All The Claims

1. An outdoor torch safety cap comprising telescoping outer and inner cylinders, a platform secured to one end of said inner cylinder, an inner disc secured to the inner surface of said outer cylinder intermediate the ends thereof, at least one hook upstanding from one side of said platform, an aperture formed in said inner disc, a compression spring disposed between said platform and said inner disc, and said hook extending through said aperture.
2. A safety cap according to claim 1 wherein a first tab is disposed on the periphery of said one side of said platform.
3. A safety cap according to claim 2 wherein a second tab is disposed on said inner disc on the side facing said one side.
4. A safety cap according to claim 3 wherein said first and second tabs are disposed in an overlapping relationship.
5. A safety cap according to claim 1 wherein a finger 5 is formed on the free end of said hook
6. A safety cap according to claim 5 wherein said finger overlaps said inner disc around the periphery of said aperture.
7. A safety cap according to claim 1 wherein an aperture is formed in said outer cylinder and an S-shaped hook is disposed in said aperture formed in said outer cylinder.
8. A safety cap according to claim 2 wherein multiple equally spaced tabs are disposed on the periphery of said one side of said platform.
9. A safety cap according to claim 8 wherein multiple equally spaced tabs are disposed on said inner disc and face said one side.
10. A safety cap according to claim 1 wherein multiple hooks extend upwardly from said platform.
11. A safety cap according to claim 1 wherein an impermeable inner disc is formed on the inner surface of said inner cylinder.
12. A safety cap according to claim 11 wherein said inner cylinder is interiorly threaded intermediate said impermeable inner disc and the end thereof opposite said platform.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A deadfront switchgear comprising:
a first active switching element; and
a first bus bar coupled to the first active switching element, the first bus bar including at least a first conductive module having a first connection point connected to and contacting the first active switching element and a second connection point configured to connect to and contact a second active switching element, and a second conductive module having at least a third connection point configured to be connected to and contact at least a third active switching element, with the first conductive module and the second conductive module each comprising a conductive material surrounded by solid insulation and by a semi-conducting shield,
wherein at least one of the first conductive module and the second conductive module comprises a push-on connection point, and
wherein the first bus bar and the first active switching element are arranged such that the switchgear is deadfront in that it has no voltage on its exposed surfaces.
2. The deadfront switchgear of claim 1 further comprising a second active switching element, wherein the first bus bar is coupled to the first active switching element by a push-on connection and is coupled to the second active switching element by a mechanical connection.
3. The deadfront switchgear of claim 1 wherein the second connection point comprises a push-on connection point.
4. The deadfront switchgear of claim 1 wherein the first bus bar further comprises a cable and the first conductive module comprises a connector coupled to a first end of the cable.
5. The deadfront switchgear of claim 4 wherein the connector further comprises a push-on connection point for coupling to the first active switching element.
6. The deadfront switchgear of claim 5 wherein the push-on connection point comprises a probe.
7. The deadfront switchgear of claim 4 wherein the connector further comprises a mechanical connection point for coupling to the first active switching element.
8. The deadfront switchgear of claim 7 wherein the mechanical connection point comprises a threaded stud.
9. The deadfront switchgear of claim 4 further comprising a second bus bar and an additional active switching element coupled to the second bus bar, wherein the second bus bar comprises a second conductor and a second connector surrounded by insulation and by a semiconducting shield.
10. The deadfront switchgear of claim 9 wherein the first connector further comprises a push-on connection point for coupling to the first active switching element.
11. The deadfront switchgear of claim 9 wherein the first connector further comprises a mechanical connection point for coupling to the first active switching element.
12. The deadfront switchgear of claim 10 wherein the second connector further comprise a push-on connection point for coupling to the additional active switching element.
13. The deadfront switchgear of claim 10 wherein the second connector further comprises a mechanical connection point for coupling to the additional active switching element.
14. The deadfront switchgear of claim 1 further comprising the second active switching element wherein the second active switching element is coupled to the first bus bar.
15. The deadfront switchgear of claim 14 further comprising a switchgear housing that contains the first bus bar and includes a surface to which the first active switching element is coupled, wherein the second active switching element is coupled to the surface of the switchgear housing.
16. The deadfront switchgear of claim 14 further comprising a switchgear housing that contains the first bus bar and includes a surface to which the first active switching element is coupled, wherein the second active switching element is coupled to a second surface of the switchgear housing.
17. The deadfront switchgear of claim 14 further comprising the third active switching element wherein the third active switching element is coupled to the first bus bar.
18. The deadfront switchgear of claim 17 further comprising a switchgear housing that contains the first bus bar and includes a surface to which the first active switching element is coupled, wherein the second and third active switching elements are coupled to a second surface of the switchgear housing.
19. A high voltage bus bar comprising:
a first leg comprising:
a first conductive structure that provides a first connection point, a second connection point, and a third connection point,
first insulation surrounding the first, second and third connection points, and
a first semiconductor shield surrounding the first insulation; and

