1461120519-de30c1b7-c2ea-43eb-a2b0-e62c4db4d48c

1. A recording medium, comprising:
a user data area where user data is stored;
at least one spare area for replacement of defective units of the user data area; and
a defect management information area where defect management information for a defective unit of the user data area is stored, wherein the defect management information includes information representing whether replacement or non-replacement of the defective unit by linear replacement is required, wherein if the defect management information indicates that the defective unit is not to be replaced by linear replacement then the defective unit is not replaced even if the defective unit was previously designated for linear replacement.
2. The recording medium as claimed in claim 1, wherein a flag, representing that a linear replacement of the recording medium has been performed, is stored as a reserved bit of a secondary defect list (SDL) of the recording medium.
3. The recording medium as claimed in claim 1, wherein a flag, representing that a linear replacement of a recording medium has not been performed, is stored as a set bit of a secondary defect list (SDL) of the recording medium.
4. The recording medium of claim 1, wherein information representing replacement of the defective unit includes positions of the defective unit and a corresponding replacement unit.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A Method of collaboration among various parties to build an emergency response plan for a property, the method comprising:
receiving, at a server, structural information provided by manager of said property;
using said structural information by tenant of said property to provide to said server occupant information referenced with respect to said structured information; and
using said structural information and said occupant information by emergency respondents to provide to said server emergency response plan data referenced with respect to at least one of said structural information and said occupant information.
2. The method as claimed in claim 1, further comprising a step of receiving an emergency response plan provided by said manager of said property with respect to expertise of said manager of said property and a step of approving or rejecting, by said emergency respondents, said emergency response plan provided by said manager of said property.
3. The method as claimed in claim 1, further comprising a step of receiving an emergency response plan provided by said tenant of said property with respect to expertise of said tenant of said property and a step of approving or rejecting, by said emergency respondents, said emergency response plan provided by said tenant of said property.
4. The method as claimed in claim 1, further comprising a step of adding on the server comments referenced with respect to at least one of said structural information, said occupant information and said emergency response plan data and sharing these comments among various parties who have access to the server.
5. The method as claimed in claim 4, wherein said comments added on the server are provided by an insurance company.

