Author: claimsbot

1. A vehicle display comprising;
a housing;
a first appliqu\xe9 immovably coupled to the housing;
a second appliqu\xe9 immovably coupled to the housing so as to prevent relative movement of the second appliqu\xe9 with respect to the first appliqu\xe9, the second appliqu\xe9 being spaced apart rearwardly from the first appliqu\xe9;
a first graphics set coupled to a surface of the first appliqu\xe9;
a second graphics set coupled to a surface of the second appliqu\xe9;
a third graphics set coupled to a surface of the first appliqu\xe9 opposite the first graphics set, the third graphics set also cooperating with the first and second graphics sets to at least partially form the display design; and
a pointer rotatably coupled to the housing, wherein the first and second graphics sets cooperate to at least partially form a display design that is adapted to be viewed from a front side of the vehicle display and wherein the pointer is movable to indicate a value associated with the display design.
2. The vehicle display of claim 1, wherein the first and second graphics sets are spaced apart by a dimension that is greater than or equal to about 2 mm.
3. The vehicle display of claim 2, wherein the dimension is greater than or equal to about 4 mm.
4. The vehicle display of claim 2, further comprising a light source coupled to the housing, the light source being selectively operable for illuminating at least one of the first and second graphic sets.
5. The vehicle display of claim 4, wherein the light source is selectively operable for back-illuminating at least one of the first and second graphics sets.
6. The vehicle display of claim 1, wherein the first and second appliqu\xe9s are separated by an air gap.
7. The vehicle display of claim 1, further comprising a fourth graphics set coupled to a surface of the second appliqu\xe9 opposite the second graphics set, the fourth graphics set also cooperating with the first, second and third graphics sets to at least partially form the display design.
8. The vehicle display of claim 7, further comprising a light source coupled to the housing, the light source being selectively operable for illuminating at least one of the first, second and third graphics sets.
9. The vehicle display of claim 8, wherein the light source is selectively operable for back-illuminating at least one of the first, second and third graphics sets.
10. The vehicle display of claim 1, further comprising a light source coupled to the housing, the light source being selectively operable for illuminating at least one of the first, second and third graphics sets.
11. The vehicle display of claim 10, wherein the light source is selectively operable for back-illuminating at least one of the first, second and third graphics sets.
12. The vehicle display of claim 1, further comprising a light source that is employed to back-light at least one of the pointer, the first graphics set and the second graphics set.
13. The vehicle display of claim 1, further comprising a light source, the light source illuminating at least a portion of a front side of each of the first and second appliqu\xe9s.
14. The vehicle display of claim 1, further comprising an additional graphics set coupled to at least one of a surface of the first appliqu\xe9 opposite the first graphic set and a surface of the second appliqu\xe9 opposite said second graphics set.
15. A vehicle display comprising:
a housing;
a pointer rotatably coupled to the housing;
a first appliqu\xe9 coupled to the housing;
a second appliqu\xe9 coupled to the housing, the second appliqu\xe9 being spaced apart rearwardly from the first appliqu\xe9;
a first graphics set coupled to a surface of the first appliqu\xe9;
a second graphics set coupled to a surface of the second appliqu\xe9;
a third graphics set coupled to a surface of the first appliqu\xe9 opposite the first graphics set, wherein the first, the second and the third graphics sets cooperate to at least partially form a display design that is adapted to be viewed from a front side of the vehicle display, and wherein the first and second graphics sets are spaced apart by a dimension that is greater than or equal to about 2 mm.
16. The vehicle display of claim 15, further comprising a fourth graphics set coupled to a surface of the second appliqu\xe9 opposite the second graphics set, the fourth graphics set also cooperating with the first, second and third graphics sets to at least partially form the display design.
17. The vehicle display of claim 15, further comprising a light source coupled to the housing, the light source being selectively operable for illuminating at least one of the first, second and third graphics sets, wherein the light source is selectively operable for back-illuminating at least one of the first, second and third graphics sets.
18. A vehicle display comprising:
a housing;
a pointer rotatably coupled to the housing;
a first appliqu\xe9 coupled to the housing;
a second appliqu\xe9 coupled to the housing, the second appliqu\xe9 being spaced apart rearwardly from the first appliqu\xe9;
a first graphics set coupled to a surface of the first appliqu\xe9;
a second graphics set coupled to a surface of the second appliqu\xe9;
a third graphics set coupled to a surface of the second appliqu\xe9 opposite the second graphics set, wherein the first, the second and the third graphics sets cooperate to at least partially form a display design that is adapted to be viewed from a front side of the vehicle display, and wherein the first and second graphics sets are spaced apart by a dimension that is greater than or equal to about 2 mm.
