1460714950-0c537c8e-59d6-4c82-91ae-f3e0fdf82d7b

1. A prosthesis for replacing a knee joint between a femur and a tibia, the prosthesis comprising:
a femoral component including a first condylar portion, a second condylar portion and an intercondylar portion having a first sidewall and a second sidewall;
a tibial component having a bone engaging inferior surface and a bearing engaging superior surface;
a bearing having an inferior surface that fixedly engages the bearing engaging superior surface of the tibial component and a superior femoral engaging surface; and
a yoke assembly having a yoke disposed between the bearing and the femoral component and an axle having an axle axis and that hingedly couples the yoke with the femoral component, wherein rotation of the femoral component about a rotation axis that is perpendicular to the axle axis causes concurrent rotation of the yoke about the rotation axis while the first and second condylar portions rotate along the superior femoral engaging surface of the bearing.
2. The prosthesis system of claim 1 wherein rotation of the yoke is limited to a fixed angle of rotation.
3. The prosthesis system of claim 2 wherein the fixed angle is substantially about twenty degrees.
4. The prosthesis system of claim 2 wherein the bearing defines a pocket having at least one wall, wherein the yoke at least partially nests in the pocket.
5. The prosthesis system of claim 4 wherein the yoke engages the at least one wall thereby limiting further rotation.
6. The prosthesis system of claim 4, further comprising a bearing support that is fixed to the bearing and includes a shaft that extends out of the bearing at the pocket.
7. The prosthesis system of claim 6 wherein the shaft is threadably coupled to a coupling nut within the yoke.
8. The prosthesis system of claim 7 wherein the coupling nut engages a surface of the yoke to preclude lift-off of the yoke away from the bearing.
9. The prosthesis system of claim 8 wherein the bearing support is formed of biocompatible metal and is molded into the bearing.
10. A prosthesis for replacing a knee joint between a femur and a tibia, the prosthesis comprising:
a femoral component including a first condylar portion, a second condylar portion and an intercondylar portion having a first sidewall and a second sidewall;
a tibial component having a bone engaging inferior surface and a bearing engaging superior surface;
a bearing having an inferior surface that fixedly engages the bearing engaging superior surface of the tibial component and a superior femoral engaging surface, the bearing further having sidewalls that define a pocket on the superior femoral engaging surface; and
a yoke assembly having a yoke disposed between the bearing and the femoral component and an axle having an axle axis and that hingedly couples the yoke with the femoral component, wherein rotation of the femoral component about a rotation axis that is perpendicular to the axle axis causes concurrent rotation of the yoke about the rotation axis while the first and second condylar portions rotate along the superior femoral engaging surface of the bearing wherein the yoke is bound by and engages the sidewalls of the bearing at a maximum rotation.
11. The prosthesis of claim 10 wherein rotation of the yoke around the rotation axis is limited to a fixed angle of rotation.
12. The prosthesis of claim 11 wherein the fixed angle is substantially about twenty degrees.
13. The prosthesis of claim 11 wherein the yoke at least partially nests in the pocket.
14. The prosthesis of claim 13, further comprising a bearing support that is fixed to the bearing and includes a shaft that extends out of the bearing at the pocket.
15. The prosthesis of claim 14 wherein the shaft is threadably coupled to a coupling nut within the yoke.
16. The prosthesis of claim 15 wherein the coupling nut engages a surface of the yoke to preclude lift-off of the yoke away from the bearing.
17. The prosthesis of claim 16 wherein the bearing support is formed of biocompatible metal and is molded into the bearing.
18. A prosthesis for replacing a knee joint between a femur and a tibia, the prosthesis comprising:
a femoral component including a first condylar portion, a second condylar portion and an intercondylar portion having a first sidewall and a second sidewall;
a tibial component having a bone engaging inferior surface and a bearing engaging superior surface;
a bearing having an inferior surface that fixedly engages the bearing engaging superior surface of the tibial component and a superior femoral engaging surface;
a yoke assembly having a yoke, a fastener, an axle having an axle axis and a yoke base, the yoke comprising at least two arms extending therefrom, the yoke base having a body portion that defines a receiving portion, wherein the fastener is configured to be advanced into the yoke causing the at least two arms to radially expand and fixedly engage the yoke base at the receiving portion, wherein the yoke and yoke base are configured to collectively rotate about a rotation axis that is perpendicular to the axle axis relative to the tibial component.
