Author: claimsbot

1. A zoom lens comprising of, in order from an object side to an image side, a first lens unit having a positive refractive power, a second lens unit having a negative refractive power, a third lens unit having a positive refractive power, and a rear group including one or more lens units, wherein the first lens unit consists of a negative lens and a positive lens, the lens units move at a time of zooming, the position of the first lens unit at the telephoto end is displaced toward the object side from its position at the wide angle end, the position of the third lens unit at the telephoto end is displaced toward the object side from its position at the wide angle end, and the zoom lens satisfies the following conditional expressions:
10.5<f1fw<30.0, and
0.010<|f2ft|<0.181,

where f1 is the focal length of the first lens unit, f2 is the focal length of the second lens unit, fw is the focal length of the whole system at the wide angle end, and ft is the focal length of the whole system at the telephoto end.
2. A zoom lens according to claim 1, wherein the zoom lens satisfies the following conditional expression:
0.20<|f2f3|<0.85,

where f3 is the focal length of the third lens unit.
3. A zoom lens according to claim 1, wherein the zoom lens satisfies the following conditional expression:
2.0<f3fw<10.0,

where f3 is the focal length of the third lens unit.
4. A zoom lens according to claim 1, wherein the zoom lens satisfies the following conditional expression:
0.1<Tdwft<1.5,

where Tdw is the overall length of the zoom lens at the wide angle end.
5. A zoom lens according to claim 1, wherein the zoom lens satisfies the following conditional expression:
0.1<\u03b22w\u03b22t<0.4,
where \u03b22w is the lateral magnification of the second lens unit at the wide angle end, \u03b22t is the lateral magnification of the second lens unit at the telephoto end.
6. A zoom lens according to claim 1, wherein the zoom lens satisfies the following conditional expression:
0.01<D1Gft<0.15,

where D1G is the thickness of the first lens unit along the optical axis.
7. A zoom lens according to claim 1, wherein the rear group consists, in order from the object side to the image side, of a fourth lens unit having a negative refractive power and a fifth lens unit having a positive refractive power.
8. A zoom lens according to claim 7, wherein the zoom lens satisfies the following conditional expression:
0.01<|f2f4|<0.6,

where f4 is the focal length of the fourth lens unit.
9. A zoom lens according to claim 1, wherein the rear group consists of a fourth lens unit having a positive refractive power.
10. A zoom lens according to claim 9, wherein the zoom lens satisfies the following conditional expression:
0.01<|f2f4|<0.6,

where f4 is the focal length of the fourth lens unit.
11. A zoom lens according to claim 1, wherein the zoom lens satisfies the following conditional expression:
0.1<f1pf1<1.0,

where f1p is the focal length of the positive lens in the first lens unit.
12. A zoom lens according to claim 1 further comprising an aperture stop that is provided on the object side of the third lens unit and moves along a locus different from loci of the lens units at a time of zooming, wherein the zoom lens satisfies the following conditional expression:
0.5<dswfw<10.0,

