All The Claims

1. A method of simulating an electrostatic discharge (ESD) circuit layout, comprising a computer processor for performing the following steps:
providing a netlist that describes connectivity among components in an electronic circuit;
pre-simulating the netlist for modeling of circuit operation;
generating a circuit layout corresponding to the electronic circuit according to a result of the pre-simulation, the generated circuit layout including an ESD circuit layout and a plurality of back-end layers for connecting individual components of the electronic circuit;
extracting parasitic according to the generated circuit layout;
providing an ESD waveform for simulating the ESD circuit layout; and
post-simulating the ESD circuit layout according to the ESD waveform and a result of the parasitic extraction;
wherein the back-end layers are subjected to the post-simulation and the post-simulation step comprises:
coupling one of a plurality of pads of the electronic circuit with the ESD waveform and grounding another of the pads, thereby forming an ESD path;
reporting currents passing through the corresponding back-end layers, respectively;
comparing the reported current with a corresponding given rated current; and
highlighting the back-end layer that has the reported current equal or greater than the corresponding rated current.
2. The method of claim 1, wherein the netlist is pre-simulated by a transistor-level circuit simulation tool.
3. The method of claim 1, wherein the back-end layers comprises one or more of the following: metal layers, vias and contacts.
4. The method of claim 1, wherein the extracted parasitics comprise parasitic capacitance and parasitic resistance.
5. The method of claim 1, wherein the extracted parasitic is represented in a Detailed Standard Parasitic Format (DSPF) file.
6. The method of claim 1, in the parasitic extraction step, a layout versus schematic (LVS) tool is used to verify whether the circuit layout matches the netlist.
7. The method of claim 1, wherein the pads in each said ESD path is either a power pad, a ground pad or an inputoutput (IO) pad.
8. The method of claim 7, wherein the ESD path is established between (1) two of the powerground pads, (2) the IO pad and the powerground pad, or (3) two of the IO pads.
9. The method of claim 1, wherein the post-simulation step further comprises:
ranking the comparing results of the back-end layers; and
visually expressing the back-end layers with a color scale that is divided into several sections represented by different colors associated with different ranks, respectively.
10. The method of claim 1, wherein the post-simulation step further comprises:
making change to a width, quantity or a location of the back-end layers according to the comparing results.
11. The method of claim 1, wherein the post-simulation is performed further according to a result of the pre-simulation.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method of manufacturing a package carrier comprising:
providing a holding substrate and a conductive layer, wherein the conductive layer is formed on the holding substrate;
forming an insulating pattern on the conductive layer, wherein the insulating pattern exposes a portion of the conductive layer;
providing a supporting board;
detachably connecting the insulating pattern to the supporting board, wherein the insulating pattern is in contact with the supporting board;
removing the holding substrate and letting the conductive layer remain after detachably connecting the insulating pattern to the supporting board; and
patterning the conductive layer to form a wiring layer after removing the holding substrate.
2. The method of manufacturing the package carrier according to claim 1, wherein the insulating pattern is a solder mask layer.
3. The method of manufacturing the package carrier according to claim 1 further comprising forming a bonding material on the portion of the conductive layer exposed by the insulating pattern.
4. The method of manufacturing the package carrier according to claim 3, wherein the bonding material is a solder layer, metallic layer or organic solderablilty preservatives (OSP) layer.
5. The method of manufacturing the package carrier according to claim 1, wherein the supporting board has a recess pattern fitting the insulating pattern, and the insulating pattern is deposed in the recess pattern after the insulating pattern is detachably connected to the supporting board.
6. The method of manufacturing the package carrier according to claim 1, wherein the holding substrate includes a main plate and a release layer, and the release layer is interposed between the main plate and the conductive layer.
7. The method of manufacturing the package carrier according to claim 1 further comprising forming a solder mask layer on the wiring layer after the wiring layer is formed.
8. The method of manufacturing the package carrier according to claim 7, wherein the supporting board comprises a metal layer electrically connected to the wiring layer, the method after forming the solder mask layer further comprising:
electrifying the metal layer to electroplate the wiring layer, thereby forming a protective layer, wherein the solder mask layer exposes the protective layer.
9. The method of manufacturing the package carrier according to claim 1 further comprising changing a surface roughness of the wiring layer after the wiring layer is formed.
