1461130232-5ffe49f9-e2bb-40bd-88eb-15342a599aca

1. A structural, energy absorbing composite element comprising:
a monolithic skin shell;
a porous filler material insert tapered or rounded at one end and positioned within said skin shell; and
a single unitary attachment fitting, wherein at least a portion of the attachment fitting is positioned inward of the skin shell and adjacent at least one end of the porous filler material insert, wherein said attachment fitting comprises:
a clevis fitting extending outward of the skin shell, and an interface portion integral and unitarily formed with the clevis fitting and positioned inward of the skin shell, wherein the interface portion is substantially hollow and the tapered or rounded end of the porous filler material insert is positioned at least partially within the hollow interface portion.
2. The structural, energy absorbing composite element according to claim 1 further comprising a shoulder between the clevis fitting and the interface portion, wherein the skin shell comprises a first end portion and a second end portion opposite of the first end portion, wherein the shoulder has a chamfered face engaging the first end portion or the second end portion of the skin shell.
3. The structural, energy absorbing composite element according to claim 1, further comprising:
a fuse pin extending through the attachment fitting and the skin shell.
4. The structural, energy absorbing composite element according to claim 1 wherein the skin shell comprises a metal selected from the group of aluminum, steel, nickel, copper, zinc, and alloys thereof.
5. The structural, energy absorbing composite element according to claim 1 wherein the skin shell comprises at least one of fiber-reinforced thermal set, thermoplastic and metal matrix composite materials.
6. The structural, energy absorbing composite element according to claim 1 wherein said porous filler material insert is formed of a metallic material.
7. The structural, energy absorbing composite element according to claim 6, wherein said metallic material is one of aluminum, steel, nickel, copper, zinc, lead cobalt, cadmium and alloys thereof.
8. A passenger floor stanchion for an aircraft comprising:
a tubular, monolithic skin shell;
a porous filler material insert having open cells and ligaments positioned within said skin shell, and
an attachment fitting, wherein said attachment fitting comprises:
an interface portion at least partially located inward of the skin shell and abutting a portion of the porous filler material insert, wherein at least a portion of the porous filler material insert is located inward of the interface portion and the skin shell, wherein at least one end of the porous filler material insert is substantially tapered, and
wherein the interface portion is substantially hollow and the tapered end of the porous filler material insert is positioned within the hollow interface portion.
9. The passenger floor stanchion according to claim 8, the attachment fitting further comprising:
a clevis fitting extending outward of the skin shell, and
a shoulder integrally formed with and located between the clevis fitting and the interface portion having a chamfered face engaging an end portion of the skin shell.
10. The passenger floor stanchion according to claim 8, further comprising:
a fuse pin extending through the attachment fitting and the skin shell.
11. The passenger floor stanchion according to claim 8 wherein said tubular skin shell comprises a metal selected from the group consisting of aluminum, steel, nickel, copper, zinc, and alloys thereof.
12. The passenger floor stanchion according to claim 8 wherein said tubular skin shell comprises a composite material selected from the group consisting of fiber-reinforced thermal set, thermoplastic and metal matrix composite materials.
13. The passenger floor stanchion according to claim 8 wherein said porous filler material is formed of a metallic material.
14. The passenger floor stanchion according to claim 13 wherein said metallic material is one of aluminum, steel, nickel, copper, zinc, lead cobalt, cadmium and alloys thereof.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A display substrate, comprising: a base substrate and a plurality of pixel sets disposed on the base substrate, each of the pixel sets comprising: four first sub-pixels, four second sub-pixels, four third sub-pixels and four fourth sub-pixels, wherein sub-pixels of each of the pixel-sets are arranged into a 4\xd74 matrix;
among four pixel rows of each of the pixel sets, a first sub-pixel, a second sub-pixel, a third sub-pixel and a fourth sub-pixel are sequentially arranged in one of the pixel rows, a second sub-pixel, a third sub-pixel, a fourth sub-pixel and a first sub-pixel are sequentially arranged in one of the pixel rows, a fourth sub-pixel, a first sub-pixel, a second sub-pixel and a third sub-pixel are sequentially arranged in one of the pixel rows, and a third sub-pixel, a fourth sub-pixel, a first sub-pixel and a second sub-pixel are sequentially arranged in one of the pixel rows.
