Author: claimsbot

1. A wiring board with a built-in electronic component, comprising:
a substrate having an opening portion and having a first surface and a second surface on an opposite side of the first surface; and
an electronic component having a third surface and a fourth surface on an opposite side of the third surface and positioned in the opening portion of the substrate such that the third surface faces a same direction as the first surface of the substrate,
wherein the electronic component has a curved surface joining the fourth surface and a side surface of the electronic component, and the opening portion of the substrate has a tapered portion formed by a tapered surface of the substrate joining an inner wall of the opening portion and the first surface and tapering from the first surface toward the second surface.
2. The wiring board with a built-in electronic component according to claim 1, wherein the opening portion of the substrate has a space formed between the substrate and the electronic component and filled with an insulator.
3. The wiring board with a built-in electronic component according to claim 1, further comprising a resin insulation layer on the substrate and the opening portion, wherein the opening portion of the substrate has a space formed between the substrate and the electronic component and filled with an insulator, and the insulator is made of a resin which forms the insulation layer.
4. The wiring board with a built-in electronic component according to claim 1, wherein the electronic component is a passive component.
5. The wiring board with a built-in electronic component according to claim 1, wherein the electronic component is a chip capacitor.
6. The wiring board with a built-in electronic component according to claim 1, wherein the inner wall of the opening portion is a cut surface formed by a laser.
7. The wiring board with a built-in electronic component according to claim 1, wherein the substrate has a first layer and a second layer, and the first layer and the second layer are made of different materials.
8. The wiring board with a built-in electronic component according to claim 1, wherein the substrate has a first layer and a second layer, the first layer and the second layer are made of different resin materials and are formed in an order of the first layer and the second layer from the first surface toward the second surface, the second layer includes an inorganic material, and the first layer includes an inorganic material in an amount which is less than an amount of the inorganic material in the second layer, the amount of the inorganic material in the first layer including no inorganic material.
9. The wiring board with a built-in electronic component according to claim 1, wherein the electronic component has an electrode having a surface which forms the curved surface of the electronic component.
10. The wiring board with a built-in electronic component according to claim 9, wherein the electronic component has an electrode having a surface which forms the curved surface of the electronic component, and at least the surface of the electrode of the electronic component is made of a plated film.
11. The wiring board with a built-in electronic component according to claim 1, further comprising an insulation layer on the substrate and on the electronic component, wherein a via conductor is formed in the insulation layer to be electrically connected to an electrode of the electronic component.
12. The wiring board with a built-in electronic component according to claim 1, wherein the inner wall of the opening portion is a plane substantially perpendicular to the second surface.
13. The wiring board with a built-in electronic component according to claim 1, further comprising an insulation layer on the second surface of the substrate, wherein the opening portion is a hole penetrating through the substrate, and the insulation layer covers an opening of the hole.
14. The wiring board with a built-in electronic component according to claim 1, wherein the substrate and the electronic component have a clearance between the substrate and the electronic component, and the clearance has the maximum value in a range of approximately 0 \u03bcm to approximately 100 \u03bcm.
15. The wiring board with a built-in electronic component according to claim 1, wherein the curved surface has a radius of curvature in a range of approximately 20 \u03bcm to approximately 40 \u03bcm.
16. The wiring board with a built-in electronic component according to claim 1, wherein the substrate has a thickness which is larger than a thickness of the electronic component, and the tapered surface is formed from the first surface to a deeper point than the third surface of the electronic component.
17. The wiring board with a built-in electronic component according to claim 1, wherein the substrate has a thickness which is larger than a thickness of the electronic component, and the thickness of the substrate and the thickness of the electronic component have a difference of approximately 20 \u03bcm or greater.
18. The wiring board with a built-in electronic component according to claim 1, wherein the substrate has a built-in metal sheet.
19. The wiring board with a built-in electronic component according to claim 1, wherein the substrate has a built-in metal sheet, and the metal sheet has a thickness which is approximately 30 \u03bcm or greater.
20. The wiring board with a built-in electronic component according to claim 1, wherein the substrate has a built-in metal sheet, the electronic component and the substrate have a space between the electronic component and the substrate, the space is filled with a first insulator, the substrate has a second insulator between the metal sheet and the opening portion, and the second insulator is made of a material which is different from a material of the first insulator.
21. The wiring board with a built-in electronic component according to claim 1, wherein the substrate has a built-in metal sheet, the electronic component and the substrate have a space between the electronic component and the substrate, the space is filled with a first insulator, the substrate has a second insulator between the metal sheet and the opening portion, and the first insulator has a thermal expansion coefficient which is lower than a thermal expansion coefficient of the second insulator.
