All The Claims

1. An apparatus for delivering a prosthesis comprising
a catheter sized and configured for introduction into a hollow body organ or blood vessel, the catheter having a distal end,
a carrier on the distal end sized and configured to carry the prosthesis during introduction of the catheter,
a release mechanism on the distal end being operable to retain the prosthesis on the carrier, the release mechanism also being operable to selectively release the prosthesis from the carrier for deployment in the hollow body organ or blood vessel,
an enclosure mechanism on the distal end being operable to enclose the prosthesis on the carrier, the enclosure mechanism also being operable to selectively expose the prosthesis on the carrier, to thereby enable the release of the prosthesis from the carrier in response to selective operation of the release mechanism, and
at least one actuator coupled to the release mechanism and the enclosure mechanism to selectively operate the release mechanism and the enclosure mechanism.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. An electronic assembly including a casing with walls providing an internal chamber, at least one circuit board located in the chamber and provided with a plurality of electronic components connected thereto, said electronic components including at least one heat generating component requiring cooling, wherein the circuit board is fitted to or proximate a said wall with the at least one heat generating component disposed on a side of the circuit board facing said wall and thermally coupled thereto, at least said wall being thermally conductive.
2. An assembly according to claim 1, wherein there is provided at least one coupling element for coupling the heat generating component or components to said wall.
3. An assembly according to claim 2, wherein the coupling element or elements include a conductive block between said wall and the or each component, and wherein the block or each block is a part of the wall or a separate component fixed to the wall.
4. An assembly according to claim 2, wherein the or each coupling element is made of a metal or metal alloy, andor wherein there is provided one coupling element per heat generating component of the circuit board.
5. An assembly according to claim 2, wherein there is provided a heat transfer agent between the or each heat generating component and its respective the coupling element.
6. An assembly according to claim 5, wherein the transfer agent includes a thermal grease or a thermal pad.
7. An assembly according to claim 1, wherein all the heat generating components of the circuit which require cooling are located on the side of the circuit board facing said wall.
8. An assembly according to claim 1, wherein the casing is substantially completely or completely closed or sealed.
9. An assembly according to claim 1, wherein said wall or walls against which the heat generating components are thermally coupled are provided with cooling fins on external sides thereof.
10. An assembly according to claim 9, including a fan for promoting air flow through the cooling fins.
11. An assembly according to claim 1, wherein there is provided at least one biasing element for biasing the heat generating component or components against said wall of the casing or said coupling elements.
12. An assembly according to claim 11, wherein the or each biasing element is of resilient form.
13. An assembly according to claim 12, wherein there is provided at least one spring located to push the or each component against said wall or associated the coupling element.
14. An assembly according to claim 13, wherein the or at least one of the biasing elements includes a sprung loaded screw, bolt pin or rivet.
15. An assembly according to claim 11, wherein the or each biasing element is located proximate an associated heat conducting element.
16. An assembly according to claim 15, wherein the or each biasing element is located no more than around 15 mm from its associated component.
17. An electronic assembly according to claim 1, wherein the at least one circuit board includes a front side and a rear side and holds a plurality of components including a set of first heat generating components which require cooling during operation, and a set of second components which generate insufficient heat to require cooling, wherein the first set of components is located on the rear side of the circuit board and at least some of the second set of components are located on the front side of the circuit board.
18. An electronic assembly according to claim 1, wherein the casing includes walls providing an internal chamber, means for locating an electronic circuit board to or proximate a said wall with at least one heat generating component thereof disposed on a side of the circuit board facing said wall and to be coupled heat conductively thereto, and at least one raised coupling element on said wall for coupling the heat generating component or components to said wall.
19. An electronic assembly including a circuit board, the circuit board having a front side and a rear side and holding a plurality of components including a set of first heat generating components which require cooling during operation; and a set of second components which generate insufficient heat to require cooling, wherein the first set of components is located on the rear side of the circuit board and at least some of the second set of components are located on the front side of the circuit board.
20. An electronic assembly including: a casing, the casing having walls providing an internal chamber; means for locating an electronic circuit board to or proximate a said wall with at least one heat generating component thereof disposed on a side of the circuit board facing said wall and to be coupled heat conductively thereto; and at least one raised coupling element on said wall for coupling the heat generating component or components to said wall.

