Author: claimsbot

1. A method of forming an adhesive connection between a first optically transparent substrate and a second substrate, the method comprising the steps of:
a) providing a connecting device suitable for connecting said first optically transparent substrate and a second substrate and comprising at least one first connector comprising a contact portion suitable to form an adhesive connection with the first optically transparent substrate, wherein the surface of the contact portion is provided with at least one recess;
b) applying an adhesive composition onto at least part of the surface of the contact portion thereby substantially filling the recess;
c) contacting the contact portion provided with the adhesive composition with the first optically transparent substrate.
2. A method according to claim 1, wherein the connecting device is provided with a second connector comprising a contact portion suitable to form an adhesive connection with the second substrate.
3. A method according to claim 2, wherein the surface of the contact portion of the second connector is provided with at least one recess, and wherein the method further comprises the steps of:
d) applying an adhesive composition onto at least part of the surface of the contact portion of the second connector thereby substantially filling the recess; and
e) contacting the contact portion of the second connector provided with the adhesive composition with the second substrate.
4. A method according to claim 1, wherein the first optically transparent substrate is a glass substrate.
5. A method according to claim 1, wherein the second substrate is a second optically transparent substrate, preferably a second glass substrate.
6. A method according to claim 1, wherein the recess is selected from the group consisting of grooves, channels, holes, niches, perforations, indentations and any combinations thereof.
7. A method according to claim 1, wherein the adhesive composition is selected from the group consisting of one-component polyurethane adhesives, two-component polyurethane adhesives, one-component epoxy adhesives, two-component epoxy adhesives, one-component acrylic adhesives, two-component acrylic adhesives, one-component silicone adhesives, two-component silicone adhesives, and any combinations or mixtures thereof.
8. A method according to claim 1, wherein the connecting device is selected from the group consisting of spider point glazing systems, point fixing or point support mechanical connecting systems, clamping systems and any combinations thereof.
9. A connecting device for connecting a first optically transparent substrate and a second substrate, which comprises at least one first connector comprising a contact portion suitable to form an adhesive connection with the first optically transparent substrate, wherein the surface of the contact portion is provided with at least one recess.
10. A connecting device according to claim 9, which is selected from the group consisting of spider point glazing systems, point fixing or point support mechanical connecting systems, clamping systems and any combinations thereof.
11. A composite assembly comprising:
a) a first optically transparent substrate;
b) a connecting device suitable for connecting the first optically transparent substrate with a second substrate and comprising at least one first connector comprising a contact portion suitable to form an adhesive connection with a first optically transparent substrate, wherein the surface of the contact portion is provided with at least one recess;
c) an adhesive composition applied onto at least part of the surface of the contact portion of the at least one first connector; and
d) optionally, an adhesion enhancing composition applied onto at least part of the surface of the first optically transparent substrate; and
e) optionally, an adhesion enhancing composition applied onto at least part of the surface of the contact portion of the at least one first connector;
wherein the adhesive composition substantially fills the recess, and the contact portion provided with the adhesive composition is contacted with the first optically transparent substrate.
12. A composite assembly according to claim 11, wherein the first optically transparent substrate is a glass substrate.
13. A composite assembly according to claim 11, which has a tensile strength of at least 1 MPa, preferably at least 1.5 MPa, more preferably at least 2 MPa, even more preferably at least 3 MPa, still more preferably at least 4 MPa, yet more preferably at least 5 MPa, and a cohesive failure mode of at least 60%, preferably at least 70%, more preferably at least 80%, even more preferably at least 90%, still more preferably at least 95%, when measured at 80\xb0 C. according to the tensile strength measurement method described in the experimental section.
14. Use of a connecting device suitable for connecting a first optically transparent substrate and a second substrate and comprising at least one first connector comprising a contact portion suitable to form an adhesive connection with the first optically transparent substrate, wherein the surface of the contact portion is provided with at least one recess, for forming an adhesive connection between the first optically transparent substrate and the second substrate.
