Author: claimsbot

1. A method for packaging a semiconductor chip, comprising:
fabricating a semiconductor chip having an active surface and a non-active surface;
applying an adhesive material in direct contact with the non-active surface of the chip;
applying an adhesive tape over the adhesive material adjacent the non-active surface of the semiconductor chip so that the adhesive material is provided between the non-active surface and the adhesive tape; and
positioning the semiconductor chip onto a plurality of contacts, each of the contacts having a first end of varying lengths relative to one another, such that the adhesive tape adjacent the non-active surface of the semiconductor chip is in contact with the plurality of contacts, the varying lengths of the plurality of contacts providing support surfaces for the semiconductor chip, whereby the plurality of contacts entirely support the semiconductor chip without the use of a die attach pad.
2. The method of claim 1, wherein applying the adhesive material further comprises applying a non-conductive epoxy.
3. The method of claim 1, wherein applying the adhesive material further comprises applying a conductive epoxy.
4. The method of claim 1, wherein applying the adhesive material further comprises applying a silver resin.
5. The method of claim 1, wherein applying the adhesive material further comprises applying a double-stick die adhesive film to the non-active surface of the semiconductor device.
6. The method of claim 1, wherein the contacts are leads.
7. The method of claim 1, further comprising etching a first surface of the leads.
8. The method of claim 7, further comprising a second surface of the leads.
9. The method of claim 1, further comprising forming electrical contacts between the plurality of contacts and the active surface of the semiconductor chip and encapsulating the semiconductor chip in an encapsulating material.
10. A method comprising:
providing one or more leads, the one or more leads each having a first end of varying lengths with respect to one another;
providing a semiconductor chip having an active surface and a non-active surface, the non-active surface of the semiconductor chip being supported by the varying lengths of the first ends of the one or more leads respectively;
applying an adhesive material onto and in direct contact with the non-active surface of the semiconductor chip; and
attaching an adhesive tape to the adhesive material, the adhesive tape acting to adhere the semiconductor chip onto the one or more leads, whereby the semiconductor chip is entirely supported on the one or more leads without a die attach pad.
11. The method of claim 10, wherein applying the adhesive material further comprises applying a non-conductive epoxy.
12. The method of claim 10, wherein applying the adhesive material further comprises applying a conductive epoxy.
13. The method of claim 10, wherein applying the adhesive material further comprises applying a silver resin.
14. The method of claim 10, wherein applying the adhesive material further comprises applying a double-stick die attach film.
15. The method of claim 10, further comprising etching a first surface of the leads.
16. The method of claim 15, further comprising etching a second surface of the leads.
17. The method of claim 10, further comprising forming electrical connections between the leads and contacts on the active surface of the semiconductor chip.
18. The method of claim 10, further comprising encapsulating the semiconductor chip and a portion of the leads so that the non-encapsulated portion of the leads are exposed.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method of impregnation treatment for foods comprising an impregnation step to impregnate foods with a liquid component or a gas component by contacting the foods with the liquid component or the gas component after a vacuum treatment or in a vacuum state andor cooling the foods in contact with the liquid component.
2. The method of impregnation treatment for foods as claimed in claim 1, wherein the impregnation step is a step in which the foods are vacuum treated, contacted with the liquid component in a maintained vacuum state and subjected to pressurization.
3. The method of impregnation treatment for foods as claimed in claim 1, wherein the impregnation step is a step in which the foods are contacted with the liquid component, vacuum treated and subjected to pressurization.
4. The method of impregnation treatment for foods as claimed in claim 1, wherein the impregnation step is a step in which the foods are vacuum treated and subjected to pressurization with the impregnating gas component.
5. The method of impregnation treatment for foods as claimed in any one of claims 1 to 4, wherein the liquid component or the gas component contains a food additive component.
6. The method of impregnation treatment for foods as claimed in any one of claims 1 to 5, wherein the pressure in the vacuum treatment or in the vacuum state ranges from 10 to 50,000 Pa.
