1461112933-7a47cf3b-79ad-46ab-9c2e-37d604167ab7

1. A method to control an optical transmitter that provides a wavelength tunable laser diode (tunable LD), a controller, and a memory look-up-table (LUT), the tunable LD integrally having a sampled grating distributed feedback (SG-DFB) region and a chirped sampled grating distributed Bragg reflector (CSG-DBR) region including at least three segments each having a diffraction grating and a space neighbor to the diffraction grating, each of segments having a heater and an optical length satisfying a relation of:
L1=L3+(L3\u2212L2)\xb7K,
where L1 to L3 are respective optical lengths and K is a constant of 0.3<=K<=0.7, the method comprising steps of:
evaluating parameters to define an emission wavelength of the tunable LD, the parameters including currents supplied to respective heaters, optimum offset power supplied to the heater in the first segment, and an operating temperature of the tunable LD;
storing the parameters to the memory LUT; and
practically operating the tunable LD by performing steps of,
receiving a target emission wavelength at which the tunable LD emit laser light,
reading parameters corresponding to the target emission wavelength from the memory LUT, and
controlling respective elements based on the parameters,

wherein the step of evaluating the parameters includes steps of,
varying power, P1 to P3, supplied to respective heaters based a relation of,
P1=P3\xb7Rth3Rth1+(P2\xb7Rth2Rth1\u2212P3\xb7Rth3Rth1)+offset,
where Rth1 to Rth3 are thermal resistance of respective heaters and offset is offset power supplied to the heater in the first segment;
measuring an emission wavelength and a side mode suppression ratio (SMSR) at the emission wavelength for the offset power;
evaluating a wavelength tunable range of the tunable LD, where the wavelength tunable range is a range the SMSR exceeds a preset value;
iterating the steps of varying power, measuring the emission wavelength and the SMSR, and the evaluating the wavelength tunable range as varying the offset;
determining the optimum offset power at which the wavelength tunable range becomes a maximum.
2. The method of claim 1,
wherein the step of evaluating the parameters further includes steps of:
measuring the emission wavelength as varying the power, P1 to P3, supplied to the heaters under the relation of:
P1=P3\xb7Rth3Rth1+(P2\xb7Rth2Rth1\u2212P3\xb7Rth3Rth1)+optimum_offset;
storing the parameters of P1 to P3, the optimum_offset as the optimum offset power, and the emission wavelength in the memory LUT.
3. The method of claim 2,
wherein the tunable LD further includes a sampled grating distributed feedback (SG-DFB) region neighbor to the CSG-DBR region, the SG-DFB region interacting with the CSG-DBR region to determine the emission wavelength of the tunable LD,
wherein the first segment in the CSG-DBR region is provided closest to the SG-DFB region compared with the second segment and the third segment.
4. The method of claim 3,
wherein the CSG-DBR region provides a first number of the first segments, a second number of the second segments, and a third number of the third segments, the first number being greater than an average of the second number and the third number.
5. The method of claim 3,
wherein the tunable LD further includes a semiconductor optical amplifier (SOA) region to amplify light generated in the SG-DFB region, and
wherein the step of evaluating parameters further includes steps of:
determining a current supplied to the SOA region for obtaining preset power of the laser light output from the tunable LD, and
storing the current to the memory LUT.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. An adhesive cover for covering a surface of a device, comprising;
a base layer comprising vinyl or polyolefin;
a primer layer applied to a surface of the base layer;
a print layer applied to the primer layer, wherein the print layer comprises a design, wherein the primer layer improves adhesion of the print layer to the base layer;
a top layer comprising an over laminate and applied over the print layer; and
a bottom layer adhered to the base layer comprising an adhesive configured to adhere the adhesive cover to a device.