19. The prosthesis of claim 18 wherein the bearing defines insets thereon that rotationally bound corresponding tabs extending from the yoke base, wherein maximum rotation of the yoke and yoke base is attained when the tabs engage corresponding surfaces on the bearing at the insets.
20. The prosthesis of claim 18, further comprising a hyperextension stop disposed between the femoral component and the yoke.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. An electronic system, comprising:
a first integrated-circuit chip having an electrical connection front side and a back side;
a second integrated-circuit chip;
a first substrate wafer which extends between the first and second integrated-circuit chips, said electrical connection front side of the first integrated-circuit chip being mounted to a surface of said first substrate wafer;
a second substrate wafer placed facing the back side of the first integrated-circuit chip; and
a layer of thermally conductive adhesive interposed between the back side of first integrated-circuit chip and a surface of the second substrate wafer.
2. The system of claim 1, wherein the first integrated-circuit chip and the first substrate wafer form a first electronic device including a first electrical connection network within the first substrate wafer, and wherein the second integrated-circuit chip and a third substrate wafer form a second electronic device including a second electrical connection network within the third substrate wafer.
3. The system of claim 2, further comprising:
first electrical connection elements interposed between the first electronic device and the second electronic device and electrically connecting the first electrical connection network and the second electrical connection network.
4. The system of claim 2, further comprising a third electronic device comprising the second substrate wafer provided with a third electrical connection network.
5. The system of claim 4, further comprising:
second electrical connection elements interposed between the first electronic device and the third electronic device and electrically connecting the first electrical connection network and the third electrical connection network.
6. The system of claim 4, wherein the third electronic device further comprises external electrical connection pads arranged on a face of the third substrate wafer opposite the first integrated-circuit device.
7. The system of claim 4, wherein the thermal adhesive layer mounts the back side of the first integrated-circuit chip in thermal contact to the surface of the second substrate wafer.
8. The system of claim 7, wherein the second substrate wafer comprises metal vias extending through the second substrate wafer from the surface of which is in thermal contact with the first integrated-circuit chip.
9. The system of claim 5, wherein the second electrical connection elements comprise: a further substrate wafer provided with a further electrical connection network electrically connecting the first electrical connection network and the third electrical connection network.
10. An electronic system, comprising:
a first electronic device comprising a first substrate wafer provided with a first electrical connection network and carrying, below one surface thereof, a first integrated-circuit chip that is electrically connected to the first electrical connection network;
a second electronic device comprising a second substrate wafer provided with a second electrical connection network and carrying a second integrated-circuit chip electrically connected to the second electrical connection network;
a third electronic device comprising a third substrate wafer provided with a third electrical connection network;
wherein the first electronic device and the second electronic device are placed above one another in a position such that both the first substrate wafer and the second substrate wafer extend between the first integrated-circuit chip and the second integrated-circuit chip;
wherein the third substrate wafer is placed such that the first integrated circuit chip is between the first substrate wafer and the third substrate wafer;
first electrical connection elements interposed between the first electronic device and the second electronic device and electrically connecting the first electrical connection network and the second electrical connection network;
second electrical connection elements interposed between the first electronic device and the third substrate wafer and electrically connecting the first electrical connection network and the third electrical connection network; and
wherein the third electrical connection network comprises external electrical connection pads arranged on a face of the third substrate wafer opposite the first integrated-circuit device.
11. The system according to claim 10, wherein a layer of a thermally conductive material is interposed between the first integrated-circuit chip and the third substrate wafer.
12. The system according to claim 10, wherein the second electrical connection elements, interposed between the first electronic device and the third substrate, comprise: a further substrate wafer provided with a further electrical connection network electrically connecting the first electrical connection network and the third electrical connection network.
13. The system according to claim 10, wherein the substrate wafer of the third electronic device comprises metal vias located in the region of the chip of the first electronic device.
14. A system, comprising:
a first electronic device comprising a first substrate wafer provided with a first electrical connection network and carrying, below one surface thereof, a first integrated-circuit chip that is electrically connected to the first electrical connection network;
a second electronic device comprising a second substrate wafer provided with a second electrical connection network;
wherein a surface of the second substrate wafer is in thermal contact with said first integrated-circuit chip;
electrical connection elements interposed between the first electronic device and the second substrate wafer and electrically connecting the first electrical connection network and the second electrical connection network;
wherein the second electrical connection network comprises external electrical connection pads arranged on a face of the second substrate wafer opposite the first integrated-circuit device.
15. The system of claim 14, further comprising a thermal adhesive coupling the first integrated-circuit chip to the surface of the second substrate wafer.
