Author: claimsbot

1. A method for providing remote wireless command and control to an electronic device comprising:
providing a receiver integrated circuit;
configuring receiver integrated circuit to a housing, the housing in the shape of an existing battery type;
replacing an existing battery of the electronic device with the housing configured with the receiver integrated circuit, the existing battery the same as the existing battery type; and
providing a remote control device in electronic communication with the receiver integrated circuit, the remote control device together with the receiver integrated circuit providing wireless command and control to the electronic device.
2. The method for providing remote wireless command and control to an electronic device of claim 1 further wherein the receiver integrated circuit further comprises programmable electronics.
3. The method for providing remote wireless command and control to an electronic device of claim 1, the remote control device comprising a first remote control button and a second remote control button, wherein the first remote control button serves to activate or deactivate the electronic device, and wherein the second remote control button selects a electronic device mode, wherein the electronic device mode is changed by momentarily clicking the second remote control button, and wherein an additional electronic device feature is adjusted by pressing and holding the second remote control button.
4. The method for providing remote wireless command and control to an electronic device of claim 1 wherein the existing electronic device is a night vision scope.
5. The method for providing remote wireless command and control to an electronic device of claim 1, wherein the existing battery type is a AA-battery.
6. A method for providing remote wireless command and control to an electronic device comprising:
providing a receiver integrated circuit;
configuring the receiver integrated circuit to a housing, the housing in the shape of an existing electronic device end cap;
replacing an existing end cap of the electronic device with the housing configured with the receiver integrated circuit, the existing end cap the same as the existing end cap type; and
providing a remote control device in electronic communication with the receiver integrated circuit, the remote control device together with the receiver integrated circuit providing wireless command and control to the electronic device.
7. The method for providing remote wireless command and control to an electronic device of claim 6 further wherein the receiver integrated circuit further comprises programmable electronics.
8. The method for providing remote wireless command and control to an electronic device of claim 6, the remote control device comprising a first remote control button and a second remote control button, wherein the first remote control button serves to activate or deactivate the electronic device, and wherein the second remote control button selects a electronic device mode, wherein the electronic device mode is changed by momentarily clicking the second remote control button, and wherein an additional electronic device feature is adjusted by pressing and holding the second remote control button.
9. The method for providing remote wireless command and control to an electronic device of claim 6, wherein the existing electronic device is a tactical flashlight.
10. A system for providing remote control capability to an existing electronic device comprising:
a remote control module, the remote control module comprising:
a housing, the housing in the shape of an existing battery type; and
a receiver integrated circuit, the receiver integrated circuit providing wireless command and control to the electronic device; and

a remote control device for sending control signals to the remote control module.
11. The system for providing remote control capability to an existing electronic device of claim 10, the remote control device comprising;
a first remote control button; and
a second remote control button, wherein the first remote control button serves to activate or deactivate the electronic device, and wherein the second remote control button selects a electronic device mode, wherein the electronic device mode is changed by momentarily clicking the second remote control button, and wherein an additional electronic device feature is adjusted by pressing and holding the second remote control button.
12. The system for providing remote control capability to an existing electronic device of claim 10, the remote control device further comprising shrink wrap plastic forming an outer protective layer thereof.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A packaged electronic chip, comprising:
a MEMS device having a conductive cap, a MEMS semiconductor substrate, and an output pad outputting an alternating current signal when the MEMS device is actuated;
an integrated circuit having an input pad for receiving the alternating current signal;
a wire bond coupling between the integrated circuit and the MEMS device;
a mechanism including a conductive plate electrically coupled to the conductive cap of the MEMS device and a conductive paddle electrically coupled to the MEMS device that shields the input pad, the output pad andor the wire bond creating a local voltage reference between the conductive plate and the conductive paddle through the MEMS semiconductor substrate and the conductive cap of the MEMS device, the local voltage reference fluctuating with electro-magnetic interference; and
molding material covering at least a portion of the integrated circuit, the wire bond, and the MEMS device.
2. A packaged electronic chip according to claim 1 wherein the conductive
plate and the conductive paddle act as a faraday cage reducing electro-magnetic interference from reaching the input pad, the wirebond, andor the output pad.
