Author: claimsbot

1. A biological test kit, wherein said test kit comprises (a) a culture instrument having a culture surface on which a cell pattern can be formed, and (b) a gel suitable for embedding said cell pattern,
wherein said culture surface comprises a cell adhesion region and a cell-adhesion-inhibiting region, and wherein said cell adhesion region is formed by subjecting a cell-adhesion-inhibiting hydrophilic film containing an organic compound having a carbon-oxygen bond to oxidation treatment andor degradation treatment, so that when said culture surface is coated with said gel thereby embedding said cell pattern into said gel, said culture instrument can be peeled off the gel.
2. The biological test kit according to claim 1, wherein the culture surface of the culture instrument is provided with a cell adhesion region and a cell-adhesion-inhibiting region, the cell adhesion region and the cell-adhesion-inhibiting region are each formed with a hydrophilic film containing an organic compound having a carbon-oxygen bond, and the density of the organic compound in the cell adhesion region is lower than that of the organic compound in the cell-adhesion-inhibiting region.
3. The biological test kit according to claim 1, wherein the difference in height between said cell adhesion region and said cell-adhesion-inhibiting region is 10 nm or less.
4. The biological test kit according to claim 1, wherein the gel is selected from the group consisting of a hydrophilic polymer, a hydrogel made of an artificial peptide, a gel made of a polysaccharide, a gel made of a protein, an extracellular matrix, and a gel made of complexes thereof.
5. The biological test kit according to claim 1, wherein the cell-adhesion-inhibiting hydrophilic film is formed by a main raw material selected from the group consisting of polyalkyleneglycol, polyacrylic acid, polymethacrylic acid, polyacrylamide, polyvinyl alcohol, a zwitterionic polymer, a polysaccharide; an alkylene glycol oligomer, an acrylate oligomer, a methacrylate oligomer, an acrylate oligomer, a saponifiable substance of a vinyl acetate oligomer, an oligomer comprising zwitterionic monomers, acrylic acid, methacrylic acid, acrylamide, a zwitterionic compound, a water-soluble silane coupling agent, a water-soluble thiol compound and a derivative thereof.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A computer-assisted method for for optimization of an aircraft’s avionics platform, said method comprising:
associating functional link instances with paths intended to implement the functional link instances, using a first set of constraints, the functional link instances exchanging messages between software module instances, the software module instances being associated with one of a plurality of avionics functions of the platform, the platform additionally including a plurality of equipment items linked together by unidirectional or bidirectional physical links which belong to different types of networks, paths used to link said plurality of equipment items, where each path is made up either of a single direct physical link between a source equipment item and a destination equipment item, or of a first physical link between said source equipment item and a first network node, a second physical link between said destination equipment item and a second network node, and a network path between said first and second nodes;
associating software modules instances with at least one of the plurality of equipment items intended to host the software modules instances, using a second set of constraints, where said constraints of the first and the second sets are formulated as linear inequalities of decision variables;
generating a third set of constraints formulated as linear inequalities of decision variables, the third set of constraints constraining instances of functional links to be segregated using sets of network paths that are disjoint, the third set of constraints including linear inequalities constraining a number of network paths between the source equipment item and the destination equipment item passing through a specific node to be less than a specific number;
minimizing a plurality of cost functions, each cost function being formulated as a linear combination of at least certain of said decision variables in order to obtain at least one optimum solution for the implementation of the avionics functions in the platform; and
implementing the plurality of avionics functions in the platform according to the optimum solution such that the software module instances are implemented on the plurality of equipment items and functional links are implemented on paths included in the at least one optimum solution.
2. The computer-assisted method for optimisation, according to claim 1, further comprising:
associating one or more power sources with each item of equipment using said second set of constraints.
3. The computer-assisted method for optimisation, according to claim 1, further comprising:
generating, prior to minimisation of the cost functions, the third set of constraints formulated as linear inequalities of decision variables, such that the third set of constraints also constrain instances of functional links to be co-located using sets of network paths that are identical.
4. The computer-assisted method for optimisation, according to claim 3, wherein the third set of constraints constrains software module instances to be co-located or segregated using sets of equipment that are, respectively, identical and disjoint.
5. The computer-assisted method for optimisation, according to claim 3, wherein the third set of constraints constrains software module instances to be required to be hosted by equipment supplied by power sources that are identical or distinct.
6. The computer-assisted method for optimisation, according to claim 1, further comprising:
generating, prior to minimisation of the cost functions, a fourth set of constraints formulated as linear inequalities of decision variables, which can be used beforehand, to constrain that an instance of a functional link passes through a given network path, or to constrain that an instance of a software module be hosted by a given item of equipment.