a second leg comprising:
a second conductive structure that provides a fourth connection point, a fifth connection point, and a sixth connection point,
second insulation surrounding the fourth, fifth and sixth connection points, and
a second semiconductor shield surrounding the second insulation,

wherein the first leg is coupled to the second leg by coupling the first and fourth connection points together, and
wherein at least one of the connection points comprises a push-on connection point.
20. The high voltage bus bar of claim 19 wherein the second and fifth connection points are in different planes.
21. The high voltage bus bar of claim 19 further comprising a third leg comprising:
a seventh connection point;
an eighth connection point;
a ninth connection point;
third insulation; and
a third semiconductor shield surrounding the seventh, eighth and ninth connection points;
wherein the second leg is coupled to the third leg by coupling the sixth and seventh connection points.
22. The high voltage bus bar of claim 19, wherein the first semiconductor shield and the second semiconductor shield are coupled together and to electrical ground.
23. The high voltage bus bar of claim 19 wherein the second connection point is a part of a second push-on connection and the fifth connection point is a part of a mechanical connection.
24. The high voltage bus bar of claim 23 wherein the second connection point comprises a probe and the fifth connection point comprises a threaded stud.
25. The high voltage bus bar of claim 19 wherein the second and fifth connection points define a plane.
26. The high voltage bus bar of claim 25 where the plane is not vertical.
27. The high voltage bus bar of claim 19 wherein the first and fourth connection points each comprises a push-on connection point such that a connection between the first and fourth connection points comprises a first push-on connection.
28. The high voltage bus bar of claim 27 wherein the first connection point comprises a probe and the fourth connection point comprises a female finger contact.
29. The high voltage bus bar of claim 27 wherein the second and fifth connection points comprise, respectively, a second and a third push-on connection point.
30. The high voltage bus bar of claim 27 wherein the second and fifth connection points comprise, respectively, a first and a second mechanical connection point.
31. The high voltage bus bar of claim 19 wherein the first and fourth connection points comprise a mechanical connection.
32. The high voltage bus bar of claim 31 wherein the first connection point comprises a threaded stud and the fourth connection point comprises a conductive member with internal threads.
33. The high voltage bus bar of claim 31 wherein the second and fifth connection points are parts of push-on connections.
34. The high voltage bus bar of claim 31 wherein the second and fifth connection points are parts of additional mechanical connections.
35. The high voltage bus bar of claim 31 wherein the second connection point comprises a probe and the fifth connection point comprises a threaded stud.
36. A high voltage bus bar contained within a switchgear housing, the bus bar comprising:
a first leg comprising:
a first connection point;
a second connection point positioned and configured to connect with a first active switching element located at a first side of the switchgear housing; and
a third connection point positioned and configured to connect with a second active switching element located at a second side of the switchgear housing opposite the first side of the switchgear housing; and

a second leg comprising:
a fourth connection point;
a fifth connection point positioned and configured to connect with a third active switching element located at the first side of the switchgear housing; and
a sixth connection point positioned and configured to connect with a fourth active switching element located at the second side of the switchgear housing;

