Author: claimsbot

1. A method of configuring a network cache to communicate with an authentication server, the method comprising:
receiving at the network cache, from an operator, a first user input specifying a user ID, the user ID representing an identify of a user who is to be authenticated by the network cache during a subsequent authentication;
in response to the first user input, identifying one or more objects that contain the user ID in an authentication database associated with an authentication server, the authentication database containing information relating to a plurality of users to be authenticated by the network cache during subsequent authentication;
retrieving each said identified object that contains the user ID from the authentication database and causing information identifying each said object to be output to the operator;
receiving at the network cache a second user input from the operator, indicating a selection by the operator of an object of said one or more objects, said object containing a plurality of attributes and a separate attribute name for each of the attributes;
in response to the second user input, causing the attributes in the object and the names of the attributes to be output to the operator;
receiving at the network cache a third user input from the operator, specifying a name of an attribute which contains the user ID in the object;
storing, in a configuration database of the network cache, the name of the attribute which contains the user ID, for use by the network cache during subsequent authentication;
receiving at the network cache a fourth user input from the operator specifying a name of an attribute which contains a group ID in the object, the group ID representing an identify of a group to which the user belongs; and
storing, in the configuration database, the name of the attribute which contains the group ID, for use by the network cache during subsequent authentication.
2. A method as recited in claim 1, further comprising:
at the network cache, using the information in the configuration database to communicate with the authentication server.
3. A machine-readable storage medium storing instructions which, when executed by a processor in a network cache, cause the network cache to perform a process that comprises:
receiving at the network cache, from an operator, a first user input specifying a user ID, the user ID representing an identify of a user who is to be authenticated by the network cache during a subsequent authentication;
in response to the first user input, identifying one or more objects that contain the user ID in an authentication database associated with an authentication server;
causing information identifying each said object that contains the user ID to be output to the operator;
receiving at the network cache a second user input from the operator, indicating a selection by the operator of an object of said one or more objects, said object containing a plurality of attributes and a separate attribute name for each of the attributes;
in response to the second user input, causing the attributes in the object and the names of the attributes to be output to the operator;
receiving at the network cache a third user input from the operator, specifying a name of an attribute which contains the user ID in the object; and
storing, in a configuration database of the network cache, the name of said attribute which contains the user ID, for use by the network cache during subsequent authentication.
4. A machine-readable storage medium as recited in claim 3, wherein said process further comprises:
receiving at the network cache a fourth user input from the operator specifying a name of an attribute which contains a group ID in the object, the group ID representing an identify of a group to which the user belongs; and
storing, in the configuration database, the name of the attribute which contains the group ID, for use by the network cache during subsequent authentication.
5. A machine-readable storage medium as recited in claim 4, wherein said process further comprises:
at the network cache, using the information in the configuration database to communicate with the authentication server.
6. A machine-readable storage medium as recited in claim 5, wherein the authentication database contains information relating to a plurality of users to be authenticated by the network cache during subsequent authentication.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A compressor comprising:
a compressor mechanism, said compressor mechanism compressing and discharging a refrigerant, and
a motor driving said compression mechanism;
a stator core having a plurality of annularly combined core elements with a plurality of 3n teeth, where n is a natural number, and a concentrated winding applied over each one of said plurality of teeth;
a rotor rotatably mounted in the stator core, said rotor incorporating a plurality of 2n permanent magnets, a sectional form of at least one of the plurality of permanent magnets having a middle section being nearer to the center of the rotor than an edge section of the permanent magnet.
2. The compressor of claim 1, wherein said plurality of permanent magnets is provided at a larger pitch relative to the stator coil pitch.
3. A compressor of claim 1, wherein respective ones of said plurality of permanent magnets is provided at a larger pitch relative to the pitch of respective ones or the concentrated winding over each one of said plurality of teeth.
4. The compressor of claim 1 wherein
said plurality of permanent magnets are arranged around a rotor center, at least one of said plurality of permanent magnets has a first end and a second end each having respective surfaces facing said stator core and angled toward each other.
5. The compessor of claim 1, wherein
an outer circumference of said rotor has a linear shape at a portion where the permanent magnets are adtacent.
6. A compressor of claim 1, further comprising a heat exchanger, wherein
a refrigerating cycle is enabled by the connection of said compressor and said heat exchanger for forming an air-conditioning device.
7. The compressor of claim 1, further comprising a heat exchanger, wherein
a refrigerating cycle is enabled by the connection of said compressor and said heat exchanger for forming refrigerator.
8. The compressor of claim 1, wherein an interval \u201cd\u201d between the ends of each one of the plurality of teeth is smaller than the width of the winding.
