What is claimed is:
1. A lightweight cement composition for cementing a subterranean zone penetrated by a well bore comprising:
a coarse particulate hydraulic cement;
an ultrafine particulate hydraulic cement mixture comprised of slag cement and a Portland or equivalent cement present in an amount in the range of from about 50% to about 150% by weight of said coarse particulate hydraulic cement in said composition;
fly ash present in an amount in the range of from about 50% to about 150% by weight of said coarse particulate hydraulic cement in said composition;
fumed silica present in an amount in the range of from about 20% to about 60% by weight of said coarse particulate hydraulic cement in said composition;
hollow glass spheres present in an amount sufficient to impart a density to said cement composition in the range of from about 9 to about 13 pounds per gallon; and
water present in an amount sufficient to form a slurry.
2. The composition of claim I wherein said coarse particulate hydraulic cement has a particle size no greater than about 118 microns and a specific surface area no less than about 2800 square centimeters per gram.
3. The composition of claim 1 wherein said coarse particulate hydraulic cement is API Class G Portland or the equivalent cement.
4. The composition of claim 1 wherein said slag cement in said ultrafine cement mixture has a particle size no greater than about 30 microns, a mean particle size of 6 microns and a specific surface area no less than about 6000 centimeters per gram.
5. The composition of claim 1 wherein said Portland or equivalent cement in said ultrafine cement mixture has a particle size no greater than about 30 microns, a mean particle size of 6 microns and a specific surface area no less than about 6000 centimeters per gram.
6. The composition of claim 1 wherein said slag cement in said ultrafine cement mixture is present in said mixture in an amount of at least about 50% by weight of said mixture.
7. The composition of claim 1 wherein said fly ash is ASTM Class F fly ash.
8. The composition of claim 1 wherein said hollow glass spheres are present in an amount in the range of from about 21% to about 310% by weight of said coarse particulate hydraulic cement in said composition.
9. The composition of claim 1 wherein said water is selected from the group consisting of fresh water, saturated salt solutions and unsaturated salt solutions.
10. The composition of claim 9 wherein said water is present in an amount in the range of from about 128% to about 400% by weight of said coarse particulate hydraulic cement in said composition.
11. The composition of claim 1 which further comprises a fluid loss control additive.
12. The composition of claim 11 wherein said fluid loss control additive is a mixture of a graft copolymer comprised of a backbone of lignin, lignite or salts thereof and a grafted pendant group of 2-acrylamido-2-methylpropanesulfonic acid and a copolymer or copolymer salt of N,N-dimethylacrylamide and 2-acrylamido-2-methylpropanesulfonic acid.
13. The composition of claim 12 wherein said fluid loss control additive is present in an amount in the range of from about 0.2% to about 8% by weight of said coarse particulate hydraulic cement in said composition.
14. The composition of claim 1 which further comprises a cement composition set accelerator.
15. The composition of claim 14 wherein said cement composition set accelerator is comprised of calcium chloride and is present in an amount in the range of from about 0.2% to about 12% by weight of said coarse particulate hydraulic cement in said composition.
16. The composition of claim 1 which further comprises a cement composition dispersing agent.
17. The composition of claim 16 wherein said cement composition dispersing agent is the condensation product of acetone, formaldehyde and sodium sulfite and is present in an amount in the range of from about 0.2% to about 8% by weight of said coarse particulate hydraulic cement in said composition.
18. The composition of claim 1 which further comprises a cement composition set retarder.
19. The composition of claim 18 wherein said cement composition set retarder is selected from the group consisting of a copolymer of 2-acrylamido-2-methylpropane sulfonic acid and acrylic acid and a copolymer of 2-acrylamido-2-methylpropane sulfonic acid and itaconic acid and is present in an amount in the range of from about 0.2% to about 8% by weight of said coarse particulate hydraulic cement in said composition.
20. The composition of claim 1 which further comprises silica flour to prevent set cement strength retrogression at elevated temperatures present in an amount in the range of from about 20% to about 60% by weight of said coarse particulate hydraulic cement in said composition.
21. A method of cementing a subterranean zone penetrated by a well bore comprising the steps of:
(a) preparing a lightweight cement composition comprised of a coarse particulate hydraulic cement, an ultrafine particulate hydraulic cement mixture of slag cement and a Portland or equivalent cement, fly ash, finned silica, hollow glass spheres and sufficient water to form a slurry;
(b) placing said cement composition in said subterranean zone; and
(c) allowing said cement composition to set into a hard impermeable mass.