7. The method of impregnation treatment for foods as claimed in any one of claims 1 to 6, wherein the impregnation step is conducted under a temperature condition of 20 to 180 C.
8. The method of impregnation treatment for foods as claimed in any one of claims 1 to 7, wherein the impregnation step is conducted with the use of a vacuum impregnating apparatus or a vacuum-pressure impregnating apparatus.
9. The method of impregnation treatment for foods as claimed in any one of claims 1 to 8, wherein an ultrasonic treatment is performed during the impregnation treatment.
10. The method of impregnation treatment for foods as claimed in any one of claims 1 to 9, wherein a microwave irradiation treatment is performed during the impregnation treatment.
11. The method of impregnation treatment for foods as claimed in any one of claims 1 to 10, wherein the foods are selected from among cereals, meats, fishes, eggs, vegetables, fruits and processed foods.
12. The method of impregnation treatment for foods as claimed in claim 11, wherein the foods are eggs.
13. The method of impregnation treatment for foods as claimed in claim 12, wherein the eggs are unshelled eggs.
14. The method of impregnation treatment for foods as claimed in claim 12 or 13, wherein the impregnation step is a step in which the eggs are contacted with a liquid component containing vitamin C or a derivative thereof to be impregnated with the vitamin C or the derivative thereof in an amount of 1 to 3,000 mg per 100 g of edible egg portions.
15. The method of impregnation treatment for foods as claimed in claim 14, wherein the contact of the eggs with the liquid component containing vitamin C or a derivative thereof is conducted at 5 to 130 C.
16. The method of impregnation treatment for foods as claimed in claim 14, wherein the contact of the eggs with the liquid component containing vitamin C or a derivative thereof is conducted at 0 to 55 C.
17. The method of impregnation treatment for foods as claimed in claim 14, wherein the liquid component contains vitamin C or a derivative thereof, and other food additive component.
18. A vitamin C-containing egg obtained by the method of impregnation treatment for foods as claimed in any one of claims 14 to 17.
19. The method of impregnation treatment for foods as claimed in claim 13, wherein the impregnation step is a step in which the eggs are contacted with a liquid component containing an alkali component to be impregnated in edible portions thereof with the liquid component.
20. The method of impregnation treatment for foods as claimed in claim 19, wherein the liquid component has pH of 12 to 15.
21. The method of impregnation treatment for foods as claimed in claim 19 or 20, wherein the liquid component contains an alkali component and a food additive component other than the alkali component.
22. The method of impregnation treatment for foods as claimed in any one of claims 19 to 21, wherein the impregnation step is a step in which the eggs are impregnated with the liquid component in an amount of 1 to 3,000 mg per 100 g of edible egg portions.
23. The method of impregnation treatment for foods as claimed in any one of claims 19 to 22, further comprising a heating step to heat the eggs after the impregnation step.
24. A pidan-like egg that has a transparent or translucent, gelled albumen, said pidan-like egg obtained by the method of impregnation treatment for foods as claimed in any one of claims 19 to 23.

1. A network interface device for connection between a host data processing device supporting a consumer process and a network, the network interface device comprising:
a data bus interface;
a controller for supporting communication with a host data processing device over the data bus interface; and
a packet capture unit located between the controller and the network and comprising:
a packet inspector configured to parse incoming data packets so as to identify data packets belonging to a first data flow;
a duplication engine configured to generate a duplicate data flow from the first data flow; and
a packet capture engine configured to process said duplicate data flow into a packet capture data stream having a predefined format;

wherein the network interface device is configured to cause:
the first data flow to be made available to a consumer process of a host data processing device to which the network interface device is connected; and
the processed packet capture data stream to be stored at a packet capture buffer.
2. The network interface device as claimed in claim 1, wherein the packet capture buffer is supported at the network interface device.
