Author: claimsbot

What is claimed is:

1. A surface acoustic wave filter comprising:
a piezoelectric substrate;
an exciting electrode formed on the piezoelectric substrate and exciting a surface acoustic wave; and
a receiving electrode receiving the surface acoustic wave,
wherein both the exciting and receiving electrodes are provided with interdigital electrode fingers having a period p,
either one of the exciting and receiving electrodes is constructed of a plurality of interdigital electrode sub-units having substantially the same electrode surface areas occupied by interdigital electrode fingers, and
said plurality of interdigital electrode sub-units are disposed in a direction perpendicular to a propagation direction of the excited surface acoustic wave and have a positional relation such that the interdigital electrode sub-units are offset to each other by (n)p, wherein n is an integer, in a direction parallel to the propagation direction of the surface acoustic wave.
2. A surface acoustic wave filter according to claim 1, wherein said plurality of interdigital electrode sub-units are formed as a plurality of separate electrodes.
3. A surface acoustic wave filter according to claim 2, wherein the other electrode of the exciting and receiving electrodes than that constructed of said plurality of interdigital electrode sub-units is constructed as a single electrode.
4. A surface acoustic wave filter according to claim 2, wherein the other electrode of the exciting and receiving electrodes than that constructed of said plurality of interdigital electrode sub-units is constructed of a number of electrodes arranged in a direction perpendicular to the propagation direction of the surface acoustic wave, the number of the electrodes being the same as the number of the interdigital electrode sub-units.
5. A surface acoustic wave filter according to claim 1, wherein said plurality of interdigital electrode sub-units are formed in a single interdigital electrode in which ends of the electrode fingers of the interdigital electrode sub-units are connected to each other by connection electrode fingers.
6. A surface acoustic wave filter according to claim 5, wherein the other electrode of the exciting and receiving electrodes than that constructed of said plurality of interdigital electrode sub-units is constructed as a single electrode.
7. A surface acoustic wave filter according to claim 5, wherein the other electrode of the exciting or receiving electrodes than that constructed of said plurality of interdigital electrode sub-units is constructed of a number of electrodes arranged in a direction perpendicular to the propagation direction of the surface acoustic wave, the number of the electrodes being the same as the number of the interdigital electrode sub-units.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

We claim:

1. A cord spool for winding a lift cord for lifting and lowering a window covering,
the cord spool including an elongated generally cylindrical body with a large diameter end and a small diameter end and a circumferential outer surface of a given length extending there between wherein the circumferential outer surface having a plurality of generally parallelly extending longitudinal ribs.
2. The cord spool of claim 1 wherein, the ribs extend along the entire given length of the outer surface from the large diameter end to the small diameter end.
3. The cord spool of claim 1 wherein the ribs are short ribs which extend only along a first longitudinal section of the spool and, the first longitudinal section starting at the large diameter end and extending a part of the entire given length of the spool towards the small diameter end.
4. The cord spool of claim 1, wherein a first number of long ribs extend along the entire given length of outer surface of the spool, and a second number of short ribs extend along a first longitudinal section of the spool and are shorter than the long ribs and the first longitudinal spool section starting at the large diameter end and extending a part of the entire given length of the spool towards the small diameter end.
5. The cord spool of claim 4, wherein, the first spool section the long and short ribs alternate about the circumference of the spool.
6. The cord spool of claim 1 wherein the ribs are tapered being wider at the large diameter end and progressively narrowing in the direction of the small diameter end.
7. The cord spool of claim 4 wherein the short ribs extending only along the first spool section have a stronger taper than the long ribs extending along the entire given length of the spool.
8. The cord spool of claim 1 further including, the cord spool is a conical spool including a first spool diameter at the large diameter end and a second spool diameter at the small diameter end, the first spool diameter being larger than the second spool diameter, and the diameter of the spool decreasing over the entire given length of the spool from first spool end to second spool end.
9. The cord spool of claim 8 further including, the first spool section starting at the large diameter end and extending a part of the entire given length of the spool towards the small diameter end, a second spool portion extending towards the small diameter end after the first spool section, and the first spool section is conical with a stronger taper than the second spool section.
10. The cord spool of claim 9 wherein, the length of the second spool section is longer than the length of the first spool portion.
11. The cord spool of claim 1 wherein the large diameter end includes a mounting means for rotatably mounting the cord spool in a support means, and wherein the support means includes a camming surface adjacent the large diameter end for moving a first winding of the cord about the spool in a direction away from the large diameter end of the cord spool, such that a next winding will not overlap the first winding.
12. The cord spool of claim 1 further including at least one longitudinally extending slot in the small diameter end adapted to receive a second end of the lift cord for attachment to the spool.
13. The cord spool of claims 1 further including an end plug attachable to the small diameter end and adapted to receive a second end of the lift cord for attachment to the spool.
14. The cord spool of claim 13 wherein, the end plug has a longitudinally extending cylindrical portion forming an extension to the cord spool.
15. The cord spool of claim 14 wherein, the cylindrical portion of the end plug is a conical portion having an increasing diameter extending away from the small diameter end.
16. The cord spool of claim 13 wherein the small diameter end and end plug include respective co-operating features which are able to secure resiliently the elongated generally cylindrical body and the end plug in a plurality of relative angular positions such that the end plug may be snap-indexed between the relative angular positions to adjust cord length.
17. A lifting and lowering mechanism for a blind, including:
a rotatable drive shaft;
at least one lift cord;
and a cord spool for winding the at least one lift cord and mounted for rotation with the winding shaft, the cord spool having a large diameter end and a small diameter end, defining a conical circumferential winding surface therebetween for the cord;
wherein the cord spool has a plurality of longitudinally extending, radial ribs on the winding surface, which are located at least on the circumferential area adjoining the large diameter end.
18. The lifting and lowering mechanism of claim 17, further including an end plug attached to the small diameter end to receive one end of the at least one lift cord.
19. The lifting and lowering mechanism of claim 18, wherein the end plug has a cylindrical portion forming an extension to the spool, but being without a taper or with a taper opposite to the spool.
20. The lifting and lowering mechanism of claim 18, wherein the end plug has a plurality of circumferentially distributed radial slots, each of which is adapted to receive an end of the at least one lift cord for attachment.
21. The lifting and lowering mechanism of claim 17, further including a support for rotatably supporting the cord spool.
22. The lifting and lowering mechanism of claim 21, wherein the support has a camming surface adjacent the large diameter end of the cord spool for guiding the lift cord to be wound onto the spool.
23. The lifting and lowering mechanism of claim 21 wherein a first side of the support is arranged to rotatably support the cord spool and a second side, opposite the first side, of the support is arranged to support a drive mechanism, such as a motor.
24. The lifting and lowering mechanism of claim 12 further including a grommet for insertion into a corresponding aperture in a head rail and for guiding said at least one lift cord to or from the cord spool, the support having a base arranged to hold the grommet, such that the support can be fixed to a head rail by means of the grommet.
25. The lifting and lowering mechanism of claim 22 further including a grommet for insertion into a corresponding aperture in a head rail and for guiding said at least one lift cord to or from the cord spool, the support having a base arranged to hold the grommet, such that the support can be fixed to a head rail by means of the grommet.

