1461120022-e61c0601-226a-4bc0-9ccb-53dcfb3b69f9

1-20. (canceled)
21. An apparatus comprising:
a plurality of electrodes disposed as a matrix below a touch surface;
a shield electrode; and
a capacitance-sensing circuit to measure capacitances of the plurality of electrodes to detect a conductive object in contact with the touch surface or above the touch surface, wherein the capacitance-sensing circuit is configured to measure a self-capacitance of a first electrode of the plurality of electrodes while driving the shield electrode with a shield signal, the shield signal being the same electrical potential as the plurality of electrodes, and wherein the capacitance-sensing circuit is further configured to drive a second electrode of the plurality of electrodes as a barrier electrode to increase a detection distance from the touch surface to detect a conductive object above the touch surface.
22. The apparatus of claim 21, wherein the capacitance-sensing circuit comprises:
a sensing channel to selectively couple to one or more of the plurality of electrodes; and
an analog-to-digital converter (ADC) coupled to the sensing channel, the ADC to convert the capacitances to digital values.
23. The apparatus of claim 22, further comprising
processing logic coupled to the ADC, the processing logic to detect a proximity event of a conductive object based on the digital values.
24. The apparatus of claim 21, wherein the capacitance-sensing circuit further comprises:
a signal source to provide the shield signal; and
a signal generator to generate an excitation signal, wherein the capacitance-sensing circuit is further configured to drive the second electrode as the barrier electrode with the excitation signal.
25. The apparatus of claim 24, wherein the shield signal is synchronized to the excitation signal.
26. The apparatus of claim 24, wherein the shield signal is less than 5 volts and the excitation signal is greater than 5 volts.
27. The apparatus of claim 22, wherein the capacitance-sensing circuit further comprises:
a signal source to provide the shield signal;
a signal generator to generate an excitation signal; and
a multiplexer coupled to the plurality of electrodes, the signal generator, the signal source, and the sensing channel.
28. The apparatus of claim 21, wherein the plurality of electrodes form a touch area, and wherein the barrier electrode is a first edge electrode within the touch area.
29. The apparatus of claim 21, wherein the plurality of electrodes form a touch area, wherein the capacitance-sensing circuit is further configured to drive two of the plurality of electrodes as a first barrier electrode and a second barrier electrode, and wherein the first barrier electrode is a first edge electrode within the touch area and the second barrier electrode is a second edge electrode within the touch area.
30. The apparatus of claim 21, wherein the capacitance-sensing circuit is configured to measure the self-capacitance of the first electrode in a self-capacitance mode, and wherein the capacitance-sensing circuit is configured to measure a mutual capacitance between at least two of the plurality of electrodes in a mutual capacitance mode.
31. The apparatus of claim 30, further comprising
processing logic coupled to the ADC, the processing logic to detect a proximity event of a conductive object in the self-capacitance mode and to detect a touch event of one or more conductive objects on the touch surface in the mutual capacitance mode.
32. A method comprising:
measuring a self-capacitance of a first electrode of a plurality of electrodes of a matrix disposed below a touch surface to detect a conductive object in contact with the touch surface or above the touch surface;
while measuring the self-capacitance of the first electrode, driving a shield electrode with a shield signal, the shield signal being the same electrical potential as the plurality of electrodes; and
driving a second electrode of the plurality of electrodes as a barrier electrode to increase a detection distance from the touch surface to detect a conductive object above the touch surface.
33. The method of claim 32, further comprising converting the capacitances to digital values using a an analog-to-digital converter (ADC).
34. The method of claim 33, further comprising detecting a proximity event of a conductive object based on the digital values.
35. The method of claim 32, wherein the driving the second electrode as the barrier electrode comprises driving the second electrode with an excitation signal that is synchronized with the shield signal, the excitation signal being greater than the shield signal.
36. The method of claim 31, further comprising measuring a mutual capacitance between at least two of the plurality of electrodes in a mutual capacitance mode, and wherein the self-capacitance is measured in a self-capacitance mode.