3. The network interface device as claimed in claim 1, wherein the controller is arranged to make available the first data flow to a consumer process by:
identifying an endpoint representing a corresponding consumer process accessible over the data bus interface; and
delivering over the data bus interface data of the first data flow addressed to said identified endpoint.
4. The network interface device as claimed in claim 1, wherein the packet capture unit is arranged to make available the processed packet capture data to the controller for delivery to an endpoint accessible over the data bus interface.
5. The network interface device as claimed in claim 4, wherein the processed packet capture data is assigned a lower priority than data of the first data flow and the controller is configured to enforce a quality of service protocol such that the processed packet capture data is delivered over the data bus interface between data of the first data flow.
6. The network interface device as claimed in claim 4, wherein the controller is configured to deliver data of the first data flow over the data bus interface when the data bus interface is otherwise quiescent.
7. The network interface device as claimed in claim 1, further comprising interconnect logic for connection to a storage subsystem, the packet capture unit being configured to deliver the processed packet capture data stream to the interconnect logic for storage at the storage subsystem, the data path between the packet capture unit and the interconnect logic not including the controller.
8. The network interface device as claimed in claim 1, wherein the packet capture unit is arranged to deliver the processed packet capture data stream onto the network over a data path that does not include the controller.
9. The network interface device as claimed in claim 8, wherein the processed packet capture data is assigned a lower priority than data of the first data flow and the packet capture unit is configured to enforce a quality of service protocol such that the processed packet capture data is delivered onto the network between data of any outgoing data flows.
10. The network interface device as claimed in claim 1, wherein the packet capture unit further comprises a data store including one or more triggers, the packet inspector being configured to parse incoming data packets by matching said one or more triggers to each received data packet so as to identify data packets belonging to the first data flow.
11. The network interface device as claimed in claim 10, wherein the one or more triggers include a regular expression over at least a portion of incoming data packets.
12. The network interface device as claimed in claim 1, further comprising timestamping apparatus configured to, on each data packet of the first data flow being received at the network interface device, generate a timestamp, each such timestamp being included in the processed packet capture data stream by the packet capture engine.
13. The network interface device as claimed in claim 1, wherein the processing of said duplicate data flow into a packet capture data stream by the packet capture engine includes performing data compression.
14. The network interface device as claimed in claim 1, wherein the packet capture unit is a reconfigurable logic device such as an FPGA.
15. The network interface device as claimed in claim 14, wherein the packet inspector, duplication engine and packet capture engine are defined by one or more firmware modules installed at the reconfigurable logic device.
16. A data processing system comprising:
the network interface device as claimed in claim 1; and
a host data processing device having a plurality of processing cores, a memory subsystem and being coupled to the network interface device by means of a data bus, the host data processing device supporting said consumer process and a packet capture process arranged to support a host packet capture buffer;
wherein the consumer process and the packet capture process are supported at different processing cores of the host data processing device.
17. The data processing system as claimed in claim 16, wherein the packet capture process is a user level process supporting the host packet capture buffer in its address space, the network interface device being arranged to deliver the processed packet capture data stream over the data bus by means of direct memory access.
18. The data processing system as claimed in claim 17, further comprising a user level protocol processing engine, the packet capture unit being configured to pass the processed packet capture data stream to a controller of the network interface device as a series of data packets for delivery to an endpoint associated with the user level protocol processing engine.
19. The data processing system as claimed in claim 18, wherein the packet capture process is arranged to, in a first mode, service one or more receive queues associated with said endpoint so as to read data of the processed packet capture data stream into the host packet capture buffer.
20. The data processing system as claimed in claim 19, wherein the packet capture process is arranged to, in a second mode, read processed packet capture data including timestamp information from the host packet capture buffer and cause the packet capture unit to enter a replay mode in which it:
receives the read processed packet capture data from the packet capture process;
reforms the read processed packet capture data into a reformed sequence of data packets and associated timestamp information representative of a corresponding sequence of received data packets of the first data flow; and
causes the reformed sequence of data packets to be delivered to the host by means of the controller according to a schedule commensurate with the relative receive time intervals indicated by the associated timestamp information.