2. The display substrate of claim 1, wherein the sequentially arranged first sub-pixel, second sub-pixel, third sub-pixel and fourth sub-pixel are located in a first pixel row, the sequentially arranged second sub-pixel, third sub-pixel, fourth sub-pixel and first sub-pixel are located in a second pixel row, the sequentially arranged fourth sub-pixel, first sub-pixel, second sub-pixel, and third sub-pixel are located in a third pixel row, and the sequentially arranged third sub-pixel, fourth sub-pixel, first sub-pixel and second sub-pixel are located in a fourth pixel row; or
the sequentially arranged first sub-pixel, second sub-pixel, third sub-pixel and fourth sub-pixel are located in a first pixel row, the sequentially arranged third sub-pixel, fourth sub-pixel, first sub-pixel and second sub-pixel are located in a second pixel row, the sequentially arranged fourth sub-pixel, first sub-pixel, second sub-pixel, and third sub-pixel are located in a third pixel row, and the sequentially arranged second sub-pixel, third sub-pixel, fourth sub-pixel and first sub-pixel are located in a fourth pixel row.
3. The display substrate of claim 1, wherein a white light-transmissive region is disposed in at least one of the first sub-pixel, the second sub-pixel and the third sub-pixel.
4. The display substrate of claim 3, wherein the white light-transmissive region is disposed in all of the first and second sub-pixels.
5. The display substrate of claim 3, wherein the white light-transmissive region is disposed in the first and second sub-pixels, and projections along a direction of pixel rows of the white light-transmissive regions disposed in adjacent first and second sub-pixels do not overlap each other.
6. The display substrate of claim 4, wherein the white light-transmissive region is disposed in the second and third sub-pixels, and projections along a direction of pixel rows of the white light-transmissive regions disposed in adjacent second and third sub-pixels do not overlap each other.
7. The display substrate of claim 3, wherein the white light-transmissive region is disposed in all of the second sub-pixels.
8. The display substrate of claim 2, comprising eight pixel sets arranged into a 2\xd74 matrix, wherein two adjacent pixel sets form one region, and a white light-transmissive region is disposed in all of the first and second sub-pixels in two regions arranged along a diagonal line of the matrix.
9. The display substrate of claim 3, wherein the white light-transmissive region is a strip-shaped region obliquely disposed with respect to a direction of pixel rows.
10. The display substrate of claim 3, wherein the white light-transmissive region is a strip-shaped region disposed parallel to a direction of pixel rows.
11. The display substrate of claim 10, wherein a length of the white light-transmissive region along the direction of pixel rows is larger than 0 and smaller or equal to one-third of a length of the sub-pixel along the direction of pixel rows.
12. The display substrate of claim 1, wherein the first sub-pixel is a red sub-pixel, the second sub-pixel is a blue sub-pixel, the third sub-pixel is a green sub-pixel, and the fourth sub-pixel is a white sub-pixel.
13. A display device, comprising the display substrate of claim 1.
14. The display device of claim 13, further comprising an opposed substrate, wherein the display substrate is a color filter substrate and the opposed substrate is an array substrate.
15. A method for fabricating a display substrate, comprising:
forming a plurality of pixel sets on a base substrate, wherein each of the pixel sets comprises: four first sub-pixels, four second sub-pixels, four third sub-pixels and four fourth sub-pixels, sub-pixels of each of the pixel-sets are arranged into a 4\xd74 matrix; among four pixel rows of each of the pixel sets, a first sub-pixel, a second sub-pixel, a third sub-pixel and a fourth sub-pixel are sequentially arranged in one of the pixel rows, a second sub-pixel, a third sub-pixel, a fourth sub-pixel and a first sub-pixel are sequentially arranged in one of the pixel rows, a fourth sub-pixel, a first sub-pixel, a second sub-pixel and a third sub-pixel are sequentially arranged in one of the pixel rows, and a third sub-pixel, a fourth sub-pixel, a first sub-pixel and a second sub-pixel are sequentially arranged in one of the pixel rows.