7. The computer-assisted method for optimization, according to claim 6, wherein at least one cost function includes an additional decision variable which does not occur in the set of constraints in the first, second, third or fourth sets of constraints, and the method further comprising:
generating a fifth set of constraints in the form of an inequality, which is linearly dependent on at least said additional decision variable.
8. The computer-assisted method for optimisation, according to claim 1 further comprising:
minimising the cost functions conjointly over a set of possible values of said decision variables.
9. The computer-assisted method for optimization, according to claim 1 further comprising: minimizing successively the cost functions with a first cost function being minimized over the set of possible values of said decision variables and where each of the other cost functions are minimized over the sub-set of said values obtained through the previous cost function minimization.
10. The computer-assisted method for optimisation, according to claim 1, wherein said cost functions belong to the following list:
number of items of equipment connected to several communication networks;
weighted combination of the number of communication nodes of various types;
maximum number of communication node connections;
sum of the real distances between the items of equipment and the communications nodes to which they are connected;
number of power sources supplying the various items of equipmentM sum of the maximum levels of utilisation of equipment resources by the software module instances;
number of paths associated with a given functional link;
topological length of network paths associated with a given functional link;
number of communication nodes common to the network paths associated with a given functional link; and
total number of communication nodes used by the network paths associated with a given functional link.
11. A method for the creation of an avionics platform, comprising:
optimising the platform architecture the optimisation method according to claim 1, wherein the implementing of the avionics functions comprises:
equipping terminals of the avionics platform with the resources determined by the optimum solution; and
storing the software module instances in these terminals.
12. The method for creating an avionics platform, according to claim 11, further comprising:
providing network and physical links, either directly between terminals or between terminals and network nodes; and
storing the routingcommutation tables in said nodes in order to implement the network paths determined by said optimum solution.

1. A method of forming a bonded body comprised of a first base member, a second base member, and a first bonding film and a second bonding film provided between the first base member and the second base member, wherein the first bonding film and the second bonding film are constituted mainly of copper, wherein the method comprising:
forming the first bonding film on the first base member by using a chemical vapor-film formation method;
forming the second bonding film on the second base member by using a chemical vapor-film formation method;
bringing the first bonding film formed on the first base member into contact with the second bonding film formed on the second base member so that the first bonding film faces the second bonding film; and
applying a compressive force to the first base member and the second base member so that the first bonding film and the second bonding film are bonded together to thereby obtain the bonded body.
2. The method as claimed in claim 1, wherein in the forming processes of the first bonding film and the second bonding film, each of the first bonding film and the second bonding film is formed so that its surface roughness Ra (according to JIS B 0601) is in the range of 1 to 30 nm.
3. The method as claimed in claim 1, wherein in the applying process of the compressive force, the compressive force to be applied to the first base member and the second base member is in the range of 1 to 100 MPa.
4. The method as claimed in claim 1, wherein in the applying process of the compressive force, a time of applying the compressive force to the first base member and the second base member is in the range of 5 to 180 minutes.
5. The method as claimed in claim 1, wherein in the applying process of the compressive force, the first bonding film and the second bonding film are heated.
6. The method as claimed in claim 5, wherein a temperature of heating the first bonding film and the second bonding film is in the range of 75 to 200\xb0 C.
7. The method as claimed in claim 1, wherein in the applying process of the compressive force, when the compressive force to be applied to the first base member and the second base member is 50 MPa, a time of applying the compressive force to the first base member and the second base member is defined as \u201cY\u201d minutes, a temperature of heating the first bonding film and the second bonding film is defined as \u201cT\u201d K, and a gas constant is defined as \u201cR\u201d J(mol\xb7K), the following relation is satisfied: 1Y\u22671.35\xd7109 exp \u221282\xd7103RT.
8. The method as claimed in claim 1, wherein the applying process of the compressive force is carried out in an air atmosphere.
9. The bonding method as claimed in claim 1, wherein an amount of the copper contained in each of the first bonding film and the second bonding film is 99 atom % or higher at a atomic ratio.
10. The bonding method as claimed in claim 1, wherein the forming processes of the first bonding film and the second bonding film are carried out by using a metal organic chemical vapor deposition method in which an organic metal material constituted of copper and the organic component is used as a raw material.
11. The method as claimed in claim 10, wherein the organic metal material includes an organic copper complex.
12. The method as claimed in claim 10, wherein a part of the organic component constituting the organic metal material remains in the first bonding film and the second bonding film as an impurity.
13. The method as claimed in claim 1, wherein an average thickness of each of the first bonding film and the second bonding film is in the range of 1 to 1,000 nm.
14. The method as claimed in claim 1, wherein each of the first base member and the second base member has a plate shape.
15. The method as claimed in claim 1, wherein the first base member and the second base member have a region on which the first bonding film and the second bonding film are formed, respectively, and at least the region of each of the first base member and the second base member is constituted of a silicon material, a metal material or a glass material as a main component thereof.