3. A packaged electronic chip according to claim 1 wherein the MEMS device and the integrated circuit are stacked within the molding material.
4. A packaged electronic chip according to claim 1 wherein the MEMS device and the integrated circuit are arranged side-by-side.
5. A packaged electronic chip according to claim 1 wherein the conductive plate is encapsulated in the molding material.
6. A packaged electronic chip according to claim 1 wherein the packaged electronic chip is packaged in a lead frame package.
7. A system comprising:
a printed circuit board having a plurality of predefined inputoutput nodes including at least one grounding node; and
a leadframe packaged chip including a leadframe having one or more inputoutput pads and a ground pad; the leadframe packaged chip including:
a MEMS device including a MEMS semiconductor substrate and a conductive cap;
an integrated circuit having a semiconductor substrate;
a wire bond electrically coupling a signal path between the integrated circuit and the MEMS device;
an electrically conductive plate that resides above the wire bond, wherein the conductive plate forms a low impedance path through the conductive cap of the MEMS device and the semiconductor substrate of the MEMS device, the semiconductor substrate of the integrated circuit and to the ground pad and wherein the ground pad is configured to be mounted to the grounding node of the printed circuit board and the inputoutput pads are positioned to be mounted with the predefined inputoutput nodes of the printed circuit board.
8. A system according to claim 7 wherein the ground pad is a conductive paddle.
9. A system according to claim 8 wherein the conductive plate and the conductive paddle act as a faraday cage reducing electro-magnetic interference from reaching the input pad, the wirebond, andor the output pad.
10. The system according to claim 8 wherein the conductive plate forms at least a portion of a top surface of the leadframe packaged chip and wherein a bottom surface includes the conductive paddle.
11. A system according to claim 7 wherein the MEMS device and the integrated circuit are stacked.
12. A system according to claim 7 wherein the leadframe packaged chip includes a molding material.
13. A system according to claim 12 wherein the molding material is an electrical insulator.
14. A system according to claim 12 wherein the conductive plate is encapsulated in the molding material.
15. The system according to claim 12 wherein the conductive plate resides on top of the molding material.
16. The system according to claim 12 wherein the conductive plate is at least partially exposed through the molding material.
17. A system according to claim 7 wherein the MEMS device and the integrated circuit are arranged side-by-side.

1. A method for producing a solid state battery comprising a laminate including a solid electrolyte layer, an active material layer and a current collector layer, said method comprising the steps of:
(a) dispersing an active material powder in a solvent containing a binder and a plasticizer to obtain an active material slurry;
(b) dispersing a solid electrolyte powder in a solvent containing a binder and a plasticizer to obtain a solid electrolyte slurry;
(c) dispersing a current collector powder in a solvent containing a binder and a plasticizer to obtain a current collector slurry;
(d) forming an active material green sheet and a solid electrolyte green sheet using said active material slurry and said solid electrolyte slurry, respectively;
(e) laminating said solid electrolyte green sheet on one surface of said active material green sheet to form a first green sheet group, and forming a current collector green sheet layer on the other surface of said active material green sheet using said current collector slurry to form a second green sheet group;
(f) heating said second green sheet group at not less than 200\xb0 C. and not greater than 400\xb0 C. in an oxidizing atmosphere; and
(g) baking said second green sheet group having heated in said step (f) in a low oxygen atmosphere at a baking temperature higher than the heating temperature in said step (f) to obtain a laminate including a solid electrolyte layer, an active material layer and a current collector layer.
2. The method for producing a solid state battery in accordance with claim 1,
wherein said baking temperature in said step (g) is not less than 700\xb0 C. and not greater than 1000\xb0 C.
3. The method for producing a solid state battery in accordance with claim 1,
wherein said current collector powder comprises at least one selected from the group consisting of copper, nickel, palladium, gold and platinum.
4. The method for producing a solid state battery in accordance with claim 1,
wherein in said step (g), an oxygen equilibrium partial pressure (atm) of said low oxygen atmosphere represented by P1 and said baking temperature (\xb0 C.) represented by T satisfies \u22120.0310 T+33.5\u2212log P1\u22120.0300 T+38.1.
