector comprises:
positioning ends of the microfilaments differentially with respect to each other to define a three-dimensional interdigitating mating surface at the end of the bundle; and
fixing together a portion of the microfilaments near the end of the bundle to form the connector.
6. The method of claim 5 further comprising mating the connector to a second bundle of microfilaments having a compatible connector.
7. The method of claim 1 wherein forming a bundle of microfilaments comprises placing the microfilaments so that each microfilament is touching at least one adjacent microfilament.
8. The method of claim 1 wherein forming a bundle of microfilaments comprises surrounding each of the at least two microfilaments having an electrically-conductive portion by a plurality of insulating microfilaments.
9. The method of claim 1 wherein forming a bundle of microfilaments comprises depositing the electrically-conductive portions on outer surfaces of the at least two microfilaments.
10. A microelectronic circuit comprising:
a substrate having microelectronic circuitry disposed thereon, the microelectronic circuitry including a plurality of bond pads;
a bundle of microfilaments wherein at least a first subset of the microfilaments are signal-carrying microfilaments having longitudinally-extending electrically-conductive portions; and
wherein the signal-carrying microfilaments are directly bonded to corresponding bond pads to make electrical connection between the corresponding bond pads and the longitudinally-extending electrically-conductive portions of the signal-carrying microfilaments.
11. The microelectronic circuit of claim 10 wherein a first end of the signal-carrying microfilaments are bonded to the substrate.
12. The microelectronic circuit of claim 10 wherein a second subset of the microfilaments are insulating microfilaments.
13. The microelectronic circuit of claim 11 wherein the signal-carrying microfilaments are separated from each other by at least one insulating microfilament.
14. The microelectronic circuit of claim 10 wherein the longitudinally-extending electrically-conductive portion includes a circumferential ring disposed near an end of the microfilament.
15. The microelectronic circuit of claim 10 wherein at least one of the plurality of bond pads is disposed within an interior portion of the substrate.
16. The microelectronic circuit of claim 10 further comprising:
a package having a lead frame with lead-connecting portions, wherein the substrate is disposed within the package; and
wherein the signal-carrying microfilaments are bonded to corresponding lead-connecting portions of the lead frame to make electrical connection between the longitudinally-extending electrically-conductive portions of the signal-carrying microfilaments and the lead-connecting portions of the lead frame.
17. The microelectronic circuit of claim 10 wherein second ends of the bundle of microfilaments are formed into a connector.
18. The microelectronic circuit of claim 17 wherein the second ends of the bundle are disposed differentially with respect to each other to define a three-dimensional interdigitating mating surface.
19. The microelectronic circuit of claim 10 further comprising:
a second substrate having microelectronic circuitry disposed thereon, the microelectronic circuitry including a plurality of second bond pads; and
wherein the signal-carrying microfilaments are directly bonded to corresponding second bond pads to make electrical connection between the longitudinally-extending electrically-conductive portions and the corresponding second bond pads.
20. The microelectronic circuit of claim 10 wherein at least one of the signal-carrying microfilaments includes a plurality of longitudinally-extending electrically-conductive portions, and wherein the at least one signal-carrying microfilament makes electrical connection between the plurality of longitudinally-extending electrically-conductive portions and a corresponding plurality of the bond pads.
21. The microelectronic circuit of claim 10 wherein the substrate is a silicon substrate.
22. The microelectronic circuit of claim 10 wherein the substrate is a printed circuit board.
23. The microelectronic circuit of claim 10 wherein the bond pad is a plated through hole.
24. The microelectronic circuit of claim 10, wherein the microfilaments have a cross section chosen from the group of shapes consisting of round, oval, triangular, square, rectangular, pentagonal, hexagonal, and polygonal.
25. The microelectronic circuit of claim 10, wherein the microfilaments are chosen from the group of filamentary structures consisting of a microwire, an insulated microwire, and a glass fiber.
26. The microelectronic circuit of claim 10, wherein the microfilaments have a cross-sectional diameter of less than 15 micrometer.
27. The microelectronic circuit of claim 10, wherein the microfilaments are all substantially equal in cross section dimension.
28. A microelectronic circuit comprising:
a substrate having microelectronic circuitry disposed thereon, the microelectronic circuitry including a plurality of bond pads; and
at least one microfilament having a plurality of longitudinally-extending electrically-conductive portions, the microfilament being directly bonded to the substrate near a first end of the microfilament so that at least one of the plurality of longitudinally-extending conductive portions makes electrical contact to a corresponding bond pad.
29. The microelectronic circuit of claim 28, wherein each of the plurality of longitudinally-extending electrically-conductive portions makes electrical contact to a corresponding bond pad.
30. The microelectronic circuit of claim 28, wherein each of the plurality of longitudinally-extending electrically-conductive portions comprises an electrically-conductive ring disposed circumferentially around the at least one microfilament.
