Author: claimsbot

1. A method of copying data from a memory card to a device, comprising:
providing a device having an enclosure;
providing non-volatile memory storage within the device enclosure;
providing a card slot in the enclosure adapted to receive a removable memory card;
configuring the device to have at least two power modes including a full power mode and a power saving mode;
configuring the device to detect insertion of a removable memory card into the device’s card slot in the power saving mode;
configuring the device to create a memory card construct in the non-volatile memory storage without leaving the power saving mode; and
configuring the device to copy data from the removable memory card to the memory card construct in the non-volatile storage without leaving the power saving mode.
2. The method of claim 1, further comprising:
configuring the device to recognize that a new memory card has been inserted and may be accessed from the non-volatile memory storage in the full power mode.
2. The method of claim 1 further comprising indicating that the memory card is in use, in response to determining that data is being copied from the memory card to the non-volatile memory storage.
3. The method of claim 1, wherein the memory card is detected and loaded into the non-volatile memory storage while the device is fully operational.
4. The method of claim 1, wherein the memory card is detected and loaded into the non-volatile memory storage while the device is in a powered down state.
5. The method of claim 4, wherein the powered down state is a standby mode designated for the device.
6. The method of claim 5, wherein the standby mode designated for the device is approximately S3 or a mode that uses more power than S3.
7. The method of claim 1, wherein the informing is postponed until the device is fully operational.
8. A computing device, comprising:
an enclosure having a card slot adapted to receive a removeable memory card from outside the enclosure, and disposed within the enclosure:
a processor;
an IO control hub coupled to the processor, the IO hub adapted to detect insertion of a memory card into a card slot of a device;
a non-volatile memory storage coupled to the IO hub, the non-volatile memory storage adapted to store data copied from the memory card; and
a PCI control hub adapted to communicate with the memory card, the non-volatile memory storage, and the processor,

wherein the device is configured to copy data from the memory card to the non-volatile memory storage when the insertion of the memory card is detected without changing a current power state of the device.
9. The device of claim 8, wherein the device’s processor is informed that a new memory card has been inserted and may be accessed from the non-volatile memory storage.
9. The system of claim 8, wherein the PCI control hub is responsible for indicating that the memory card is in use, in response to determining that data is being copied from the memory card to the non-volatile memory storage.
10. The system of claim 8, wherein the device comprises the IO control hub, the non-volatile memory storage, and the PCI control hub.
11. The system of claim 8, wherein the memory card is detected and loaded into the non-volatile memory storage while the device is fully operational.
12. The system of claim 8, wherein the memory card is detected and loaded into the non-volatile memory storage while the device is in a powered down state.
13. The system of claim 12, wherein the powered down state is a standby mode designated for the device.
14. The system of claim 12, wherein the standby mode designated for the device is approximately S3 or a mode that uses more power than S3.
15. The system of claim 8, wherein the informing is postponed until the device is fully operational.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A user equipment (UE) comprising:
a receiver configured to detect a first sidelink synchronization signal; and
a controller configured to acquire, from the physical sidelink channel, information specifying whether or not a source of the first sidelink synchronization signal is in-coverage; wherein
the first sidelink synchronization signal is generated by using at least a first identity.
2. The user equipment (UE) of claim 1, wherein
the first sidelink synchronization signal is generated by further using a second identity,
a range of the first identity is 0, 1, and
a range of the second identity is 0-167.
3. The user equipment (UE) of claim 2, wherein
a value \u201c0\u201d of the first identity corresponds to in-coverage and
a value \u201c1\u201d of the first identity corresponds to out-of-coverage.
4. The user equipment (UE) of claim 1, wherein
a root index of a sequence for the first sidelink synchronization signal is determined by using at least the first identity.
5. The user equipment (UE) of claim 1, further comprising:
a generator configured to generate a second sidelink synchronization signal; and
a transmitter configured to transmit the physical sidelink channel which carries information specifying whether or not the UE is in coverage; wherein
the second sidelink synchronization signal is generated by using at least the first identity.