37. A processing device comprising:
a capacitance-sensing circuit;
a first pin coupled to a shield signal source;
a plurality of pins coupled to the capacitance-sensing circuit, wherein the capacitance-sensing circuit is configured to measure a self-capacitance of a second pin of the plurality of pins while driving the first pin with a shield signal, the shield signal being the same electrical potential as the plurality of pins, and wherein the capacitance-sensing circuit is further configured to drive a third pin of the plurality of pins with an excitation signal; and
processing logic to detect a proximity event of a conductive object based on the self-capacitance, wherein the excitation signal increase a detection distance for detecting the proximity event.
38. The processing device of claim 37, wherein the capacitance-sensing circuit comprises:
a sensing channel to selectively couple to one or more of the plurality of pins; and
an analog-to-digital converter (ADC) coupled to the sensing channel, the ADC to convert the self-capacitance to a digital value.
39. The processing device of claim 37, wherein the capacitance-sensing circuit further comprises:
a signal source to provide the shield signal; and
a signal generator to generate the excitation signal.
40. The processing device of claim 37, wherein the shield signal is less than 5 volts and the excitation signal is greater than 5 volts.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A Schottky barrier diode, comprising
a substrate;
a buffer layer, formed on the substrate;
an upper layer, formed on the buffer layer;
a first electrode layer, formed on the upper layer as an anode of the Schottky barrier diode;
a second electrode layer, formed on the upper layer as a cathode of the Schottky barrier diode;
a first n-type doping region, formed in the upper layer and under the first electrode layer, and contacting the first electrode layer;
wherein an edge of the first n-type doping region and an edge of the first electrode layer are separated by a first predetermined distance at a first direction at which the first electrode layer faces the second electrode layer.
2. The Schottky barrier diode as claimed in claim 1, further comprising a second n-type doping region formed in the upper layer and under the second electrode layer, and contacting the second electrode layer;
wherein an edge of the second n-type doping region is extended from the edge of the second electrode layer toward the first electrode layer for a second predetermined distance, the direction of the extension is parallel to the first direction, and the second n-type doping region does not contact the first electrode layer.
3. The Schottky barrier diode as claimed in claim 1, wherein the upper layer further comprises a barrier layer and a channel layer, the channel layer is formed on the buffer layer, the barrier layer is formed on the buffer layer, the first electrode layer and the second electrode layer are formed on the barrier layer, and the first n-type doping region is formed in the barrier layer and under the first electrode layer.
4. The Schottky barrier diode as claimed in claim 1, wherein the upper layer further comprises a barrier layer and a channel layer, the first electrode layer, the second electrode layer and the barrier layer are formed on the channel layer and the barrier layer is formed between the first electrode layer and the second electrode layer, and the first n-type doping region is formed in the channel layer and under the first electrode layer.
5. The Schottky barrier diode as claimed in claim 3, further comprising a second n-type doping region formed in the barrier layer and under the second electrode layer, and contacting the second electrode layer;
wherein, an edge of the second n-type doping region is extended from an edge of the second electrode layer toward the first electrode layer for a second predetermined distance, the direction of the extension is parallel to the first direction, and the second n-type doping region does not contact the first electrode layer.
6. The Schottky barrier diode as claimed in claim 4, further comprising a second n-type doping region formed in the channel layer and beneath the second electrode layer, and contacting the second electrode layer;
wherein, an edge of the second n-type doping region is extended from an edge of the second electrode layer toward the first electrode layer for a second predetermined distance, the direction of the extension is parallel to the first direction, and the second n-type doping region does not contact the first electrode layer.
7. The Schottky barrier diode as claimed in claim 2, wherein the edge of the first electrode layer and the edge of the second electrode layer are separated by a third predetermined distance in the first direction.
8. The Schottky barrier diode as claimed in claim 3, wherein the first n-type doping region is extended downward to the channel layer.
9. The Schottky barrier diode as claimed in claim 3, wherein the barrier layer is metal nitride, and the metal of the metal nitride comprises Ga, In, Al, or a combination thereof.

