Author: claimsbot

1. A retractable barrier comprising:
a first support member;
a first take-up member supported by the first support member;
a second support member spaced apart from the first support member;
a third support member disposed between the first support member and the second support member;
a second take-up member supported by the third support member;
a first retractable panel that includes a proximal end attached to the first take-up member and a distal end that can be releasably coupled to the third support member, wherein the first retractable panel can selectively retract onto the first take-up member and extend out toward the third support member;
a second retractable panel that includes a proximal end attached to the second take-up member and a distal end that can be releasably coupled to the second support member, wherein the second retractable panel can selectively retract onto the second take-up member and extend out toward the second support member;
2. The retractable barrier of claim 1, further comprising a first stop member disposed on the first retractable panel.
3. The retractable barrier of claim 2, further comprising a first catch member disposed on the first support member and being associated with the first stop member such that the first catch member impedes the movement of the first stop member to limit an extent to which the first retractable panel can extend out from the first support member.
4. The retractable barrier of claim 2, further comprising a second stop member disposed on the second retractable panel.
5. The retractable barrier of claim 4, further comprising a second catch member disposed on the third support member and being associated with the second stop member such that the second catch member impedes the movement of the second stop member to limit an extent to which the second retractable panel can extend out from the third support member.
6. A retractable barrier comprising:
a first support member;
a first roller supported by the first support member;
a second support member spaced apart from the first support member;
an intermediate support member disposed between the first support member and the second support member;
a second roller supported by the intermediate support member;
a first rollup panel that includes a first proximal end attached to the first roller and a first distal end that can be releasably coupled to the intermediate support member, wherein the roller can be rotated to selectively take up and pay out the first rollup panel; and
a second rollup panel that includes a second proximal end attached to the second roller and a second distal end that can be releasably coupled to the second support member, wherein the roller can be rotated to selectively take up and pay out the second rollup panel.
7. A retractable barrier comprising:
a first support member;
a second support member spaced apart from the first support member;
an intermediate support member disposed between the first support member and the second support member;
a first rollup panel supported by the first support member and adapted to be selectively coupled to the intermediate support member; and
a second rollup panel supported by the intermediate support member and adapted to be selectively coupled to the second support member.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

What is claimed is:

1. A semiconductor device comprising:
a semiconductor chip having electrodes;
an interconnect layer connected to said electrodes;
a conducting layer formed on said interconnect layer, avoiding a position where said electrodes are provided;
an underlying metal layer formed on said conducting layer, said underlying metal layer having a size larger than a peripheral outline of said conducting layer, and being more easily deformed than said conducting layer;
a bump formed on said underlying metal layer; and
a resin layer formed around said conducting layer.
2. The semiconductor device as defined in claim 1 wherein:
said bump is formed having a size larger than the peripheral outline of said conducting layer; and
a projected area of a region in which said bump contacts with said underlying metal layer is larger than a projected area of a region in which said underlying metal layer contacts with said conducting layer.
3. The semiconductor device as defined in claim 1,
wherein said resin layer contacts at least a portion of a lower surface of said underlying metal layer.
4. The semiconductor device as defined in claim 2,
wherein said resin layer contacts at least a portion of a lower surface of said underlying metal layer.
5. The semiconductor device as defined in claim 1,
wherein said resin layer is formed being separated from a lower surface of said underlying metal layer.
6. The semiconductor device as defined in claim 2,
wherein said resin layer is formed being separated from a lower surface of said underlying metal layer.
7. The semiconductor device as defined in any one of claims 1 to 6,
wherein an adhesive is provided between the lower surface of said underlying metal layer and said resin layer.
8. The semiconductor device as defined in any one of claims 1 to 6,
wherein said conducting layer has a height approximately in a range 12 to 300 m, and a diameter approximately in a range 20 to 100 m.
9. The semiconductor device as defined in claim 7,
wherein said conducting layer has a height approximately in a range 12 to 300 m, and a diameter approximately in a range 20 to 100 m.