9. The compressor of claim 1, wherein end portions of the adjacent magnets face each other.
10. The compressor of claim 1, wherein said refrigerant includes HFC (Hydro-Fluoro-Carbon).
11. The compressor of claim 1, wherein said refrigerant includes a carbon dioxide.
12. The compressor of claim 1, wherein said refrigerant includes HC (Hydro-Carbon).
13. A compressor comprising:
a compressor mechanism, said compressor mechanism compressing and discharging a refrigerant, and
a motor driving said compression mechanism;
a stator core having a plurality of annularly combined core elements with a plurality of teeth end a concentrated winding applied over each one of said plurality of teeth;
a rotor rotatably mounted in the stator core, said rotor incorporating a plurality of permanent magnets;
formed of two layers and having an arc convex shape toward a center of the rotor, and
including an inside permanent magnet separated by a gap from an outside permanent magnet, a width of the gap being greater than \u2153 of one tooth of the plurality of teeth,

end portions of the plurality of permanent magnets extending to a position adjacent to an outer circumference of the rotor, and said plurality of permanent magnets are multi-layered.
14. The compressor of claim 1, wherein the sectional form of each of the plurality of permanent magnets has a flat shape or a V shape.
15. The compressor of claim 1, wherein the core elements are coupled.
16. The compressor of claim 1, wherein the core elements are coupled at respective sections of the core elements, the respective sections being thin and capable of being bent.

1. A semiconductor device, comprising:
a wiring board that has four sides joined by four corners;
a semiconductor chip that has four chip sides joined by four chip corners, and is disposed on one face of the wiring board; and
a plurality of connection pads formed on the one face of the wiring board, and that are electrically connected to the semiconductor chip,
wherein the semiconductor chip is disposed such that the four chip sides face the corners of the wiring board, and each chip corner of the semiconductor chip is near a respective one of the sides of the wiring board, and
on one face of the wiring board, the wiring board has each corner region being defined by the chip sides that face the each corner and the sides of the wiring board that form the same corner, and the connection pads are disposed in the corner regions.
2. The semiconductor device according to claim 1, further comprising;
a plurality of bumps arranged in a matrix on another face of the wiring board; and
internal wirings that are formed on the wiring board, the internal wirings connecting the bumps to the connection pad.
3. The semiconductor device according to claim 1, wherein on one face of the semiconductor chip, a plurality of the electrode pads are arranged along the chip sides, and the plurality of connection pads in the corner regions are lined up along the chip sides of the semiconductor chip while curving to the corner sides of the wiring board, and the plurality of bonding wires that join the electrode pads and the connection pads are wired such as to spread mutually in a fan-shape from the electrode pads toward the connection pads.
4. The semiconductor device according to claim 1, wherein on one face of the semiconductor chip, a plurality of the electrode pads are arranged along the chip sides, and the plurality of connection pads in the corner regions are arranged in a plurality of lines along the chip sides of the semiconductor chip while the plurality of connection pads are curving to the corner sides of the wiring board.
5. The semiconductor device according to claim 3, wherein the connection pads are disposed in an arc-shape in plane view.
6. The semiconductor device according to claim 4, wherein the connection pads are disposed in an arc-shape in plane view.
7. The semiconductor device according to claim 1, wherein the one face of the wiring board is laminated with a sealing resin that seals the semiconductor chip, the corner regions, and the bonding wires.
8. The semiconductor device according to claim 4, wherein the plurality of connection pads in the corner regions are arranged in two lines along the chip sides of the semiconductor chip.
9. The semiconductor device according to claim 1, wherein the wiring board is square and the semiconductor chip is square.
10. The semiconductor device according to claim 1, wherein the wiring board is square and the semiconductor chip is square.
11. A method of manufacturing a semiconductor device, the method comprising:
preparing a wiring board that has four sides joined by four corners and has connection pads being disposed on one face of the wiring board near the corners, wherein the wiring board has a plurality of lands in a matrix-shape disposed on another face of the wiring board electrically connected to the connection pads;
mounting, on the wiring board, a semiconductor chip that has four chip sides joined by four corners on one face of the wiring board, such that the four chip sides face corners of the wiring board and the chip corners are near the sides of the wiring board;
connecting electrode pads of the semiconductor chip and the connection pads of the wiring board by bonding wires; and
disposing a plurality of bumps on the lands in a matrix-shape on another face of the wiring board.
12. The method of manufacturing a semiconductor device according to claim 11, wherein the prepared wiring board is rectangular in plane view, and the mounted semiconductor chip is rectangular in plane view.
13. The method of manufacturing a semiconductor device according to claim 12, wherein the plurality of connection pads are arranged along mount positions of the chip sides of the semiconductor chip, while curving to the corners of the wiring board, the plurality of electrode pads are arranged along the chip sides on one face of the semiconductor chip, and in connecting the electrode pads and the connection pads with the plurality of bonding wires, the plurality of bonding wires are disposed such as to spread mutually in a fan-shape from the electrode pads toward the connection pads.
14. The method of manufacturing a semiconductor device according to claim 12, wherein the plurality of connection pads are arranged in a plurality of lines along mount positions of the chip sides of the semiconductor chip while curving to the corners of the wiring board, the plurality of electrode pads are arranged along the chip sides on one face of the semiconductor chip, and the electrode pads and the connection pads are connected by a plurality of the bonding wires.
