Author: claimsbot

1. A method, comprising:
receiving from a first user device a message comprising location information indicating a geographic location of the first user device;
receiving from the first user device environmental information indicating at least one physical environmental condition in the vicinity of the first user device, as detected by an environmental sensor on the first user device;
calculating values representing logical connection strengths between a first user of the first user device and other users, the logical connection strengths based, at least partially, on location information and at least partially on the environmental information, wherein the logical connection strengths each pertain to a different logical connection between the first user and another user;
determining, using at least one processor, a first user group to which to add the first user based on the values representing the logical connection strengths, the first group of users containing a plurality of users, including one or more users with whom the first user has not directly communicated;
adding the first user to the first user group without causing direct communications between the first user and the one or more users, in the first user group, with whom the first user has not directly communicated;
receiving content from the first user device; and
transmitting the content to users of the first user group.
2. The method of claim 1, wherein the environmental information includes atmospheric pressure.
3. The method of claim 1, wherein the environmental information includes temperature.
4. The method of claim 1, wherein the environmental information includes light levels.
5. The method of claim 1, wherein the environmental information includes velocity of the first user device.
6. The method of claim 1, wherein the environmental information includes acceleration of the first user device.
7. The method of claim 1, wherein the environmental information is weather-related information that is of interest to another user in the first user group.
8. The method of claim 1, wherein the environmental information includes persistent changes in acceleration of the first user device.
9. The method of claim 1, wherein the environmental information includes the presence of multiple voices within a vicinity of the first user device.
10. A user device comprising:
at least one processor;
memory comprising modules including instructions executable by the at least one processor, the modules comprising:
a location services module configured to generate location information indicating a location of the user device;
an environmental detection module configured to generate environmental information indicating at least one physical environmental condition in the vicinity of the user device, as detected by an environmental sensor on the user device; and
an interface module configured to transmit a message comprising the location information and the environmental information to a server system, to receive group recommendations of a device group for the user device to be added, the group recommendations being based at least in part on logical relationship information describing logical relationships between the user device and each of one or more other user devices, the location information and at least in part on the environmental information, each of the group representations being a group of a plurality of user devices including at least one user device with which the user device has not directly communicated and will not directly communicate, the interface module further configured to add a first user of the user device to a first user group without causing direct communications between the first user and the one or more users, in the first user group, with whom the first user has not directly communicated, and to send content to the server system for forwarding to users of the first user group.
11. The user device of claim 10, wherein the environmental sensor comprises a microphone.
12. The user device of claim 10, wherein the environmental sensor comprises a light meter.
13. The user device of claim 10, wherein the environmental sensor comprises an accelerometer.
14. The user device of claim 10, wherein the environmental sensor comprises a gyroscope.
15. The user device of claim 10, wherein the environmental sensor comprises a thermometer.
16. A non-transitory computer-readable storage medium comprising instructions that, when executed by at least one processor of a machine, cause the machine to perform operations comprising:
receiving from a first user device a message comprising location information indicating a geographic location of the first user device;
receiving from the first user device environmental information indicating at least one physical environmental condition in the vicinity of the first user device, as detected by an environmental sensor on the first user device;
calculating values representing logical connection strengths between a first user of the first user device and other users, the logical connection strengths based, at least partially, on location information and at least partially on the environmental information, wherein the logical connection strengths each pertain to a different logical connection between the first user and another user;
determining, using at least one processor, a first user group to which to add the first user based on the values representing the logical connection strengths, the first group of users containing a plurality of users, including one or more users with whom the first user has not directly communicated;
adding the first user to the first user group without causing direct communications between the first user and the one or more users, in the first user group, with whom the first user has not directly communicated;
receiving content from the first user device; and
transmitting the content to users of the first user group.
17. The non-transitory computer-readable storage medium of claim 16, wherein the logical connection strengths are based, at least partially, on number and frequency of communications between the first user and other users.
18. The non-transitory computer-readable storage medium of claim 16, wherein the environmental sensor is located on the first user device.