wherein the first leg is coupled to the second leg by coupling the first and fourth connections points together.
37. The high voltage bus bar of claim 36 wherein the second and fifth connection points are in different planes.
38. The high voltage bus bar of claim 36 further comprising a third leg comprising:
a seventh connection point;
an eighth connection point; and
a ninth connection point;
wherein the second leg further is coupled to the third leg by coupling the fifth and seventh connection points together.
39. The high voltage bus bar of claim 36 wherein the second connection point is part of a second push-on connection and the fifth connection point is part of a mechanical connection.
40. The high voltage bus bar of claim 39 wherein the second connection point comprises a probe and the fifth connection point comprises a threaded stud.
41. The high voltage bus bar of claim 36 wherein the second and fifth connection points define a plane.
42. The high voltage bus bar of claim 41 wherein the plane is not vertical.
43. The high voltage bus bar of claim 36 wherein the first and fourth connection points comprise a first push-on connection.
44. The high voltage bus bar of claim 43 wherein the first connection point comprises a probe and the fourth connection point comprise a female finger contact.
45. The high voltage bus bar of claim 43 wherein the second and fifth connection points are parts of additional push-on connections.
46. The high voltage bus bar of claim 43 wherein the second and fifth connection points are parts of mechanical connections.
47. The high voltage bus bar of claim 36 wherein the first and fourth connection points comprise a mechanical connection.
48. The high voltage bus bar of claim 47 wherein the first connection point is a threaded stud and the fourth connection point is a conductive member with internal threads.
49. The high voltage bus bar of claim 47 wherein the second and fifth connection points are parts of push-on connections.
50. The high voltage bus bar of claim 47 wherein the second and fifth connection points are parts of additional mechanical connections.
51. The high voltage bus bar of claim 47 wherein the second connection point comprises a probe and the fifth connection point comprises a threaded stud.
52. A method of assembling a switchgear, the method comprising:
receiving specifications about the switchgear;
assembling a first set of bus modules to form a first bus bar in accordance with the specifications, the first set of bus modules including at least a first conductive module having first and second connection points configured to be connected to and to contact first and second active switching elements and a second conductive module having at least a third connection point configured to be connected to and to contact at least a third active switching element;
coupling the first connection point of the first bus bar to the first active switching element; and
mounting the first active switching element onto a frame.
53. The method of claim 52 wherein the specifications received correlate to an existing switchgear and the new switchgear is assembled so as to replace the existing switchgear.
54. The method of claim 52 wherein the specifications received include data about a way.
55. The method of claim 52 wherein:
the first set of bus modules comprises a cable; and
the assembling of the first set of bus modules to form a first bus bar comprises coupling the cable to the first conductive module.
56. The method of claim 52 wherein the first conductive module further comprises:
first insulation surrounding the connection points; and
a first semiconductor shield surrounding the first insulation.
57. The deadfront switchgear of claim 52 wherein at least one of the connection points comprises a push-on connection point.
58. The method of claim 52 further comprising:
assembling a second set of bus modules to form a second bus bar in accordance with the specifications;
coupling the second bus bar to a fourth active switching element; and mounting the fourth active switching element onto the frame.
59. The method of claim 58 further comprising
assembling a third set of bus modules to form a third bus bar in accordance with the specifications;
coupling the third bus bar to a fifth active switching element; and
mounting the fifth active switching element onto the frame.
60. The method of claim 58 wherein:
the second bus bar includes a fourth connection point for coupling the second bus bar to the fourth active switching element; and
the specifications received include data about a spacing between the first connection point and the fourth connection point.
61. The method of claim 58 wherein:
the second bus bar includes a fourth connection point for coupling the second bus bar to the fourth active switching element; and
the specifications received include data that describes an orientation of the first connection point with respect to the fourth connection point.
62. The method of claim 61 wherein the orientation is substantially horizontal.
63. The method of claim 61 wherein the orientation is substantially vertical.
64. The method of claim 61 wherein the orientation is a slope with respect to a horizontal plane.
65. The method of claim 52 wherein assembling of the first set of bus modules to form the first bus bar comprises:
providing the first conductive module as a first leg comprising:
the first connection point;
the second connection point;
a fourth connection point;
first insulation surrounding the first, second and fourth connection points; and
a first semiconductor shield surrounding the first insulation;

