Author: claimsbot

1. A spectroscopic gas sensor for detecting at least one gas component in ambient air, comprising:
at least one radiation detection device configured to detect a radiation spectrum that is characteristic for the at least one gas component;
a package for receiving the at least one radiation detection device, the package having at least one package wall end section; and
at least one optical component having at least one connecting section that is connectable to the at least one package wall end section by hot caulking the at least one package wall end section,
wherein the at least one optical component includes a reflector and a screen, wherein both the reflector and the screen are connectable to the at least one package wall end section using a joint hot caulking process with the aid of a form punch.
2. The gas sensor as recited in claim 1, wherein the package is configured as a premolded package using an injection-molding process.
3. The gas sensor as recited in claim 1, wherein the reflector is used for at least one of deflecting and concentrating, the radiation.
4. The gas sensor as recited in claim 3, wherein the reflector is made of a plastic coated with a reflective material.
5. The gas sensor as recited in claim 3, wherein the reflector has at least one reflecting surface.
6. The gas sensor as recited in claim 5, wherein a shape of the reflecting surface is one of parabolic or elliptical.
7. The gas sensor as recited in claim 1, wherein the screen is an optical screen.
8. The gas sensor as recited in claim 7, wherein the optical screen is made of steel.
9. The gas sensor as recited in claim 1, wherein the gas sensor is mounted on an assigned p.c. board using a pick-and-place assembly method.
10. The gas sensor as recited in claim 1, wherein the gas sensor is designed as one of a two-channel carbon dioxide gas sensor or nitrogen oxide gas sensor.
11. A spectroscopic gas sensor for detecting at least one gas component in ambient air, comprising:
at least one radiation detection device configured to detect a radiation spectrum that is characteristic for the at least one gas component;
a package for receiving the at least one radiation detection device, the package having at least one package wall end section; and
at least one optical component having at least one connecting section that is connectable to the at least one package wall end section by hot caulking the at least one package wall end section,
wherein the at least one optical component includes a reflector and a screen, each of the reflector and the screen having a connecting section, wherein the connecting sections of the screen and the reflector are each provided in a form-fitting manner on a circumferential contact section of the package.
12. A spectroscopic gas sensor for detecting at least one gas component in ambient air, comprising:
at least one radiation detection device configured to detect a radiation spectrum that is characteristic for the at least one gas component;
a package for receiving the at least one radiation detection device, the package having at least one package wall end section; and
at least one optical component having at least one connecting section that is connectable to the at least one package wall end section by hot caulking the at least one package wall end section,
wherein the at least one package wall end section of the package surrounds the connecting section of the at least one optical component and has a deformation section that projects over the connecting section,
wherein the deformation section is deformable in the direction of the connecting section by a form punch during the hot caulking process to clamp the connecting section of the at least one optical component.
13. A spectroscopic gas sensor for detecting at least one gas component in ambient air, comprising:
at least one radiation detection device configured to detect a radiation spectrum that is characteristic for the at least one gas component;
a package for receiving the at least one radiation detection device, the package having at least one package wall end section; and
at least one optical component having at least one connecting section that is connectable to the at least one package wall end section by hot caulking the at least one package wall end section,
wherein the at least one package wall end section of the package surrounds the connecting section of the at least one optical component and has a deformation section that projects over the connecting section,
wherein a predetermined force for bending the deformation section is applicable to the form punch during the hot caulking process without damaging the at least one optical component.
14. A method for manufacturing a spectroscopic gas sensor, the gas sensor for detecting at least one gas component in ambient air, the method comprising:
forming a package for receiving at least one detection device for detecting a radiation spectrum that is characteristic for the at least one gas component, the package having at least one deformation section;
inserting at least one optical component having at least one connecting section into the package so that the at least one deformation section of the package projects over the at least one connecting section; and
deforming the at least one deformation section of the package in a direction of the at least one connecting section of the at least one optical component for clamping the at least one optical component in place in the package using a hot caulking process.
15. The method as recited in claim 14, wherein the package is manufactured as a premolded package, using an injection-molding method.
