1. A blade server system comprising:
a blade chassis;
a plurality of server blades coupled to the blade chassis;
a power supply system coupled to the blade chassis; and
a chassis management module coupled to the blade chassis, wherein the blade chassis includes electrical and data communication interconnections between the plurality of server blades, the redundant power supply system and the chassis management module, the chassis management module including computer readable media having program instructions for dynamically managing a power supply allocation for each one of the plurality of server blades including program instructions for powering on a selected, previously powered off server blade including:
program instructions for receiving a request for power on in the chassis management module wherein the request is from the selected server blade;
program instructions for calculating a power cap necessary to power on the selected server blade;
program instructions for determining whether to apply a hard power cap or a soft power cap including converting a present hard cap power level for all powered server blades to a soft cap power level when redundant allocated power is available, wherein the soft power cap allows an allocated power level to be exceeded for a selected time duration; and
program instructions for allocating unallocated power to the selected server blade.
2. The system of claim 1, wherein the program instructions for calculating the power cap necessary power on the selected server blade includes program instructions for denying the power on request from the selected server blade when insufficient unallocated power is available.
3. The system of claim 1, wherein the program instructions for calculating the power cap necessary power on the selected server blade includes:
program instructions for selecting a first server blade from the plurality of server blades, wherein the first server blade is presently powered on; and
program instructions for incrementally reducing an allocated power for the first server blade when the first server blade is allocated power greater than a corresponding minimum power requirement for the first server blade.
4. The system of claim 3, wherein the program instructions for incrementally reducing the allocated power for the first server blade includes program instructions for reducing the allocated power by a selected percentage.
5. The system of claim 3, wherein calculating the power cap necessary power on the selected server blade further includes program instructions for selecting a subsequent server blade that is presently powered on and incrementally reducing an allocated power for the subsequent server blade when the subsequent server blade is allocated power greater than a corresponding minimum power requirement for the subsequent server blade.
6. The system of claim 3, wherein incrementally reducing the allocated power for the first server blade when the first server blade is allocated power greater than the corresponding minimum power requirement for the first server blade includes a incremental power cap reduction of a selected number quantity of power.
7. The system of claim 3, wherein the program instructions for selecting the first server blade from the plurality of server blades includes selecting the selected blade according to a priority level corresponding to each one of the plurality of server blades.
8. The system of claim 1, wherein the computer readable media having program instructions for dynamically managing the power supply allocation for each one of the plurality of server blades includes program instructions for determining whether to apply a hard power cap or a soft power cap including program instructions for converting a present hard cap power level for all powered server blades to a soft cap power level when redundant allocated power is available.
9. The system of claim 1, wherein the computer readable media having program instructions for dynamically managing the power supply allocation for each one of the plurality of server blades includes program instructions for reallocating power when a blade powers off including:
program instructions for detecting a previously powered on blade is now powered off; and
program instructions for incrementally increasing power allocated to each one of a plurality of powered on server blades when a present power allocation is not equal to a corresponding maximum power allocation for each of the plurality of powered on server blades.
10. The system of claim 1, wherein the power supply system includes a redundant power supply system including at least two power supplies.
11. A blade server system comprising:
a blade chassis;
a plurality of server blades coupled to the blade chassis;
a redundant power supply system including at least two power supplies coupled to the blade chassis;
a chassis management module coupled to the blade chassis, wherein the blade chassis includes electrical and data communication interconnections between the plurality of server blades, the redundant power supply system and the chassis management module, the chassis management module including computer readable media having program instructions for dynamically managing a power supply allocation for each one of the plurality of server blades includes program instructions for powering on a selected, previously powered off server blade including:
program instructions for receiving a request for power on in the chassis management module wherein the request is from the selected server blade;
program instructions for calculating a power cap necessary power on the selected server blade including:
program instructions for denying the power on request from the selected server blade when insufficient unallocated power is available;
program instructions for selecting a first server blade from the plurality of server blades, wherein the first server blade is presently powered on; and
program instructions for incrementally reducing an allocated power for the first server blade when the first server blade is allocated power greater than a corresponding minimum power requirement for the first server blade;
program instructions for determining whether to apply a hard power cap or a soft power cap including converting a present hard cap power level for all powered server blades to a soft cap power level when redundant allocated power is available, wherein the soft power cap allows an allocated power level to be exceeded for a selected time duration;
program instructions for allocating unallocated power to the selected server blade; and
program instructions for determining whether to apply a hard power cap or a soft power cap including program instructions for converting a present allocated power level for all powered server blades to a hard cap power level when redundant allocated power is not available.