10. The method of manufacturing the package carrier according to claim 1 comprising:
providing at least two conductive layers, wherein the holding substrate is interposed between the conductive layers;
forming two insulating patterns respectively on the conductive layers;
providing two supporting boards;
detachably connecting the insulating patterns to the supporting boards respectively, wherein the insulating patterns is in contact with the supporting boards respectively;
removing the holding substrate and letting the conductive layers remain after detachably connecting the insulating patterns to the supporting boards; and
patterning the conductive layers to form wiring layers respectively after removing the holding substrate.
11. A method of manufacturing a package carrier comprising:
forming a circuit structure and an insulating pattern on a holding substrate, wherein the insulating pattern is attached to the circuit structure, and the circuit structure is interposed between the insulating pattern and the holding substrate;
providing a supporting board;
detachably connecting the insulating pattern to the supporting board, wherein the insulating pattern is in contact with the supporting board; and
removing the holding substrate and letting the circuit structure remain after detachably connecting the insulating pattern to the supporting board.
12. The method of manufacturing the package carrier according to claim 11, wherein forming the circuit structure comprises:
providing a conductive layer on the holding substrate;
forming a barrier layer on the conductive layer; and
forming at least one wiring layer on the barrier layer, wherein the insulating pattern is formed on the wiring layer.
13. The method of manufacturing the package carrier according to claim 12, wherein the barrier layer and the conductive layer are removed after removing the holding substrate.
14. The method of manufacturing the package carrier according to claim 12, wherein forming the wiring layer comprises forming a seed layer on the barrier layer interposed between the conductive layer and the seed layer; further remove the seed layer after removing the holding substrate.
15. The method of manufacturing the package carrier according to claim 11, wherein forming the circuit structure comprises:
forming a first wiring layer on the holding substrate;
forming a plurality of metal posts on the first wiring layer;
after forming the metal posts, forming a dielectric layer covering the first wiring layer and the metal posts; and
forming a second wiring layer connected to the metal posts on the dielectric layer.
16. A package carrier, comprising:
a circuit structure comprising at least one connecting pad and a mounting pad, wherein the mounting pad is used for mounting an electronic component, and the connecting pad is used for electrically connecting the electronic component; and
an insulating pattern attached to the circuit structure.
17. The package carrier according to claim 16, wherein the circuit structure further comprises:
at least two wiring layers, one of the wiring layers comprising the connecting pad and the mounting pad;
at least one dielectric layer interposed between the wiring layers; and
a plurality of metal posts electrically connected to the wiring layer and arranged in the dielectric layer.
18. The package carrier according to claim 16, wherein the circuit structure is a wiring layer, and the insulating pattern in contact with the wiring layer has an opening exposing the connecting pad.
19. The package carrier according to claim 16 further comprising a supporting board having a recess pattern fitting the insulating pattern, wherein the insulating pattern is detachably connected to the supporting board, and the insulating pattern is disposed in the recess pattern.
20. The package carrier according to claim 19, wherein the supporting board comprises:
a plastic board; and
a metal layer laminated on the plastic board and having the recess pattern, wherein the metal layer is interposed between the insulating pattern and the plastic board.
21. A method of manufacturing an electronic package comprising:
mounting the electronic component on the mounting pad of the package carrier according to claim 19;
forming a molding layer encapsulating the electronic component on the circuit structure; and
removing the supporting board after forming the molding layer.
22. The method of manufacturing the electronic package according to claim 21 further comprising:
dicing the supporting board, the insulating pattern and the circuit structure to form a plurality of strips before mounting the electronic component on the circuit structure, wherein the electronic component is mounted on one of the strips.
23. The method of manufacturing the electronic package according to claim 22 further comprising dicing the strip after removing the supporting board.
24. An electronic package, comprising:
the package carrier according to claim 16;
the electronic component mounted on the mounting pad and electrically connected to at least one connecting pad, wherein the mounting pad and the connecting pad are both interposed between the electronic component and the insulating pattern; and
a molding layer covering the electronic component.
25. The electronic package according to claim 24, wherein the package carrier further comprises a supporting board having a recess pattern fitting the insulating pattern, and the insulating pattern is detachably connected to the supporting board and disposed in the recess pattern.