19. The vehicle display of claim 18, further comprising a light source coupled to the housing, the light source being selectively operable for illuminating at least one of the first, second and third graphics sets, wherein the light source is selectively operable for back-illuminating at least one of the first, second and third graphics sets.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A lead assembly for an implantable medical device, the lead assembly comprising:
a lead body having a first portion and a second portion, the first portion adapted for coupling to a pulse generator and the second portion adapted for implantation in or near a heart;
first and second co-radial conductive coils positioned within the lead body and electrically isolated from each other, wherein the first and second conductive coils include a first and second number of coil turns and the first number is substantially equivalent to the second number;
a ring electrode located at the second portion; and
a tip electrode located distal to the ring electrode and coupled to the second conductive coil;
wherein the first conductive coil extends past the ring electrode to between the ring electrode and the tip electrode and transitions to a non-coiled region, which extends back to and couples to the ring electrode.
2. The lead assembly of claim 1 wherein the first conductive coil extends approximately halfway between the ring electrode and the tip electrode.
3. The lead assembly of claim 1 wherein the first conductive coil extends approximately one-quarter of the distance between the ring electrode and the tip electrode.
4. The lead assembly of claim 1 wherein the first conductive coil extends approximately three-quarters of the distance between the ring electrode and the tip electrode.
5. The lead assembly of claim 1 further comprising a first capacitor element connected in parallel with the first conductive coil and a second capacitor element connected in parallel with the second conductive coil.
6. The lead assembly of claim 1 further comprising a plurality of capacitor elements connected in parallel with the first conductive coil and a plurality of capacitor elements connected in parallel with the second conductive coil.
7. The lead assembly of claim 1 further comprising a capacitor element coupled between the first and second conductive coils.
8. The lead assembly of claim 1 further comprising a plurality of capacitor elements, each capacitor element coupled between the first and second conductive coils.
9. The lead assembly of claim 1 further comprising a first capacitor element connected in parallel with the first conductive coil, a second capacitor element connected in parallel with the second conductive coil, and a third capacitor coupled between the first and second conductive coils.
10. The lead assembly of claim 1 wherein the first and second conductive coils extend along a portion of the lead body.
11. The lead assembly of claim 1 wherein the lead body includes a lumen and the first and second conductive coils are located within the lumen.
12. The lead assembly of claim 1 wherein the first and second conductive coils are embedded within the lead body.
13. A lead assembly for an implantable medical device, the lead assembly comprising:
a lead body having a first portion and a second portion, the first portion adapted for coupling to a pulse generator and the second portion adapted for implantation in or near a heart;
first and second electrodes located at the second portion, wherein the second electrode is distal to the first electrode; and
a first means for blocking RF currents coupled to the first and second electrodes, wherein the first means for blocking RF currents includes first and second co-radial conductive coils positioned within the lead body, wherein the second conductive coil is coupled to the second electrode, and wherein the first conductive coil extends past the first electrode to between the first electrode and the second electrode and transitions to a non-coiled region, which extends back to and couples to the first electrode.
14. The lead assembly of claim 13 wherein the first and second conductive coils are parts of a unitary conductive member.
15. The lead assembly of claim 14 wherein the second conductive coil is coaxial with the first conductive coil.
16. The lead assembly of claim 13 further comprising third and fourth electrodes located at the second portion and a second means for blocking RF currents coupled to the third and fourth electrodes.
17. A lead assembly for an implantable medical device, the lead assembly comprising:
a lead body having a first portion and a second portion, the first portion adapted for coupling to a pulse generator and the second portion adapted for implantation in or near a heart;
first and second co-radial conductive coils positioned within the lead body and electrically isolated from each other, wherein the first and second conductive coils include a first and second number of coil turns, the first and second number of coil turns include a number of matched turns and a number of unmatched turns, and the number of unmatched turns divided by the total number of unmatched and matched turns is less than approximately 1.5%;
a first electrode located at the second portion and coupled to the first conductive coil; and
a second electrode located at the second portion and coupled to the second conductive coil,
wherein the first conductive coil extends past the first electrode to between the first electrode and the second electrode and transitions to a non-coiled region, which extends back to and couples to the first electrode.
18. The lead assembly of claim 17 wherein the number of unmatched turns divided by the total number of unmatched and matched turns is less than approximately 0.2%.
19. The lead assembly of claim 17 wherein the first and second conductive coils are offset on a one to one, two to two, three to three, two to three, three to two, or a four to four basis.