5. The method for producing a solid state battery in accordance with claim 1,
wherein in said step (f), said oxidizing atmosphere contains an oxygen gas, and
said oxidizing atmosphere has an oxygen gas equilibrium partial pressure (P2) of not less than 0.1 atm and not greater than 1.0 atm.
6. The method for producing a solid state battery in accordance with claim 1,
wherein said step (e) further comprises cutting said first green sheet group or said second green sheet group into a specified size.
7. The method for producing a solid state battery in accordance with claim 1,
wherein said method further comprises, after said step (g), forming an external electrode connected to said current collector layer on one surface of said laminate.
8. The method for producing a solid state battery in accordance with claim 1,
wherein said active material powder comprises a first phosphoric acid compound capable of absorbing and releasing lithium ions, and
said solid electrolyte powder comprises a second phosphoric acid compound having lithium ion conductivity.
9. The method for producing a solid state battery in accordance with claim 8,
wherein said first phosphoric acid compound is represented by the following formula (1):
LiMPO4\u2003\u2003(1)
where M represents at least one selected from the group consisting of Mn, Fe, Co and Ni.
10. The method for producing a solid state battery in accordance with claim 8,
wherein said second phosphoric acid compound is represented by the following formula (2):
Li1+XMIIIXTiIV2\u2212X(PO4)\u2003\u2003(2)
where MIII represents at least one selected from the group consisting of Al, Y, Ga, In and La, and 0X0.6.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A system for managing interferences in a satellite system, the system comprising:
a coordination database comprising information regarding a current communications environment of the satellite system; and
a device, in communication with at least one terrestrial terminal operative to communicate with the satellite system and the coordination database, that is operative to perform interference calculations using information in the coordination database in order to determine whether a terrestrial terminal antenna can communicate with the satellite system.
2. The system according to claim 1 wherein the coordination database is located on-board at least one of the satellites.
3. The system according to claim 1 wherein the coordination database is coupled to a terrestrial terminal.
4. The system according to claim 1 wherein the coordination database tracks at least one from the group consisting of (i) geographic coordinates of satellite coverage, (ii) orbital positions of satellites, (iii) frequency, and (iv) time planning in real time.
5. The system according to claim 1 wherein the terrestrial terminal comprises a mobile terrestrial terminal and the device is operative to perform interference calculations for the mobile terrestrial terminal.
6. The system according to claim 5 wherein the device is operative to determine whether the mobile terrestrial terminal can safely operate.
7. The system according to claim 5 wherein the device is operative to determine an extent of operation available to a mobile terrestrial terminal.
8. The system according to claim 1 wherein the device is operative to determine orbital slots for operations using non-compliant antennas.
9. The system according to claim 1 further comprising an antenna simulation device.
10. A method to allow users to communicate with satellites using a non-compliant antenna system, comprising the steps of:
supplying an operator data concerning the non-compliant antenna system;
scanning for satellite capacity;
pointing a terrestrial terminal’s antenna towards a target satellite;
transmitting geoposition data to a software engine; and
conducting an interference calculation to determine whether the terrestrial terminal can safely operate.
11. The method according to claim 10 wherein the data concerning the non-compliant system comprises at least one of the group consisting of (i) antenna geometry, (ii) antenna design, (iii) measured radiation patterns, (iv) radio frequency equipment information, (v) frequency, (vi) power levels, (vii) bandwidth, and (viii) waveforms.
12. The method according to claim 10 wherein the scanning for satellite capacity occurs on a link budget and non-interference basis.
13. The method according to claim 10 further comprising the step of transmitting a confirmation signal from the software engine to the terrestrial terminal if the terrestrial terminal can safely operate.
14. The method according to claim 10 further comprising the step of transmitting a denial signal from the software engine to the terrestrial terminal if the terrestrial terminal cannot safely operate.
15. The method according to claim 13 further comprising the step of continuously conducting interference calculations.
16. The method according to claim 15 further comprising the step of sending a shut down command to the terrestrial terminal if an interference calculation determines the terrestrial terminal cannot safely operate.