1. A photochromic compound selected from a spiro(indoline)naphtho(2,1-b) (1,4)oxazine and a spiro(indoline) naphtho(1,2-b)(1,4)oxazine containing a group selected from:
(a) CH2CnF2n1 at the nitrogen atom in the 1-position on the indoline part of the molecule, wherein n is an integer of 1 to 6;
(b) COOR at the 3-position on the indoline part of the molecule, wherein R is (i) C1-C6 alkyl optionally substituted by fluoro, C1-C4 alkoxy or fluoroalkoxy, C1-C4 alkylcarbonyloxy, C2-C4 alkenylcarbonyloxy, C3-C6 cycloalkyl or aryl; (ii) C2-C6 alkenyl with a terminal double bond; (iii) C3-C6 cycloalkyl optionally substituted by fluoro; or (iv) aryl;
(c) an OCF3 group on the benzene ring of the indoline part of the molecule;
(d) an aryl(dialkyl)methyl group of the formula C(aryl)(CnH2n1)(CmH2m1), wherein n and m are integers from 1 to 5, linked to one of the benzene rings of the naphthoxazine part of the molecule; and
(e) any combination of (a), (b), (c) andor (d).
2. A spiro(indoline)naphtho(2,1-b) (1,4)oxazine or a spiro(indoline) naphtho(1,2-b)(1,4)oxazine according to claim 1, containing a group CH2CnF2n1 at the nitrogen atom in the 1-position on the indoline part of the molecule, wherein n is an integer of 1 to 4.
3. A spiro(indoline)naphtho(2,1-b)(1,4)oxazine or spiro(indoline)naphtho(1,2-b)(1,4) oxazine according to claim 2 having the following formulas Ia and Ib, respectively:
23
wherein
(a) n is an integer from 1 to 6; p is 1 or 2; and q is an integer from 1 to 6;
(b) R2 and R3 represent independently a radical selected from: (i) C1-C6 alkyl optionally substituted by fluoro, C1-C4 alkoxy or fluoroalkoxy, C1-C4 alkylcarbonyloxy, C2-C4 alkenylcarbonyloxy, C3-C6 cycloalkyl or aryl-; (ii) C2-C6 alkenyl with a terminal double bond; (iii) C3-C6 cycloalkyl optionally substituted by fluoro; (iv) aryl; (v) alkylcarbonyl; or (vi) one of R2 and R3 is a group COOR wherein R is a radical (i) to (iv) as defined hereinbefore and the other of R2 and R3 is a radical (i) to (iv) as defined hereinbefore; or (vii) R2 and R3 together with the carbon atom at position 3 of the indoline ring form a 3-7 membered saturated ring optionally containing a heteroatom selected from nitrogen, oxygen or sulfur, and
(c) R4 and R5 represent independently (i) hydrogen; (ii) halogen, preferably fluoro; or a radical selected from: (iii) cyano; (iv) aryloxy optionally substituted by C1-C6 alkyl, C1-C4 alkoxy or amino; (v) C1-C4 alkoxy optionally substituted by halogen, preferably di- and trifluoromethoxy; (vii) C1-C6 alkyl optionally substituted by C1-C4 alkoxy, halogen, preferably trifluoromethyl, C3-C6 cycloalkyl, polycycloalkyl (such as norbomane or adamantane), aryl or heterocyclyl; (viii) aryl optionally substituted with amino or alkoxy group, preferably dialkylaminophenyl or methoxyphenyl; (ix) amide (CONH2); (x) sulfonamide (SO2NH2); (xi) NR6R7, wherein R6 and R7 are independently selected from alkyl, alkenyl, cycloalkyl, aryl, alkylaryl, fluoroalkyl (preferably trifluoromethyl) or R6 and R7 together with the nitrogen atom form a 3-7 membered saturated ring optionally containing a further heteroatom selected from nitrogen, oxygen or sulfur atom, preferably piperidino, piperazino or morpholino; (xii) R4 may further be OCF3, in which case p is 1; and (xiii) R5 may further be an aryl(dialkyl)methyl group of the formula C(aryl)(CnH2n1)(CmH2m1), wherein n and m are integers from 1 to 5, linked to one of the benzene rings of the naphthoxazine part of the molecule, in which case q is an integer from 1 to 5.