15. The method of manufacturing a semiconductor device according to claim 12, further comprising laminating a sealing resin to seal the semiconductor chip and the bonding wires on the one face of the wiring board after connecting the electrode pads and the connection pads and before disposing the plurality of bumps.
16. The method of manufacturing a semiconductor device according to claim 14, wherein the plurality of connection pads are arranged in two lines along mount positions of the chip sides of the semiconductor chip.
17. A semiconductor device, comprising:
a wiring board including an upper surface and a lower surface opposed to the upper surface;
a semiconductor chip that is a rectangular shape in plane view, and that includes four sides joined by four chip corners, and that is mounted over the upper surface of the wiring board; and
a plurality of bumps arranged in a matrix provided on the lower surface of the wiring board, and that are electrically connected to the semiconductor chip,
wherein the plurality of bumps includes outer bumps that are positioned outermost of the bumps arranging in the matrix, and
wherein at least one of the four chip corners of the semiconductor chip is positioned outside the outer bumps, by being turned relative to the wiring board.
18. The semiconductor device according to claim 17, wherein the plurality of bumps includes four corner bumps that are positioned at four corners of the bumps arranged in the matrix, and wherein the four corner bumps are deviated from the four chip corners of the semiconductor chip.
19. The semiconductor device according to claim 17, further comprising:
a plurality of connection pads provided on the upper surface of the wiring board so as to be exposed from the semiconductor chip,
wherein the connection pads are electrically connecting the semiconductor chip through a wire.
20. The semiconductor device according to claim 17, wherein the at least one of the four chip corners of the semiconductor chip is positioned outside a bump of the outer bumps that is arranged nearest to the at least one of the four chip corners.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method for the reduction of a concentration of amines and their salts in a human comprising the steps of:
contacting the amines andor their salts present in an aqueous solution in the digestive tract of the human with clinoptilolite or clinoptilolite containing mixtures to thereby reduce the concentration of the amines andor their salts, wherein said amines are one or more of the group consisting of 2-(4\u2032-imidazolyl)-ethylamine, 2-phenyl-ethylamine, 2-(4\u2032-hydroxyphenyl) -ethylarmine, dimethylamine, (2-aminoethyl)-disulfide-dihydrochloride, 1,2-dimethylhydrazine, sarcosine pyrrolidine, benzidine, dimethylnitrosamine, aniline, naphtylamine, piperidine, disulfidic cystamine, tryptamine, dimethyl ammonium, and benzylidine, any of which can be substituted with the same or different radicals, that are selected from the group consisting of alkyl-, halogen-, NH2\u2014, acyl-NH\u2014, aryl-NH\u2014, heterocylyl-, OH, \u2014SH and its oxidation products, \u2014SCH3, \u2014CO\u2014NH2, and \u2014O\u2014CH3.
2. The method of claim 1, wherein the amines andor their salts in aqueous solution or aqueous suspension are in chemical equilibrium with each other through reaction with acid or through deprotonation in water.
3. The method as in claim 1, wherein the clinoptilolite comprises particles, in a particle size between 2 and 16 \u03bcm, has zeta potentials between 20 and 26 mV and a specific surface area between 30 and 60 m2g.
4. A method for the reduction of a concentration of amines and their salts in a skin wound in a human comprising the steps of:
providing clinoptilolite or a mixture of clinoptilolite and water,
applying the clinoptilolite or a mixture of clinoptilolite and water several times to a cleaned wound using sterile bandaging to interrupt the formation of nettle secretion and release therefrom of 2-(4\u2032-imidazolyl)-ethylamine by infection-causing bacteria.
5. A method of using clinoptilolite or clinoptilolite containing mixtures in preparation of meals or production of food stuff for humans comprising,
mixing, food stuff with clinoptilolite or the clinoptilolite containing mixtures, which after ingestion of food by a human, lowers a concentration of amines with a general formula I R1R2R3N andor their salts of a formula II R1R2R3N\u2014H, present in aqueous solution or aqueous suspension in the chyme of a digestive tract wherein said amines are one or more of the group consisting of 2-(4\u2032-imidazolyl)-ethylarnine, 2-phenyl-ethylamine, 2-(4\u2032-hydroxyphenyl)-ethylamine dimethylamine, (2-aminoethyl)-disulfide-dihydrochloride, 1,2-dimethylhydrazine, sarcosine pyrrolidine, benzidine, dimethylnitrosamine, aniline, naphtylamine, piperidine, disulfidic cystamine, tryptamine, dimethyl ammonium, and benzylidine, any of which can be substituted with the same or different radicals, that are selected from the group consisting of alkyl-, halogen-, NH2\u2014, acyl-NH\u2014, aryl-NH\u2014, heterocylyl-, OH, \u2014SH and its oxidation products, \u2014SCH3, \u2014CO\u2014NH2, and \u2014O\u2014CH3.