21. The data processing system as claimed in claim 20, wherein the packet capture unit further includes a replay unit configured to perform at least the reforming step of the replay mode.
22. The data processing system as claimed in claim 20, wherein, if the read processed packet capture data at the packet capture buffer does not allow the payload data of the corresponding sequence of received data packets of the first data flow to be entirely reformed, the packet capture unit is configured to generate the reformed sequence of data packets using one or more predetermined test patterns in the place of any missing payload data.
23. The data processing system as claimed in claim 20, wherein the packet capture process is arranged to cause at least some of the packet capture data to be delivered to a buffer of the network interface device prior to the packet capture unit being caused to enter its replay mode.
24. A network interface device for connection between a host data processing device and a network, the network interface device comprising:
a data bus interface;
a controller for supporting communication with a host data processing device over the data bus interface; and
a packet capture unit located between the controller and the network and comprising:
a packet inspector configured to parse outgoing data packets so as to identify data packets belonging to a first data flow;
a duplication engine configured to generate a duplicate data flow from the first data flow; and
a packet capture engine configured to process said duplicate data flow into a packet capture data stream having a predefined format;

wherein the network interface device is configured to cause:
the first data flow to be transmitted onto a network to which the network interface device is connected; and
the processed packet capture data stream to be stored at a packet capture buffer.
25. The network interface device as claimed in claim 24, wherein the packet capture unit is arranged to deliver the processed packet capture data stream onto the network over a data path that does not include the controller.
26. The network interface device as claimed in claim 25, wherein the processed packet capture data is assigned a lower priority than data of the first data flow and the packet capture unit is configured to enforce a quality of service protocol such that the processed packet capture data is delivered onto the network between data of the first data flow.
27. A data processing system comprising:
the network interface device as claimed in claim 24; and
a host data processing device having a plurality of processing cores, a memory subsystem and being coupled to the network interface device by means of a data bus, the host data processing device supporting a source process from which data of the first data flow originates and a packet capture process arranged to support a host packet capture buffer;
wherein the source process and the packet capture process are supported at different processing cores of the host data processing device.
28. The data processing system as claimed in claim 27, wherein the packet capture process is a user level process supporting the host packet capture buffer in its address space, the network interface device being arranged to deliver the processed packet capture data stream over the data bus by means of direct memory access.
29. The data processing system as claimed in claim 28, further comprising a user level protocol processing engine, the packet capture unit being configured to pass the processed packet capture data stream to a controller of the network interface device as a series of data packets for delivery to an endpoint associated with the user level protocol processing engine.
30. The data processing system as claimed in claim 29, wherein the packet capture process is arranged to, in a first mode, service one or more receive queues associated with said endpoint so as to read data of the processed packet capture data stream into the host packet capture buffer.
31. The data processing system as claimed in claim 30, wherein the packet capture process is arranged to, in a second mode, read processed packet capture data including timestamp information from the host packet capture buffer and cause the packet capture unit to enter a replay mode in which it:
receives the read processed packet capture data from the packet capture process;
reforms the read processed packet capture data into a reformed sequence of data packets and associated timestamp information representative of a corresponding sequence of received data packets of the first data flow; and
transmits the reformed sequence of data packets onto the network at the relative time intervals indicated by the associated timestamp information.
32. The data processing system as claimed in claim 31, wherein the packet capture unit further includes a replay unit configured to perform at least the reforming step of the replay mode.