22. The wiring board with a built-in electronic component according to claim 1, further comprising an insulation layer formed on the substrate and the electronic component, wherein the substrate has a built-in metal sheet, the electronic component and the substrate have a space between the electronic component and the substrate, the space is filled with a first insulator, the substrate has a second insulator between the metal sheet and the opening portion, and the first insulator is made of a resin from the insulation layer which extends over the space between the electronic component and the substrate.
23. A method for manufacturing a wiring board with a built-in electronic component, comprising:
preparing a substrate having a first surface and a second surface on an opposite side of the first surface;
preparing an electronic component having a third surface and a fourth surface on an opposite side of the third surface, the electronic component including a curved surface joining the fourth surface and a side surface of the electronic component;
forming in the substrate an opening portion which accommodates the electronic component;
forming in the opening portion of the substrate a tapered portion by forming a tapered surface of the substrate joining an inner wall of the opening portion and the first surface and tapering from the first surface toward the second surface; and
positioning the electronic component in the opening portion such that the third surface of the electronic component faces in a same direction as the first surface of the substrate.
24. The method for manufacturing a wiring board with a built-in electronic component according to claim 23, wherein the forming of the opening portion comprises irradiating laser upon the substrate.
25. The method for manufacturing a wiring board with a built-in electronic component according to claim 23, wherein the forming of the substrate comprises forming a first layer and a second layer made of different materials in an order of the first layer and the second layer from the first surface toward the second surface, and the forming of the opening portion comprises irradiating laser at the first surface of the substrate such that the laser penetrates at least through the first layer and reaches the second layer.
26. The method for manufacturing a wiring board with a built-in electronic component according to claim 23, wherein the forming of the substrate comprises forming a first layer and a second layer made of different resin materials in an order of the first layer and the second layer from the first surface toward the second surface, and the second layer includes an inorganic material, and the first layer includes an inorganic material in an amount less than an amount of the inorganic material in the second layer, the amount of the inorganic material in the first layer including no inorganic material.
27. The method for manufacturing a wiring board with a built-in electronic component according to claim 23, wherein the positioning of the electronic component comprises contacting the curved surface of the electronic component with the tapered surface of the tapered portion of the substrate while the electronic component is being positioned into the opening portion.
28. The method for manufacturing a wiring board with a built-in electronic component according to claim 23, further comprising forming an insulation layer comprising a resin on the substrate over the opening portion, filling a portion of the resin of the insulation layer into a space between the substrate and the electronic component in the opening portion, and curing the resin filled in the space.
29. The method for manufacturing a wiring board with a built-in electronic component according to claim 23, further comprising forming an insulation layer comprising a resin on the substrate over the opening portion, filling a portion of the resin of the insulation layer into a space between the substrate and the electronic component in the opening portion, and curing the resin filled in the space, wherein the insulation layer is formed on the substrate over the opening portion while the resin of the insulation layer is semicured, and the filling of the space comprises pressing the insulation layer in a semicured state such that the portion of the resin flows from the insulation layer into the space in the opening portion.
30. The method for manufacturing a wiring board with a built-in electronic component according to claim 23, wherein the forming of the opening portion comprises forming a hole penetrating through the substrate, and covering one opening of the hole with an adhesive sheet before the electronic component is positioned in the opening portion.
31. The method for manufacturing a wiring board with a built-in electronic component according to claim 23, further comprising forming an insulation layer comprising a resin on the substrate over the opening portion, wherein the forming of the opening portion comprises forming a hole penetrating through the substrate, and covering one opening of the hole with an adhesive sheet before the electronic component is positioned in the opening portion, the positioning of the electronic component comprises placing the electronic component on the adhesive sheet in the opening portion from an opening on an opposite side of the opening covered with the adhesive sheet, and the forming of the insulation layer comprises forming the insulation layer on the opposite side of the opening covered with the adhesive sheet, filling a portion of the resin of the insulation layer into a space between the substrate and the electronic component in the opening portion, removing the adhesive sheet from the substrate, and curing the resin after the removing of the adhesive sheet.
32. The method for manufacturing a wiring board with a built-in electronic component according to claim 23, further comprising forming on the substrate a conductive layer including an alignment mark before the positioning of the electronic component in the opening portion, wherein the positioning of the electronic component comprise determining a position of the electronic component in the opening portion of the substrate by the alignment mark.