2. The adhesive cover of claim 1, wherein the base layer is corona treated.
3. The adhesive cover of claim 1, wherein the print layer is applied to the primer layer by a digital printer.
4. The adhesive cover of claim 1, wherein the print layer is applied to the primer layer by a silk screen.
5. The adhesive cover of claim 1, wherein the print layer comprises an ink selected from a group consisting of a metal ink and a glow-in-the-dark ink.
6. The adhesive cover of claim 1, wherein the print layer is applied to the primer layer by etching.
7. The adhesive cover of claim 1, wherein the print layer is applied to the primer layer by chemically burning the design into the primer layer.
8. The adhesive cover of claim 1, wherein the adhesive cover has a shape that facilitates adhering the cover to one or more sides of the device.
9. The adhesive cover of claim 1, wherein the adhesive cover comprises one or more apertures, tear away sections, punch out sections, peel away sections or a combination thereof.
10. The adhesive cover of claim 9 wherein the one or more apertures, the tear away sections, the punch out sections, the peel away sections or the combination thereof are each configured to form an opening in a portion of the adhesive cover, the opening configured to reveal a portion of the surface of the device therethrough.
11. The adhesive cover of claim 1, wherein the design comprises one or more customized colors, text, names, company brands, slogans, patterns, images, graphics, photographs, logos, advertisements, or a combination thereof.
12. The adhesive cover of claim 1, further comprising one or more decorative pieces affixed to an outer surface of the adhesive cover.
13. The adhesive cover of claim 1, further comprising a pre-printed pattern adapted to facilitate placement of decorative pieces on the adhesive cover.
14. The adhesive cover of claim 13, wherein the pre-printed pattern comprises a plurality of dots, each dot indicating a location for a user to place a decorative piece.
15. The adhesive cover of claim 1, wherein the top layer further comprises a resin dome that provides a raised appearance to the top layer of the adhesive cover.
16. The adhesive cover of claim 1, further comprising an adhesive layer between the print layer and the top layer to allow the top layer to be applied over the print layer.
17. The adhesive cover of claim 1, wherein the bottom layer has a pattern formed therein and configured to channel air out from underneath the adhesive cover when the adhesive cover is applied to the device.
18. The adhesive cover of claim 1 further comprising a release liner applied to the bottom layer.
19. An adhesive cover capable of adhering to a surface of a device, comprising:
a first layer comprising an adhesive configured to adhere the adhesive cover to a device;
a second layer comprising a fabric material; and
a third layer sandwiched between the first layer and the second layer, the third layer comprising a material that provides stiffness to the adhesive cover,
wherein the adhesive cover has a shape that facilitates adhering the adhesive cover to one or more sides of the device.
20. The adhesive cover of claim 19, wherein the fabric material comprises a flock transfer material.
21. The adhesive cover of claim 19, wherein a design is applied to an outer surface of the second layer.
22. The adhesive cover of claim 21, wherein the design was applied to the second layer via screen-printing.
23. The adhesive cover of claim 21, wherein the design was applied to the second layer via a digital printer.
24. The adhesive cover of claim 19, the second layer is an outwardly exposed layer not to be overlaminated.
25. An adhesive cover capable of adhering to a surface of a device, comprising:
a first top layer having a design applied to an underside thereof;
a second layer adhered to the underside of the first top layer after the design has been applied to the underside of the first top layer; and
a third layer adhered to the second layer opposite the first top layer, the third layer configured to adhere the adhesive cover to a device,
wherein the adhesive cover has a shape that facilitates adhering the adhesive cover to one or more sides of the device.
26. The adhesive cover of claim 25, wherein the design is applied to the first top layer via a digital printer.
27. The adhesive cover of claim 25, wherein the design is applied to the first top layer via a silk screen.
28. The adhesive cover of claim 25, wherein the third layer comprises a non-permanent adhesive and a release liner.
29. The adhesive cover of claim 25, wherein the first top layer further comprises a primer layer, wherein the primer layer facilitates application of the design to the underside.
30. The adhesive cover of claim 25, further comprising an adhesive layer sandwiched between the first top layer and the second layer.