providing the second conductive module as a second leg comprising:
the third connection point;
a fifth connection point;
a sixth connection point;
second insulation surrounding the third, fifth and sixth connection points; and
a second semiconductor shield surrounding the second insulation; and

coupling the first leg to the second leg by coupling the fourth and the fifth connection points together.
66. The method of claim 65 wherein the fourth and fifth connection points comprise a first push-on connection so that assembling the first set of bus modules to form the first bus bar comprises pushing the fifth connection point into the fourth connection point.
67. The method of claim 65 wherein the fourth and fifth connection points comprise a mechanical connection so that assembling the first set of bus modules to form the first bus bar comprises threading the fifth connection point onto the fourth connection point.
68. A switchgear comprising:
a first bus bar comprising a first set of bus modules assembled together so as to form the first bus bar, the first bus bar being assembled in conformance with a set of specifications, and the first set of bus modules including at least a first conductive module having first and second connection points configured to be connected to and to contact first and second active switching elements and a second conductive module having at least a third connection point configured to be connected to and to contact at least a third active switching element;
a first active switching element coupled to the first connection point of the first bus bar;
a frame to which the first active switching element is coupled; and
first solid insulation surrounding the first bus bar and the first active switching element.
69. The switchgear of claim 68 wherein the first conductive module further comprises:
first insulation surrounding the connection points; and
a first semiconductor shield surrounding the first insulation.
70. The switchgear of claim 68 wherein the specifications correlate to an existing switchgear such that the new switchgear is assembled so as to replace the existing switchgear.
71. The switchgear of claim 70 wherein the specifications correlate to a way.
72. The switchgear of claim 68 further comprising:
a second bus bar comprising a second set of bus modules assembled together so as to form the second bus bar, the second bus bar being assembled in conformance with the set of specifications; and
a fourth active switching element coupled to the second bus bar and the frame;
wherein the first solid insulation surrounds the second bus bar and the fourth active switching element.
73. The switchgear of claim 72 further comprising:
a third bus bar comprising a third set of bus modules assembled together in conformance with the set of specifications so as to form the third bus bar; and
a fifth active switching element coupled to the third bus bar and the frame;
wherein the first solid insulation surrounds the third bus bar and the fifth active switching element.
74. The switchgear of claim 72 wherein:
the second bus bar includes a fourth connection point for coupling the second bus bar to the fourth active switching element; and
the specifications include data that describes a spacing between the first connection point and the fourth connection point.
75. The switchgear of claim 72 wherein:
the second bus bar includes a fourth connection point for coupling the second bus bar to the fourth active switching element; and
the specifications include data that describes an orientation of the first connection point with respect to the fourth connection point.
76. The switchgear of claim 75 wherein the orientation is substantially horizontal.
77. The switchgear of claim 75 wherein the orientation is substantially vertical.
78. The switchgear of claim 75 wherein the orientation is a slope with respect to a horizontal plane.
79. The switchgear of claim 68 wherein the first set of bus modules comprises a cable.
80. The switchgear of claim 68 wherein the first set of bus modules comprises:
the first conductive module including a first leg comprising:
the first connection point;
the second connection point;
a fourth connection point;
first insulation surrounding the first, second and fourth connection points; and
a first semiconductor shield surrounding the first insulation; and

the second conductive module including a second leg comprising:
the third connection point;
a fifth connection point;
a sixth connection point;
second insulation surrounding the third, fifth and sixth connections points; and
a second semiconductor shield surrounding the second insulation;
wherein the first leg is coupled to the second leg by coupling the fourth and the fifth connection points together.
81. The switchgear of claim 80 wherein the fourth and fifth connection points comprise a first push-on connection so that the first leg is coupled to the second leg by pushing the fifth connection point into the fourth connection point.
82. The switchgear of claim 80 wherein the fourth and fifth connection points comprise a mechanical connection so that the first leg is coupled to the second leg by threading the fifth connection point onto the fourth connection point.