19. The non-transitory computer-readable storage medium of claim 16, wherein the environmental sensor is located in the vicinity of the first user device.
20. The non-transitory computer-readable storage medium of claim 16, wherein the operations are performed by a server in communication with a plurality of user devices.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method for manufacturing a thin film transistor array panel, comprising:
forming a gate line on an insulating substrate, the gate line comprising a gate electrode;
forming a gate insulating layer on the gate line;
sequentially forming a first amorphous silicon layer, a second amorphous silicon layer, a lower data metal layer, and an upper data metal layer on the gate insulating layer;
forming a first photosensitive film pattern on the upper data metal layer, the first photosensitive film pattern comprising a first part and a second part that is thicker than the first part;
performing a first etching process to form a first lower data metal pattern and a first upper data metal pattern that comprises an outwardly extending protrusion disposed at the perimeter thereof, by etching the upper data metal layer and the lower data metal layer using the first photosensitive film pattern as a mask;
performing a second etching process to form a first amorphous silicon layer pattern and a second amorphous silicon layer pattern, by etching the first amorphous silicon layer and the is second amorphous silicon layer using the first photosensitive film pattern as a mask;
ashing the first photosensitive film pattern to form a second photosensitive film pattern;
performing a third etching process to form a second upper data metal pattern, by etching the first upper data metal pattern using the second photosensitive film pattern as a mask;
performing a fourth etching process to form a data line, a source electrode that extends from the data line, a drain electrode, a semiconductor, and ohmic contact layers disposed between the source and drain electrodes and the semiconductor, by etching the first lower data metal pattern, the first amorphous silicon layer pattern, and the second amorphous silicon layer pattern using the second photosensitive film pattern as a mask;
forming a passivation layer on the data line, the drain electrode, and the gate insulating layer; and
forming a pixel electrode on the passivation layer, such that the pixel electrode is connected to the drain electrode.
2. The method of claim 1, wherein the perimeters of the first upper data metal pattern and the first lower data metal pattern are disposed inside of the perimeter of the first photosensitive film pattern, so as to undercut the first photosensitive film pattern.
3. The method of claim 2, wherein the protrusion of the first upper data metal pattern extends outside of the perimeter of the second photosensitive film pattern.
4. The method of claim 3, wherein the protrusion of the first upper data metal pattern has an upper surface and an opposing lower surface.
5. The method of claim 4, wherein the lower surface of the protrusion extends from an edge of the upper surface to the perimeter of the first lower data metal pattern.
6. The method of claim 5, wherein:
the upper data metal layer comprises copper or a copper alloy; and
the lower data metal layer comprises titanium or a titanium alloy.
7. The method of claim 6, wherein:
the first etching process and the third etching process comprise wet etching processes; and
the second etching process and the fourth etching process comprise dry etching processes.
8. The method of claim 7, wherein an end of the lower surface of the protrusion of the first upper data metal pattern is disposed directly below the perimeter of the second photosensitive film pattern.
9. The method of claim 1, wherein:
the upper data metal layer comprises copper or a copper alloy; and
the lower data metal layer comprises titanium or a titanium alloy.
10. The method of claim 9, wherein:
the first etching process and the third etching process comprise wet etching processes; and
the second etching process and the fourth etching process comprise dry etching processes.
11. The method of claim 10, wherein an edge of the lower surface of the protrusion of the first upper data metal pattern is disposed directly below the perimeter of the second photosensitive film pattern.
12. The method of claim 1, wherein:
the first etching process and the third etching process comprise wet etching processes; and
the second etching process and the fourth etching process comprise dry etching processes.
13. The method of claim 12, wherein the protrusion of the first upper data metal pattern extends outside of the perimeter of the second photosensitive film pattern.
14. The method of claim 1, wherein the protrusion of the first upper data metal pattern includes an upper surface and an opposing lower surface.
15. The method of claim 14, wherein the lower surface of the protrusion of the first upper data metal pattern contacts the perimeter of the first lower data metal pattern.
16. The method of claim 1, wherein the outer edge of the first lower data metal pattern is tapered and is disposed on the inside of the protrusion of the first upper data metal pattern.
17. The method of claim 1, wherein the semiconductor comprises a protrusion that extends outwardly past side walls of the data line and the drain electrode by about 0.8 \u03bcm.
18. The method of claim 1, wherein the performance of the first etching process comprises using an etchant comprising 12 wt % of ammonium sulfate, 2 wt % of inorganic acid, 1 wt % of organic acid, 1 wt % of hydrogen fluoride, and 0.7 wt % of fluoroborionate.
19. The method of claim 18, wherein the inorganic acid comprises nitric acid and the organic acid comprises acetate.
20. The method of claim 1, wherein,
the protrusion of the first upper data metal pattern includes an upper surface and a lower surface,
the upper surface is inclined with respect to the first photosensitive film pattern in the range of about 30 to about 50 degrees, and
the lower surface is inclined with respect to the first lower data metal pattern in the range of about 30 to about 50 degrees.
21. The method of claim 20, wherein a line connecting an inner portion of the upper surface and an inner portion the lower surface is inclined with respect to the first lower data metal pattern at about 90 degrees.