4. A spiro(indoline)naphtho(2,1-b)(1,4)oxazine or spiro(indoline)naphtho(1,2-b)(1,4) oxazine compound according to claim 1, containing at the 3-position on the indoline part of the molecule a group COOR, wherein R is selected from: (i) C1-C6 alkyl optionally substituted by fluoro, C1-C4 alkoxy or fluoroalkoxy, C1-C4 alkylcarbonyloxy, C2-C4 alkenylcarbonyloxy, C3-C6 cycloalkyl or aryl; (ii) C1-C6 alkenyl with a terminal double bond; (iii) C3-C6 cycloalkyl; or (iv) aryl.
5. A spiro(indoline)naphtho(2,1-b)(1,4)oxazine or spiro(indoline)naphtho(1,2-b)(1,4) oxazine according to claim 4, having the formulas IIa and IIb, respectively:
24
wherein
(a) p is 1 or 2 and q is an integer from 1 to 6;
(b) R1 is a radical selected from: (i) C1-C6 alkyl optionally substituted by C1-C4 alkoxy, C1-C4 alkylcarbonyloxy, C2-C4 alkenylcarbonyloxy, C3-C6 cycloalkyl, polycycloalkyl, aryl or heterocyclic ring; (ii) C3-C6 cycloalkyl; (iii) polycycloalkyl: (iv) aryl; (v) heterocyclic ring; (vi) CH2CnF2n1 wherein n is an integer of 1 to 6; or (vii) C2-C6 alkenyl with a terminal double bond;
(c) R3 represents a radical selected from: (i) C1-C6 alkyl optionally substituted by fluoro, C1-C4 alkoxy or fluoroalkoxy, C1-C4 alkylcarbonyloxy, C2-C4 alkenylcarbonyloxy, C3-C6 cycloalkyl or aryl; (ii) C2-C6 alkenyl with a terminal double bond; (iii) C3-C6 cycloalkyl optionally substituted by fluoro ; or (iv) aryl; and
(d) R4 and R5 represent independently (i) hydrogen; (ii) halogen, preferably fluoro; or a radical selected from: (iii) cyano; (iv) aryloxy optionally substituted by C1-C6 alkyl, C1-C4 alkoxy or amino; (v) C1-C4 alkoxy optionally substituted by halogen, preferably di- and trifluoromethoxy; (vii) C1-C6 alkyl optionally substituted by C1-C4 alkoxy, halogen, preferably trifluoromethyl, C3-C6 cycloalkyl, polycycloalkyl (such as norbomane or adamantane), aryl or heterocyclyl; (viii) aryl optionally substituted with amino or alkoxy group, preferably dialkylaminophenyl or methoxyphenyl; (ix) amide (CONH2); (x) sulfonamide (SO2NH2); (xi) NR6R7, wherein R6 and R7 are independently selected from alkyl, alkenyl, cycloalkyl, aryl, alkylaryl, fluoroalkyl (preferably trifluoromethyl) or R6 and R7 together with the nitrogen atom form a 3-7 membered saturated ring optionally containing a further heteroatom selected from nitrogen, oxygen or sulfur atom, preferably piperidino, piperazino or morpholino; (xii) R4 may further be OCF3, in which case p is 1; and (xiii) R5 may further be an aryl(dialkyl)methyl group of the formula C(aryl)(CnH2n1)(CmH2m1), wherein n and m are integers from 1 to 5, linked to one of the benzene rings of the naphthoxazine part of the molecule, in which case q is an integer from 1 to 5.
6. A spiro(indoline)naphtho(2,1-b)(1,4)oxazine and spiro(indoline)naphtho(1,2-b)(1,4) oxazine according to claim 1, having a trifluoromethoxy (OCF3) group on the benzene ring of the indoline part of the molecule.