10. A circuit board on which is mounted the semiconductor device as defined in any one of claims 1 to 6.
11. A circuit board on which is mounted the semiconductor device as defined in claim 7.
12. A circuit board on which is mounted the semiconductor device as defined in claim 8.
13. A circuit board on which is mounted the semiconductor device as defined in claim 9.
14. An electronic instrument equipped with the semiconductor device as defined in any one of claims 1 to 6.
15. An electronic instrument equipped with the semiconductor device as defined in claim 7.
16. An electronic instrument equipped with the semiconductor device as defined in claim 8.
17. An electronic instrument equipped with the semiconductor device as defined in claim 9.
18. A method of manufacturing a semiconductor device comprising:
a step of preparing a semiconductor chip having electrodes and an interconnect layer connected to said electrodes;
a step of forming a conducting layer on said interconnect layer, avoiding a position where said electrodes are provided;
a step of forming an underlying metal layer on said conducting layer, said underlying metal layer having a size larger than a peripheral outline of said conducting layer, and being more easily deformed than said conducting layer;
a step of forming a bump on said underlying metal layer; and
a step of forming a resin layer around said conducting layer.
19. The method of manufacturing a semiconductor device as defined in claim 18, wherein the steps of forming said conducting layer and said resin layer comprise:
a first step of providing an opening in a formation of said resin layer, as a formation region for said conducting layer, on said interconnect layer;
a second step of filling said opening by a printing method with a conductive paste having a conductive filler distributed in a binder; and
a third step of heating said conductive paste and hardening said binder, to cause said binder intimate contact with said interconnect layer.
20. The method of manufacturing a semiconductor device as defined in claim 19,
wherein, in said third step, said conductive filler is fused to cause intimate contact with said interconnect.
21. The method of manufacturing a semiconductor device as defined in any one of claims 18 to 20, wherein the step of forming said underlying metal layer comprises:
after forming said conducting layer and said resin layer, a first step of adhering a metal foil provided with an adhesive avoiding a contact portion with said conducting layer on said conducting layer and said resin layer in a vacuum, creating a vacuum in a space between said conducting layer and said metal foil at atmospheric pressure, and bringing said conducting layer and said metal foil into intimate contact; and
a second step of patterning said metal foil in a form of said underlying metal layer.
22. The method of manufacturing a semiconductor device as defined in claim 18, wherein the step of forming said conducting layer and said underlying metal layer comprises:
a first step of providing a first conducting material in a region including a formation region of said conducting layer;
a second step of forming a first resist layer having a first opening which is provided at a formation region of said conducting layer and positioned on said first conducting material;
a third step of providing a second conducting material within said first opening and on said first conducting material;
a fourth step of forming on said first resist layer a second resist layer having a second opening formed at a formation region of said underlying metal layer;
a fifth step of providing a metal material in said second opening to form said underlying metal layer; and
a sixth step of removing said first and second resist layers, patterning said first conducting material, and forming said conducting layer from a portion of said first conducting material and said second conducting material.

1. Footwear comprising:
a foot dressing;
an adjustable assembly coupled to the foot dressing having a manually-operable control to adjust a longitudinal dimension of the inner assembly in fixed relationship with the inner assembly;
an indicator bearing indicia of the adjustable dimension of the inner assembly in fixed relationship with the inner assembly;
a visualization window positioned over the indicator so that as a longitudinal dimension of the footwear apparatus is adjusted the indicia on the indicator is moved behind the window;
and a light source disposed within the footwear apparatus to illuminate the visualization window.
2. The footwear of claim 1 further comprising a power source connected to the light source to provide power for the light source.
3. The footwear of claim 2 wherein the power source is disposed within the footwear apparatus.
4. The footwear of claim 1 further comprising a lens disposed within the footwear apparatus to reflect light from the light source to the visualization window.
5. The footwear of claim 1 wherein the visualization window provides a magnification factor.
6. The footwear of claim 1 wherein the indicia is a shoe size.
7. The footwear of claim 1 wherein the indicia is a relative shoe size.
8. The footwear of claim 1 wherein the indicia is of a shoe dimension.
9. The footwear of claim 1 wherein the indicator bearing indicia of the adjustable dimensions of the inner assembly is taped to the inner assembly,
10. The footwear of claim 1 wherein the visualization window is positioned in a vertical position of a heel of the footwear apparatus.
11. The footwear of claim 1 wherein the visualization window is positioned in a sole of the footwear apparatus.
12. The footwear of claim 1 wherein the visualization window is positioned in a vertical position of a sole of the footwear apparatus.
13. The footwear of claim 1 wherein the adjustable assembly can be controlled for half size increments of longitudinal shoe size.
14. The footwear of claim 1 wherein the control has a manually operable activation mechanism to illuminate the light source.