33. The method for manufacturing a wiring board with a built-in electronic component according to claim 23, wherein the preparing of the electronic component comprises forming the curved surface on an electrode of the electronic component.
34. The method for manufacturing a wiring board with a built-in electronic component according to claim 23, wherein the preparing of the electronic component comprises forming the curved surface on an electrode of the electronic component, and the curved surface of the electrode of the electronic component is made of a plated film.
35. The method for manufacturing a wiring board with a built-in electronic component according to claim 23, wherein the substrate has a built-in metal sheet.
36. The method for manufacturing a wiring board with a built-in electronic component according to claim 23, wherein the substrate has a built-in metal sheet, and the preparing of the substrate includes laminating a first insulation layer comprising a resin, the built-in metal sheet with a pattern, and a second insulation layer comprising a resin in an order of the first resin insulation layer, the metal sheet and the second resin insulation layer, and pressing the substrate such that at least one of the resins of the first and second insulation layer fills a portion of the pattern where no metal is present.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1-20. (canceled)
21. A method for reducing processor, storage or bandwidth utilization through the presentation of a map interface, the method comprising:
physically generating, on a physical display device communicationally coupled to a computing device, a first map interface comprising a map canvas depicting a first location according to a first map view setting;
receiving, at the computing device, a user input identifying an area within the first location depicted by the map canvas; and
physically generating, on the physical display device, a second map interface representing an update to the first map interface in response to the user input, the second map interface comprising:
the map canvas depicting the first location according to the first map view setting;
a contextual view portal visually overlaid over a portion of the map canvas corresponding to the area such that the portion of the map canvas that is visually overlaid by the contextual view portal is, visually, wholly surrounded by the map canvas;
imagery of the area according to a second map view setting differing from the first map view setting, the imagery of the area being, visually, wholly within the contextual view portal; and
one or more user interface elements representative of one or more contextual actions for the area identified by the user input.
22. The method of claim 21, further comprising:
receiving, at the computing device, a second user input identifying a second area within the first location depicted by the map canvas, the second area differing from the area; and
physically generating, on the physical display device, a third map interface representing an update to the second map interface in response to the second user input, the third map interface comprising the contextual view portal visually overlaid over a portion of the map canvas corresponding to the second area such that the portion of the map canvas that is visually overlaid by the contextual view portal is, visually, wholly surrounded by the map canvas.
23. The method of claim 22, wherein the third map interface further comprises imagery of the second area according to a third map view setting differing from the first map view setting, the imagery of the second area being, visually, wholly within the contextual view portal.
24. The method of claim 21, wherein the one or more contextual actions comprise an open task tracking action, the method further comprising: physically generating, on the physical display device, a task tracking interface comprising a first entry that provides contextual information associated with the area.
25. The method of claim 24, further comprising:
receiving, at the computing device, a second user input identifying a second area within the first location depicted by the map canvas, the second area differing from the area; and
updating the task tracking interface to now comprise a second entry that provides contextual information associated with the second area.
26. The method of claim 21, further comprising the steps of:
identifying, with the computing device, an entity associated with the area; and
presenting, within the contextual view portal, contextual information about the identified entity.
27. The method of claim 26, wherein the contextual information about the identified entity comprises at least one of: a promotion offered by the identified entity, an event hosted by the identified entity, a social network profile associated with the identified entity, a social network message associated with the identified entity, a coupon redeemable at the identified entity or a reservation functionality for making a reservation at the identified entity.
28. The method of claim 21, wherein the one or more contextual actions comprise a view option contextual action for changing the second map view setting.
29. The method of claim 28, wherein the second map view setting is changed to one of a street-side view setting, an aerial imagery view setting or a photorealistic view setting.
30. A computing device comprising:
one or more processing units;
a display device; and
one or more computer storage media comprising computer-executable instructions which, when executed by the one or more processing units, cause the computing device to:
generate, on the display device, a first map interface comprising a map canvas depicting a first location according to a first map view setting;
receive a user input identifying an area within the first location depicted by the map canvas; and
generate, on the display device, a second map interface representing an update to the first map interface in response to the user input, the second map interface comprising:
the map canvas depicting the first location according to the first map view setting;
a contextual view portal visually overlaid over a portion of the map canvas corresponding to the area such that the portion of the map canvas that is visually overlaid by the contextual view portal is, visually, wholly surrounded by the map canvas;
imagery of the area according to a second map view setting differing from the first map view setting, the imagery of the area being, visually, wholly within the contextual view portal; and
one or more user interface elements representative of one or more contextual actions for the area identified by the user input.