12. A method of dynamically managing power supply allocation for each one of a plurality of server blades in a blade server comprising:
powering on a selected, previously powered off server blade including:
receiving a request for power on in the chassis management module wherein the request is from the selected server blade;
calculating a power cap necessary power on the selected server blade;
determining whether to apply a hard power cap or a soft power cap including converting a present hard cap power level for all powered server blades to a soft cap power level when redundant allocated power is available, wherein the soft power cap allows an allocated power level to be exceeded for a selected time duration; and
allocating unallocated power to the selected server blade.
13. The method of claim 12, further comprising denying the power on request from the selected server blade when insufficient unallocated power is available.
14. The method of claim 12, further comprising selecting a first server blade from the plurality of server blades, wherein the first server blade is presently powered on and reducing an allocated power for the first server blade when the first server blade is allocated power greater than a corresponding minimum power requirement for the first server blade.
15. The method of claim 12, further comprising determining whether to apply a hard power cap or a soft power cap including converting a present allocated power level for all powered server blades to a hard cap power level when redundant allocated power is not available.
16. The method of claim 12, wherein dynamically managing the power supply allocation for each one of the plurality of server blades includes reallocating power when a blade powers off including:
detecting a previously powered on blade is now powered off; and
incrementally increasing power allocated to each one of a plurality of powered on server blades when a present power allocation is not equal to a corresponding maximum power allocation for each of the plurality of powered on server blades.
17. The method of claim 16, wherein incrementally reducing the allocated power for the first server blade includes reducing the allocated power by a selected percentage.
18. The method of claim 16, wherein calculating the power cap necessary power on the selected server blade further includes selecting a subsequent server blade that is presently powered on and incrementally reducing an allocated power for the subsequent server blade when the subsequent server blade is allocated power greater than a corresponding minimum power requirement for the subsequent server blade.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A solar module structure, comprising:
a top encapsulant layer;
a plurality of three-dimensional thin-film solar cells, each thin-film solar cell comprising:
a three-dimensional thin-film solar cell substrate comprising emitter junction regions and doped base regions;
emitter metallization regions; and
base metallization regions;
wherein said three-dimensional thin-film solar cell substrate comprises a plurality of single-aperture unit cells;
a printed circuit board;
a rear encapsulant layer; and
a protective back plate.
2. The solar module structure of claim 1, further comprising a glass layer.
3. The solar module structure of claim 2, wherein said glass layer comprises a separate glass cover.
4. The solar module structure of claim 2, wherein said glass layer comprises a glass-like protective coating formed by a coating method.
5. The solar module structure of claim 1, further comprising a top patterned cell interconnect layer.
6. The solar module structure of claim 1, further comprising a rear patterned cell interconnect layer.
7. The solar module structure of claim 1, wherein said protective back plate comprises a Tedlar protective back plate.
8. The solar module structure of claim 1, wherein each three-dimensional thin-film solar cell further comprises a rear mirror.
9. The solar module structure of claim 8, wherein said rear mirror comprises an integrated rear mirror.
10. The solar module structure of claim 8, wherein said rear mirror comprises a detached rear mirror.
11. The solar module structure of claim 1, wherein each three-dimensional thin-film solar cell further comprises a peripheral cell frame.
12. The solar module structure of claim 11, wherein said peripheral cell frame may be used to produce wrap-through or wrap-around emitter metallization for making contacts to the cell emitter at the bottom of each three-dimensional thin-film solar cell.