16. The method as recited in claim 14, wherein a form punch having a deformation contact surface is used for the hot caulking process.
17. The method as recited in claim 14, wherein the gas sensor is mounted on an assigned p.c. board, using a pick-and-place assembly method.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A semiconductor device, comprising:
a word line and a bit line on a substrate, the word line intersecting the bit line;
an insulating layer on the substrate, the insulating layer including voids therein; and
a passivation layer on the insulating layer, the passivation layer including hydrogen atoms therein,
the voids defining diffusion pathways through which the hydrogen atoms in the passivation layer diffuse in a direction toward the substrate.
2. The semiconductor device as claimed in claim 1, wherein the word line includes a metal gate, the metal gate including a metal material or including a conductive metal nitride material.
3. The semiconductor device as claimed in claim 2, wherein the metal gate is buried in the substrate.
4. The semiconductor device as claimed in claim 2, wherein the substrate includes a trench therein and the metal gate is buried within the trench.
5. The semiconductor device as claimed in claim 2, wherein the metal gate includes at least one of a titanium nitride layer, a stacked titanium nitride layer and tungsten layer, a tungsten nitride layer, a tantalum nitride layer, and a tungsten layer.
6. The semiconductor device as claimed in claim 1, further comprising a first interlayer dielectric layer, a second interlayer dielectric layer, and a metal interconnection, wherein:
the first interlayer dielectric layer covers the word line and the bit line,
the second interlayer dielectric layer is on the first interlayer dielectric layer,
the metal interconnection is between the first interlayer dielectric layer and the second interlayer dielectric layer, and
at least one of the first interlayer dielectric layer and the second interlayer dielectric layer corresponds to the insulating layer having the voids therein.
7. The semiconductor device as claimed in claim 6, wherein:
the first and second interlayer dielectric layers correspond to the insulating layer having the voids therein, and
a size of the voids in the first interlayer dielectric layer is equal to a size of the voids in the second interlayer dielectric layer.
8. The semiconductor device as claimed in claim 6, wherein:
the first and second interlayer dielectric layers correspond to the insulating layer having the voids therein, and
a size of the voids in the first interlayer dielectric layer is different from a size of the voids in the second interlayer dielectric layer.
9. The semiconductor device as claimed in claim 1, wherein the passivation layer includes a silicon oxide layer containing the hydrogen atoms or includes a silicon nitride layer containing the hydrogen atoms.
10.-20. (canceled)

1. A communication device, comprising:
a transmitter circuit adapted to transmit messages to at least one further communication device, the transmitter circuit operating based on a first encoding scheme on a first communication connection,
a receiver circuit adapted to receive messages from the at least one further communication device, the receiver circuit being adapted to operate based on a second communication encoding scheme different from the first encoding scheme on a second communication connection different from the first communication connection,
wherein at least one of the first encoding scheme or the second encoding scheme comprises an edge-based pulse width modulation encoding scheme, and
wherein the other one of the first or second encoding scheme comprises modulating a supply voltage on a supply voltage line.
2. The communication device of claim 1, wherein the edge-based pulse width modulation encoding scheme comprises transmission of a message comprising a plurality of pulses, a width at least of some of the pulses encoding a data value.
3. The communication device of claim 1, wherein the edge-based pulse width modulation encoding scheme comprises a transmission of messages in at least one of a voltage domain or a current domain.
4. (canceled)
5. The communication device of claim 1, wherein the other one of the first and second encoding schemes comprises transmitting pulses corresponding to bits, wherein equal time durations are provided for transmission of each bit.
6. The communication device of claim 1, wherein the transmitter is adapted to transmit a trigger message requesting a response message from the further device based on the first encoding scheme, and wherein the receiver is adapted to receive the response message with the response message from the further device based on the second encoding scheme.
7. The communication device of claim 1, wherein the receiver is adapted to receive a trigger message from the further communication device based on the first encoding scheme requesting a response message, and wherein the transmitter is adapted to transmit the response message based on the second encoding scheme.
8. The communication device of claim 1, wherein at least one of the first communication connection or the second communication connection comprises a supply voltage line.