16. The method of claim 15, further comprising: forming a white light-transmissive region in at least one of the first sub-pixel, the second sub-pixel and the
17. The method of claim 16, wherein the white light-transmissive region is a strip-shaped region obliquely disposed with respect to a direction of pixel rows.
18. The method of claim 16, wherein the white light-transmissive region is a strip-shaped region disposed parallel to a direction of pixel rows.
19. The method of claim 15, wherein the first sub-pixel is a red sub-pixel, the second sub-pixel is a blue sub-pixel, the third sub-pixel is a green sub-pixel, and the fourth sub-pixel is a white sub-pixel.
20. The method of claim 15, further comprising: forming a black matrix surrounding each of the sub-pixels on the base substrate.

1461130223-0f2fea9f-46fc-4d01-8c0d-a64b4f3618e4

1. A developing unit to develop an image by supplying a developer to a photosensitive medium on which an electrostatic latent image is formed, the developing unit comprises:
a container containing a developer;
barriers to partition a portion from other portions within the container, such that a space defined by the barriers is not filled with the developer; and
a sealing film to partition another space inside of the container and can be removed to unify the another space inside of the container without disassembling the container.
2. The developing unit claim 1, wherein the barriers are provided in a portion of the space inside the container partitioned by the sealing film.
3. The developing unit of claim 2, wherein the sealing film is disposed to partition the container into a top space and a bottom space, and spaces defined by the barriers are provided in the same side of the top space and bottom space.
4. The developing unit of claim 1, wherein slits in which end portions of the barriers are inserted are formed in the inside surface of the container.
5. An electrophotographic image forming apparatus equipped with a photosensitive medium, on which an electrostatic latent image is formed on an outer surface of the photosensitive medium by light scanning and a developing unit to develop an image by supplying a developer to the photosensitive medium, the developing unit comprising:
a container containing the developer; and barriers removeably attached to the container to partition the container, in which a space defined by the barriers is not filled with the developer,
wherein a sealing film to partition a space inside of the container that can be removed to unify the space inside of the container without disassembling the container is provided, and the barriers are provided in a portion of the space inside the container partitioned by the sealing film.
6. The apparatus of claim 5 wherein the sealing film is disposed to partition the container into a top space and a bottom space, and spaces defined by the barriers are provided in the same side of the top space and bottom space.
7. The apparatus of claim 5, wherein slits in which end portions of the barriers are inserted are formed in the inside surface of the container.
8. A developing unit of an electrophotographic image forming apparatus comprising:
a developing member to develop an electrostatic image; and
a container to contain developer therein, the container including:
a first sealing film to separate an inside of the container from the developing member,
a second sealing film to partition the inside of the container into a first space containing the developer and a second space containing the developer,
a first barrier provided in the first space to create a first region containing no developer, and
a second barrier provided in the second space to create a second region containing no developer.
9. The developing unit of claim 8, wherein the first sealing film can be removed without dissembling the container, and the second sealing film can be removed without disassembling the container.
10. The developing unit of claim 9, wherein the developer contained in the first and second spaces leak out only when the first and second sealing films are removed, respectively.
11. The developing unit of claim 9, further comprising a residual developer detecting sensor to detect a residual amount of the developer, and the residual developer detecting sensor sends a message indicating that the second sealing film needs to be removed when the residual amount of the developer contained in the first space is determined to be below a predetermined amount.
12. The developing unit of claim 11, wherein the residual developer detecting sensor sends a message indicating that the container needs to be replaced when the residual amount of the developer contained in the second space is determined to be below a predetermined amount.
13. The developing unit of claim 8, wherein the first and second sealing films are composed of one of paper, urethane, polyethylene series, and polypropylene series.
14. The developing unit of claim 8, wherein the second sealing film is disposed horizontally at a center of the container and the first space is a bottom space and the second space is a top space.