where dsw is the distance between the aperture stop and the third lens unit at the wide angle end.
13. A zoom lens according to claim 1, wherein the third lens unit comprises one negative lens and two positive lenses.
14. A zoom lens according to claim 1, wherein the third lens unit is shifted in a direction having a component perpendicular to the optical axis to thereby shift the imaging position of the zoom lens in a direction perpendicular to the optical axis.
15. A zoom lens according to claim 1, wherein the zoom lens forms an image on a solid state image pickup element.
16. An image pickup apparatus comprising a zoom lens according to claim 1 and a solid state image pickup element that receives an image formed by the zoom lens.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A solid state storage device comprising:
a printed circuit board assembly;
a memory arranged on the printed circuit board assembly;
a storage medium arranged on the printed circuit board assembly;
a processor arranged on the printed circuit board assembly, wherein the processor is coupled to the memory and to the storage medium via the printed circuit board assembly, and wherein the processor is configured to store data in the memory and the storage medium and to read data from the memory and the storage medium; and
a removable power pack comprising a plurality of capacitors serially arranged in a housing, wherein the plurality of capacitors is detachably connected to the printed circuit board assembly to supply backup power to the processor, the memory, and the storage medium when the removable power pack is mounted in the solid state storage device.
2. The solid state storage device according to claim 1, wherein the housing comprises a plurality of cavities defined therein, and wherein each of the plurality of capacitors is arranged in a respective one of the plurality of cavities.
3. The solid state storage device according to claim 2, wherein the removable power pack further comprises a mounting circuit board connected to each of the plurality of capacitors, wherein the plurality of capacitors are serially connected to one another via the mounting circuit board, and wherein the mounting circuit board comprises a plurality of connectors configured to detachably connect to the printed circuit board assembly.
4. The solid state storage device according to claim 3, wherein the plurality of connectors comprises a plurality of pogo pins.
5. The solid state storage device according to claim 3, wherein the plurality of connectors comprises a plurality of contact pads.
6. The solid state storage device according to claim 3, wherein the housing and the mounting circuit board at least partially enclose the plurality of capacitors.
7. The solid state storage device according to claim 1, wherein the housing is formed of plastic.
8. The solid state storage device according to claim 1, further comprising:
a frame base, wherein the printed circuit board assembly is attached to the frame base; and
a frame cover attached to the frame base,
wherein the frame base and the frame cover partially enclose the printed circuit board assembly, the memory, the storage medium, and the processor, and
wherein the frame base and the frame cover define an opening for mounting the removable power pack in the solid state storage device.
9. The solid state storage device according to claim 1, further comprising a monitor circuit configured to monitor a voltage at a positive plate of each of the plurality of capacitors.
10. The solid state storage device according to claim 9, wherein the monitor circuit comprises an analog-to-digital convertor configured to convert the voltage at the positive plate of each of the plurality of capacitors to a respective digital value, and wherein the monitor circuit is further configured to communicate the respective digital values to the processor.
11. The solid state storage device according to claim 10, wherein the monitor circuit further comprises a plurality of voltage dividers configured to standardize the voltage at the positive plate of respective ones of the plurality of capacitors, wherein the monitor circuit is configured to monitor the respective standardized voltages.
12. The solid state storage device according to claim 1, further comprising an active balance network configured to equalize the respective voltages across the plurality of capacitors, wherein the active balance network comprises:
a first plurality of resistors arranged in a first voltage divider circuit configured to equally divide the total voltage across the plurality of capacitors; and
a plurality of op amps configured as voltage followers,
wherein the output of each of the plurality of op amps is coupled to a respective terminal connecting two adjacent capacitors, and an input of each of the plurality of op amps is coupled to a respective terminal connecting two adjacent resistors in the first voltage divider circuit.
13. The solid state storage device according to claim 12, wherein the active balance network is further configured to bring the voltage at the positive plate of each of the plurality of capacitors to a respective cumulative percentage of the total capacity of the plurality of capacitors.
14. The solid state storage device according to claim 12, further comprising a passive balance network configured to equalize the respective voltages across the plurality of capacitors, wherein the passive balance network comprises:
a second plurality of resistors arranged in second voltage divider circuit configured to equally divide the total voltage across the plurality of capacitors,
wherein each of the second plurality of resistors is arranged in parallel with a respective one of the plurality of capacitors.
15. A solid state storage device comprising:
a printed circuit board assembly;
a memory arranged on the printed circuit board assembly;
a storage medium arranged on the printed circuit board assembly;
a processor arranged on the printed circuit board assembly, wherein the processor is coupled to the memory and to the storage medium via the printed circuit board assembly, and wherein the processor is configured to store data in the memory and the storage medium and to read data from the memory and the storage medium;
a plurality of capacitors serially arranged and connected to the printed circuit board assembly to supply backup power to the processor, the memory, and the storage medium; and
a monitor circuit configured to monitor a voltage at a positive plate of each of the plurality of capacitors.
16. The solid state storage device according to claim 15, wherein the monitor circuit comprises an analog-to-digital convertor configured to convert the voltage at the positive plate of each of the plurality of capacitors to a respective digital value, and wherein the monitor circuit is further configured to communicate the respective digital values to the processor.
17. The solid state storage device according to claim 16, wherein the monitor circuit further comprises a plurality of voltage dividers configured to standardize the voltage at the positive plate of respective ones of the plurality of capacitors, wherein the monitor circuit is configured to monitor the respective standardized voltages.
18. The solid state storage device according to claim 15, wherein the plurality of capacitors are serially arranged in a housing of a removable power pack, and wherein the plurality of capacitors are configured to be detachably connected to the printed circuit board when the removable power pack is mounted in the solid state storage device.
19. A solid state storage device comprising:
a printed circuit board assembly;
a memory arranged on the printed circuit board assembly;
a storage medium arranged on the printed circuit board assembly;
a processor arranged on the printed circuit board assembly, wherein the processor is coupled to the memory and to the storage medium via the printed circuit board assembly, and wherein the processor is configured to store data in the memory and the storage medium and to read data from the memory and the storage medium;
a plurality of capacitors serially arranged and connected to the printed circuit board assembly to supply backup power to the processor, the memory, and the storage medium; and
an active balance network configured to equalize the respective voltages across the plurality of capacitors, wherein the active balance network comprises:
a first plurality of resistors arranged in a first voltage divider circuit configured to equally divide the total voltage across the plurality of capacitors; and
a plurality of op amps configured as voltage followers,
wherein the output of each of the plurality of op amps is coupled to a respective terminal connecting two adjacent capacitors, and an input of each of the plurality of op amps is coupled to a respective terminal connecting two adjacent resistors in the first voltage divider circuit.
20. The solid state storage device according to claim 19, wherein the active balance network is further configured to bring the voltage at the positive plate of each of the plurality of capacitors to a respective cumulative percentage of the total capacity of the plurality of capacitors.
21. The solid state storage device according to claim 19, further comprising a passive balance network configured to equalize the respective voltages across the plurality of capacitors, wherein the passive balance network comprises:
a second plurality of resistors arranged in second voltage divider circuit configured to equally divide the total voltage across the plurality of capacitors,