1. An integrated circuit package system comprising:
forming a stack module including:
providing a stack die,
encapsulating the stack die with an insulating material having a protruding support and a pad connected to the stack die;
providing a routing layer,
connecting the stack die to the routing layer,
encapsulating the routing layer and the stack die with the insulating material having the protruding support and the pad and an exposed contact connected to the routing layer; and

further comprising:
mounting the stack module on a package base;
connecting the pad to the package base;
mounting a top die on the protruding support, supported with the protruding support;
connecting the top die to the exposed contact;
connecting the top die to the package base; and
encapsulating the top die, the package base, and the stack module with a package encapsulant.
2. The system as claimed in claim 1 wherein:
forming the stack module includes:
providing an exposed die paddle,
attaching the stack die to the exposed die paddle, and
encapsulating the stack die with the insulating material having the protruding support and the pad connected to the stack die or the exposed die paddle.
3. The system as claimed in claim 1 wherein:
forming the stack module includes:
providing a circuit board,
connecting a discrete component to the circuit board,
connecting the stack die to the circuit board,
connecting the circuit board to the pad and the exposed contact,
encapsulating the circuit board, the stack die, and the discrete component with the insulating material having the protruding support and the pad and the exposed contact connected to the circuit board; and

further comprising:
connecting the top die to the exposed contact; and
supporting the top die with the protruding support.
4. The system as claimed in claim 1 further comprising:
forming an array module including:
providing an array die,
encapsulating the array die with an insulating material having another protruding support and another pad connected to the array die; and

further comprising:
mounting the array module on the stack module;
connecting the pad of the array module to the package base;
mounting the top die on the protruding support of the array module; and
encapsulating the top die, the package base, the array module, and the stack module with the package encapsulant.
5. An integrated circuit package system comprising:
forming an internal stacking module including:
providing a stack die,
encapsulating the stack die with an insulating material having a protruding support and a pad connected to the stack die;
providing an exposed die paddle,
attaching the stack die to the exposed die paddle,
connecting the stack die to the exposed die paddle,
encapsulating the stack die with the insulating material having the protruding support and the pad connected to the stack die or the exposed die paddle; and

further comprising:
providing a package base having a component surface;
mounting the internal stacking module on the component surface;
connecting a stack interconnect between the pad and the component surface;
mounting a top die on the protruding support;
connecting a top die interconnect between the top die and the component surface; and
applying a package encapsulant over the top die, over the component surface, and adjacent the internal stacking module, the stack interconnect and the top die interconnect.
6. The system as claimed in claim 5 wherein:
forming the internal stacking module includes:
providing a circuit board,
connecting a discrete component to the circuit board,
connecting the stack die to the circuit board,
connecting the pad to the circuit board,
providing an exposed contact,
connecting a board interconnect between the circuit board and the exposed contact,
encapsulating the circuit board, the stack die, and the discrete component with the insulating material having the protruding support, the pad connected to the circuit board, and the exposed contact adjacent the insulating material; and

further comprising:
connecting the top die to the exposed contact; and
supporting the top die with the protruding support.
7. The system as claimed in claim 5 wherein:
forming the internal stacking module includes:
providing a routing layer having an exposed contact,
connecting the stack die to the routing layer,
connecting the pad to the routing layer,
encapsulating the routing layer and the stack die with the insulating material having the protruding support, and the exposed contact adjacent the insulating material; and

further comprising:
connecting the top die to the exposed contact; and
supporting the top die with the protruding support.
8. The system as claimed in claim 5 further comprising:
forming an internal stacking array module including:
providing an array die,
encapsulating the array die with an insulating material having another of the protruding support and another of the pad connected to the array die; and
further comprising:
mounting the internal stacking array module on the internal stack module;
connecting another of the stack interconnect between the pad of the internal stacking array module and the component surface;
mounting the top die on the protruding support of the internal stacking array module; and
applying the package encapsulant over the top die, over the component surface, and adjacent the internal stacking array module, the internal stacking module, the stack interconnect and the top die interconnect.
9. An integrated circuit package system comprising:
a stack module including:
a stack die,
the stack die encapsulated with an insulating material having a protruding support and a pad connected to the stack die;
a routing layer,
the stack die connected to the routing layer,
the routing layer and the stack die encapsulated with the insulating material having the protruding support and the pad and an exposed contact connected to the routing layer; and

further comprising:
the stack module mounted on a package base;
the pad connected to the package base;
a top die connected to the package base;
the top die connected to the exposed contact;
the top die supported with the protruding support; and
the top die, the package base, and the stack module encapsulated with a package encapsulant.
10. The system as claimed in claim 9 wherein:
the stack module includes:
an exposed die paddle,
the stack die attached to the exposed die paddle, and
the stack die encapsulated with the insulating material having the protruding support and the pad connected to the stack die or the exposed die paddle.
11. The system as claimed in claim 9 wherein:
the stack module includes:
a circuit board,
a discrete component connected the circuit board,
the stack die connected to the circuit board,
the circuit board connected to the pad and the exposed contact,
the circuit board, the stack die, and the discrete component encapsulated with the insulating material having the protruding support and the pad and the exposed contact connected to the circuit board; and
wherein:
the top die is connected to the exposed contact; and
the top die is supported with the protruding support.
12. The system as claimed in claim 9 further comprising:
an array module including:
an array die,
the array die encapsulated with an insulating material having another protruding support and another pad connected to the array die; and