7. A spiro(indoline)naphtho(2,1-b)(1,4)oxazine or spiro(indoline)naphtho(1,2-b)(1,4) oxazine according to claim 6, having the formulas IIIa and IIIb, respectively:
25
(a) q is an integer from 1 to 6;
(b) R1 is a radical selected from: (i) C1-C6 alkyl optionally substituted by C1-C4 alkoxy, C1-C4 alkylcarbonyloxy. C2-C4 alkenylcarbonyloxy, C3-C6 cycloalkyl, polycycloalkyl, aryl or heterocyclic ring; (ii) C3-C6 cycloalkyl; (iii) polycycloalkyl: (iv) aryl; (v) heterocyclic ring; (vi) CH2-CnF2n1 wherein n is an integer of 1 to 6; or (vii) C2-C6 alkenyl with a terminal double bond;
(c) R2 and R3 represent independently a radical selected from: (i) C1-C6 alkyl optionally substituted by fluoro, C1-C4 alkoxy or fluoroalkoxy, C1-C4 alkylcarbonyloxy, C2-C4 alkenylcarbonyloxy, C3-C6 cycloalkyl or aryl; (ii) C2-C6 alkenyl with a terminal double bond; (iii) C3-C6 cycloalkyl optionally substituted by fluoro; (iv) aryl; or (v) alkylcarbonyl; or (vi) one of R2 and R3 is a group COOR wherein R is a radical (i) to (iv) as defined hereinbefore and the other of R2 and R3 is a radical (i) to (iv) as defined hereinbefore; or (vii) R2 and R3 together with the carbon atom at position 3 of the indoline ring form a 3-7 membered saturated ring optionally containing a heteroatom selected from nitrogen, oxygen or sulfur, and
(d) R4 and R5 represent independently (i) hydrogen; (ii) halogen, preferably fluoro; or a radical selected from: (iii) cyano; (iv) aryloxy optionally substituted by C1-C6 alkyl, C1-C4 alkoxy or amino; (v) C1-C4 alkoxy optionally substituted by halogen, preferably di- and trifluoromethoxy; (vii) C1-C6 alkyl optionally substituted by C1-C4 alkoxy, halogen, preferably trifluoromethyl, C3-C6 cycloalkyl, polycycloalkyl (such as norbornane or adamantane), aryl or heterocyclyl; (viii) aryl optionally substituted with amino or alkoxy group, preferably dialkylaminophenyl or methoxyphenyl; (ix) amide (CONH2); (x) sulfonamide (SO2NH2); (xi) NR6R7, wherein R6 and R7 are independently selected from alkyl, alkenyl, cycloalkyl, aryl, alkylaryl, fluoroalkyl (preferably trifluoromethyl) or R6 and R7 together with the nitrogen atom form a 3-7 membered saturated ring optionally containing a further heteroatom selected from nitrogen, oxygen or sulfur atom, preferably piperidino, piperazino or morpholino; and (xii) R5 may further be an aryl(dialkyl)methyl group of the formula C(aryl)(CnH2n1)(CmH2m1), wherein n and m are integers from 1 to 5, linked to one of the benzene rings of the naphthoxazine part of the molecule, in which case q is an integer from 1 to 5.
8. A spiro(indoline)naphtho(2,1-b)(1,4)oxazine or spiro(indoline)naphtho(1,2-b)(1,4) oxazine according to claim 1, having an aryl(dialkyl)methyl group of the formula C(aryl)(CnH2n1)(CmH2m1), wherein n and m are integers from 1 to 5, linked to one of the benzene rings of the naphthoxazine part of the molecule.