1. A semiconductor device comprising:
a first memory mat including a plurality of first non-volatile memory cells, a plurality of first volatile memory cells, of which a storage capacity is smaller than a storage capacity of the plurality of first non-volatile memory cells, and a first local data line coupled to the plurality of first non-volatile memory and the plurality of first volatile memory;
a second memory mat including a plurality of second non-volatile memory cells, a plurality of second volatile memory cells, of which a storage capacity is smaller than a storage capacity of the plurality of second volatile memory cells, and a second local data line coupled to the plurality of second non-volatile memory cells and the plurality of second volatile memory cells; and
a global data line coupled to the first local data line via a first switch and to the second local data line via a second switch,
wherein, while first information that is transferred from the global data line to the first local data line is written into at least one of the plurality of first non-volatile memory cells, second information is transferred from the global data line to the second data line by turning off the first switch and turning on the second switch.
2. A semiconductor device according to claim 1, wherein
the plurality of first and second non-volatile memory cells are formed above the plurality of first and second volatile memory cells.
3. A semiconductor device according to claim 1, further comprising:
a plurality of memory mats including the first memory mat and the second memory mat,
wherein sequential sector numbers are allocated to different memory mats.
4. A semiconductor device according to claim 1, wherein
the plurality of first and second volatile memory cells are SRAM cells.
5. A semiconductor device according to claim 4, wherein
third information read out from one of the plurality of first non-volatile memory cells is amplified by one of the plurality of first volatile memory cells, and
wherein the amplified third information is transferred to the global data line by turning on the first switch.
6. A semiconductor device according to claim 1, wherein
at least one of the plurality of first volatile memory cells is adapted to hold the first information to write the first information into at least one of the plurality of first non-volatile memory cells after turning off the first switch.
7. A semiconductor device according to claim 1, wherein
while the first information is written into at least one of the plurality of first non-volatile memory cells, at least one of the plurality of second non-volatile memory cells is activated to hold the second information from the global data line.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method to improve operational efficiency of an optoelectronic device, the optoelectronic device comprising a first electrode, a second electrode and an organic optoelectronic sub-structure disposed between the first and the second electrodes, wherein the efficiency of the optoelectronic device is at least partially based on an electron transport process in the optoelectronic sub-structure, said method comprising:
providing an inorganic layer between the organic optoelectronic sub-structure and the second electrode, wherein the inorganic layer comprises at least a layer substantially made of LiMn2O4, wherein the optoelectronic device comprises a light emitting device and the optoelectronic sub-structure comprises an emissive section, an electron transport section for providing electrons and a hole transport section for providing holes so that at least some of the provided electrons and holes combine in the emissive section to produce electromagnetic radiation, and wherein the first electrode comprises an anode adjacent to the hole transport section, the second electrode comprises a cathode adjacent to the election transport section, and the inorganic layer is disposed between the electron transport section and the cathode.
2. A method to improve operational efficiency of an optoelectronic device, the optoelectronic device comprising a first electrode, a second electrode and an organic optoelectronic sub-structure disposed between the first and the second electrodes, wherein the efficiency of the optoelectronic device is at least partially based on an electron transport process in the optoelectronic sub-structure, said method comprising:
providing an inorganic layer between the organic optoelectronic sub-structure and the second electrode, wherein the inorganic layer comprises at least a layer substantially made of LiMn2O4, wherein the optoelectronic device comprises a photocell and the optoelectronic sub-structure comprises an active layer for producing electron-hole pairs in response to electromagnetic radiation, an electron transport section for transporting at least some of electrons produced by said electron-hole pairs to the first electrode, and a hole transport section for transporting at least some of holes produced by the electron-hole pairs to the second electrode.