1. An aircraft comprising:
a plurality of spanner bars, each spanner bar having a pattern of mounting holes separated by lands; and
a plurality of nut plates engaging the spanner bars, each nut plate including:
a body;
a mounting surface affixed to the body, the mounting surface being disposed against at least one of the spanner bars; and
a first mounting post extending from the mounting surface and having a first undercut portion that abuts one of the lands;
a second mounting post extending from the mounting surface and having a second undercut portion that abuts one of the lands; and
a generally L-shaped spring lever comprising a first end cantilevered from the body; a second, free end; a retractable locking member extending generally downwardly from the free end of the spring lever and movable through a gap between a locked position and an unlocked position; and a release grip ledge adjacent to and extending generally transversely with respect to the locking member,

wherein the first and second mounting posts are configured to extend into corresponding mounting holes in at least one of the plurality of spanner bars; and
wherein the locking member is configured to occupy at least a portion of the same hole as the second mounting post to prevent the nut plate from disengaging at least one of the spanner bar bars when the spring lever is in a locked position.
2. The aircraft of claim 1, further comprising a plurality of wire bundles mounted to the nut plates.
3. The aircraft of claim 1, further comprising tubing mounted to the nut plates.
4. The aircraft of claim 1, wherein the body further includes an internal bore having an internally threaded portion, the posts located on opposite sides of the bore.
5. The aircraft of claim 4, wherein, the bore is offset from the posts by a distance such that the bore is aligned with an opening in the member when the nut plate engages its corresponding spanner bar.
6. The aircraft of claim 1, wherein the portion of the posts abutting against the lands are solid and elliptical in cross section.
7. The aircraft of claim 1, wherein each post terminates in an enlarged resilient cap, the cap and the mounting surface forming the undercut portion, which is wider than the spanner bar’s gauge, the cap capturing an inner surface of the hole in the spanner bar as the nut plate is pushed into engagement, and wherein the locking member of the L-shaped spring lever makes an audible noise as it snaps onto one of the holes as the nut plate is pushed into engagement with the spanner bar.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

What is claimed is:

1. A method for manufacturing a semiconductor device, comprising:
forming a resist post on a connection pad of a semiconductor chip;
forming an insulating layer that covers the semiconductor chip and the resist post;
removing a part of the insulating layer to expose a surface of the resist post;
removing the resist post to form a through hole in the insulating layer, the through hole thereby exposing the connection pad; and
forming a wiring layer that is in electrical contact with the connection pad via the through hole and is elongated over the insulating layer.
2. A method according to claim 1, wherein the wiring layer is formed by plating.
3. A method according to claim 1, further comprising:
connecting a circuit board and the insulating layer having the wiring layer after forming the wiring.
4. A method according to claim 1, further comprising:
connecting a support member to a rear surface of the semiconductor chip that is on the side opposite to a surface on which the connection pad is formed, after forming the resist post; and
removing the support member after forming the wiring layer.
5. A method according to claim 1, wherein the resist post has a shape whose horizontal cross sectional area becomes larger from a bottom surface of the resist post contacting the connection pad toward the other surface of the resist post that is on the side opposite to the bottom surface.
6. A method according to claim 1, wherein a value found by dividing the depth of the through hole by a reduced radius for a surface that is parallel to an opening surface of the through hole and that has a maximum surface area is equal to or greater than 1.
7. A method according to claim 1, further comprising:
forming a groove in a front surface of the insulating layer, after exposing the surface of the resist post, wherein the groove is connecting to the through hole, and a part of the wiring layer is embedded in the groove.
8. A method for manufacturing a semiconductor device, comprising:
forming a first resist post on a connection pad of a semiconductor chip;
forming a second resist post on a support member;
mounting the semiconductor chip on the support member apart from the second resist post;
forming an insulating layer that covers the semiconductor chip, the first resist post, and the second resist post;
removing the insulating layer to expose a surface of the first resist post and a surface of the second resist post;
removing the first resist post and the second resist post to form a first through hole and a second through hole in the insulating layer, the first through hole thereby exposing the connection pad, and the second through hole thereby exposing the support member;
forming a wiring layer that is in electrical contact with the connection pad via the first through hole and is in contact with the support member via the second through hole and is elongated over the insulating layer; and
removing at least a part of the support member to expose the wiring layer as a rear pad in a surface of the insulating layer opposite to a surface in which the first through hole is formed.
9. A method according to claim 8, wherein the wiring layer is formed by plating.
10. A method according to claim 8, further comprising:
preparing a plurality of the semiconductor devices;
connecting the rear pad of one of the semiconductor devices to the wiring layer of another semiconductor device electrically to laminate the plurality of the semiconductor devices.
11. A method according to claim 10, wherein the rear pad of one of the semiconductor devices and the wiring layer of another semiconductor device are connected via a solder bump or a conductive paste.
12. A method according to claim 8, further comprising:
preparing a plurality of the semiconductor devices;
forming a build-up multi-layer substrate on the wiring layer of each of the semiconductor devices, the build-up multi-layer substrate having a connection portion on a surface opposite to a surface facing the wiring layer;
connecting the rear pad of one of the semiconductor devices to the connection portion of the build-up multi-layer substrate formed on another semiconductor device electrically to laminate the plurality of the semiconductor devices.
13. A semiconductor apparatus having a first semiconductor device,
said first semiconductor device comprising:
a first semiconductor chip having a first front surface having thereon a first connection pad and a first back surface opposing to said first front surface;
a first resin body encapsulating said first semiconductor chip with leaving said first back surface of said semiconductor chip exposed from said first resin body, said first back surface of said first semiconductor chip being thereby in substantially same plane as a surface of said first resin body;
a first through hole selectively formed in said first resin body to expose a part of said first connection pad;
a second through hole penetrating said first resin body; and
a first conductive layer connected to said part of said first connection pad via said first through hole, elongated over said first resin body, inserted in said second through hole and terminated to be in substantially same plane as the surface of said first resin body.
14. The apparatus as claimed in claim 13, wherein each of said first and second through holes is filled up with said first conductive layer.
15. The apparatus as claimed in claim 14, wherein said first conductive layer is formed continuously over a whole area by said first conductive layer being formed in one time.
16. The apparatus as claimed in claim 13, further comprising a second semiconductor device and a conductor,
said second semiconductor device comprising:
a second semiconductor chip having a second front surface having thereon a second connection pad and a second back surface opposing to said second front surface;
a second resin body encapsulating said second semiconductor chip with leaving said second back surface of said second semiconductor chip exposed from said second resin body, said second back surface of said second semiconductor chip being thereby in substantially same plane as a surface of said second resin body;
a third through hole selectively formed in said second resin body to expose a part of said second connection pad;
a fourth through hole penetrating said second resin body; and
a second conductive layer connected to said part of said second connection pad via said third through hole, elongated over said second resin body, inserted in said fourth through hole and terminated to be in substantially same plane as the surface of said second resin body;

said first semiconductor device being stacked on said second semiconductor device with an intervention of said conductor which electrically connects said first conductive layer to said second conductive layer.
17. The device as claimed in claim 16, wherein each of said first and second through holes is filled up with said first conductive layer and each of said third and fourth through holes is filled up with said second conductive layer.
18. The apparatus as claimed in claim 17, wherein said first conductive layer is formed continuously over a whole area by said first conductive layer being formed in one time and said second conductive layer is formed continuously over a whole area by said second conductive layer being formed in one time.