13. A method for assembling a solar module structure, comprising:
patterning a frontside and a backside of a double-sided printed circuit board coated with metallic foils according to desired frontside and backside interconnect layouts;
applying a first coating layer to the rear side of a plurality of three-dimensional thin-film solar cells, each three-dimensional thin-film solar cell comprising:
a three-dimensional thin-film solar cell substrate comprising emitter junction regions and doped base regions;
emitter metallization regions; and
base metallization regions;
wherein said three-dimensional thin-film solar cell substrate comprises a plurality of single-aperture unit cells;
placing said plurality of three-dimensional thin-film solar cells on the frontside of said double-sided printed circuit board;
preparing a solar module assembly, comprising:
a glass layer;
a top encapsulant layer;
said plurality of three-dimensional thin-film solar cells on the frontside of said double-sided printed circuit board;
a rear encapsulant layer;
a protective back plate; and
sealing and packaging said solar module assembly.
14. The method for assembling a solar module structure of claim 13, wherein each three-dimensional thin-film solar cell further comprises a rear mirror.
15. The method for assembling a solar module structure of claim 13, further comprising arranging a plurality of said solar module assemblies in series.
16. The method for assembling a solar module structure of claim 13, further comprising arranging a plurality of said solar module assemblies in parallel.
17. The method for assembling a solar module structure of claim 15, further comprising connecting at least one pair of module power output electrical leads.
18. The method for assembling a solar module structure of claim 16, further comprising connecting at least one pair of module power output electrical leads.
19. A solar module structure, comprising:
a top glass plate;
a plurality of three-dimensional thin-film solar cells, each three-dimensional thin-film solar cell comprising:
a three-dimensional thin-film solar cell substrate comprising emitter junction regions and doped base regions;
emitter metallization regions; and
base metallization regions;
wherein said three-dimensional thin-film solar cell substrate comprises a plurality of dual-aperture unit cells;
a rear patterned cell interconnect layer; and
a bottom glass plate.
20. The solar module structure of claim 19, wherein each three-dimensional thin-film solar cell further comprises a peripheral cell frame.
21. A method for assembling a solar module structure, comprising:
applying a rear patterned cell interconnect layer to the rear side of a plurality of three-dimensional thin-film solar cells, each thin-film solar cell comprising:
a three-dimensional thin-film solar cell substrate comprising emitter junction regions and doped base regions;
emitter metallization regions; and
base metallization regions;
wherein said three-dimensional thin-film solar cell substrate comprises a plurality of dual-aperture unit cells;
preparing a solar module assembly, comprising:
a top glass plate;
said plurality of three-dimensional thin-film solar cells with said rear patterned cell interconnect layer applied to the rear side;
a bottom glass plate;
sealing and packaging said solar module assembly.
22. The method for assembling a solar module structure of claim 21, wherein said step of preparing a solar module assembly further comprises preparing a solar module assembly with a frame.
23. The method for assembling a solar module structure of claim 21, wherein each three-dimensional thin-film solar cell further comprises a rear mirror.
24. The method for assembling a solar module structure of claim 21, further comprising arranging a plurality of said solar module assemblies in series.
25. The method for assembling a solar module structure of claim 21, further comprising arranging a plurality of said solar module assemblies in parallel.
26. The method for assembling a solar module structure of claim 24, further comprising connecting at least one pair of module power output electrical leads.
27. The method for assembling a solar module structure of claim 25, further comprising connecting at least one pair of module power output electrical leads.
28. A solar module structure, comprising:
a top protective layer;
a plurality of three-dimensional thin-film solar cells, each thin-film solar cell comprising:
a three-dimensional thin-film solar cell substrate comprising emitter and base regions;
wherein said three-dimensional thin-film solar cell substrate comprises a plurality of unit cells;
a printed circuit board; and
a protective back plate.
29. A solar module structure, comprising:
a top glass plate;
a plurality of three-dimensional thin-film solar cells, each thin-film solar cell comprising:
a three-dimensional thin-film solar cell substrate comprising emitter and base regions;
wherein said three-dimensional thin-film solar cell substrate comprises a plurality of unit cells; and
a bottom glass plate.
30. A solar module structure, comprising:
a top protective layer;
a plurality of three-dimensional thin-film solar cells, each thin-film solar cell comprising:
a three-dimensional thin-film solar cell substrate comprising emitter and base regions;
wherein said three-dimensional thin-film solar cell substrate comprises a plurality of unit cells; and
a bottom protective layer.