22. The method of claim 21 wherein said coarse particulate hydraulic cement has a particle size no greater than about 118 microns and a specific surface area no less than about 2800 square centimeters per gram.
23. The method of claim 21 wherein said coarse particulate hydraulic cement is APJ Class G Portland or the equivalent cement.
24. The method of claim 21 wherein said slag cement in said ultrafine cement mixture has a particle size no greater than about 30 microns, a mean particle size of 6 microns and a specific surface area no less than about 6000 centimeters per gram.
25. The method of claim 21 wherein said Portland or equivalent cement in said ultrafine cement mixture has a particle size no greater than about 30 microns, a mean particle size of 6 microns and a specific surface area no less than about 6000 centimeters per gram.
26. The method of claim 21 wherein said slag cement in said ultrafine cement mixture is present in said mixture in an amount of at least about 50% by weight of said mixture.
27. The method of claim 21 wherein said fly ash is ASTM Class F fly ash.
28. The method of claim 21 wherein said ultrafine cement mixture of slag cement and a Portland or equivalent cement is present in said cement composition in an amount in the range of from about 50% to about 150% by weight of said coarse particulate hydraulic cement therein.
29. The method of claim 21 wherein said fly ash is ASTM Class F fly ash.
30. The method of claim 21 wherein said fumed silica is present in said composition in an amount in the range of from about 20% to about 60% by weight of said coarse particulate hydraulic cement therein.
31. The method of claim 21 wherein said hollow glass spheres are present in said composition in an amount in the range of from about 21% to about 310% by weight of said coarse particulate hydraulic cement therein.
32. The method of claim 21 wherein said water is selected from the group consisting of fresh water, saturated salt solutions and unsaturated salt solutions.
33. The method of claim 32 wherein said water is present in said composition in an amount in the range of from about 128% to about 400% by weight of said coarse particulate hydraulic cement therein.
34. The method of claim 21 wherein said composition further comprises a fluid loss control additive.
35. The composition of claim 21 wherein said fluid loss control additive is a mixture of a graft copolymer comprised of a backbone of lignin, lignite or salts thereof and a grafted pendant group of 2-acrylamido-2-methylpropanesulfonic acid and a copolymer or copolymer salt of N,N-dimethylacrylamide and 2-acrylamido-2-methylpropanesulfonic acid.
36. The composition of claim 21 wherein said fluid loss control additive is present in said composition in an amount in the range of from about 0.2% to about 8% by weight of said coarse particulate hydraulic cement in said composition.
37. The method of claim 21 wherein said subterranean zone has a temperature in the range of from about 45 F. to about 100 F. and said cement composition further comprises a cement composition set accelerator and a cement composition dispersing agent.
38. The method of claim 37 wherein said cement composition set accelerator is calcium chloride and is present in said composition in an amount in the range of from about 0.2% to about 12% by weight of said coarse particulate hydraulic cement therein.
39. The method of claim 21 wherein said cement composition dispersing agent is the condensation product of acetone, formaldehyde and sodium sulfite and is present in said composition in an amount in the range of from about 0.2% to about 8% by weight of said coarse particulate hydraulic cement therein.
40. The method of claim 21 wherein said subterranean zone has a temperature in the range of from about 100 F. to about 230 F. and said cement composition further comprises a cement composition set accelerator.
41. The method of claim 40 wherein said cement composition set accelerator is calcium chloride and is present in said composition in an amount in the range of from about 0.2% to about 12% by weight of said coarse particulate hydraulic cement composition.
42. The method of claim 21 wherein said subterranean zone has a temperature in the range of from about 230 F. to about 270 F. and said cement composition further comprises a cement composition set retarder and silica flour to prevent set cement strength retrogression.
43. The method of claim 42 wherein said cement composition set retarder is selected from the group consisting of a copolymer of 2-acrylamido-2-methylpropane sulfonic acid and acrylic acid and a copolymer of 2-acrylamido-2-methylpropane sulfonic acid and itaconic acid and is present in said composition in an amount in the range of from about 0.2% to about 8% by weight of said coarse particulate hydraulic cement therein.