31. A method of making an adhesive cover for covering a surface of a device, comprising:
obtaining a base layer comprising vinyl or polyolefin and having a first surface and a second surface, the first surface having a first adhesive layer applied thereto and a release liner applied to the first adhesive layer;
applying a primer layer to the second surface of the base layer;
applying a print layer to the primer layer, wherein the print layer comprises a design; and
applying a top laminate layer to the print layer to laminate the adhesive cover.
32. The method of claim 31 further comprising:
corona treating the second surface of the base layer prior to applying the primer layer.
33. The method of claim 32 further comprising:
corona treating the print layer prior to applying the top laminate layer.
34. The method of claim 31 wherein the applying the top laminate layer comprises:
applying a second adhesive layer to the top laminate layer; and
applying the second adhesive layer to the print layer.

1461112922-b08084f7-aa91-424a-aa7d-5b75dd4489ee

1. A method of molding an article, said method comprising the steps of:
providing a mold, said mold including a mold channel having an opening therein;
sliding a mold plate in a direction parallel to said mold channel and into a first position within said mold, wherein in said first position said mold plate extends through said opening and into said channel to create an undercut feature in said article;
placing a material within said mold to create said article;
molding said article from said material, wherein said molding of said article includes heating said material in said mold and rotating said mold;
sliding said mold plate in a direction parallel to said mold channel and into a second position within said mold, wherein in said second position said mold plate does not extend into said channel through said opening; and
removing said molded article from said mold, said article containing an undercut feature.
2. The method of claim 1 wherein said mold plate has an edge portion, said edge portion having a mold edge and a recessed edge; and
wherein in said first position said mold edge extends through said opening into the mold channel to create said undercut feature and in said second position said recessed edge is in alignment with, and does not extend through, said opening such that a molded article having an undercut feature may be removed from said mold channel.
3. The method of claim 1 wherein said mold has a plurality of adjacent mold channels to create a plurality of molded features in an article.
4. The method of claim 1 wherein said mold channel has a plurality of openings in said channel to create a series of undercut features in a molded article.
5. A method of molding an article, said method comprising the steps of:
providing a mold, said mold including a mold channel defined by opposed first and second sidewalls, at least one of said sidewalls having an opening therein;
selecting between a first position in which a mold plate extends through said opening in one of said sidewalls into said channel and towards the other of said sidewalls to create an undercut feature in said article and a second position in which said mold plate does not extend through said opening and into said channel so that an undercut feature is not created in said article;
placing a material within said mold to create said article;
molding said article from said material, said step of molding said article including heating said material in said mold and rotating said mold; and
removing said molded article from said mold.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A system for determining linear position, the system comprising:
a magnet having a first magnetic pole and a second magnetic pole, wherein the first magnetic pole and the second magnetic pole define an axis of the magnet; and
a magnetoresistive sensor comprising a magnetoresistive sensor structure that includes a Wheatstone bridge circuit including a plurality of anisotropic magnetoresistors, the magnetoresistive sensor structure defining a plane that, in the system, is oriented out-of-plane with the axis of the magnet,
wherein, in operation, the magnet travels, with respect to the magnetoresistive sensor, along a substantially linear path of travel that is substantially parallel to the plane defined by the sensor structure, such that the sensor operates in a saturation mode when the magnet is located along a given portion of the path of travel and, when operating in the saturation mode, the magnetoresistive sensor produces an electrical signal that corresponds with a linear position of the magnet along the given portion of the path of travel, the electrical signal approximates a third order polynomial and includes only a single mid-point crossing as the magnet travels along the given portion of the path of travel in a single direction.
2. The system of claim 1, wherein the plane defined by the sensor structure is substantially perpendicular to the axis of the magnet.
3. The system of claim 1, wherein the path of travel is arranged along a line that is a first distance from an approximate center of the magnetoresistive sensor structure in a first Cartesian coordinate axis and a second distance from the first Cartesian coordinate axis in a second Cartesian coordinate axis.