16. The system of claim 14, wherein the electrical connection elements, interposed between the first electronic device and the second substrate wafer, comprise: a further substrate wafer provided with a further electrical connection network electrically connecting the first electrical connection network and the second electrical connection network.
17. The system of claim 14, wherein the second substrate wafer comprises metal vias extending through the second substrate wafer from the surface of the second substrate wafer which is in thermal contact with the first integrated-circuit chip.

1460714943-553094e4-2471-4ab5-9f32-20409ce57e01

1. A panel assembly for a display device, comprising:
a display region including a plurality of pixels and most of display signal lines connected to the pixels;
a plurality of repair lines disposed in a shape of a ring in a peripheral region outside of the display region; and
first to third auxiliary repair lines disposed in the peripheral region,
wherein the display signal lines comprise data lines for transmitting data voltages;
wherein the first to third auxiliary repair lines are not connected to any signal line that intersects the data lines, except the repair lines, and do not intersect the data lines, and
wherein the data lines are disposed between the first auxiliary repair line and the second auxiliary repair line.
2. The panel assembly of claim 1, wherein the second auxiliary repair line and the third auxiliary repair line are adjacent to each other.
3. The panel assembly of claim 2, wherein the first to third auxiliary repair lines intersect at least one of the repair lines.
4. The panel assembly of claim 3, further comprising a plurality of data driving IC regions where data driving ICs for generating data voltages and applying the data voltages to the data lines of the display signal lines are mounted.
5. The panel assembly of claim 4,
wherein the first to third auxiliary repair lines are disposed in the data driving IC regions, and
wherein the third auxiliary repair line and the first auxiliary repair line disposed in the adjacent data driving IC regions intersect one of the repair lines at the same point.
6. The panel assembly of claim 5, wherein the data driving IC regions are disposed at equal intervals.
7. A display device comprising:
a panel assembly including:
a display region including a plurality of pixels and most of display signal lines connected to the pixels;
a plurality of repair lines disposed in a shape of a ring in a peripheral region outside of the display region,
first to third auxiliary repair lines disposed in the peripheral region in parallel to data lines of the display signal lines for transmitting data voltages; and
a plurality of data driving IC regions where data driving ICs for generating data voltages and applying the data voltages to the data lines of the display signal lines are mounted,

wherein the first to third auxiliary repair lines are disposed in the data driving IC regions, and
wherein the third auxiliary repair line and the first auxiliary repair line disposed in adjacent data driving IC regions intersect one of the repair lines at the same point.
8. The display device of claim 7, wherein the data lines are disposed between the first auxiliary repair line and the second auxiliary repair line.
9. The display device of claim 8, wherein the second auxiliary repair line and the third auxiliary repair line are adjacent to each other.
10. The display device of claim 9, wherein the first to third auxiliary repair lines intersect at least one of the repair lines.
11. The display device of claim 7, wherein the data driving IC regions are disposed at equal intervals.
12. The display device of claim 7, wherein the data driving ICs are mounted in a COG scheme.
13. The display device of claim 7,
wherein the panel assembly further comprises data driving IC regions where data driving ICs for applying the data voltages to the data lines of the display signal lines are mounted, and
wherein contact portions are formed by end portions of the first to third auxiliary repair lines and the data lines having a larger width than a remaining portion of the first to third auxiliary repair lines and the data lines, respectively, the contact portions disposed in the data driving IC regions.
14. The display device of claim 13, wherein in a case where at least one of the second auxiliary repair line and the third auxiliary repair line is connected to the repair line, a test unit where a test IC the same as the data driving IC is mounted applies a test signal to the contact portion.
15. The display device of claim 14, wherein the test unit comprises:
a TCP (tape carrier package) where the test IC is mounted; and
a probe connected to a signal line which extends from the test IC.
16. The display device of claim 15, wherein a portion of the probe is connected to a contact portion formed by enlarging the data line, and a remaining portion thereof is connected to contact portions formed by enlarging the second and third auxiliary repair lines.
17. The display device of claim 15, wherein the data driving ICs are directly mounted on the panel assembly.
18. The display device of claim 15, wherein the data driving IC regions are disposed at equal intervals.
19. A panel assembly for display device, comprising:
a plurality of data lines for transmitting data voltages;
a plurality of data driving IC regions where data driving ICs for generating the data voltages and applying the data voltages to the data lines are disposed;
a plurality of auxiliary repair lines which are formed in the data driving ICs and are disposed asymmetrically at both sides of the data lines, and
a plurality of repair lines intersecting at least one of the auxiliary repair lines;
wherein the auxiliary repair lines do not intersect the data lines, and
wherein the auxiliary repair lines are not connected to any signal line that intersects the data lines, except the repair lines.