16. The method as claimed in claim 1, wherein the first base member and the second base member have a surface on which the first bonding film and the second bonding film are formed, respectively, and the surface of each of the first base member and the second base member is preliminarily subjected to a surface treatment to improve bonding strength between the first base member and the first bonding film and bonding strength between the second base member and the second bonding film.
17. The method as claimed in claim 16, wherein the surface treatment is a plasma treatment.
18. The method as claimed in claim 1, wherein the bonded body is further comprised of intermediate layers, and the intermediate layers are formed between the first base member and the first bonding film and between the second base member and the second bonding film, respectively.
19. The method as claimed in claim 18, wherein the intermediate layers are constituted of an oxide-based material as a main component thereof.
20. A bonded body formed by the method defined in claim 1.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A system for signal processing, the system comprising:
one or more circuits comprising an integrated amplifier, said one or more circuits being configurable such that:
in a first configuration, said one or more circuits are operable to process a differential input signal; and
in a second configuration, said one or more circuits are operable to process a single-ended input signal.
2. The system according to claim 1, wherein said one or more circuits output a differential signal when processing said differential input signal and when processing said single-ended input signal.
3. The system according to claim 1, wherein a voltage applied to a bias point of said one or more circuits comprises a first voltage for said first configuration and comprises a second voltage for said second configuration.
4. The system according to claim 1, wherein an inductance between an input of said integrated amplifier and a reference point comprises a first inductance for said first configuration and comprises a second inductance for said second configuration.
5. The system according to claim 4, wherein said inductance comprises the inductance of a bond wire which communicatively couples said integrated amplifier to an integrated circuit package.
6. The system according to claim 4, wherein said inductance is fabricated on a common substrate with said integrated amplifier.
7. The system according to claim 1, wherein a first bias voltage and a second bias voltage are available to said one or more circuits, and said first bias voltage is different than said second bias voltage.
8. The system according to claim 7, wherein, for said first configuration, a first input terminal of said integrated amplifier is communicatively coupled to a reference voltage via an inductance and a bias point of said integrated amplifier is communicatively coupled to said first bias voltage.
9. The system according to claim 7, wherein, for said second configuration, a first input terminal and a second input terminal of said integrated amplifier are communicatively coupled to said differential input signal and a bias point of said integrated amplifier is communicatively coupled to said second bias voltage.
10. The system according to claim 1, wherein said circuits comprise a center-tapped differential inductor that is coupled to an output terminal of said integrated amplifier.
11. A system for signal processing, the system comprising:
one or more circuits comprising an integrated amplifier, said one or more circuits being configurable to handle a single-ended or differential input signal, wherein:
for handling said single-ended input signal, a first input terminal of said integrated amplifier is communicatively coupled to a reference voltage via an inductance and a bias point of said integrated amplifier is communicatively coupled to a first bias voltage.
12. The system according to claim 11, wherein said one or more circuits output a differential signal when handling said differential input signal and when handling said single-ended input signal.
13. The system according to claim 11, wherein, for handling said differential input signal, said first input terminal of said integrated amplifier is communicatively coupled to said differential input signal and a bias point is communicatively coupled to a second bias voltage.
14. The system according to claim 13, wherein said reference voltage is zero volts DC, said first bias voltage is zero volts DC, and said second bias voltage is a non-zero voltage.
15. A system for signal processing, the system comprising:
one or more circuits comprising an integrated amplifier, said one or more circuits being configurable to process a differential or single-ended input signal, wherein:
for processing said differential input signal, a first input terminal and a second input terminal of said integrated amplifier are communicatively coupled to said differential input signal and a bias point is communicatively coupled to a first bias voltage.
16. The system according to claim 15, wherein said one or more circuits output a balanced signal when handling said differential input signal and when handling said single-ended input signal.
17. The system according to claim 15, wherein, for handling said single-ended input signal, a first input terminal of said integrated amplifier is communicatively coupled to ground via an inductance and a bias point of said integrated amplifier is communicatively coupled to a second bias voltage.
18. The system according to claim 17, wherein said reference voltage is zero volts DC, said first bias voltage is zero volts DC, and said second bias voltage is a non-zero DC voltage.
19. A system for signal processing, the system comprising:
one or more circuits comprising an integrated amplifier, said one or more circuits being configurable to handle differential or single-ended input signals, wherein whether said one or more circuits are operable to handle differential input signals or single-ended input signals is based on an inductance of a bond wire coupling said integrated amplifier to an integrated circuit package.
20. The system according to claim 19, wherein:
said bond wire is of a first length in instances that said one or more circuits are to handle differential input signals; and
said bond wire is a second length in instances that said one or more circuits are to handle single-ended input signals.