wherein each of the second plurality of resistors is arranged in parallel with a respective one of the plurality of capacitors.
22. The solid state storage device according to claim 19, wherein the plurality of capacitors are serially arranged in a housing of a removable power pack, and wherein the plurality of capacitors are configured to be detachably connected to the printed circuit board when the removable power pack is mounted in the solid state storage device.

1. A method, comprising:
providing an accommodating intraocular lens system having first and second viewing elements that are interconnected by biasing elements;
translationally displacing the interconnected viewing elements relative to each other in a direction other than toward each other; and
implanting the intraocular lens with the viewing elements so displaced.
2. The method of claim 1, wherein said viewing elements comprise optics.
3. The method of claim 1, wherein said displacing comprises placing said viewing elements in a side-by-side relationship.
4. The method of claim 1, wherein said displacing comprises changing said viewing elements from a first configuration in which respective optical axes of said viewing elements are coincident, to a second configuration in which said optical axes of said viewing elements are not coincident.
5. The method of claim 1, wherein said displacing comprises changing said viewing elements from a first configuration in which a first optical surface of said first viewing element faces a second optical surface of said second viewing element, to a second configuration in which said optical surfaces do not face each other.
6. The method of claim 1, further comprising folding or rolling said lens system after said displacing.
7. The method of claim 1, further comprising placing said lens system in an insertion tool.
8. A method for use with an accommodating intraocular lens having first and second viewing elements that are interconnected by biasing elements, said method comprising:
non-rotationally displacing the interconnected viewing elements relative to each other in a direction other than toward each other; and
implanting the intraocular lens with the viewing elements so displaced.
9. The method of claim 8, wherein said displacing, comprises placing said viewing elements in a side-by-side relationship.
10. The method of claim 8, wherein said displacing comprises changing said viewing elements from a first configuration in which respective optical axes of said viewing elements are coincident, to a second configuration in which said optical axes of said viewing elements are not coincident.
11. The method of claim 8, wherein said displacing comprises changing said viewing elements from a first configuration in which a first optical surface of said first viewing element faces a second optical surface of said second viewing element, to a second configuration in which said optical surfaces do not face each other.
12. The method of claim 8, further comprising folding or rolling said lens after said displacing.
13. The method of claim 8, further comprising placing said lens in an insertion tool.
14. The method of claim 8, wherein said viewing elements comprise optics.
15. A method for use with an accommodating intraocular lens having first and second viewing elements that are interconnected by biasing elements, said method comprising:
non-rotationally displacing the interconnected viewing elements relative to each other in a direction other than toward each other; and
rolling or folding the intraocular lens with the viewing elements so displaced.
16. The method of claim 15, wherein said displacing comprises placing said viewing elements in a side-by-side relationship.
17. The method of claim 15, wherein said displacing comprises changing said viewing elements from a first configuration in which respective optical axes of said viewing elements are coincident, to a second configuration in which said optical axes of said viewing elements are not coincident.
18. The method of claim 15, wherein said displacing comprises changing said viewing elements from a first configuration in which a first optical surface of said first viewing element faces a second optical surface of said second viewing element, to a second configuration in which said optical surfaces do not face each other.
19. The method of claim 15, further comprising placing said lens in an insertion tool.
20. The method of claim 15, wherein said viewing elements comprise optics.
21. A method for use with an accommodating intraocular lens having first and second viewing elements that are interconnected by biasing elements and situated substantially on a common optical axis, said method comprising:
displacing the interconnected viewing elements relative to each other in a direction other than along or about said optical axis; and
rolling or folding the intraocular lens with the viewing elements so displaced.
22. The method of claim 21, wherein said displacing comprises placing said viewing elements in a side-by-side relationship.
23. The method of claim 21, wherein said displacing comprises changing said viewing elements from a first configuration in which respective optical axes of said viewing elements are coincident, to a second configuration in which said optical axes of said viewing elements are not coincident.
24. The method of claim 21, wherein said displacing comprises changing said viewing elements from a first configuration in which a first optical surface of said first viewing element faces a second optical surface of said second viewing element, to a second configuration in which said optical surfaces do not face each other.
25. The method of claim 21, further comprising placing said lens in an insertion tool.
26. The method of claim 21, wherein said viewing elements comprise optics.
27. The method of claim 21, further comprising implanting said intraocular lens in an eye.
28. The method of claim 27, further comprising positioning said intraocular lens in a capsular bag of said eye such that said viewing elements move relative to each other in response to action of a ciliary muscle of said eye.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

