All The Claims

1. A process to manufacture a synthetically pinned CPP SV magnetic read head, comprising:
providing a substrate and depositing thereon a seed and then depositing a layer of antiferromagnetic material on said seed layer;
on said layer of antiferromagnetic material, depositing a first layer of an inverse GMR material;
depositing a first layer of chromium on said first layer;
on said first layer of chromium, depositing a second layer, of cobalt-iron;
then depositing a copper spacer layer on said second layer;
on said copper spacer layer, depositing a third layer, of low coercivity ferromagnetic material;
on said third layer, depositing a second layer of chromium;
on said second layer of chromium, depositing a fourth layer, of low coercivity inverse GMR material; and
then depositing a cap layer on said fourth layer.
2. The process described in claim 1 wherein said antiferromagnetic layer is selected from the group consisting of MnPt, NiMn, and IrMn.
3. The process described in claim 1 wherein said layer first layer of inverse GMR material is selected from the group consisting of FeCr, CoFeCr, NiFeCr, CoCr, CoFeV, FeV, and CoV.
4. The process described in claim 1 wherein said first layer of inverse GMR material is deposited to a thickness between about 10 and 70 Angstroms.
5. The process described in claim 1 wherein said first layer of chromium is deposited to a thickness between about 5 and 15 Angstroms.
6. The process described in claim 1 wherein said second layer ferromagnetic material is selected from the group consisting of CoFe, Co, CoFeNi, CoNi, and NiFe.
7. The process described in claim 1 wherein said second layer ferromagnetic material is deposited to a thickness between about 20 and 50 Angstroms.
8. The process described in claim 1 wherein said third layer of low coercivity ferromagnetic material is selected from the group consisting of CoFe, Co, CoFeNi, CoNi, and NiFe.
9. The process described in claim 1 wherein said third layer of low coercivity ferromagnetic material is deposited to a thickness between about 20 and 100 Angstroms.
10. The process described in claim 1 wherein said second layer of chromium is deposited to a thickness between about 5 and 15 Angstroms.
11. The process described in claim 1 wherein said fourth layer, of low coercivity inverse GMR material, is selected from the group consisting of FeCr, CoFeCr, NiFeCr, CoCr, CoFeV, FeV, and CoV.
12. The process described in claim 1 wherein said fourth layer, of low coercivity inverse GMR material, is deposited to a thickness between about 10 and 100 Angstroms.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method for selectively resending a first message in a publish-subscribe message distribution model, the method comprising:
receiving the first message, wherein the first message has a first message identification (ID) associated with the first message;
sending the received first message to a plurality of subscribers;
receiving a rolled back first message from a first subscriber;
determining if the first message ID associated with the first message matches a second message ID associated with a second message, wherein the second message is stored in a data structure;
creating a first subscriber list associated with the rolled back first message, wherein the first subscriber list includes a subscriber identifier corresponding with the first subscriber based on the determining that the first message ID does not match the second message ID;
storing the first message in the data structure based on the determining that the first message ID does not match the second message ID;
appending a second subscriber list associated with the second message to include the subscriber identifier associated with the first subscriber based on the determining that the first message ID matches the second message ID; and
sending the second message to the first subscriber based on the appending the second subscriber list or the first message to the first subscriber based on the storing the first message in the data structure.
2. The method of claim 1, further comprising:
resending the rolled back first message to the first subscriber a predetermined number of times.
3. The method of claim 1, wherein the receiving the rolled back first message from the first subscriber comprises the first subscriber encountering an issue attempting to process the first message and rolling back the first message.
4. The method of claim 1, wherein the data structure comprises an exception queue.
5. The method of claim 1, wherein the first subscriber is a non-durable subscriber.
6. The method of claim 5, wherein the subscriber identifier associated with the first subscriber is valid until the first subscriber disconnects from a messaging oriented middleware system.
7. The method of claim 1, further comprising:
determining if the rolled back first message should be resent to the first subscriber.