1461120013-b6e0c9ed-c1ec-40e9-886b-90d54cbb5a2c

1. A method comprising:
receiving a work plan comprising at least one work item to a mobile terminal, wherein the at least one work item includes an initial location of at least one identification device;
reading identification information contained on the identification device with the mobile terminal;
identifying a deployed location of the at least one identification device; and
providing the identification information and the corresponding deployed location that are associated with the identification device to permit the work plan to be updated.
2. The method according to claim 1, wherein providing the identification information and the corresponding deployed location comprises transmitting the identification information and corresponding deployed location to a network entity for updating the work plan.
3. The method according to claim 1, wherein identifying a deployed location of the at least one identification device comprises receiving user input of the location of the mobile terminal.
4. The method according to claim 1, wherein identifying a deployed location of the at least one identification device comprises determining a location of the mobile terminal with a location device residing on the mobile terminal.
5. The method according to claim 4, further comprising defining a deployed location of at least one identification device in the work plan according to the location of the mobile terminal prior to reading the identification information.
6. The method according to claim 5, further comprising allowing a user to select at least one work item within the work plan based on the deployed location of the at least one identification device defined by the location of the mobile terminal prior to reading the identification information.
7. The method according to claim 4, wherein identifying a deployed location of the at least one identification device comprises defining the deployed location of the identification device according to the location of the mobile terminal.
8. The method according to claim 7, further comprising displaying the defined deployed location of the identification device on the mobile terminal.
9. The method according to claim 7, wherein reading the identification information occurs approximately simultaneously with defining a deployed location of the at least one identification device according to the location of the mobile terminal.
10. The method according to claim 1, further comprising attaching the at least one identification device to a physical location associated with a work item.
11. The method according to claim 1, further comprising storing the identification information and the corresponding deployed location with the mobile terminal.
12. A computer program product comprising a computer-readable medium containing computer-readable program instructions comprising:
a first executable portion to receive a work plan comprising at least one work item at the mobile terminal, wherein the at least one work item includes an initial location of at least one identification device;
a second executable portion to read identification information contained on the identification device with the mobile terminal;
a third executable portion to identify a deployed location of the at least one identification device; and
a fourth executable portion to provide the identification information and the corresponding deployed location that are associated with the identification device to permit the work plan to be updated.
13. The computer program product according to claim 12, wherein the fourth executable portion is further configured to transmit the identification information and corresponding deployed location to a network entity for updating the work plan.
14. The computer program product according to claim 12, wherein the third executable portion is further configured to receive user input of the location of the mobile terminal.
15. The computer program product according to claim 12, wherein the third executable portion is further configured to determine a location of the mobile terminal with a location device residing on the mobile terminal.
16. The computer program product according to claim 15, further comprising a fifth executable portion for defining a deployed location of at least one identification device in the work plan according to the location of the mobile terminal prior to reading the identification information.
17. The computer program product according to claim 15, wherein the third executable portion is further configured to define the deployed location of the identification device according to the location of the mobile terminal.
18. The computer program product according to claim 17, further comprising a fifth executable portion to display the defined deployed location of the identification device on the mobile terminal.
19. The computer program product according to claim 17, wherein the second executable portion is further configured to read the identification information approximately simultaneously with defining the deployed location of the at least one identification device according to the location of the mobile terminal.
20. The computer program product according to claim 12, further comprising a fifth executable portion to store the identification information and the corresponding deployed location.
21. A mobile terminal comprising:
a receiver configured to receive a work plan comprising at least one work item including an initial location of at least one identification device;
a reader configured to read identification information contained on the at least one identification device; and
a processor configured to receive the work plan from the receiver and the identification information from the reader, the processor also configured to receive a deployed location of the at least one identification device to permit the work plan to be updated.
22. The mobile terminal according to claim 21, further comprising a user interface configured to allow a user to provide the deployed location of the at least one identification device.
23. The mobile terminal according to claim 21, further comprising a location device configured to provide a location of the reader, wherein the processor is further configured to interpret the location of the reader as the deployed location of the at least one identification device.
24. The mobile terminal according to claim 23, wherein the location device comprising a global positioning system.
25. The mobile terminal according to claim 21, further comprising a display configured to display the deployed location of the at least one identification device and associated identification information.