20. The panel assembly of claim 19, wherein some of the auxiliary repair lines are adjacent to each other.
21. The panel assembly of claim 20, wherein the data driving IC regions are disposed at equal intervals.
22. The panel assembly of claim 5, wherein the first to third auxiliary repair lines are disposed asymmetrically at both sides of the data lines.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A golf shoe outsole having a heel end, opposite toe end, lateral side and opposed medial side, the outsole member defining a lateral-medial midline through the outsole that divides the outsole into a forefoot region forward of the midline and a heel-arch region rearward of the midline;
wherein the forefoot region comprises a plurality of discrete platforms extending downwardly from a thin, flexible base layer that extends across the forefoot region;
wherein the plurality of platforms and the base layer define a forked channel extending below the base layer and between the platforms, the forked channel comprising a stem portion extending inwardly from the medial perimeter of the forefoot, a forward branch extending from the stem portion to the lateral perimeter of the forefoot, and a rearward branch extending from the stem portion to the lateral perimeter of the forefoot rearward of the forward branch;
wherein the forked channel further comprises an intermediate branch that extends from the rearward branch to the lateral perimeter and is positioned between the forward and rearward branches;
wherein a first one of the platforms is positioned along the lateral perimeter between the rearward branch and the intermediate branch, a second one of the platforms is positioned along the lateral perimeter between the forward branch and the intermediate branch; and
wherein the first platform comprises plural static traction members and the second platform is configured to mount a dynamic traction member.
2. The outsole of claim 1, wherein the rearward branch and the stem portion are aligned and form a linear channel extending across the entire forefoot region.
3. The outsole of claim 1, wherein the forward branch comprises at least three discrete aligned sub-channels, each sub-channel defined by a separate pair of the platforms.
4. The outsole of claim 1, wherein a platform having a generally triangular base defines a fork between the forward branch and the rearward branch.
5. The outsole of claim 1, wherein the portions of the base layer forming a roof of the forked channel have a maximum thickness of about 2.5 mm.
6. The outsole of claim 1, wherein the forked channel is bordered by at least 10 platforms extending downward from the base layer.
7. The golf shoe outsole of claim 1, wherein the heel-arch region comprises a heel region and an arch region between the heel region and the forefoot region, and the arch region comprises two platforms projecting downwardly from the medial side of the base layer and at least two static traction elements extending downwardly from each of the two platforms on the medial side of the arch region.
8. The golf shoe outsole of claim 7, wherein a lateral half of the arch region is free of traction elements.
9. The golf shoe outsole of claim 1, wherein the plurality of platforms comprises a first group of platforms disposed around the outer perimeter of the forefoot and a second group of platforms clustered at a central portion of the forefoot within the first group of platforms; and
wherein the plurality of platforms and the base layer further define a second forked channel extending below the base layer and between the platforms, the second forked channel comprising a longitudinal stem portion extending longitudinally from the midline between the first group of platforms, a medial branch extending from the longitudinal stem portion through the first group of platforms to the medial perimeter of the forefoot, and a lateral branch extending from the longitudinal stem portion between the first group of platforms to the lateral perimeter of the forefoot.
10. The golf shoe outsole of claim 9, wherein the second forked channel further comprises two intermediate branches extending from the longitudinal stem portion between the first group of platforms to different points on the outer perimeter between the medial branch and the lateral branch.
11. A golf shoe comprising an upper, a midsole, and an outsole, the outsole having a heel end, opposite toe end, lateral side and opposite medial side, the outsole defining a lateral-medial midline through the outsole that divides the outsole into a forefoot region forward of the midline and a rear portion rearward of the midline, the rear portion having a heel region proximate the heel end and an arch region between the heel region and the midline;
wherein the outsole comprises a thin, flexible base layer extending the entire width and length of the outsole;
wherein the forefoot region and the heel region each comprise at least one dynamic traction element;
wherein the arch region comprises two platforms projecting downwardly from the medial side of the base layer, a portion of the base layer being exposed between the two platforms; and
wherein the arch region comprises at least two static traction elements extending downwardly from each of the two platforms positioned along the medial side of the arch region.