31. The computing device of claim 30, wherein the one or more computer storage media comprising further computer-executable instructions which, when executed by the one or more processing units, cause the computing device to:
receive a second user input identifying a second area within the first location depicted by the map canvas, the second area differing from the area; and
generate, on the physical display device, a third map interface representing an update to the second map interface in response to the second user input, the third map interface comprising the contextual view portal visually overlaid over a portion of the map canvas corresponding to the second area such that the portion of the map canvas that is visually overlaid by the contextual view portal is, visually, wholly surrounded by the map canvas.
32. The computing device of claim 31, wherein the third map interface further comprises imagery of the second area according to a third map view setting differing from the first map view setting, the imagery of the second area being, visually, wholly within the contextual view portal.
33. The computing device of claim 30, wherein the one or more contextual actions comprise an open task tracking action; and wherein further the one or more computer storage media comprising further computer-executable instructions which, when executed by the one or more processing units, cause the computing device to generate, on the physical display device, a task tracking interface comprising a first entry that provides contextual information associated with the area.
34. The computing device of claim 33, wherein the one or more computer storage media comprising further computer-executable instructions which, when executed by the one or more processing units, cause the computing device to:
receive a second user input identifying a second area within the first location depicted by the map canvas, the second area differing from the area; and
update the task tracking interface to now comprise a second entry that provides contextual information associated with the second area.
35. The computing device of claim 30, wherein the one or more computer storage media comprising further computer-executable instructions which, when executed by the one or more processing units, cause the computing device to:
identify an entity associated with the area; and
present, within the contextual view portal, contextual information about the identified entity.
36. The computing device of claim 35, wherein the contextual information about the identified entity comprises at least one of: a promotion offered by the identified entity, an event hosted by the identified entity, a social network profile associated with the identified entity, a social network message associated with the identified entity, a coupon redeemable at the identified entity or a reservation functionality for making a reservation at the identified entity.
37. The computing device of claim 30, wherein the one or more contextual actions comprise a view option contextual action for changing the second map view setting.
38. The computing device of claim 37, wherein the second map view setting is changed to one of a street-side view setting, an aerial imagery view setting or a photorealistic view setting.
39. A graphical user interface physically generated on a physical display device communicationally coupled to a computing device, the graphical user interface comprising:
a map canvas depicting a first location according to a first map view setting;
a contextual view portal visually overlaid over a portion of the map canvas corresponding to a user identified area such that the portion of the map canvas that is visually overlaid by the contextual view portal is, visually, wholly surrounded by the map canvas;
imagery of the user identified area according to a second map view setting differing from the first map view setting, the imagery of the user identified area being, visually, wholly within the contextual view portal; and
one or more user interface elements representative of one or more contextual actions for the user identified area.
40. The graphical user interface of claim 39, wherein the contextual view portal is circular.

What is claimed is:

1. A method of preventing HIV and retroviral infections comprising administering to a patient in need thereof a therapeutically effective amount of (5-aryl-1,2,4-thiadiazol)-3-yl thiourea derivative or (5-aryl- 1,2,4-thiadizol)-3-yl urea derivative having the formula:
6
wherein X is oxygen or sulfur, R is hydrogen or alkyl having from 1-3 carbons, n is 1-4, R1 is independently selected from the group consisting of hydrogen, alkyl having from 1 to 7 carbon atoms, chloro, bromo or fluoro, oxychloro, alkoxy having the formula O(CH2)yCH3 wherein y is from 1 to 6, or the pharmaceutically acceptable acid addition salt or prodrugs thereof for a period of time sufficient to build up immunity to the infection with the virus.
2. A method according to claim 1 wherein the treatment is for at least 3 weeks.
3. A method according to claim 2 comprising administering a therapeutically effective amount of a pharmaceutical composition comprising (5-phenyl-1,2,4-thiadiazol)-3-yl thiourea or the pharmaceutical addition salt thereof or the prodrugs thereof.
4. A method according to claim 3 comprises administering to a patient in need thereof from about 1 mgkg to about 10000 mgkg of said (5-aryl-1,2,4-thiadiazol)-3-yl thiourea derivative.
5. A method according to claim 2 comprises administering an adjunct therapy with said (5-aryl-1,2,4-thiadiazol)-3-yl thiourea derivative or (5-aryl-1,2,4-thiadizol)-3-yl urea derivative
6. A method according to claim 5 wherein said adjunct therapy comprises administration of a member selected from the group consisting of AZT, TC-3 and protease inhibitors.