4. The system of claim 3, wherein the first distance is measured in the plane defined by the magnetoresistive sensor structure and the second distance is measured along a line that is orthogonal to the plane defined by the magnetoresistive sensor structure.
5. The system of claim 1, wherein the plurality of magnetoresistors comprise ferrous materials.
6. The system of claim 1, wherein the Wheatstone bridge circuit comprises four magnetoresistors arranged in a diamond-shaped pattern, wherein each side of the diamond-shaped pattern includes a single one of the four resistors.
7. The system of claim 1, further comprising signal conditioning circuitry for receiving the electrical signal from the magnetoresistive sensor and converting the electrical signal to a linear position of the magnet along the given portion of the path of travel.
8. A system for determining linear position, the system comprising:
a magnet having a first magnetic pole and a second magnetic pole, wherein the first magnetic pole and the second magnetic pole define an axis of the magnet; and
a plurality of magnetoresistive sensors, each of the plurality of magnetoresistive sensors including a magnetoresistive sensor structure that includes a Wheatstone bridge circuit including a plurality of anisotropic magnetoresistors, each magnetoresistive sensor structure defining a respective plane, the defined planes of the magnetoresistive sensor structures being oriented out-of-plane with the axis of the magnet in a substantially coplanar fashion with one another, the plurality of magnetoresistive sensors being arranged along a first line and having substantially the same angular orientation with respect to one another,
wherein, in operation:
the magnet travels, with respect to the magnetoresistive sensors, along a substantially linear path of travel that is substantially parallel to (i) the respective planes defined by the sensor structures and (ii) the first line;
at least one of the magnetoresistive sensors of the plurality operates in a saturation mode when the magnet is located along a particular portion of the path of travel; and
when operating in the saturation mode, the magnetoresistive sensors each produce an electrical signal that corresponds with a linear position of the magnet along the particular portion of the travel path, each electrical signal approximating a third order polynomial and having only a single mid-point crossing as the magnet travels, in a single direction, along the particular portion of the path of travel corresponding with each respective electrical signal.
9. The system of claim 8, wherein the planes defined by the sensor structures are substantially perpendicular to the axis of the magnet.
10. The system of claim 8, wherein the path of travel is arranged along a second line, the second line being a first distance from the first line in a first Cartesian coordinate axis and a second distance from the first Cartesian coordinate axis in a second Cartesian coordinate axis.
11. The system of claim 8, further comprising signal conditioning circuitry for receiving the respective electrical signals from the plurality of magnetoresistive sensors and determining a linear position of the magnet along the particular portion of the path of travel based on the electrical signals.
12. A method for detecting linear position comprising:
providing a magnet having a first magnetic pole and a second magnetic pole, wherein the first magnetic pole and the second magnetic pole define an axis of the magnet;
providing a magnetoresistive sensor comprising a magnetoresistive sensor structure that includes a Wheatstone bridge circuit including a plurality of anisotropic magnetoresistors, the magnetoresistive sensor structure defining a plane that is oriented out-of-plane with the axis of the magnet; and
receiving an electrical signal produced by the magnetoresistive sensor, the electrical signal corresponding with a linear position of the magnet along a given portion of a path of travel, the path of travel being substantially parallel with the plane, wherein the magnetoresistive sensor operates in a saturation mode when the magnet is located along the given portion of the path of travel and wherein the electrical signal produced by the magnetoresistive sensor approximates a third order polynomial and includes only a single mid-point crossing as the magnet travels along the given portion of the path of travel in a single direction.
13. The method of claim 12, wherein the plane defined by the sensor structure is substantially perpendicular to the axis of the magnet.
14. The method of claim 12, wherein the electrical signal produced by the magnetoresistive sensor comprises an analog signal and the method further comprises:
amplifying the analog signal;
converting the analog signal to a digital value; and
determining the linear position of the magnet along the given portion of the path of travel based on the digital value.