6. A user equipment (UE) comprising:
a controller configured to generate a sidelink synchronization signal; and
a transmitter configured to transmit the physical sidelink channel which carries information specifying whether or not the UE is in coverage; wherein
the sidelink synchronization signal is generated by using at least a first identity.
7. The user equipment (UE) of claim 6, wherein
the sidelink synchronization signal is generated by further using a second identity,
a range of the first identity is 0, 1, and
a range of the second identity is 0-167.
8. The user equipment (UE) of claim 7, wherein
a value \u201c0\u201d of the first identity corresponds to in-coverage, and
a value \u201c1\u201d of the first identity corresponds to out-of-coverage.
9. The user equipment (UE) of claim 6, wherein a root index of a sequence for the sidelink synchronization signal is determined by using at least the first identity.
10. A method in a user equipment (UE), the method comprising:
receiving a first sidelink synchronization signal; and
acquiring, from a physical sidelink channel, information specifying whether or not a source of the first sidelink synchronization signal is in-coverage;wherein the first sidelink synchronization signal is generated by using at least a first identity.
11. The method of claim 10, the method further comprising:
generating a second sidelink synchronization; and
transmitting the physical sidelink channel which carries information specifying whether or not the UE is in coverage; wherein
the second sidelink synchronization signal is generated by using at least the first identity.
12. A method in a user equipment (UE), the method comprising:
generating a sidelink synchronization signal; and
transmitting a physical sidelink channel which carries information specifying whether or not the UE is in coverage; wherein
the sidelink synchronization signal is generated by using at least a first identity.

What is claimed is:

1. A semiconductor memory device, comprising:
a first wiring extending in a first direction;
a second wiring extending in a second direction differing from said first direction; and
a magneto resistive element arranged between said first wiring and said second wiring and comprising a first portion and a second portion, said second portion being in contact with said second wiring and extending along said second wiring to reach an outside region positioned outside said first portion.
2. The semiconductor memory device according to claim 1, wherein said second portion extends along said second wiring to reach at least an adjacent cell.
3. The semiconductor memory device according to claim 1, further comprising a constricted portion formed in the outside region, said constricted portion being formed in a portion where said second portion and said second wiring are narrower than said first portion.
4. The semiconductor memory device according to claim 1, further comprising a folded portion formed in the outside region, said folded portion being formed in a portion where said second portion and said second wiring are bent in a direction differing from said second direction.
5. The semiconductor memory device according to claim 1, further comprising a transistor or a diode connected to said magneto resistive element.
6. The semiconductor memory device according to claim 5, wherein said diode is arranged between said magneto resistive element and said first wiring and is connected to said magneto resistive element and said first wiring.
7. The semiconductor memory device according to claim 1, wherein said magneto resistive element comprises:
a first magnetic layer;
a second magnetic layer; and
a first nonmagnetic layer interposed between said first magnetic layer and said second magnetic layer.
8. The semiconductor memory device according to claim 7, wherein said first portion comprises one of said first and second magnetic layers and said first nonmagnetic layer, and said second portion comprises the other of said first and second magnetic layers.
9. The semiconductor memory device according to claim 8, wherein a part of the other of said first and second magnetic layers is included in said first portion.
10. The semiconductor memory device according to claim 8, wherein said second portion is said second magnetic layer, and said second magnetic layer is a magnetic recording layer.
11. The semiconductor memory device according to claim 8, wherein said second portion is said first magnetic layer and said first magnetic layer is a magnetically fixed layer.
12. The semiconductor memory device according to claim 7, wherein said first portion is said first magnetic layer, and said second portion includes said first nonmagnetic layer and said second magnetic layer.
13. The semiconductor memory device according to claim 1, wherein said magneto resistive element comprises:
a first magnetic layer;
a second magnetic layer;
a third magnetic layer;
a first nonmagnetic layer sandwiched between said first and second magnetic layers; and
a second nonmagnetic layer sandwiched between said second and third magnetic layers.