15. The developing unit of claim 8, wherein the first region and the second region are disposed on a same side of the first space and the second space, respectively.
16. The developing unit of claim 8, wherein the container further comprises:
a first slit to accommodate an end portion of the first barrier; and
a second slit to accommodate an end portion of the second barrier.
17. The developing unit of claim 16, wherein another end portion of the first barrier contacts an inner surface of the container and another end portion of the second barrier contacts the inner surface of the container.
18. The developing unit of claim 16, wherein the container further comprises:
a third slit to accommodate another end portion of the first barrier; and
a fourth slit to accommodate another end portion of the second barrier.
19. The developing unit of claim 8, wherein the first barrier and the second barrier are removable.
20. A container containing a developer to be used with a developing unit of an electrophotographic image forming apparatus, the container comprising:
a plurality of sealing films partitioning the container into a plurality of spaces;
a plurality of removable barriers to partition the plurality of spaces into a plurality of developer filled spaces and a plurality of non-developer spaces containing no developer.
21. The container of claim 20, wherein each of the plurality of sealing films can be removed to allow the developer contained in each of the plurality of developer filled spaces to exit the container.
22. A container containing a developer to be used with a developing unit of an electrophotographic image forming apparatus, the container comprising:
a first compartment containing the developer and a first barrier to create a first region within the first compartment containing no developer; and
a second compartment containing the developer, wherein the developer in the first and second compartments are used sequentially.
23. The container of claim 22, further comprising a sealing film to separate the first and second compartments.
24. The container of claim 23, wherein the sealing film can be removed without disassembling the container.
25. The container of claim 22, wherein the second compartment comprises a second barrier to create a second region within the second compartment containing no developer.
26. A container containing a developer to be used with a developing unit of an electrophotographic image forming apparatus, the container comprising:
a first compartment containing the developer; and
a second compartment containing the developer, wherein the developer in the first and second compartments are used sequentially such that the developer in the second compartment flows through the first compartment to be used to develop images after the developer in the first compartment is fully depleted,
wherein a sealing film to partition a space inside of the container that can be removed to unify the space inside of the container without disassembling the container is provided, and the barriers are provided in a portion of the space inside the container partitioned by the sealing film.
27. The container of claim 26, further comprising a sealing member disposed between the first compartment and the second compartment such that when the sealing member is removed the developer of the second compartment flows through the first compartment and then to the image forming apparatus to develop images.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A high voltage shielded electrical connector assembly, comprising:
a high voltage shielded connector sub-assembly comprising:
a high voltage cap connector comprising a high voltage cap outer housing and a high voltage cap shield, the high voltage cap shield secured within the high voltage cap outer housing; and
a high voltage plug connector comprising a high voltage plug outer housing and a high voltage plug shield, the high voltage plug shield secured within the high voltage plug housing, and the high voltage plug connector configured to mate with the high voltage cap connector;
wherein the high voltage cap shield and high voltage plug shield form a continuous electromagnetic interference (EMI) shield when the high voltage cap connector and the high voltage plug connector are mated; and
wherein both the high voltage cap shield and the high voltage plug shield include a rear wall, the rear wall comprising rear openings comprising rear springs disposed therearound, the rear springs configured to provide an electrical connection with a high voltage conductor retained within the rear openings.
2. The assembly of claim 1, wherein the high voltage cap connector further includes a high voltage cap inner housing secured within the high voltage cap shield, and the high voltage plug connector includes a high voltage plug inner housing secured within the high voltage plug shield.
3. The assembly of claim 2, wherein the formed continuous EMI shield surrounds the high voltage cap inner housing and the high voltage plug inner housing.
4. The assembly of claim 2, wherein the high voltage cap shield includes tabs configured to secure the high voltage cap shield within the high voltage cap outer housing and indentations configured to retain the high voltage cap inner housing within the high voltage cap shield, and wherein the high voltage plug shield includes tabs configured to secure the high voltage plug shield within the high voltage plug outer housing, and indentations configured to retain the high voltage plug inner housing within the high voltage plug shield.
