1461118629-5f742081-89a8-4f79-848c-9eb7b5dc98c3

1. A method in a communication network in which a session initiation protocol (SIP) is overlaid on top of a code division multiple access network for reducing a number of transcoders in a voice bearer path, the SIP protocol for initiating a session between a calling party and a called party, the method comprising:
transmitting a connection management (CM) Service Request message) to initiate a call from a base station (BS) to a Serving mobile switching center (MSCe), the CM Service Request message containing BS connection information, a list of voice codecs and a list of BS transcoders;
establishing a context between the MSCe and a media gateway (MGW); and
transmitting a message from the MSCe to the BS for the purpose of instructing the BS to establish a bearer resource connection between the calling party terminal device and the BS, sending the BS information as to which MGW connection point the BS is to send data packets to, instructing the BS as to whether or not to assign a transcoder in the bearer path between the BS-to-MS connection or the BS-to-MGW connection, and if so, assigning the calling party terminal device to a codec.
2. The method of claim 1 further including the MSCe sending an SIP callsession initiation message to a network entity support the called party wherein the message contains a list of preferred codecs for callsession setup.
3. The method of claim 1 wherein the BS sends the MSCe a message confirming the codec that the calling party terminal device (MS) is using and confirming which transcoder is being used or is to be used.
4. The method of claim 2 wherein, upon receiving a SIP 180 Ringing message, the MSCe instructs a MGW to generate progress tones to the calling party.
5. The method of claim 4 wherein, upon receiving a SIP 183 Session Progress message containing with a list of codecs for callsession setup from a network entity supporting the called party, the MSCe instructing the MGW to discontinue the generation of progress tones to the calling party using at least one of the MGW-to-BS connection and the BS-to-MS connection.
6. A method in a mobile switching center (MSCe) of a communication network for call setup utilizing session initiation protocol (SIP) protocol and more specifically for initiating a session between a calling party and a called party, the method comprising:
receiving a connection management (CM) Service Request message from a base station (BS), the CM Service Request message containing BS connection information, a list of supported calling party terminal device (MS) voice codecs and a list of BS transcoders;
establishing a context with an originating media gateway (MGW) by:
transmitting an H.248 message to establish a termination to the BS for a voice bearer channel using using Real-Time Transport Protocol (RTP) and a Session Description Protocol (SDP) message which contains the connection information for which the MGW is to use to send RTP packets to the base station; and
transmitting an H.248 message to establish a termination to a bearer device supporting the called party using RTP;