We claim:

1. A method of forming a buried interconnecting wire, comprising:
a first step of forming a first recessed portion in an insulating film deposited on a semiconductor substrate;
a second step of depositing a high-melting-point conductive material on said insulating film to form a first conductive film composed of said high-melting-point conductive material and having a second recessed portion in a position corresponding to the first recessed portion of said insulating film;
a third step of nitriding a surface of said first conductive film by using a plasma with said semiconductor substrate being held in a vacuum chamber maintained at a pressure of 10 Pa or higher to form a second conductive film composed of a nitride of said high-melting-point conductive material and having a third recessed portion in a position corresponding to the second recessed portion of said first conductive film;
a fourth step of depositing a metal for interconnections on said second conductive film such that said metal for interconnections is filled in the third recessed portion of said second conductive film to form a metal film composed of said metal for interconnections; and
a fifth step of removing the portions of said first conductive film, said second conductive film, and said metal film located outside the first recessed portion of said insulating film to form a buried interconnecting wire made of said metal for interconnections in the third recessed portion of said second conductive film.
2. A method of forming a buried interconnecting wire according to claim 1, wherein
said third step includes the step of nitriding the surface of said first conductive film by using a plasma with said semiconductor substrate being held in a vacuum chamber maintained at a pressure of 50 Pa or higher.
3. A method of forming a buried interconnecting wire according to claim 1, wherein
the metal for interconnections in said fourth step is copper or a copper alloy.
4. A method of forming a buried interconnecting wire according to claim 1, wherein
the high-melting-point conductive material in said second step is titanium, tantalum, or tungsten.
5. A method of forming a buried interconnecting wire according to claim 1, wherein
said third step includes the step of nitriding the surface of said first conductive film by using a plasma with said semiconductor substrate being held at the ground potential or at a positive potential.
6. A method of forming a buried interconnecting wire according to claim 1, wherein
said second step includes the step of depositing said high-melting-point conductive material by CVD.
7. A method of forming a buried interconnecting wire according to claim 6, wherein
said second step includes the step of depositing said high-melting-point conductive material at a temperature within such a range as to suppress crystallization of said high-melting-point conductive material to form said first conductive film with at least a part thereof being amorphous.