14. The semiconductor memory device according to claim 13, wherein said first portion includes one of said first and third magnetic layers and said first and second nonmagnetic layers, and said second portion includes the other of said first and third magnetic layers.
15. The semiconductor memory device according to claim 14, wherein a part of the other of said first and third magnetic layers is included in said first portion.
16. The semiconductor memory device according to claim 14, wherein said first and third magnetic layers are magnetically fixed layers.
17. A method of manufacturing a semiconductor memory device provided with a magneto resistive element including a first portion and a second portion, comprising:
extending said second portion along a second wiring to reach an outside region positioned outside said first portion by patterning said second portion together with said second wiring.
18. The method of manufacturing a semiconductor memory device according to claim 17, further comprising, before patterning said second portion together with said second wiring:
forming a first wiring;
forming said first portion above said first wiring; and
forming said second portion and said second wiring on said first portion.
19. The method of manufacturing a semiconductor memory device according to claim 17, further comprising, after patterning said second portion together with said second wiring:
forming said first portion on said second portion; and
forming a first wiring above said first portion.
20. The method of manufacturing a semiconductor memory device according to claim 17, further comprising forming a constricted portion in the outside region, said constricted portion being positioned in a region where said second portion and said second wiring are rendered narrower than said first portion.
21. The method of manufacturing a semiconductor memory device according to claim 17, further comprising forming a folded portion in the outside region, said folded portion being a portion where said second portion and said second wiring are bent in a direction differing from a direction in which said second wiring extends.
22. The method of manufacturing a semiconductor memory device according to claim 17, wherein said second portion extends along said second wiring to reach at least an adjacent cell.
23. The method of manufacturing a semiconductor memory device according to claim 17, wherein said magneto resistive element comprises:
a first magnetic layer;
a second magnetic layer; and
a first nonmagnetic layer sandwiched between said first and second magnetic layers.
24. The method of manufacturing a semiconductor memory device according to claim 23, wherein said first portion includes said first magnetic layer and said first nonmagnetic layer, and said second portion includes said second magnetic layer.
25. The method of manufacturing a semiconductor memory device according to claim 24, wherein a part of said second magnetic layer is included in said first portion.
26. The method of manufacturing a semiconductor memory device according to claim 23, wherein said first portion includes said first magnetic layer, and said second portion includes said first nonmagnetic layer and said second magnetic layer.
27. The method of manufacturing a semiconductor memory device according to claim 17, wherein said magneto resistive element comprises:
a first magnetic layer;
a second magnetic layer;
a third magnetic layer;
a first nonmagnetic layer sandwiched between said first and second magnetic layers; and
a second nonmagnetic layer sandwiched between said second and third magnetic layers.
28. The method of manufacturing a semiconductor memory device according to claim 27, wherein said first portion includes the first magnetic layer, the second magnetic layer, the first nonmagnetic layer and the second nonmagnetic layer, and said second portion includes a third magnetic layer.