15. Use according to claim 14, wherein the first optically transparent substrate is a glass substrate.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. An apparatus for medical X-ray diagnosis andor X-ray therapy which includes a detection device for electromagnetic detection of the presence of an object in the vicinity of a movable part (6) of the apparatus, and also includes:
at least one sensor electrode (16) which is mounted on the movable part (6) in order to produce an electromagnetic field in the vicinity of this sensor electrode,
at least one sensor electrode (18) which is mounted on the movable part in order to detect an electromagnetic field in the vicinity of this sensor electrode,
a receiver for receiving, via a sensor electrode, an input signal which corresponds to the electromagnetic field in the vicinity of the sensor electrode, and
an additional electrode (28), characterized in that
the additional electrode (28) is RF coupled to at least one sensor electrode (18),
which additional electrode is arranged in the beam path of the X-ray apparatus and in the sensitive area of said sensor electrode (18), and
which additional electrode includes a carrier of a material which is substantially transparent to X-rays, said carrier supporting a layer of an electrically conductive material of a thickness such that this layer is substantially transparent to X-rays.
2. An apparatus as claimed in claim 1, wherein
the movable part is formed by an X-ray detector whose X-ray receiving side has a substantially cylindrical shape,
the sensor electrodes (18) are constructed so as to be strip-shaped and are arranged in a mutual parallel arrangement in the same plane around the cylindrical shape, whereas
the additional electrode (28) is arranged directly in front of the X-ray receiving window (20) of the X-ray detector.
3. An apparatus as claimed in claim 2, wherein the strip-shaped sensor electrode (18) is subdivided into a number of N parts (18-1, . . . , 18-4) and the additional electrode (28) is subdivided into a corresponding number of N sectors (28-1, . . . , 28-4), each of said sectors being situated opposite a respective one of said parts of the detection electrode.
4. An apparatus as claimed in one of the preceding claims, wherein the RF coupling between the additional electrode and the sensor electrode is realized without a physical connection.
5. An apparatus as claimed in one of the preceding claims, wherein the carrier is made of a synthetic material.
6. An apparatus as claimed in one of the preceding claims, wherein the layer of electrically conductive material consists of aluminium andor nickel.

1. An electronic package comprising at least one semiconductor chip mounted on an organic substrate, said at least one semiconductor chip having edge portions forming at least one corner point; said organic substrate having edge portions forming at least two corner points at distal edge portions thereof, whereby said at least one corner point of said at least one semiconductor chip is angularly rotated about a z-axis through a neutral point relative to said at least two corner points of said substrate substantially subtending a predetermined angular displacement between the corner points of said substrate and the at least one corner point of said at least one semiconductor chip so as to reduce warpage between said at least one semiconductor chip and said organic substrate caused by thermally-induced stresses generated therebetween at said corner points, wherein said at least one corner point on said at least one semiconductor chip is rotated in the z-axis through said neutral point from at least one corner point on said organic substrate by an angular displacement of about 45\xb0, and wherein said neutral point coincides with a center point of said at least one semiconductor chip, and a maximum bending shear deformation of said electronic package occurs at least at one corner point of said organic substrate distant from said neutral point (DNP).
2. An electronic package as claimed in claim 1, wherein at least one solder joint array corner point is provided between said at least corner point of said at least one semiconductor chip and said organic substrate, said at least one solder joint array corner point being in superimposed alignment with said at least one corner point of said at least one semiconductor chip.
3. An electronic package as claimed in claim 1, wherein a thermally curable adhesive underfill material is provided between said at least one semiconductor chip and said organic substrate, whereby cooling of said underfill material or thermal cycling of said electronic package generates stresses causing warpage between the components of said package.
4. An electronic package as claimed in claim 1, wherein said at least one semiconductor chip comprises silicon having a coefficient of thermal expansion of about 3 ppm.\xb0 C.
5. An electronic package as claimed in claim 1, wherein said organic substrate comprises an epoxy having a coefficient of thermal expansion of about 18 ppm\xb0 C.