receiving a Reply message from the serving MGW containing an SDP for where the serving MGW want the BS to send RTP packets to and an SDP for where the serving MGW wants a bearer device supporting the called party to send RTP packets; and
sending an Assignment Request message to the BS to instruct the BS to assign radio resources to the calling party terminal device, to instruct the BS as to which serving MGW connection point to send RTP packets to, to instruct the BS whether to use a transcoder, and if so, which one, and to instruct the BS to assign the calling party terminal device to a specific voice codec.
7. The method of claim 6 further including sending a SIP INVITE message to the call control entity supporting the called party, wherein the SIP INVITE message contains an SDP message which further includes a prioritized list of codecs to be used for call negotiation.
8. The method of claim 7 wherein the SIP INVITE message further includes an integrated services digital network (ISDN) User Part (ISUP) Initial Address Message (IAM) message.
9. The method of claim 6 further including receiving an Interoperability Specification (IOS) Assignment Complete message from the BS confirming the voice codec that the calling party terminal device is using, confirming that radio resources have been assigned to calling party terminal device and if the BS is using a transcoder between the BS-to-MS connection and the BS-to-MGW connection to confirm which transcoder.
10. The method of claim 7 wherein, if the Serving MSCe received a 180 Ringing message, the serving MSCe sends an H.248 message to the serving MGW for the purpose of generating progress tones to the calling party through the BS to MGW connection and MS to BS connection.
11. The method of claim 7 wherein the serving MSCe receives a SIP 183 Session Progress message wherein the SIP 183 Session Progress message contains an SDP message which further includes a list of codecs to be used for the call between the calling party and the called party.
12. The method of claim 11 wherein the MSCe, based upon receiving the SIP 183 Session Progress message, sends an H.248 message to the serving MGW to modify the BS to MGW connection to cause progress tones to the calling party terminal device to be discontinued.
13. A serving mobile switching center (MSCe) for call delivery to a mobile station (MS) in a wireless communication network, comprising:
circuitry for configured to receive and process a connection management (CM) Service Request message, indicating that a call is to be setup with a specified called party, containing base station (BS) connection information, a list of voice codecs supported by a calling party terminal device and a list of BS transcoders;
circuitry configured to establish a context with a media gateway (MGW) by transmitting an H.248 message to establishes a termination to the BS for a voice bearer channel using RTP and also contains an SDP message which contains the connection information for which the Serving MGW is to use to send RTP packets to the base station; and
circuitry for transmitting an Assignment Request message to instruct the BS to assign radio resources to the calling party terminal device, to instruct the BS as to which serving MGW connection point to send RTP packets to, to instruct the BS whether to use a transcoder, and if so, which one, and to instruct the BS to assign the calling party terminal device to a specific voice codec.
14. The serving MSCe of claim 13 further including:
circuitry configured to establish a context with a media gateway (MGW) by transmitting a H.248 message to establish a termination to a bearer device supporting the called party using Real-Time Transport Protocol (RTP); and
circuitry configured to receive and process an H.248 Reply message from the serving MGW containing an Session Description Protocol (SDP) message for identifying where the serving MGW wants the BS to send RTP packets to and an SDP message for identifying where the serving MGW wants a bearer device supporting the called party to send RTP packets.
15. The serving MSCe of claim 13 wherein the serving MSCe is operable to transmit a SIP INVITE message to a call control entity supporting the called party which further includes a prioritized list of codecs to be used for call negotiation.
16. The serving MSCe of claim 13 wherein the MSCe, based upon receiving a SIP 183 Session Progress message, sends an H.248 message to the MGW to modify a BS to MGW connection to cause progress tones to the calling party terminal device to be discontinued.
17. A method in a base station (BS) of a communication network for initiating call setup between a calling party and a called party, the method comprising:
transmitting a connection management (CM) Service Request message to an mobile switching center (MSCe), the CM Service Request message containing BS connection information, a list of supported MS voice codecs and a list of BS transcoders; and
receiving an Assignment Request message from the MSCe and, responsive thereto, assigning radio resources to the calling party terminal device, determining which serving media gateway (MGW) connection point to send Real-Time Transport Protocol (RTP) packets to, determining to use a codec from the list of supported MS voice codecs, and assigning the calling party terminal device to the codec from the list of supported MS voice codecs.
18. The method of claim 19 further including sending an IOS Assignment Complete message to the MSCe confirming the voice codec that the calling party terminal device is using, confirming that radio resources have been assigned to calling party terminal device and if the BS is using a transcoder between the BS-to-MS connection and the BS-to-MGW connection to confirm which transcoder.
19. A base station (BS) of a communication network operable to initiate call setup between a calling party and a called party, comprising:
circuitry for transmitting a connection management (CM) Service Request message from the BS, the CM Service Request message containing BS connection information, a list of supported mobile station (MS) voice codecs and a list of BS transcoders; and
circuitry for receiving and processing an Assignment Request message from the mobile switching center (MSCe) and, responsive thereto, for assigning radio resources to the calling party terminal device, determining which serving media gateway (MGW) connection point to send Real-Time Transport Protocol (RTP) packets to, determining whether to use a transcoder, and if so, which one, and assigning the calling party terminal device to a specific voice codec.
20. The BS of claim 21 including circuitry for sending an IOS Assignment Complete message to the MSCe confirming the voice codec that the calling party terminal device is using, confirming that radio resources have been assigned to the calling party terminal device and if the BS is using a transcoder between the BS-to-MS connection and the BS-to-MGW connection to confirm which transcoder.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method of manufacture of an integrated circuit packaging system comprising:
providing a substrate;
mounting an integrated circuit over the substrate;
mounting a lid base over the substrate, the lid base having:
a base indentation and a hole with the integrated circuit within the hole,
a cavity below the base indentation, and
a leg portion, wherein a first leg portion is below a substrate bottom side of the substrate and a second leg portion is directly on a substrate non-horizontal side of the substrate;

attaching a thermal interface layer to the integrated circuit;
attaching a base-slug adhesive layer to the lid base, the base-slug adhesive layer within the cavity; and
mounting a heat slug directly on the thermal interface layer over the integrated circuit, the heat slug having:
a slug non-horizontal side partially within the base indentation, and
a slug bottom side with the base-glue adhesive layer directly on portions of the slug non-horizontal side and the slug bottom side.
2. The method as claimed in claim 1 wherein mounting the heat slug includes mounting the heat slug having a slug protrusion, the slug protrusion extending from the slug bottom side and partially within the base indentation.