26. The mobile terminal according to claim 21, further comprising a memory configured to store the deployed location of the at least one identification device and associated identification information.
27. A system comprising:
a processor configured to receive a work plan comprising at least one work item including an initial location of at least one identification device, the processor also configured to receive: (i) identification information contained on the at least one identification device and (ii) a deployed location of the at least one identification device to permit the work plan to be updated; and
a network entity configured to receive the identification information and deployed location to permit the work plan to be updated.
28. A system according to claim 27, wherein the processor is further configured to transmit the identification information and the deployed location of the at least one identification device to the network entity to permit the work plan to be updated.
29. A system according to claim 27, wherein the processor is further configured to update the work plan based upon the identification information and the deployed location of the at least one identification device.
30. A system according to claim 27, wherein the processor is further configured to receive the deployed location from a user interface.
31. A system according to claim 27, wherein the processor is further configured to receive the deployed location from a location device.
32. A system comprising:
means for receiving a work plan comprising at least one work item, wherein the at least one work item includes an initial location of at least one identification device;
means for reading identification information contained on the identification device;
means for identifying a deployed location of the at least one identification device; and
means for providing the identification information and the corresponding deployed location that are associated with the identification device to permit the work plan to be updated.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A semiconductor device, comprising:
a thin film transistor formed on a first insulating surface of a substrate;
a diamond-like carbon film formed on a second insulating surface of the substrate;
a wiring electrically connected to the thin film transistor; and
a pixel electrode formed over the wiring,
wherein the first insulating surface is opposite to the second insulating surface.
2. A semiconductor device according to claim 1, wherein the substrate is a quartz substrate.
3. A device according to claim 1, wherein the diamond like carbon film has a specific resistance of 107 to 1014 \u03a9cm.
4. A device according to claim 1, wherein said semiconductor device is an active matrix type display device having a pixel region and a driver region on the substrate.
5. A device according to claim 1, wherein said semiconductor device is selected from the group consisting of a personal computer, a video camera, a mobile computer, a goggles-type display, a player apparatus having a recording medium, a digital camera, a front type projector, and a rear type projector.
6. A device according claim 1, further comprising a buffer layer having at least one of silicon, silicon carbide, and silicon nitride.
7. A device according claim 1, further comprising a buffer layer having a thickness of 80 to 200 nm.
8. An electronic device comprising:
a thin film transistor formed on a first insulating surface of the substrate;
a diamond-like carbon film formed on a second insulating surface of the substrate:
a wiring electrically connected to the thin film transister; and
a pixel electrode formed over the wiring,
wherein the first insulating surface is opposite to the second insulating surface.
9. A device according to claim 8, wherein the substrate is a quartz substrate.
10. A device according to claim 8, wherein the diamond-like carbon film has a specific resistance of 107 to 1014 \u03a9cm.
11. A device according to claim 8, wherein said electronic device is selected from the group consisting of a personal computer, a video camera, a mobile computer, a goggles-type display, a player apparatus comprising a recording medium, a digital camera, a front type projector, and a rear type projector.
12. A semiconductor device, comprising:
a diamond-like carbon film;
a substrate over the diamond like carbon film; and
a logic circuit comprising a transistor formed over the substrate.
13. A semiconductor device according to claim 12, wherein the substrate is a quartz substrate.
14. A device according to claim 12, wherein the diamond-like carbon film has a specific resistance of 107 to 1014 \u03a9cm.
15. A device according to claim 12, wherein said semiconductor device is an active matrix type display device having a pixel region and a driver region on the substrate.
16. A device according to claim 12, wherein said semiconductor device is selected from the group consisting of a personal computer, a video camera, a mobile computer, a goggles-type display, a player apparatus having a recording medium, a digital camera, a front type projector, and a rear type projector.
17. A semiconductor device according to claim 12, wherein the logic circuit is a signal processing circuit.
18. A semiconductor device according to claim 17, wherein the signal processing circuit comprises at least one selected from the group consisting of an AD converter circuit, a \u03b3-correction circuit, and a memory circuit.
19. A semiconductor device according to claim 12, wherein the logic circuit is a computation processing circuit.