7. A method according to claim 1 wherein said (5-aryl-1,2,4-thiadiazol)-3-yl thiourea is administered in a solid form and wherein said solid form includes a carrier selected from the group consisting of lactose, sucrose, gelatin and agar.
8. A method according to claim 7 wherein from about 10 mgkg body weight to about 6000 mgkg body weight of said (5-aryl-1,2,4-thiadiazol)-3-yl thiourea is administered.
9. A method according to claim 1 wherein said (5-aryl-1,2,4-thiadiazol)-3-yl thiourea is administered in a liquid form and wherein said liquid dosage form is selected from the group consisting of aqueous solutions, alcohol solutions, emulsions, liposomes, suspensions, and suspensions reconstituted from non-effervescent and effervescent preparations and suspensions in pharmaceutically acceptable fats or oils.
10. A method of treating viral infections comprising administering a therapeutically effective amount of (5-phenyl-1,2,4-thiadiazol)-3-yl thiourea having the formula:
7
wherein X is sulfur, R is hydrogen, n is 1-4, R1 is independently selected from the group consisting of hydrogen or alkyl having from 1 to 7 carbon atoms or the prodrugs or pharmaceutically acceptable addition salt thereof.
11. A method according to claim 10 wherein R1 is hydrogen and n is 4 and R is hydrogen.
12. A method according to claim 11 wherein said pharmaceutical composition comprises from about 1 mgkg to about 6000 mgkg of said (5-aryl-1,2,4-thiadiazol)-3-yl thiourea.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A video anti-shaking method, comprising:
obtaining a first global relative motion vector and a sequence of second global relative motion vectors, wherein the first global relative motion vector represents a global relative motion vector of a current video frame relative to a video frame which is previous and adjacent to the current video frame, and the sequence of second global relative motion vectors comprises one or more second global relative motion vectors each of which represents a global relative motion vector of a reference video frame relative to a video frame which is previous to and adjacent to the reference video frame;
calculating a sequence of third global relative motion vectors based on the first global relative motion vector and the sequence of second global relative motion vectors, wherein the sequence of third global relative motion vectors comprises one or more third global relative motion vectors each of which represents a global relative motion vector of a reference video frame relative to the current video frame;
filtering the sequence of third global relative motion vectors to obtain a motion vector for compensating shaking of the current video frame; and
cropping an entire pixel image of the current video frame based on the motion vector for compensating shaking of the current video frame and a predetermined size of an effective pixel image to obtain an image after anti-shaking compensation.
2. The video anti-shaking method according to claim 1, wherein the reference video frame is one video frame adjacent to the current video frame or one of a set of consecutive video frames adjacent to the current video frame.
3. The video anti-shaking method according to claim 1, wherein obtaining the first global relative motion vector and the sequence of second global relative motion vectors comprises:
detecting information of lens motion during video-recording; and
calculating the first global relative motion vector and the sequence of second global relative motion vectors based on the information of lens motion.
4. The video anti-shaking method according to claim 1, wherein obtaining the first global relative motion vector and the sequence of second global relative motion vectors comprises:
obtaining the current video frame and the reference video frame;
calculating a sequence of fourth global relative motion vectors and a sequence of fifth global relative motion vectors using a motion estimation algorithm, respectively, wherein the sequence of fourth global relative motion vectors comprises global relative motion vectors of pixel blocks in the current video frame relative to corresponding pixel blocks in a video frame previous to and adjacent to the current video frame, and the sequence of fifth global relative motion vectors comprises global relative motion vectors of pixel blocks in the reference video frame relative to corresponding pixel blocks in a video frame previous to and adjacent to the reference video frame; and
calculating the first global relative motion vector and the sequence of second global relative motion vectors based on the sequence of fourth global relative motion vectors and the sequence of fifth global relative motion vectors.
5. The video anti-shaking method according to claim 4, wherein calculating the sequence of fourth global relative motion vectors and the sequence of fifth global relative motion vectors using the motion estimation algorithm comprises:
calculating the sequence of fourth global relative motion vectors based on all pixel blocks in the current video frame or portions of the pixel blocks in the current video frame; and
calculating the sequence of fifth global relative motion vectors based on all pixel blocks in the current video frame or portions of the pixel blocks in the reference video frame.