31. The microelectronic circuit of claim 28, further comprising a connector wherein a second end of the microfilament is coupled to the connector.
32. The microelectronic circuit of claim 28, further comprising:
a second substrate having microelectronic circuitry disposed thereon, the microelectronic circuitry including a plurality of second bond pads; and
wherein the microfilament is directly bonded to the second substrate near a second end of the microfilament so that at least one of the plurality of longitudinally-extending electrically-conductive portions makes electrical contact to a corresponding second bond pad.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An annular centrifugal contactor, said contactor comprising:
a housing adapted to receive a plurality of flowing liquids;
a rotor on the interior of the housing;
an annular mixing zone defined by the housing and a vane plate, wherein the annular mixing zone has a plurality of fluid retention reservoirs with ingress apertures near the bottom of the annular mixing zone and egress apertures located above the ingress apertures of the annular mixing zone; and
an adjustable vane plate stem, wherein the stem can be raised to restrict the flow of a liquid into the rotor or lowered to increase the flow of the liquid into the rotor.
2. The annular centrifugal contactor of claim 1, wherein the fluid retention reservoirs are a plurality of helical tubes.
3. The annular centrifugal contactor of claim 1, wherein the opening of each reservoir has an inlet oriented tangential to the flow of the liquid within the contactor.
4. The annular centrifugal contactor of claim 1, wherein a plurality of baffles are disposed within each reservoir.
5. The annular centrifugal contactor of claim 2, wherein a plurality of heat transfer tubes run countercurrent with the helical mixing tubes.
6. The annular centrifugal contactor of claim 1, wherein the reservoirs are jacketed with a volume enclosing a flowing heat transfer fluid.
7. The annular centrifugal contactor of claim 1, wherein a plurality of baffles extend from the external surface of each of the reservoirs.
8. The annular centrifugal contactor of claim 1, wherein the annular mixing zone is impregnated with a catalyst, reactant, adsorbent, or a combination thereof.
9. The annular centrifugal contactor of claim 1, wherein the adjustable vane plate stem is adapted to serve as a needle valve and drain tube.
10. The annular centrifugal contactor of claim 1, wherein the adjustable vane plate stem is in mechanical communication with a mechanized assembly such that the adjustable vane plate stem is adjusted up and down using the mechanized assembly.
11. An annular mixing zone for an annular centrifugal contactor, wherein the annular mixing zone is defined by the annular centrifugal contactor’s housing and vane plate and wherein the annular mixing zone has a plurality of helical mixing tubes with ingress apertures near the bottom of the annular mixing zone and egress apertures located above the inlets of the annular mixing zone.
12. The annular mixing zone of claim 11, wherein the annular mixing zone has between four and six helical mixing tubes, inclusive.
13. The annular mixing zone of claim 11, wherein the annular mixing zone is a single monolithic piece, printed from a 3D printer.
14. The annular mixing zone of claim 11, wherein the opening of each helical mixing tube has an inlet oriented tangential to the flow of the liquid within the contactor.
15. The annular mixing zone of claim 11, wherein a plurality of baffles are disposed within each helical mixing tube.
16. The annular mixing zone of claim 11, wherein a plurality of heat transfer tubes run countercurrent between the helical mixing tubes.
17. The annular mixing zone of claim 11, wherein the annular mixing zone is impregnated with a catalyst, reactant, adsorbent, or a combination thereof.
18. A method for performing a liquid-liquid extraction, the method comprising the steps of:
a) selecting a first liquid containing a desired constituent;
b) selecting a second liquid having a different density than the first liquid, wherein the desired constituent has a greater affinity for the second liquid than the first liquid;
c) providing a centrifugal contactor with an annular mixing zone, wherein the annular mixing zone has a plurality of helical mixing tubes with ingress apertures near the bottom of the annular mixing zone and egress apertures located above the inlets of the annular mixing zone;
d) flowing the first and second liquid into the annular mixing zone, including into the helical mixing tubes;
e) mixing the first and second liquid in the annular mixing zone using a rotor;
f) directing the first and second liquid into the interior of the rotor using a vane plate;
g) separating the first and second liquid based on their relative densities using centrifugal force on the inside of the rotor; and
h) extracting the first liquid as a first stream and the second liquid as a second stream, wherein the second stream contains at least some of the desired constituent.
19. The method as recited in claim 11, wherein the vane plate has an adjustable stem that can be raised to restrict flow of the first and second liquid into the rotor and lowered to allow more flow of the first and second liquid into the rotor.
20. The method as recited in claim 18, wherein several contactors are connected in series and the first stream becomes the first liquid in an upstream contactor and the second stream becomes the second liquid in a downstream contactor and wherein the steps d through h are repeated in the upstream and downstream contactors.