6. An electronic package comprising at least one rectangular semiconductor chip mounted on an organic substrate, said at least one semiconductor chip having edge portions forming corner points; said organic substrate having edge portions forming at least two corner points at distal edge portions thereof, the corner points of said at least one semiconductor chip being angularly rotated about a z-axis extending through a neutral point located at the center of said at least one rectangular semiconductor chip relative to said at least two corner points of said substrate substantially subtending a predetermined angular displacement between the corner points of said substrate and the corner points of said at least one semiconductor chip so as to reduce warpage between said at least one semiconductor chip and said organic substrate caused by thermally-induced stresses generated therebetween at said corner points, wherein a thermally cured adhesive underfill material is provided between said at least one semiconductor chip and said organic substrate, whereby cooling of said underfill material or thermal cycling of said electronic package generates stresses causing warpage between the components of said package.
7. An electronic package as claimed in claim 6, wherein solder joint array corner points are provided between said corner points of said at least one semiconductor chip and said organic substrate, said solder joint array corner points being in superimposed alignment with said corner point of said at least one semiconductor chip.
8. An electronic package as claimed in claim 6, wherein said corner points on said at least one semiconductor chip are rotated about the z-axis about a neutral point from the corner points said organic substrate by an angular displacement of about 45\xb0.
9. An electronic package as claimed in claim 6, wherein said at least one semiconductor chip comprises silicon having a coefficient of thermal expansion of about 3 ppm.\xb0 C.
10. An electronic package as claimed in claim 6, wherein said organic substrate comprises an epoxy having a coefficient of thermal expansion of about 18 ppm\xb0 C.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method of performing a transaction comprising:
receiving a request from a user for information about merchants who are located within a local area;
identifying merchants responsive to the request from a database that includes information about the physical location of the merchants; and
providing information about the identified merchants to the user.
2. The method of claim 1, wherein the local area is a circular area having a predetermined radius from a predetermined physical location.
3. The method of claim 1, wherein the local area is a circular area having a user defined radius from a user defined physical location.
4. The method of claim 1, wherein the local area is a zip-code area defined by the user.
5. The method of claim 1, wherein the local area is defined by identifying boundaries on a map.
6. The method of claim 1, wherein the information provided to the user includes a map including the local area having the physical location of the merchants shown on the map with a marker.
7. A method of performing a transaction comprising:
receiving a request from a user for information about merchants who are located within a local area;
identifying merchants responsive to the request from a database that includes information about the physical location of the merchants; and
providing to the user a map including the local area and having the physical location of the merchants identified on the map.
8. The method of claim 7, wherein the local area is a circular area having a predetermined radius from a predetermined physical location.
9. The method of claim 7, wherein the local area is a circular area having a user defined radius from a user defined physical location.
10. The method of claim 7, wherein the local area is a zip-code area defined by the user.
11. The method of claim 7, wherein the physical location of the merchants is identified on the map with a marker.
12. The method of claim 11, wherein the marker is user selectable to display additional information about a selected merchant.
13. A method of advertising over a computer network comprising:
identifying potentials customers in a local area;
transmitting information about a merchant to the potential customers;
receiving requests for additional information about the merchant from the potential customers;
transmitting additional information about the merchant to the potential customers who requested additional information.
14. The method of claim 13, wherein the local area is a circular area having a predetermined radius from a predetermined physical location.
15. The method of claim 14, wherein the predetermined physical location is the location of the merchant.
16. The method of claim 14, wherein the predetermined local area is defined by the merchant.
17. The method of claim 16, wherein the predetermined local area is defined by identifying boundaries on a map.
18. The method of claim 13, further comprising the step of billing the merchant for each potential customer who requests additional information.
19. A method of providing information through a website comprising:
displaying first content on one or more public pages that are generally accessible by anyone accessing the website; and
displaying second content on one or more private pages that are accessible only to individuals who have special access rights.
20. The method of claim 19, wherein the first content includes information about merchants within a local area.
21. The method of claim 20, further comprising:
identifying potentials customers based upon merchants identified in the first content;
transmitting information about a merchant to the potential customers;
receiving requests for additional information about the merchant from the potential customers;
transmitting additional information about the merchant to the potential customers who requested additional information.