1461120509-e7bf2fb1-7b98-44d8-b225-f5c726852844

1. A flip chip packaging structure comprising:
a semiconductor chip;
a substrate;
a first bonding pad provided on a surface of the semiconductor chip;
a second bonding pad provided on the substrate;
a passivation film formed to cover the first bonding pad such that a plurality of apertures are opened on the passivation film so as to expose a plurality of portions of said first bonding pad through the apertures, respectively;
a plurality of first bumps, respectively, disposed on the portions of the first bonding pad through the apertures such that the first bumps are spaced apart from one another so as to form a clearance space;
a second bump disposed on the second bonding pad and bonded to the first bumps such that the second bump enters into the clearance space so as to form a three-dimensional bonding boundary surface between the second bump and the plurality of first bumps bonded to each other, wherein the first and second bonding pads are electrically and mechanically connected with each other through the first and second bumps.
2. The flip chip packaging structure in accordance with claim 1, wherein said first bumps disposed on the first bonding pad of said semiconductor chip are formed by plating.
3. The flip chip packaging structure in accordance with claim 1, wherein said second bump disposed on the second bonding pad of said substrate is a stud bump formed by anchoring a gold ball formed with the discharge onto said second bonding pad provided on said substrate.
4. The flip chip packaging structure in accordance with claim 1, wherein said semiconductor chip is faced down when it is mounted, and then heat and pressure are added to the second bump to cause said second bump to plastically deform and then enter into said clearance space of said first bumps.
5. The flip chip packaging structure in accordance with claim 1, wherein said semiconductor chip is faced dawn when it is mounted, and then heat, pressure, and ultrasonic vibration are added to the second bump to cause said second bump to plastically deform and then enter into said clearance of said first bumps.
6. The flip chip packaging structure in accordance with claim 1, further comprising:
an underfill member filling an open space intervening between said semiconductor chip and said substrate.
7. The flip chip packaging structure in accordance with claim 1, wherein said substrate is a circuit substrate.
8. The flip chip packaging structure in accordance with claim 1, wherein said substrate is an interposer substrate of a semiconductor package.
9. The flip chip packaging structure in accordance with claim 1, wherein the second bump has a tapered projection entered into the clearance space of the first bumps, and the tapered projection of the second bump is narrowed along a direction from the substrate to the semiconductor chip.
10. The flip chip packaging structure in accordance with claim 1, wherein the first bumps have a plurality of side walls facing the clearance space, and the side walls of the first bumps define a part of the three-dimensional bonding boundary surface.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. An interchangeable lens that can be detachably fitted to a camera body, the interchangeable lens comprising:
a clock signal reception unit that receives a clock signal outputted from the camera body;
a control command reception unit that receives a control command and data signal from the camera body, the control command and data signal being in synchrony with the clock signal, specifying a control command for the interchangeable lens and including type data specifying a type of the control command;
a response generation unit that generates a response data signal including the type data based on the control command and data signal that has been received; and
a response transmission unit that transmits the response data signal to the camera body while the control command reception unit is receiving the control command and data signal from the camera body in a next communication cycle in synchrony with the clock signal received by the clock signal reception unit, wherein
if the control command and data signal is normally received, the response generation unit generates the response data including the type data based on the type data in the normally received control command and data signal, and if the control command and data signal is not normally received, the response generation unit holds the response data that has been generated based on the normally received control command and data signal in a previous communication cycle.
2. The interchangeable lens according to claim 1, further comprising:
an anomaly detection unit that detects if the control command and data signal received by the control command reception unit is anomalous; wherein
if an anomaly has been detected by the anomaly detection unit in the control command and data signal that was received by the control command reception unit in an immediately previous communication cycle, the response generation unit generates the response data signal including anomaly data that specifies the anomaly, instead of the type data that was received in the immediately previous communication cycle.
3. The interchangeable lens according to claim 2, wherein:
two of the control command and data signals that are received successively by the control command reception unit are configured to have non-coinciding type data; and
the anomaly data is the type data received by the control command reception unit during the communication cycle immediately previous to the immediately previous communication cycle.
4. The interchangeable lens according to claim 1, further comprising:
a control unit that performs predetermined control based on the received control command and data signal; wherein
the response data signal includes control result data that specifies a result of control performed by the control unit based on the control command and data received by the control command reception unit during the immediately previous communication cycle.
5. The interchangeable lens according to claim 1, wherein:
if the control command reception unit sequentially receives a plurality of the control command and data signals, the response generation unit generates a final response data signal including the type data specifying the type of a final control command and data signal among the plurality of control command and data signals; and
the response transmission unit transmits the final response data signal to the camera body, in response to the clock signal received by the clock signal reception unit after the response generation unit has generated the final response data.
6. The interchangeable lens according to claim 1, wherein
if the control command reception unit sequentially receives a plurality of the control command and data signals, the response generation unit does not perform generation of a response data signal based on the type data specifying the type of the final control command and data signal among the plurality of control command and data signals.
7. A camera body to which is fitted the interchangeable lens according to claim 1, comprising:
a clock signal reception unit that transmits the clock signal to the interchangeable lens;
a control command transmission unit that transmits the control command and data signal to the interchangeable lens in synchrony with the clock signal;
a response reception unit that receives the response data signal from the interchangeable lens in synchrony with the clock signal; and
a decision unit that, based on the response data signal received by the response reception unit, makes a decision as to whether or not the control command and data signal that was transmitted by the control command transmission unit during the previous communication cycle was received normally.
8. The camera body according to claim 7, wherein
if the decision unit decides that the control command and data signal that was transmitted by the control command transmission unit during the previous communication cycle was not received normally, the control command transmission unit transmits the control command and data signal to the interchangeable lens again.
9. The camera body according to claim 7, wherein
if the control command transmission unit sequentially transmits a plurality of the control command and data signals to the interchangeable lens, the clock signal transmission unit transmits a clock signal to the interchangeable lens for receiving the response data after the transmission of the final control command and data signal of the plurality of control command and data signals.