29. The method of manufacturing a semiconductor memory device according to claim 28, wherein a part of said third magnetic layer is included in said first portion.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method of entertainment for individuals receiving chemotherapy andor individuals receiving head operations andor other medical patients andor individuals who need to wear a head covering, comprising: a cap being configured for wearing as a head covering, said cap comprising a flexible material being configured for fitting the head of an individual and being configured for assuming a ball shape; at least two strings or straps being configured for fitting and securing said cap to the head of said individual; an opening being configured for receiving an inflatable balloon into said opening; said balloon being disposed in said cap and being configured for inflation; said head covering being further configured for assuming a substantially spherical shape of said balloon; and said head covering being further configured for converting said cap into a ball to entertain, said method comprising the following steps:
locating said opening in said covering;
holding said opening in a first hand;
locating an end of said covering comprising a point on said covering which is furthest from said opening substantially opposite from said opening on said head covering;
holding said end in a second hand;
bringing both of said hands together;
placing said second hand on top of said first hand;
arranging said end of covering to create a substantially top center point of exterior of cap, resulting in a substantially convex shape;
arranging said opening to create a substantially top center point of interior of cap, resulting in a substantially concave shape;
shaping said head covering into a cap shape to fit on head of said individual;
locating said at least two strings or straps;
placing said cap on head of said individual, with said at least two strings or straps being located at the back of the head of said individual;
positioning said cap in a desired location and position on head of said individual;
tying said at least two strings or straps to fasten and fit said cap on head of said individual;
wearing said cap to shield the head of said individual;
untying said at least two strings or straps;
removing said cap from the head of said individual;
locating and holding said opening inside said cap with said first hand;
locating and holding said end outside of said cap with said second hand;
pulling said opening and said end away from each other by moving said hands apart, resulting in a substantially collapsed covering;
flattening and smoothing said material;
locating said opening on said head covering;
inserting said balloon into said opening;
keeping an end portion of said balloon substantially outside of said opening in said cover to receive inflation;
inflating said balloon;
creating a ball toy by said inflated balloon changing said covering into a substantially spherical shape;
tying said end portion of said balloon to maintain said substantially spherical shape; and
playing with said ball as a form of entertainment.
2. The device configured to function according to the method in claim 1, wherein said head covering comprises:
a cap being configured to be worn as a head covering;
said cap comprising:
a flexible material being configured to fit the head of said individual and being configured to assume a ball shape;
at least two strings or straps being configured to fit and secure said cap to the head of said individual;
an opening being configured to receive an inflatable balloon;
a balloon being disposed inside said head covering and being configured to be inflated and tied; and
said head covering being configured to provide entertainment as a ball-like toy when said balloon is inflated.
3. The device according to claim 2, wherein said head covering comprises sections of material fixed together by sewing andor some other means to create said spherical shape.
4. The device according claim 3, wherein said head covering comprises substantially diamond-shaped sections.
5. The device according to claim 4, wherein said head covering comprises at least two strings or straps that are attached to said head covering halfway down the spherical shape from said opening, at a point substantially midway between said opening in said covering and said end of said covering.
6. The device according to claim 5, wherein said head covering comprises at least two strings or straps that are approximately 13 inches in length.
7. The device according to claim 6, wherein said head covering comprises one of:
A. Sections of the same material; or
B. Sections of different material.
8. The device according to claim 7, wherein said head covering comprises different sizes of caps.
9. The device according to claim 8, wherein said head covering comprises six substantially diamond-shaped sections.
10. The device according to claim 9, wherein said head covering comprises a brim.
11. A device for individuals receiving chemotherapy andor individuals receiving head operations andor other medical patients andor individuals who need to wear a head covering, comprising:
a cap being configured to be worn as a head covering;
said cap comprising:
a flexible material being configured to fit the head of an individual and being configured to assume a ball shape;
at least two strings or straps being configured to fit and secure said cap to the head of said individual;
an opening being configured to receive an inflatable balloon into said opening;
said balloon being configured to be disposed in said cap and being configured to be inflated;
said head covering being further configured to assume a substantially spherical shape of said balloon; and
said head covering being further configured to be converted from said cap into a ball to entertain.
12. The device according to claim 11, wherein said head covering comprises sections of material fixed together by sewing andor some other means to create said spherical shape.
13. The device according claim 12, wherein said head covering comprises substantially diamond-shaped sections.
14. The device according to claim 13, wherein said head covering comprises at least two strings or straps that are attached to said head covering halfway down the spherical shape from said opening, at a point substantially midway between said opening in said covering and said end of said covering.
15. The device according to claim 14, wherein said head covering comprises at least two strings or straps that are approximately 13 inches in length.
16. The device according to claim 15, wherein said head covering comprises one of:
A. Sections of the same material; or
B. Sections of different material.
17. The device according to claim 16, wherein said head covering comprises different sizes of caps.
18. The device according to claim 17, wherein said head covering comprises six substantially diamond-shaped sections.
19. The device according to claim 18, wherein said head covering comprises a brim.
20. The device according to claim 19, wherein said head covering comprises a logo.