33. The network interface device as claimed in claim 1, wherein the packet capture unit is arranged to deliver the processed packet capture data stream onto the network over a data path that does not include the controller.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A superconducting device comprising:
a rotor which is mounted to rotate about a rotation axis extending in an axial direction, the rotor comprising:
a thermally conductive winding mount;
a cylindrical, central cavity which extends in the axial direction, the central cavity being connected to a lateral cavity which rotates with the rotor and which leads out of the winding mount; and
a superconducting winding having conductors arranged in the winding mount; and
a refrigeration unit having a cold head which is thermally coupled to the winding mount, the refrigeration unit being located outside the rotor such that the rotor rotates with respect to the refrigeration unit, the refrigeration unit having a condenser unit to condense a refrigerant; and
a stationary heat pipe coupled to the condenser unit, which heat pipe projects axially into the lateral cavity and is radially sealed to the lateral cavity, wherein
the heat pipe, the lateral cavity and the central cavity are filled with the refrigerant, with condensed refrigerant being passed through a thermosyphon effect to the central cavity via the heat pipe and the lateral cavity, and with vaporized refrigerant being passed from the central cavity to the consenser unit via the lateral cavity and the heat pipe, and
the refrigerant is a mixture of at least two refrigerant components with different condensation temperatures.
2. The device as claimed in claim 1, wherein
the central cavity is closed on one side by the winding mount, and
the lateral cavity is sealed with respect to the heat pipe by a sealing device having parts which rotate with the lateral cavity and the rotor.
3. The device as claimed in claim 2, wherein the sealing device has at least one seal selected from the group consisting of ferro fluid seals, labyrinth seals, and gap seals.
4. The device as claimed in claim 1, wherein the refrigeration unit has a regenerative cryogenic cooler.
5. The device as claimed in claim 4, wherein the regenerative cryogenic cooler comprises at least one cooler selected from the group consisting of a pulse tube cooler, a split Stirling cooler, and a Gifford-McMahon cooler.
6. The device as claimed in claim 1, wherein the cold head is a multistage cold head.
7. The device as claimed in claim 6, wherein the cold head has two refrigeration stages, with the first stage being thermally connected to an electricity supply or to a radiation shield, and the second stage being thermally connected to the condenser.
8. The device as claimed in claim 1, wherein the cold head maintains superconducting winding at a temperature of below 77 K.
9. The device as claimed in claim 1, wherein the superconducting winding is formed from a metallic low-Tc superconductor material or a metal-oxide high-Tc superconductor material.
10. The device as claimed in claim 1, wherein the heat pipe has a dripping edge which projects into the lateral cavity or the central cavity.
11. The device as claimed in claim 1, wherein the lateral cavity widens from the heat pipe to the central cavity.
12. The device as claimed in claim 1, wherein at least a portion of the rotor and at least a portion of the heat pipe are vacuum-insulated.
13. The device as claimed in claim 1, wherein the refrigerant is a mixture of neon and argon or a mixture of neon and nitrogen.
14. The device as claimed in claim 3, wherein the refrigeration unit has a regenerative cryogenic cooler.
15. The device as claimed in claim 14, wherein the regenerative cryogenic cooler comprises at least one cooler selected from the group consisting of a pulse tube cooler, a split Stirling cooler, and a Gifford-McMahon cooler.
16. The device as claimed in claim 15, wherein the cold head is a multistage cold head.
17. The device as claimed in claim 16, wherein the cold head has two refrigeration stages, with the first stage being thermally connected to an electricity supply or to a radiation shield, and the second stage being thermally connected to the condenser.
18. The device as claimed in claim 17, wherein the cold head maintains superconducting winding at a temperature of below 77 K.
19. The device as claimed in claim 18, wherein the superconducting winding is formed from a metallic low-Tc superconductor material or a metal-oxide high-Tc superconductor material.
20. The device as claimed in claim 19, wherein the heat pipe has a dripping edge which projects into the lateral cavity or the central cavity.
21. The device as claimed in claim 20, wherein the lateral cavity widens from the heat pipe to the central cavity.
22. The device as claimed in claim 21, wherein the refrigerant is a mixture of neon and argon or a mixture of neon and nitrogen.