1. A chip packaging process, comprising:
providing a wafer, said wafer having an active surface and a backside corresponding to said active surface, said wafer having a first chip area and a second chip area adjacent to said first chip area, said wafer having a plurality of first and second bond pads on said active surface in said first and second chip areas respectively;
forming a plurality of through holes on said wafer, said plurality of through holes passing through said wafer and connecting said active surface and said backside, said through holes being arranged between said first chip area and said second chip area;
forming a plurality of connecting lines on peripheral surfaces of said through holes, wherein each of said connecting lines has a first end portion extending on said active surface and electrically connecting to one of said first bond pads and one of said second bond pads; and
disposing a first rigid cover and a second rigid cover on said active surface of said first chip area and said active surface of said second chip area respectively, wherein said first rigid cover and said second rigid cover respectively have a plurality of rows and columns of openings exposing the corresponding first bond pads and the corresponding; second bond pads.
2. The process of claim 1, further comprising:
cutting said wafer along an area between said first and second chip areas and cutting said connecting lines into first connecting lines and second connecting lines in said through holes; and
separating said first chip area and said second chip area from said wafer, said first chip area and said first rigid cover being a first chip package, said second chip area and said second rigid cover being a second chip package.
3. The process of claim 1, wherein said first rigid cover is adhered to said active surface.
4. The process of claim 1, wherein a periphery of said first rigid cover is adhered to said active surface.
5. The process of claim 1 wherein a material of said first rigid cover includes a conducting material, an insulating material, or a transparent material.
6. The process of claim 2, in said step of forming said connecting lines, wherein each of said connecting lines has a second end portion extending on the backside.
7. The process of claim 6, wherein in the step of cutting said wafer, each of said second end portions is cut into a first terminal pad and a second terminal pad corresponding to said first chip area and said second chip area, respectively.
8. The process of claim 7, wherein said first terminal pads and said second terminal pads are disposed as an area array, respectively.
9. The process of claim 2, wherein said first and second rigid covers are structurally connected, said step of cutting said wafer comprises cutting said structural connection of said first and second rigid covers to separate said first and second rigid covers.
10. The process of claim 1, wherein said connecting lines are formed by electroplating.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A system for use with a video of a live golf game with a ball, wherein the system comprising:
a. a source providing video of the live golf game containing images of the ground;
b. a processor in communication with the source;
c. data storage in communication with the processor;
d. a digital image display in communication with the processor for presenting the video of the live golf game;
e. computer instructions in the data storage to instruct the processor to capture a ground slope of the images of the ground at a position of a ball;
f. computer instructions in the data storage to instruct the processor to compute a difference in degrees between the ground slope at the position of the ball relative to an earth level; and
g. computer instructions in the data storage to instruct the processor to display the ground slope, the earth level, and the difference in degrees between the slope of the ground at the position of the ball relative to the earth level on the digital image display simultaneously while displaying the video of the live golf game.
2. The system of claim 1, wherein the source is a video camera at the live golf.
3. The system of claim 1, wherein the processor is a laptop, a cell phone, another personal digital device, a computer, a server, a combination of processors connected in series with a network, or combinations thereof.
4. The system of claim 1, wherein the data storage is a jump drive, flash memory, memory, or another data storage device capable of storing video.
5. The system of claim 1, wherein the digital image display is a monitor, an LCD display, a cell phone display, an I-pod\u2122 display, a DVD display, a display of a slot machine, or another digital image display capable of presenting video.
6. The system of claim 5, wherein the ground slope shown in a circular gauge comprises the earth level contained within in the circular gauge and the icon on a per shot basis reveals graphically a difference in slope between the ground slope and the earth level and the difference is displayed on the digital display and the earth level is tangent to the gravitational force field of planet earth.
7. The system of claim 6, wherein the circular gauge and variable golf shot are presented in sequence as an executive dashboard connected via a network communicating with a client device for the viewer.
8. The system of claim 1, wherein the video comprises a live video feed, an RSS feed, stored video programming, animated video programming, or combinations thereof.
9. The system of 1, further comprising computer instructions for wagering and computer instructions for paying out wagering to a viewer and computer instructions providing communications to at least on financial institution via a network.
10. The system of claim 9, wherein the computer instructions for wagering and computer instructions for paying out wagering are used with a slot machine, a sports book with at least one live video monitor, an on-line casino, or combinations thereof.
11. The system of claim 10, wherein a plurality of videos are provided simultaneously to the viewer for multiple betting simultaneously.