44. The method of claim 42 wherein said silica flour is present in said composition in an amount in the range of from about 20% to about 60% by weight of said coarse particulate hydraulic cement therein.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method of fabricating a composite semiconductor structure, the method comprising:
providing a first substrate comprising:
a first surface; and
a pedestal, wherein:
the pedestal extends from the first surface to a predetermined height; and
the pedestal extends in a direction normal to the first surface;
providing a second substrate comprising a first material and a recess;
attaching an element made of a second material to the pedestal;
bonding the element in the recess of the second substrate to form the composite semiconductor structure, wherein the first surface of the first substrate does not contact the second substrate; and
removing at least a portion of the first substrate from the composite structure.
2. A method of fabricating a composite semiconductor structure, the method comprising:
providing a first substrate comprising:
a first surface; and
a pedestal, wherein:
the pedestal extends from the first surface to a predetermined height; and
the pedestal extends in a direction normal to the first surface;
providing a second substrate comprising a first material and a recess;
attaching an element made of a second material to the pedestal; and
bonding the element in the recess of the second substrate to form the composite semiconductor structure, wherein the first surface of the first substrate does not contact the second substrate.
3. The method of fabricating the composite semiconductor structure as recited in claim 2, the method further comprising removing at least a portion of the first substrate from the composite structure.
4. The method of fabricating the composite semiconductor structure as recited in claim 2 wherein the first substrate further comprises a splitting region in the pedestal.
5. The method of fabricating the composite semiconductor structure as recited in claim 4, wherein the splitting region comprises an implanted region.
6. The method of fabricating the composite semiconductor structure as recited in claim 2, wherein:
the recess has a depth;
the first substrate further comprises a splitting region in the pedestal;
the splitting region is a given distance from the predetermined height of the pedestal;
the element has a given thickness;
the depth of the recess is less than the sum of the given thickness of the element and the given distance between the splitting region and the predetermined height of the pedestal.
7. The method of fabricating the composite semiconductor structure as recited in claim 2, wherein:
the second substrate has a device surface; and
one or more structures are on the device surface.
8. The method of fabricating the composite semiconductor structure as recited in claim 7, wherein the one or more structures comprise at least one of an optical element or an integrated circuit.
9. The method of fabricating the composite semiconductor structure as recited in claim 2, wherein:
the first material is silicon; and
the second material comprises at least one of III-V material, ferromagnetic materials, or nonlinear optical materials.
10. The method of fabricating the composite semiconductor structure as recited in claim 2, further comprising forming the pedestal, wherein the pedestal is formed by masking and etching.
11. A method of fabricating a composite semiconductor structure, the method comprising:
providing a SOI substrate;
providing a photonic die;
providing an assembly substrate, the assembly substrate comprising:
a first surface; and
a pedestal, wherein:
the pedestal extends from the first surface to a predetermined height; and
the pedestal extends in a direction normal to the first surface;
mounting the photonic die to the pedestal of the assembly substrate; and
joining the photonic die to the SOI substrate to form the composite structure, wherein the first surface of the assembly substrate does not contact the SOI substrate.
12. The method of fabricating the composite semiconductor structure as recited in claim 11, the method further comprising removing at least a portion of the assembly substrate from the composite structure.
13. The method of fabricating the composite semiconductor structure as recited in claim 11, wherein the assembly substrate further comprises a second pedestal and the method further comprises:
attaching a second die to the second pedestal; and
bonding the second die to the SOI substrate.
14. The method of fabricating the composite semiconductor structure as recited in claim 13, wherein the die and the second die are both diced from a common semiconductor substrate.
15. The method of fabricating the composite semiconductor structure as recited in claim 11, wherein the SOI substrate comprises a plurality of silicon-based devices.
16. The method of fabricating the composite semiconductor structure as recited in claim 15, wherein the plurality of silicon-based devices comprise an electrical or optical element.
17. The method of fabricating the composite semiconductor structure as recited in claim 11, wherein the die comprises a laser gain medium, a detector active medium, or a modulator active medium.
18. The method of fabricating the composite semiconductor structure as recited in claim 11, further comprising aligning the assembly substrate with the SOI substrate before bonding the die to the SOI substrate.
19. The method of fabricating the composite semiconductor structure as recited in claim 11, wherein providing the assembly substrate comprises oxidizing a silicon substrate.
20. The method of fabricating the composite semiconductor structure as recited in claim 11, wherein the pedestal comprises a splitting region.