further comprising:
the array module mounted on the stack module;
the pad of the array module connected to the package base;
the top die mounted on the protruding support of the array module; and
the top die, the package base, the array module, and the stack module encapsulated with the package encapsulant.
13. The system as claimed in claim 9 wherein:
the stack module is an internal stacking module;
the package base has a component surface;
the internal stacking module is mounted on the component surface;
the pad and the component surface are connected with a stack interconnect therebetween;
the top die is mounted on the protruding support;
the top die and the component surface have a top die interconnect connected therebetween; and
the package encapsulant is applied over the component surface, and adjacent the internal stacking module, the stack interconnect and the top die interconnect.
14. The system as claimed in claim 13 wherein:
the internal stacking stack module includes:
an exposed die paddle,
the stack die attached to the exposed die paddle,
the stack die connected to the exposed die paddle, and
the stack die encapsulated with the insulating material having the protruding support and the pad connected to the stack die or the exposed die paddle.
15. The system as claimed in claim 13 wherein:
the internal stacking module includes:
a circuit board,
a discrete component connected to the circuit board,
the stack die connected to the circuit board,
the pad connected to the circuit board,
the exposed contact,
a board interconnect connected between the circuit board and the exposed contact,
the circuit board, the stack die, and the discrete component encapsulated with the insulating material having the protruding support, the pad connected to the circuit board, and the exposed contact adjacent the insulating material; and
wherein:
the top die is connected to the exposed contact; and
the top die is supported with the protruding support.
16. The system as claimed in claim 13 further comprising:
an internal stacking array module includes:
an array die,
the array die encapsulated with an insulating material having another of the protruding support and another of the pad connected to the array die; and

further comprising:
the internal stacking array module mounted on the internal stack module;
another of the stack interconnect connected between the pad of the internal stacking array module and the component surface;
the top die mounted on the protruding support of the internal stacking array module; and
the package encapsulant applied over the top die, over the component surface, and adjacent the internal stacking array module, the internal stacking module, the stack interconnect and the top die interconnect.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. Device (1) comprising a base (2) for holding at least one sheet of paper, the device comprising an adhesive means (8), and
further comprising an arm (3) for carrying a mobile device, wherein the base (2) is adapted to carry a document and wherein the arm (3) provides at least one holding portion (9) for carrying the mobile device.
2. (canceled)
3. Device according to claim 1,
wherein the arm (3) comprises an adhesive means (11) to which the mobile device may be attached to.
4. (canceled)
5. Device according to claim 1,
wherein the distance (h) between the base (2) and the first holding portion (9) can be changed.
6.-10. (canceled)
11. Device according to claim 1, wherein the arm (3) further comprises a second holding portion (10) which is bent downward to the base (2).
12. Device according to claim 1, wherein the second holding portion (10) is connected to the arm (3) or to the first holding portion (9) by a joint.
13. Device according to claim 1, further comprising at least one illumination source.
14. Device according to claim 11, wherein the first holding portion (9) andor the second holding (10) portion comprise an adhesive means (11, 12).
15. Device according to claim 1, wherein the adhesive means (8, 11, 12) comprises at least one adhesive layer (14a, 14b, 16).
16. Device according to claim 1, wherein the adhesive means comprises two adhesive layers (14a, 14b).
17. Device according to claim 1, wherein the adhesive means (8, 11, 12) is a pad having a mid layer (13) which is covered on both sides by an adhesive layer (14a, 14b).
18. Device according to claim 16, wherein the two adhesive layers (14a, 14b) have different colours.
19. Device according to claim 16, wherein one of the adhesive layers (14a, 14b) has a colour adapted to perform a chroma keying, preferably a bluebox or greenbox keying.
20. Device according to claim 1, wherein the adhesive means (8, 11, 12) is a nano structured adhesive layer or comprises at least one nano structured adhesive layer.
21. Device according to claim 20, wherein the nano structure comprises a plurality of stamps (19) arranged on a substrate (18).
22. Device according to claim 21, wherein at least a part of the stamps (19) comprise a cavity (20).
23. Use of the device of claim 1 for fixing andor flattening of a sheet of paper, especially for scanning the contents of the paper.
24-30. (canceled)