9. The communication device of claim 1, wherein the other one of the first and second encoding scheme is used in a device testing protocol of the communication device.
10. A communication device, comprising:
a transmitter circuit adapted to transmit a trigger message to at least one further communication device by modulating a supply voltage on a voltage supply line, and
a receiver circuit adapted to receive an edge-based pulse width modulated response message in response to the trigger message on a data line.
11. The communication device of claim 10, wherein the trigger message is adapted to select one of a plurality of further communication devices.
12. The communication device of claim 10, wherein in the trigger message a same duration is allocated for each of a plurality of transmitted bits, and in the response message a duration allocated to each of a plurality of data units depends on a value of the data unit.
13. A communication device, comprising:
a receiver circuit adapted to receive a trigger message from a further communication device by detecting a modulation of a supply voltage on a voltage supply line, and
a transmitter circuit adapted to transmit an edge-based pulse width modulated response message in response to the trigger message on a data line.
14. The communication device of claim 13, wherein the transmitter circuit is adapted to transmit the response message only if the trigger message identifies the communication device.
15. The communication device of claim 13, wherein in the trigger message a same duration is allocated for each of a plurality of transmitted bits, and in the response message a duration allocated to each of a plurality of data units depends on a value of the data unit.
16. The communication device of claim 13, wherein the communication device comprises a sensor.
17. A communication system, comprising:
a first communication device, the first communication device comprising a first transmitter coupled to a first communication connection, the first transmitter being adapted to operate based on a first encoding scheme, and a first receiver coupled to a second communication connection, the first receiver being adapted to operate based on a second encoding scheme different from the first encoding scheme, the second encoding scheme comprising an edge-based pulse width modulation encoding scheme, and
one ore more second communication devices, the one or more second communication devices each comprising a second receiver coupled to the first communication connection, the second receiver being adapted to operate based on the first encoding scheme, and a second transmitter coupled to the second communication connection, the second transmitter being adapted to operate based on the second encoding scheme,
wherein the first transmitter of the first communication device is adapted to transmit a message identifying a particular second communication device of the one or more second communication devices,

wherein the first transmitter is adapted to transmit a trigger message requesting a response message from the particular second communication device based on the first encoding scheme, and wherein the second receiver of the particular second communication device is adapted to receive the trigger message and the second transmitter of the particular second communication device is adapted to transmit a response message from the particular second communication device based on the second encoding scheme.
18. The communication system of claim 17, wherein the first communication connection is a positive supply voltage line, and the first encoding scheme comprises modulating a supply voltage on the positive supply voltage line.
19. The communication system of claim 17, wherein the first communication device comprises an electronic control unit, and wherein the at least one second communication device comprises a sensor.
20. The communication system of claim 17, wherein the second encoding scheme comprises transmission of SPC messages.
21. A method, comprising:
transmitting a request from a first communication device to a second communication device based on a first encoding scheme modulating a supply voltage on a supply voltage line, and
responding to the request by the second communication device based on a second encoding scheme different from the first encoding scheme, the second encoding scheme comprising an edge-based pulse width modulation encoding scheme.
22. The method of claim 21, wherein transmitting the request comprises identifying the second communication device.
23. The method of claim 21, wherein the second encoding scheme comprises sending messages in one of a voltage domain or a current domain.
24. The method of claim 21, wherein the first encoding scheme comprises transmitting pulses corresponding to bit values, wherein a same time duration is assigned to the transmission of each bit value, and wherein the second encoding scheme comprises sending pulses corresponding to multi-bit values, different time durations being assigned to transmissions of pulses corresponding to different multi-bit values.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

What is claimed is:

1. A method for identifying a compound that prevents ecdysis comprising:
providing a compound that binds a mouse IgG;
exposing an insect to an effective amount of the compound; and
observing ecdysis in the insect, wherein failure of the insect to complete ecdysis indicates the compound prevents ecdysis.