1. An electronic device, comprising:
an organic light-emitting diode display having an array of display pixels formed on a display substrate; and
a mandrel having an edge, wherein a portion of the display substrate is wrapped around the edge of the mandrel.
2. The electronic device defined in claim 1 wherein the display substrate includes an active area in which the array of display pixels is formed and wherein the display substrate is curved in the active area.
3. The electronic device defined in claim 2 wherein the display substrate has a convex surface and wherein the array of display pixels is formed on the convex surface.
4. The electronic device defined in claim 2 wherein the portion of the display substrate that is wrapped around the edge of the mandrel extends behind the active area of the display substrate.
5. The electronic device defined in claim 4 wherein a portion of the mandrel is interposed between the active area of the display substrate and the portion of the display substrate that extends behind the active area of the display substrate.
6. The electronic device defined in claim 2 further comprising a glass cover layer having a curved surface.
7. The electronic device defined in claim 1 wherein the edge of the mandrel has a curved surface and wherein the display substrate bends around the curved surface.
8. The electronic device defined in claim 1 wherein the display substrate comprises a flexible sheet of polymer.
9. An electronic device, comprising:
a display having a flexible substrate and an array of display pixels formed on a first portion of the flexible substrate;
a support structure having a rounded edge, wherein a second portion of the flexible substrate curves around the rounded edge; and
a housing in which the display and the support structure are mounted.
10. The electronic device defined in claim 9 wherein the support structure comprises opposing upper and lower surfaces, wherein the rounded edge joins the upper and lower surfaces, wherein the first portion of the flexible substrate is adjacent to the upper surface and wherein the second portion of the flexible substrate is adjacent to the lower surface.
11. The electronic device defined in claim 9 wherein the array of display pixels comprises an array of organic light-emitting diode pixels.
12. The electronic device 9 wherein the flexible substrate comprises a flexible sheet of polymer.
13. The electronic device defined in claim 9 wherein the first portion of the flexible substrate on which the array of display pixels is formed is curved.
14. The electronic device defined in claim 9 wherein the support structure comprises metal.
15. An electronic device, comprising:
a flexible display having a bent edge portion;
a curved transparent cover layer through which the flexible display emits light; and
a mandrel having opposing upper and lower surfaces joined by a rounded edge, wherein the bent edge portion of the flexible display bends around the rounded edge from the upper surface to the lower surface of the mandrel.
16. The electronic device defined in claim 15 wherein the flexible display comprises a flexible organic light-emitting diode display having an array of organic light-emitting diode pixels.
17. The electronic device defined in claim 16 wherein the bent edge portion comprises conductive routing lines for routing display signals to the array of organic light-emitting diode pixels.
18. The electronic device defined in claim 16 wherein the array of organic light-emitting diode pixels is formed on a non-planar portion of the flexible display.
19. The electronic device defined in claim 15 further comprising an adhesive interposed between the flexible display and the mandrel.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

I claim:

1. A method of pre-processing data including a watermark before detecting said watermark by correlating said data with said watermark, said method comprising the steps of:
(a) dividing said data into a plurality of sub-spaces, each sub-space being associated with a position within said data;
(b) for each sub-space, spectral shaping frequency amplitudes of the data of said sub-space to a predetermined function; and
(c) adding said data of said sub-spaces at positions corresponding with said sub-space positions.
2. A method as claimed in claim 1 wherein step (b) comprises the sub-steps of:
(b1) transforming said data of said sub-space into frequency coefficients including amplitude and phase;
(b2) spectral shaping said frequency amplitudes to said predetermined function; and
(b3) inverse transforming said frequency coefficients.
3. A method as claimed in claim 2 wherein step (b2) comprises setting all frequency amplitudes excluding a zero frequency amplitude to a predetermined value.
4. A method as claimed in claim 3 wherein said zero frequency amplitude is reduced.
5. A method as claimed in claim 2 wherein step (b1) uses the Discrete Fourier Transform for transforming said data and step (b3) uses the Inverse Discrete Fourier Transform for inverse transforming said frequency coefficients.
6. A method as claimed in claim 5 comprising an initial sub-step of step (b) of applying a window function to said data of said sub-space.
7. A method as claimed in claim 6 wherein said window function is a Hanning window function.
8. A method as claimed in claim 1 wherein said sub-spaces are overlapping.
9. An apparatus for pre-processing data including a watermark before detecting said watermark by correlating said data with said watermark, said apparatus comprising:
means for dividing said data into a plurality of sub-spaces, each sub-space being associated with a position within said data;
for each sub-space, means for spectral shaping frequency amplitudes of the data of said sub-space to a predetermined function; and
means for adding said data of said sub-spaces at positions corresponding with said sub-space positions.
10. An apparatus as claimed in claim 9 wherein said means for spectral shaping comprises:
means for transforming said data of said sub-space into frequency coefficients including amplitude and phase;
means for spectral shaping said frequency amplitudes to said predetermined function; and
means for inverse transforming said frequency coefficients.
11. An apparatus as claimed in claim 10 wherein said predetermined function is all frequency amplitudes, excluding a zero frequency amplitude, having a predetermined value.
12. An apparatus as claimed in claim 11 wherein said zero frequency amplitude is reduced.
13. An apparatus as claimed in claim 10 wherein the Discrete Fourier Transform is used for transforming said data and the Inverse Discrete Fourier Transform is used for inverse transforming said frequency coefficients.
14. An apparatus as claimed in claim 9 wherein said sub-spaces are overlapping.
15. A program stored in a memory medium for pre-processing data including a watermark before detecting said watermark by correlating said data with said watermark, said program comprising:
code for dividing said data into a plurality of sub-spaces, each sub-space being associated with a position within said data;
for each sub-space, code for spectral shaping frequency amplitudes of the data of said sub-space to a predetermined function; and
code for adding said data of said sub-spaces at positions corresponding with said sub-space positions.
16. A program as claimed in claim 15 wherein said code for spectral shaping comprises:
code for transforming said data of said sub-space into frequency coefficients including amplitude and phase;
code for spectral shaping said frequency amplitudes to said predetermined function; and
code for inverse transforming said frequency coefficients.
17. A program as claimed in claim 16 wherein said predetermined function is all frequency amplitudes, excluding a zero frequency amplitude, having a predetermined value.
18. A program as claimed in claim 17 wherein said zero frequency amplitude is reduced.
19. A program as claimed in claim 16 wherein the Discrete Fourier Transform is used for transforming said data and the Inverse Discrete Fourier Transform is used for inverse transforming said frequency coefficients.
20. A program as claimed in claim 15 wherein said sub-spaces are overlapping.