9. A spiro(indoline)naphtho(2,1-b)(1,4)oxazine or spiro(indoline)naphtho(1,2-b)(1,4) oxazine according to claim 8, having the formulas IVa and IVb, respectively:
26
wherein
(a) p is 1 or 2 and q is an integer from 1 to 5;
(b) R1 is a radical selected from: (i) C1-C6 alkyl optionally substituted by C1-C4 alkoxy, C1-C4 alkylcarbonyloxy, C2-C4 alkenylcarbonyloxy, C3-C6 cycloalkyl, polycycloalkyl, aryl or heterocyclic ring; (ii) C3-C6 cycloalkyl; (iii) polycycloalkyl: (iv) aryl; (v) heterocyclic ring; (vi) CH2CnF2n1 wherein n is an integer of 1 to 6; or (vii) C2-C6 alkenyl with a terminal double bond;
(c) R2 and R3 represent independently a radical selected from: (i) C1-C6 alkyl optionally substituted by fluoro, C1-C4 alkoxy or fluoroalkoxy, C1-C4 alkylcarbonyloxy, C2-C4 alkenylcarbonyloxy, C3-C6 cycloalkyl or aryl; (ii) C2-C6 alkenyl with a terminal double bond; (iii) C3-C6 cycloalkyl optionally substituted by fluoro; (iv) aryl; or (v) alkylcarbonyl; or (vi) one of R2 and R3 is a group COOR wherein R is a radical (i) to (iv) as defined hereinbefore and the other of R2 and R3 is a radical (i) to (iv) as defined hereinbefore; or (vii) R2 and R3 together with the carbon atom at position 3 of the indoline ring form a 3-7 membered saturated ring optionally containing a heteroatom selected from nitrogen, oxygen or sulfur, and
(d) R4 and R5 represent independently (i) hydrogen; (ii) halogen, preferably fluoro; or a radical selected from: (iii) cyano; (iv) aryloxy optionally substituted by C1-C6 alkyl, C1-C4 alkoxy or amino; (v) C1-C4 alkoxy optionally substituted by halogen, preferably di- and trifluoromethoxy; (vii) C1-C6 alkyl optionally substituted by C1-C4 alkoxy, halogen, preferably trifluoromethyl, C3-C6 cycloalkyl, polycycloalkyl (such as norbomane or adamantane), aryl or heterocyclyl; (viii) aryl optionally substituted with amino or alkoxy group, preferably dialkylaminophenyl or methoxyphenyl; (ix) amide (CONH2); (x) sulfonamide (SO2NH2); (xi) NR6R7, )wherein R6 and R7 are independently selected from alkyl, alkenyl, cycloalkyl, aryl, alkylaryl, fluoroalkyl (preferably trifluoromethyl) or R6 and R7 together with the nitrogen atom form a 3-7 membered saturated ring optionally containing a further heteroatom selected from nitrogen, oxygen or sulfur atom, preferably piperidino, piperazino or morpholino; and (xii) R4 may further be OCF3, in which case p is 1.
10. A spiro(indoline)naphtho(2,1-b)(1,4)oxazine or spiro(indoline)naphtho(1,2-b)(1,4) oxazine according to any one of claims 1 to 9, wherein any alkyl or alkoxy radical is linear or branched; any C2-C4 alkenylcarbonyloxy radical is preferably the radical derived from acrylic (OCOCHCH2) or methacrylic (OCO(CH3)CH2) acid; any C3-C6 cycloalkyl is preferably cyclopentyl or cyclohexyl; the polycycloalkyl may be a C4-C20 bicycloalkyl such as partially or completely saturated naphthyl or a C6-C20 tricycloalkyl such as adamantyl and norbornyl; any C2-C6 alkenyl with a terminal double bond is preferably CH2CHCH2 or CH2(CH2)3CHCH2; preferred radicals CH2CnF2n1 are CH2CF3 and CH2CF2CF3; in the group of the formula C(aryl)(CnH2n1)(CmH2m1), n and m are preferably 1 such that said linking group is preferably tert-propylene (CH3)C(CH3).