6. The video anti-shaking method according to claim 1, wherein calculating a third global relative motion vector of a particular reference video frame, which is previous to the current video frame, based on the first global relative motion vector and the sequence of second global relative motion vectors comprises:
calculating a summation of second global relative motion vectors of all reference video frames after the particular reference video frame and before the current video frame and the first global relative motion vector of the current video frame; and
multiplying the summation with \u22121 to obtain the third global relative motion vector of the particular reference video frame relative to the current video frame.
7. The video anti-shaking method according to claim 1, wherein calculating a third global relative motion vector of a particular reference video frame, which is after the current video frame, based on the first global relative motion vector and the sequence of second global relative motion vectors comprises:
summing up second global relative motion vectors of all reference video frames after the current video frame and before the particular reference video frame and the second global relative motion vector of the particular reference video frame to obtain the third global relative motion vector of the particular reference video frame relative to the current video frame.
8. The video anti-shaking method according to claim 1, wherein filtering the sequence of third global relative motion vectors comprises a low-pass filtering process to filter out high frequency portions in the sequence of third global relative motion vectors.
9. The video anti-shaking method according to claim 1, wherein cropping the entire pixel image of the current video frame based on the motion vector for compensating shaking of the current video frame and the predetermined size of an effective pixel image to obtain the image after anti-shaking compensation comprises:
setting an end point of the motion vector for compensating shaking as a compensation center, wherein the motion vector for compensating shaking starts from a geographic center of the entire pixel image of the current video frame;
determining a cropping region on the entire pixel image of the current video frame, wherein the cropping region has a geographic center as the compensation center and a size as the size of the effective pixel image; and
outputting pixels within the cropping region as the image after anti-shaking compensation.
10. A video anti-shaking device, comprising:
a first processing unit, adapted to obtaining a first global relative motion vector and a sequence of second global relative motion vectors, wherein the first global relative motion vector represents a global relative motion vector of a current video frame relative to a video frame which is previous and adjacent to the current video frame, and the sequence of second global relative motion vectors comprises one or more second global relative motion vectors each of which represents a global relative motion vector of a reference video frame relative to a video frame which is previous to and adjacent to the reference video frame;
a second processing unit, adapted to calculating a sequence of third global relative motion vectors based on the first global relative motion vector and the sequence of second global relative motion vectors, wherein the sequence of third global relative motion vectors comprises one or more third global relative motion vectors each of which represents a global relative motion vector of a reference video frame relative to the current video frame;
a third processing unit, adapted to filtering the sequence of third global relative motion vectors to obtain a motion vector for compensating shaking of the current video frame; and
a fourth processing unit, adapted to cropping an entire pixel image of the current video frame based on the motion vector for compensating shaking of the current video frame and a predetermined size of an effective pixel image to obtain an image after anti-shaking compensation.
11. The video anti-shaking device according to claim 10, wherein the reference video frame is one video frame adjacent to the current video frame or one of a set of consecutive video frames adjacent to the current video frame.
12. The video anti-shaking device according to claim 10, wherein the first processing unit comprises:
a lens motion information detecting sub-unit, adapted to detecting information of lens motion during video-recording; and
a lens motion information processing sub-unit, adapted to calculating the first global relative motion vector and the sequence of second global relative motion vectors based on the information of lens motion.
13. The video anti-shaking device according to claim 12, wherein the lens motion information detecting sub-unit is a gyro sensor.
14. The video anti-shaking device according to claim 10, wherein the first processing unit comprises:
a video frame receiving sub-unit, adapted to obtaining the current video frame and the reference video frame;
a motion estimation calculation sub-unit, adapted to calculating a sequence of fourth global relative motion vectors and a sequence of fifth global relative motion vectors using a motion estimation algorithm, respectively, wherein the sequence of fourth global relative motion vectors comprises global relative motion vectors of pixel blocks in the current video frame relative to corresponding pixel blocks in a video frame previous to and adjacent to the current video frame, and the sequence of fifth global relative motion vectors comprises global relative motion vectors of pixel blocks in the reference video frame relative to corresponding pixel blocks in a video frame previous to and adjacent to the reference video frame; and
a global relative motion vector calculation sub-unit, adapted to calculating the first global relative motion vector and the sequence of second global relative motion vectors based on the sequence of fourth global relative motion vectors and the sequence of fifth global relative motion vectors.
15. The video anti-shaking device according to claim 10, wherein the third processing unit comprises a low-pass filtering sub-unit for filtering out high frequency portions in the sequence of third global relative motion vectors.