1461118620-e9f90070-e473-4d4a-ab65-c01981587a89

1. A solid-state imaging apparatus comprising:
an insulating structural body formed with a through opening;
a wiring part formed on a surface of the structural body;
a solid-state imaging element connected to the wiring part and attached to the structural body so as to close the through opening;
a translucent member opposed to the solid-state imaging element so as to close the through opening and attached to the structural body through an adhesive inside an adhesion region; and
a solder resist film covering at least a part of the surface of the structural body;
wherein the adhesion region includes a region in which the solder resist film is selectively removed and the removed region is filled with the adhesive.
2. The solid-state imaging apparatus as claimed in claim 1, wherein the adhesion region is surrounded by the solder resist film.
3. The solid-state imaging apparatus as claimed in claim 1, wherein the adhesion region constructs a communication region.
4. The solid-state imaging apparatus as claimed in claim 1, wherein a film thickness of the adhesive is constructed so as to be thicker than that of the solder resist film, and a region sandwiched in a region in which the solder resist film is removed constructs an air escape part.
5. The solid-state imaging apparatus as claimed in claim 4, wherein a dust trap pocket is provided inside the air escape part.
6. The solid-state imaging apparatus as claimed in claim 5, wherein a meander-shaped pattern is formed in a region in which the solder resist film is removed, constructing a dust trap pocket in the air escape part.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A thermoplastic bonded substrate comprising:
a linerboard substrate;
a plastic based material extruded to a first side of said linerboard substrate; and
a thermoplastic material layer coated on a second side of said linerboard substrate, said thermoplastic layer configured to provide adhesive properties when exposed to infrared radiation, said thermoplastic material layer comprising a mineral additive in an amount sufficient to absorb heat upon activation of said adhesive properties.
2. The substrate in accordance with claim 1 wherein said thermoplastic material layer further comprises said mineral additive in an amount low enough to prevent rapid heating of said thermoplastic layer.
3. The substrate in accordance with claim 2, wherein said mineral additive is selected from the group consisting of calcium carbonate, talc, fumed silica, mica, clay and Diatomaceous Earth (DE).
4. The substrate in accordance with claim 2 wherein said substrate, when exposed to said infrared radiation, comprises a temperature gradient there-through such that said temperature gradient decreases from said thermoplastic material layer to said linerboard.
5. The substrate in accordance with claim 1 wherein said thermoplastic material is selected from the group consisting of LDPE, HDPE, LLDPE, metallocene polyethylene, EVA, EMA, EEA, EAA, EnBA and polypropylene.
6. The substrate in accordance with claim 1 wherein said thermoplastic material is selected from the group consisting of thermoplastic urethanes, extrudable polyester and extrudable nylon.
7. The substrate in accordance with claim 1, wherein said thermoplastic material is a black low density polyethylene.
8. The substrate in accordance with claim 1 wherein said plastic based material is polypropylene.
9. The substrate in accordance with claim 1, wherein said plastic based material acts as a moisture barrier to prevent the escape of moisture from said substrate.
10. A method of laminating a substrate comprising:
coating a linerboard with a thermoplastic resin, said resin having a mineral additive to act as a heat sink when exposed to infrared radiation;
extruding a plastic based material to said linerboard; and
exposing said thermoplastic resin to infrared radiation sufficient to activate adhesive properties of said resin.
11. The method in accordance with claim 10. wherein said mineral additive is selected from the group consisting of calcium carbonate, talc, fumed silica, mica, clay and Diatomaceous Earth (DE).
12. The method in accordance with claim 10 wherein said thermoplastic resin is selected from the group consisting of LDPE, HDPE, LLDPE, metallocene polyethylene, EVA, EMA, EEA, EAA, EnBA and polypropylene.
13. The method in accordance with claim 10 wherein said thermoplastic resin is selected from the group consisting of thermoplastic urethanes, extrudable polyester and extrudable nylon.
14. The method in accordance with claim 10 further comprising the step of heating said thermoplastic resin to 110\xb0 C.-120\xb0 C.
15. The method in accordance with claim 14 further comprising the step of adhering said substrate to a polystyrene foam material.