12. The golf shoe of claim 11, wherein a lateral half of the arch region is free of traction elements.
13. The outsole of claim 11, wherein the forefoot region comprises at least seven platforms disposed around the outer perimeter of the forefoot region and projecting downwardly from the base layer, the at least seven platforms being separated from one another by portions of the base layer such that channels are defined extending inwardly from the outer perimeter between adjacent pairs of the at least seven platforms, and wherein a first plurality of the at least seven platforms each comprise two or more static traction elements extending downwardly from the respective platform and a second plurality of the at least seven platforms are each configured to mount a static traction element extending downwardly from the respective platform.
14. The golf shoe of claim 13, wherein the channels each have a minimum width adjacent the base layer of between 1.0 mm and 4.0 mm.
15. The golf shoe of claim 13, wherein the channels on a lateral half of the forefoot each have a minimum width adjacent the base layer of at least 2.5 mm.
16. The golf shoe of claim 13, wherein a majority of the channels have a minimum width adjacent the base layer of at least 2.9 mm.
17. The golf shoe of claim 11, wherein the base layer has a thickness of less than 2.5 mm and each platform extends downwardly at least 3.0 mm from the base layer.
18. The golf shoe of claim 13, wherein the at least seven platforms comprises at least three platforms each configured to mount a static traction element and at least four platforms each comprising four or more static traction elements.
19. The golf shoe of claim 13, wherein a group of at least four of the platforms in the forefoot region that are adjacent to one another each comprise three or more static traction elements.
20. The golf shoe of claim 13, wherein the forefoot region further comprises a central basin that is devoid of traction elements, the central basin bordering at least three of the platforms and communicating with the channels between the platforms and having about the same thickness as the channels between the platforms.
21. The golf shoe of claim 13, wherein the channels comprise at least nine channels each extending inwardly from the outer perimeter.
22. An athletic shoe outsole having a heel end, opposite toe end, lateral side and opposite medial side, the outsole member defining a lateral-medial midline through the outsole that divides the outsole into a forefoot region forward of the midline and a heel-arch region rearward of the midline, the forefoot region having an outer perimeter that extends from the medial side of the midline around the toe end to the lateral side of the midline;
wherein the forefoot region comprises a plurality of discrete platforms extending downwardly from a thin, flexible base layer that extends across the forefoot region, the plurality of platforms comprising a first group of platforms disposed around the outer perimeter of the forefoot and a second group of platforms clustered at a central portion of the forefoot within the first group of platforms;
wherein the plurality of platforms and the base layer define a forked channel extending below the base layer and between the platforms, the forked channel comprising a stem portion extending longitudinally from the midline between the first group of platforms, a medial branch extending from the stem portion through the first group of platforms to the medial perimeter of the forefoot, a lateral branch extending from the stem portion between the first group of platforms to the lateral perimeter of the forefoot, and two intermediate branches extending from the stem portion between the first group of platforms to different points on the outer perimeter between the medial branch and the lateral branch.
23. The outsole of claim 22, wherein the forefoot region comprises an open region of the base layer forward of the first group of platforms that is free of platforms and connects the stem portion of the forked channel with the medial, lateral, and intermediate branches of the forked channel.
24. The outsole of claim 22, wherein the first group of platforms comprises three pairs of platforms, each pair of platforms defining a channel segment between the pair of platforms, wherein the channel segments between the three pairs of platforms each form a different segment of the stem portion of the forked channel.
25. The athletic shoe outsole of claim 22, wherein the heel-arch region comprises a heel region and an arch region between the heel region and the forefoot region, and the arch region comprises two platforms projecting downwardly from the medial side of the base layer and at least two static traction elements extending downwardly from each of the two platforms on the medial side of the arch region.
26. The athletic shoe outsole of claim 11, wherein a lateral half of the arch region is free of traction elements.
27. The athletic shoe outsole of claim 22, wherein the plurality of platforms and the base layer further define a second forked channel extending below the base layer and between the platforms, the second forked channel comprising a transverse stem portion extending inwardly from the medial perimeter of the forefoot, a forward branch extending from the transverse stem portion to the lateral perimeter of the forefoot, and a rearward branch extending from the transverse stem portion to the lateral perimeter of the forefoot rearward of the forward branch.
28. The athletic shoe outsole of claim 27, wherein the second forked channel further comprises an intermediate branch that extends from the rearward branch to the lateral perimeter and is positioned between the forward and rearward branches;
wherein a first one of the platforms is positioned along the lateral perimeter between the rearward branch and the intermediate branch, a second one of the platforms is positioned along the lateral perimeter between the forward branch and the intermediate branch; and
wherein the first one of the platforms comprises plural static traction members and the second one of the platforms is configured to mount a dynamic traction member.