1. In combination, a mounting for setting diamonds in a row, said mounting and diamonds forming a jewelry item,
each of said diamonds comprising a culet at its bottom and said mounting comprising a divot in which said culet rests,
said mounting comprising a single piece structure having prongs spaced apart along the dimension of said row,
said prongs formed as two rows of prongs located on opposite sides of said stones, each of said successive prongs separated from each other by metal supporting said diamonds, said metal between said prongs forming a valley to reveal the sides of said diamonds,
each of said prongs in said two rows of prongs located opposite to each other and holding two successive precious stones,
said divot located in said mounting between pairs of successive prongs in said two rows of prongs to receive and support the culet of a diamond set between and by said opposite prongs,
spaced apart apertures formed in the bottom of said mounting along the dimension of said row, with individual ones of said apertures located between opposite prongs in said rows of prongs, said apertures aligned with said opposite prongs and located between successive stones,
each of said diamonds being supported and held in place in said divot and by said prongs, whereby a substantial portion of the sides of said diamonds is visible.
2. The combination as in claim 1, wherein said mounting comprises a repetitive X shaped structure at the bottom thereof with the cross-over of said X shaped structure being below said divot which holds said diamonds, such X shaped structure forming said spaced apart apertures, said X shaped structure extending the length of said mounting.
3. The combination as in claim 1 or 2, wherein said mounting structure comprises opposite apexes spaced apart along said setting, said shared-prong formed at said opposite apexes, said spaced-apart apertures comprising diamond shapes with the center of said apertures being located between said opposite apexes.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method for manufacturing a component having a layer construction, starting from a semiconductor substrate, the method comprising:
providing at least one conductor track on the semiconductor substrate, the conductor track extending laterally on a surface of the substrate and being in direct contact with at least one connection area in the substrate;
producing at least one functional element in a functional layer provided on the conductor track, wherein the conductor track is electrically connected to the at least one functional element;
producing, after completion of the layer construction, a trench-like insulating frame surrounding the at least one connection area of the substrate and vertically extending over the entire substrate thickness in the substrate using a back-side trenching process;
fully filling up the trench-like insulating frame with an electrically insulating polymer; and
applying, on the back side of the component, a patterned metallization that is connected to the connection area; and
forming at least one terminal pad;
wherein the connection area is electrically insulated from adjacent surrounding areas of the substrate by the trench-like insulating frame.
2. A method for manufacturing a component having a layer construction, starting from a semiconductor substrate, the method comprising:
providing at least one conductor track on the semiconductor substrate, the conductor track extending laterally on a surface of the substrate and being in direct contact with at least one connection area in the substrate;
producing at least one functional element in a functional layer provided on the conductor track, wherein the conductor track is electrically connected to the at least one functional element;
producing, after completion of the layer construction, a trench-like insulating frame surrounding the at least one connection area of the substrate and vertically extending over the entire substrate thickness in the substrate using a back-side trenching process;
fully filling up the trench-like insulating frame with an electrically insulating polymer; and
applying, on the back side of the component, a patterned metallization that is connected to the connection area; and
forming at least one terminal pad;
wherein the connection area is electrically insulated from adjacent surrounding areas of the substrate by the trench-like insulating frame, and wherein the metallization is applied on the back side of the component and patterned prior to the back-side trenching process, so that the patterned metallization forms an etching mask for the back-side trenching process subsequently carried out.
3. The method of claim 1, wherein the insulating frame is expanded in at least one of a middle area and a base area by isotropic etching.
4. The method of claim 1, wherein the polymer for filling the insulating frame is applied to the back side of the substrate by spinning or spraying under vacuum conditions.
5. The method of claim 1, wherein the polymer filling is planarized by fine grinding andor by chemical-mechanical polishing.