2. The method of claim 1 wherein the compound binds an Fc domain of the mouse IgG antibody.
3. The method of claim 1 wherein the compound binds an F(ab)2 domain of the mouse IgG antibody.
4. The method of claim 1 wherein the compound is a polypeptide.
5. The method of claim 4 wherein the compound is an antibody.
6. The method of claim 5 wherein the antibody is a polyclonal antibody or a monoclonal antibody.
7. The method of claim 1 wherein the insect is at a larval stage of development.
8. A method for identifying a compound that prevents ecdysis comprising:
providing a compound that binds a polypeptide obtainable from an insect, the polypeptide comprising an amino terminal sequence of X1X2A(QK)(QK)GVD(L1)SR (SEQ ID NO:1), where X1 is either alanine, leucine, proline, or serine and X2 is either alanine, leucine, proline, or serine, and a molecular weight of between about 25 kDa and about 29 kDa;
exposing an insect to an effective amount of the compound; and
observing ecdysis in the insect, wherein failure of the insect to complete ecdysis indicates the compound prevents ecdysis.
9. The method of claim 8 wherein the compound is a polypeptide.
10. The method of claim 9 wherein the compound is an antibody.
11. The method of claim 10 wherein the antibody is a polyclonal antibody or a monoclonal antibody.
12. The method of claim 8 wherein the insect is at a larval stage of development.
13. A method for preventing ecdysis comprising:
exposing an insect to an effective amount of a compound that binds a mouse IgG antibody, wherein the insect does not complete ecdysis.
14. The method of claim 13 wherein the compound binds an Fc domain of the mouse IgG antibody.
15. The method of claim 13 wherein the compound binds an F(ab)2 domain of the mouse IgG antibody.
16. The method of claim 13 wherein the compound is a polypeptide.
17. The method of claim 16 wherein the compound is an antibody.
18. The method of claim 17 wherein the antibody is a polyclonal antibody or a monoclonal antibody.
19. The method of claim 13 wherein the insect is at a larval stage of development.
20. A method for preventing ecdysis comprising:
exposing an insect to an effective amount of a compound that binds a polypeptide present in the insect, the polypeptide comprising an amino terminal sequence of X1X2A(QK)(QK)GVD(L1)SR (SEQ ID NO:1), where X1 is either alanine, leucine, proline, or serine and X2 is either alanine, leucine, proline, or serine, and a molecular weight of between about 25 kDa and about 29 kDa, wherein the insect does not complete ecdysis.
21. The method of claim 20 wherein the compound is a polypeptide.
22. The method of claim 21 wherein the compound is an antibody.
23. The method of claim 20 wherein the antibody is a polyclonal antibody or a monoclonal antibody.
24. The method of claim 20 wherein the insect is at a larval stage of development.
25. A method for killing an insect comprising:
exposing an insect to an effective amount of a compound that binds a mouse IgG antibody, wherein the compound causes the insect to die after failing to complete ecdysis.
26. The method of claim 25 wherein the compound binds an Fc domain of the mouse IgG antibody.
27. The method of claim 25 wherein the compound binds an F(ab)2 domain of the mouse IgG antibody.
28. The method of claim 25 wherein the compound is a polypeptide.
29. The method of claim 28 wherein the compound is an antibody.
30. The method of claim 29 wherein the antibody is a polyclonal antibody or a monoclonal antibody.
31. The method of claim 25 wherein the insect is at a larval stage of development.
32. A method for killing an insect comprising:
exposing an insect to an effective amount of a compound that binds a polypeptide present in the insect, the polypeptide comprising an amino terminal sequence of X1X2A(QK)(QK)GVD(L1)SR (SEQ ID NO:1), where X1 is either alanine, leucine, proline, or serine and X2 is either alanine, leucine, proline, or serine, and a molecular weight of between about 25 kDa and about 29 kDa, wherein the compound causes the insect to die after failing to complete ecdysis.
32. The method of claim 31 wherein the compound is a polypeptide.
34. The method of claim 32 wherein the compound is an antibody.
35. The method of claim 33 wherein the antibody is a polyclonal antibody or a monoclonal antibody.
36. The method of claim 32 wherein the insect is at a larval stage of development.