What is claimed is:

1. Method for maintaining storage media including the steps of
generating, editing or reading log data related to the content andor usage of a data item stored or to be stored on a storage medium,
characterized by
deleting completely and automatically at least a part of said data item or providing a recommendation for deletion on the basis of said log data from said storage medium.
2. Method according to claim 1, wherein said deleting or providing of said recommendation is performed, when the storage space on said recording medium runs short.
3. Method according to claim 1, wherein said log data includes a protection level indicator as a basis for a decision on the deletion of data items on the storage medium.
4. Method according to claim 3, wherein said protection level indicator is set according to one or more predetermined rules or combinations of predetermined rules being used in a predetermined order.
5. Method according to claim 4, further including the step of creating (1) or editing (2, 4) said rules.
6. Method according to claim 4, wherein said rules include a descriptor for the element forming a basis of decision, a criterion for the decision and a protection level as a result of the decision.
7. Method according to claim 1 or 4, further including the step of storing (6) said log data andor said rules for decision on said recording medium or on a data processing system.
8. Method according to claim 1, wherein the log data includes class, user, usage, time andor streaming information.
9. Method according to claim 8, wherein the class information includes an item identification for video data, audio data andor metadata.
10. Method according to claim 8, wherein the time information includes the date and time of the last usage of said data item.
11. Method according to claim 8, wherein the streaming information includes a stream entry position and a stream exit position.
12. Device for recording data items on a storage medium with log data means for generating, editing andor reading log data related to the contentor usage of a data item stored or to be stored on a storage medium, characterized by
deleting means for deleting completely and automatically at least a part of said data item or providing a recommendation for deletion on the basis of said log data from said storage medium.
13. Device according to claim 12, further comprising the features of one of the claims 2 to 11.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method for detecting sequential processing effects on integrated circuits to be manufactured in manufacturing process, comprising the steps of:
(a) predetermining a first random sequence for a plurality of units in a batch of units;
(b) performing a first process step on the plurality of units by a first process tool in accordance with the first random sequence, wherein the performing step comprises:
(b1) associating each of the plurality of units with a slot in a cassette;
(b2) removing each of the plurality of units according to the first random sequence by the first process tool;
(b3) performing the first process step on each of the removed units by the first process tool; and
(b4) replacing each of the units into its associated slot by the first process tool;

(c) determining a second random sequence for the plurality of units; and
(d) performing a second process step on the plurality of units by a second process tool in accordance with the second random sequence.
2. A method for detecting sequential processing effects on integrated circuits to be manufactured in a manufacturing process, comprising the steps of:
(a) predetermining a first random sequence for a plurality of wafers;
(b) performing a first process step on the plurality of wafers by a first process tool in accordance with the first random sequence, wherein the performing step comprises:
(b1) associating each of the plurality of wafers with a slot in a cassette;
(b2) removing each of the plurality of wafers according to the first random sequence by the first process tool;
(b3) performing the first process step on each of the removed wafers by the first process tool; and
(b4) replacing each of the wafers into its associated slot by the first process tool;

(c) determining a second random sequence for the plurality of wafers; and
(d) performing a second process step on the plurality of wafers by a second process tool in accordance with the second random sequence.
3. The method of claim 2, further comprising:
(e) collecting yield or device data for the plurality of wafers;
(f) generating yield or device data versus processing sequence graphs based on the collected yield or device data; and
(g) determining if any of the graphs indicate a systemic wafer-to-wafer variation.
4. The method of claim 2, wherein the determining step (a) comprises:
(a1) generating the first random sequence for the plurality of wafers by the first process tool.
5. The method of claim 4, wherein the determining step (a) further comprises:
(a2) sending the first random sequence to a factory database.
6. The method of claim 2, wherein the determining step (c) comprises:
(c1) generating the second random sequence for the plurality of wafers by the second process tool.
7. The method of claim 6, wherein the determining step (c) further comprises:
(c2) sending the second random sequence to a factory database.
8. The method of claim 2, wherein the determining step (a) comprises:
(a1) generating the first random sequence for the plurality of wafers by a factory control system.
9. The method of claim 2, wherein the determining step (c) comprises:
(c1) generating the second random sequence for the plurality of wafers by a factory control system.
10. The method of claim 2, wherein the determining step (a) comprises:
(a1) generating the first random sequence, wherein the first random sequence applies to multiple lots of wafers.
11. The method of claim 10, wherein the generating step (a1) is performed by the first process tool.
12. The method of claim 10, wherein the generating step (a1) is performed by a factory control system.
13. The method of claim 2, wherein the determining step (c) comprises:
(c1) generating the second random sequence, wherein the second random sequence applies to multiple lots of wafers.
14. The method of claim 13, wherein the generating step (c1) is performed by the second process tool.
15. The method of claim 13, wherein the generating step (c1) is performed by a factory control system.
16. The method of claim 2, wherein the performing step (d) comprises:
(d1) removing each of the plurality of wafers according to the second random sequence by the second process tool; and
(d2) performing the second process step on each of the removed wafers by the second process tool.
17. The method of claim 2, further comprising:
(e) determining a random sequence corresponding to each of remaining process steps of the manufacturing process; and
(f) performing each of the remaining process steps on the plurality of wafers by a corresponding process tool in accordance with the corresponding random sequence.
18. A system comprising:
a plurality of wafers;
a first processing tool, wherein the first processing tool contains a first computer, wherein the first processing tool removes each of the plurality of wafers from a cassette according to a first predetermined random sequence; wherein each of the plurality of wafers is associated with a slot in the cassette, wherein the first processing tool performs a first process step on the plurality of wafers; wherein the first processing tool replaces each of the plurality of wafers into its associated slot in the cassette;
a second processing tool, wherein the second processing tool contains a second computer, wherein the second processing tool removes each of the plurality of wafers from the cassette according to a second predetermined random sequence; wherein the second processing tool performs a second process step on the plurality of wafers; and
a factory control system, wherein the first computer sends first sequence information to the factory control system, wherein the second computer sends second sequence information to the factory control system.
19. The system of claim 18, wherein the first random sequence is generated by the factory control system.
20. The system of claim 19, wherein the second random sequence is generated by the factory control system.