15. The footwear of claim 14 wherein the activation source is integral to the footwear and manually operable.
16. Footwear, comprising:
a foot dressing, and
an adjustable inner assembly, disposed within the foot dressing, the inner assembly having a first member and a second member in overlapping engagement with each other and a control to adjust the position of the first member relative to the second member and to thereby adjust a dimension of the inner assembly and thereby a corresponding dimension of the footwear apparatus;
an indicator bearing indicia of the adjustable dimension of the inner assembly in fixed relationship with the inner assembly;
a visualization window positioned over the indicator so that as a longitudinal dimension of the footwear apparatus is adjusted the indicia on the indicator is moved behind the window;
and a light source disposed within the footwear apparatus to illuminate the visualization window.
17. The footwear of claim 16 wherein the corresponding dimension of the footwear apparatus is measured in half size increments of longitudinal shoe size.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. Pressure-sensitive tape for closing, sealing, and gluing construction joints, said tape comprising:
a bottom side and a top side;
a backing on said tape top side, said backing having a top side and a bottom side;
an adhesive coating, said adhesive coating having a top side and a bottom side, said adhesive coating being located against said backing bottom side;
a removable protective film, said protective film being on said tape bottom side, said protective film having a first slit; and
a first transverse fold section, said fold section longitudinally extending along said tape.
2. The tape in accordance with claim 1, further comprising a second transverse fold section, said second transverse fold section extending longitudinally along said tape.
3. The tape in accordance with claim 2, further comprising a second slit, said second slit extending longitudinally along said protective film.
4. The tape in accordance with claim 3, wherein said second fold edge coincides with said protective film second slit.
5. The tape in accordance with claim 3, wherein said second fold edge is offset from said protective film first slit.
6. The tape in accordance with claim 3, wherein said first fold edge is offset from said protective film second slit.
7. The tape in accordance with claim 6, wherein said protective film has an edge section, said edge section being adjacent to said first fold edge.
8. The tape in accordance with claim 7, wherein said first fold section opposes said second fold section.
9. The tape in accordance with claim 8, wherein said first fold section is transversely adjacent to said second fold section.
10. The tape in accordance with claim 9, wherein said first fold section partially contacts said second fold section.
11. The tape in accordance with claim 10, wherein said tape bottom is located adjacent to said first fold section.
12. The tape in accordance with claim 10, wherein said tape top side is located adjacent to said first fold section.
13. The tape in accordance with claim 12, wherein said adhesive coating is partially uncovered by said protective film.
14. The tape in accordance with claim 13, wherein said adhesive coating is uncovered by said protective film adjacent to said first fold section.
15. The tape in accordance with claim 14, wherein said backing comprises one or more of paper, plastic, woven textile, and non-woven textile, and said adhesive coating comprises one or more of pressure-sensitive acrylate adhesives, rubber adhesives, butyl adhesives, and hot melt.
16. The tape in accordance with claim 15, wherein said backing is adapted for longitudinal tearing.
17. The tape in accordance with claim 16, wherein said adhesive coating has a non-adhesive center strip.
18. The tape in accordance with claim 17, wherein said tape is rolled for forming roll of adhesive tape.
19. The tape in accordance with claim 18, further comprising an intermediate layer, said intermediate layer being provided adjacent to said first fold edge of said roll of adhesive tape.
20. The tape in accordance with claim 19, wherein said tap has a width of at least 3 cm.
21. The tape in accordance with claim 20, wherein said tape further comprises a perforation area, said perforation area having perforation apertures with an average diameter of at least 3 millimeters.
22. The tape in accordance with claim 22, wherein said perforation aperture penetrate said backing, said adhesive coating, and said removable protective film.
23. The tape in accordance with claim 22, wherein said perforation apertures round, polygonal, or oval.
24. The tape in accordance with claim 23, wherein said backing comprises an adhesive open-pore material adapted for plastering.
25. The tape in accordance with claim 3, wherein said second fold edge is offset from said protective film first slit and said protective film second slit.
26. The tape in accordance with claim 6, wherein said protective film has an edge section, said edge section being adjacent to said first fold edge and said second fold edge.
27. The tape in accordance with claim 10, wherein said tape bottom is located adjacent to said first fold section and said second fold section.
28. The tape in accordance with claim 10, wherein said tape top side is located adjacent to said first fold section and said second fold section.
29. The tape in accordance with claim 13, wherein said adhesive coating is uncovered by said protective film adjacent to said first fold section and said second fold section.
30. The tape in accordance with claim 19, wherein said tape has a width of between 3 cm and 50 cm.
31. The tape in accordance with claim 19, wherein said tape has a width of between 4.5 cm and 20 cm.