5. The assembly of claim 1, wherein the high voltage cap shield and the high voltage plug shield are electrically connected by front springs disposed on any one of the high voltage cap shield, the high voltage plug shield, or both the high voltage cap shield and the high voltage plug shield.
6. The assembly of claim 2, wherein both the high voltage cap connector and the high voltage plug connector further includes a terminal retention secondary lock configured to secure terminals attached to high voltage electrical conductors within the high voltage cap inner housing and the high voltage plug inner housing, respectively.
7. The assembly of claim 1, wherein a high voltage interlock is coupled to the high voltage connector subassembly, and wherein the high voltage interlock is configured to couple a low voltage connector sub-assembly to the high voltage connector sub-assembly, the low voltage connector sub-assembly comprising a low voltage cap connector and a low voltage plug connector.
8. The assembly of claim 7, wherein the high voltage interlock is further configured to prevent the mating of the low voltage cap connector and the low voltage plug connector before the high voltage cap connector and the high voltage plug connector are mated.
9. The assembly of claim 7, wherein the high voltage interlock comprises a high voltage interlock slider configured to change position within the high voltage interlock in response to the high voltage plug connector being mated with the high voltage cap connector to allow the low voltage plug connector to mate with the low voltage cap connector.
10. A high voltage shielded electrical connector assembly for forming an electrical connection between high voltage conductors, comprising:
a low voltage connector sub-assembly comprising:
a low voltage cap connector; and
a low voltage plug connector configured to be mated with the low voltage cap connector;

a high voltage shielded connector sub-assembly comprising:
a high voltage cap connector including a high voltage cap shield and a high voltage interlock; and
a high voltage plug connector including a high voltage plug shield, the high voltage plug connector configured to be mated with the high voltage cap connector;

wherein the high voltage interlock is configured to couple the low voltage cap connector to the high voltage cap connector, and
wherein the high voltage cap shield and high voltage plug shield form a continuous EMI shield when the high voltage cap connector and the high voltage plug connector are mated; and
wherein both the high voltage cap shield and the high voltage plug shield include a rear wall including rear openings having rear springs disposed therearound, the rear springs configured to provide an eletrical connection with a high voltage conductor retained within the rear openings.
11. The assembly of claim 10, wherein the high voltage cap connector further includes a high voltage cap inner housing secured within the high voltage cap shield, and the high voltage plug connector includes a high voltage plug inner housing secured within the high voltage plug shield.
12. The assembly of claim 11, wherein both the high voltage cap connector and the high voltage plug connector further includes a terminal retention secondary lock configured to secure terminals attached to high voltage electrical conductors within the high voltage cap inner housing and the high voltage plug inner, respectively.
13. The assembly of claim 10, wherein the high voltage cap connector further includes a high voltage cap outer housing and the high voltage plug connector further includes a high voltage plug connector outer housing.
14. The assembly of claim 11, wherein the high voltage cap shield includes tabs configured to secure the high voltage cap shield within the high voltage cap outer housing and indentations configured to retain the high voltage cap inner housing within the high voltage cap shield, and wherein the high voltage plug shield includes tabs configured to secure the high voltage plug shield within the high voltage plug outer housing, and indentations configured to retain the high voltage plug inner housing within the high voltage plug shield.
15. The assembly of claim 10, wherein the high voltage cap shield and the high voltage plug shield are electrically connected by front springs disposed on any one of the high voltage cap shield, the high voltage plug shield, or both the high voltage cap shield and the high voltage plug shield.
16. The assembly of claim 10, wherein the high voltage interlock is further configured to prevent the mating of the low voltage cap connector and the low voltage plug connector before the high voltage cap connector and the high voltage plug connector are mated.
17. The assembly of claim 10, wherein the high voltage interlock comprises a high voltage interlock slider configured to change position within the high voltage interlock in response to the high voltage plug connector being mated with the high voltage cap connector to allow the low voltage plug connector to mate with the low voltage cap connector.