11. A spiro(indoline)naphtho(2,1-b)(1,4)oxazine or spiro(indoline)naphtho(1,2-b)(1,4) oxazine according to any one of claims 1 to 10, selected from the compounds:
1,3,3-trimethyl-5-trifluoromethoxy-spiro-(indoline-2,3-(3H)-naphtho2,1-b-(1,4)-oxazine)
1-Cyclohexylmethyl-3,3-dimethyl-5-trifluoromethoxy-6-dimethyl-amino-spiro-(indoline-2,3-(3H)-naphtho2,1-b-(1,4)-oxazine)
1-Propyl-3,3-dimethyl-5-trifluoromethoxy-6-dimethylamino-spiro-(indoline-2,3-(3H)-naphtho2,1-b-(1,4)-oxazine)
1-Propyl-3,3-dimethyl-5-trifluoromethoxy-6-piperidino-spiro-(indoline-2,3-(3H)-naphtho-2,1-b-(1,4)-oxazine)
1,3-Dimethyl-3-carboethoxy-spiro-(indoline-2,3-(3H)-naphtho2,1-b-(1,4)-oxazine)
1-Cyclohexylmethyl-3-methyl-3-carboethoxy-spiro-(indoline-2,3-(3H)-naphtho 2,1-b-(1,4)-oxazine
1,3,4,5-Tetramethyl-3-carboethoxy-spiro-(indoline-2,3-(3H)-naphtho-2,1-b-(1,4)-oxazine)
1,3,4,5-Tetramethyl-3-carboethoxy-8-(1-methyl-1-phenyl)ethyl-spiro-(indoline-2,3-(3H)-naphtho2,1-b-(1,4)-oxazine)
1,3-Dimethyl-3-carboethoxy-9-acetyloxy-spiro-(indoline-2,3-(3H)-naphtho-2,1-b-(1,4)-oxazine)
1-Isobutyl-3-methyl-3-carboethoxy-spiro-(indoline-2,3-(3H)-naphtho-2,1-b-(1,4)-oxazine)
1-Isobutyl-3,5-dimethyl-3-carboethoxy-spiro-(indoline-2,3-(3H)-naphtho-2,1-b-(1,4)-oxazine)
1,3-Dimethyl-3-carboethoxy-8-(1-methyl-1-phenyl)-ethyl-spiro-(indoline-2,3-(3H)-naphtho-2,1-b-(1,4)-oxazine)
1,3,5,6-Tetramethyl-3-carboethoxy-spiro-(indoline-2,3-(3H)-naphtho-2,1-b-(1,4)-oxazine)
1-Cyclohexylmethyl-3-methyl-3-carboethoxy-6-dimethylamino-spiro-(indoline-2,3-(3H)-naphtho-2,1-b-(1,4)-oxazine)
1-Propyl-3,5-Dimethyl-3-carboethoxy-spiro-(indoline-2,3-(3H)-naphtho-2,1-b-(1,4)-oxazine)
1,3-Dimethyl-3-carboethoxy-6-methoxy-spiro-(indoline-2,3-(3H)-naphtho-2,1-b-(1,4)-oxazine)
1-(2-Phenylethyl)-3-methyl-3-carboethoxy-spiro-(indoline-2,3-(3H)-naphtho-2,1-b-(1,4)-oxazine)
1-Ethyl-3,5-dimethyl-3-carboethoxy-spiro-(indoline-2,3-(3H)-naphtho-2,1-b-(1,4)-oxazine)
1-Isobutyl-5-fluoro-3-methyl-3-carboethoxy-spiro-(indoline-2,3-(3H)-naphtho-2,1-b-(1,4)-oxazine)
1-(2,2,2-trifluoroethyl)-3,3-dimethyl-6(4-diethylaminophenyl)-spiro-(indoline-2,3-(3H)-naphtho-2,1-b-(1,4)-oxazine)
1-(2,2,2-Trifluoroethyl)-3,3-dimethyl-spiro-(indoline-2,3-(3H)-naphtho-2,1-b-(1,4)-oxazine)
1-Cyclohexylmethyl-3,3-spiro-(cyclohexyl)-8-(1-methyl-1-phenyl)ethyl-spiro-(indoline-2,3-(3H)-naphtho-2,1-b-(1,4)-oxazine)
1-Cyclohexylmethyl-3,3-dimethyl-8-(1-methyl-1-phenyl)ethyl-spiro-(indoline-2,3-(3H)-naphtho-2,1-b-(1,4)-oxazine)
1-Cyclohexylmethyl-3,3-dimethyl-6-morpholino-8-(1-methyl-1-phenyl) ethyl-spiro-(indoline-2,3-(3H)-naphtho-2,1-b-(1,4)-oxazine)
1-Cyclohexylmethyl-3,3-dimethyl-6-morpholino-8-(1-methyl-1-phenyl) ethyl-spiro-(indoline-2,3-(3H)-naphtho-1,2-b-(1,4)-oxazine)
1-Propyl-3,5-Dimethyl-3-carboethoxy-spiro-(indoline-2,3-(3H)-naphtho-1,2-b-(1,4)-oxazine)
12. A plastic organic photochromic article comprising a plastic host material containing a photochromic compound as claimed in any one of claims 1 to 11, or a mixture thereof.
13. A photochromic article according to claim 12 containing one or more compounds according to any one of claims 1 to 11 and another photochrome known in the art.
14. A photochromic article according to claim 12 or 13 further containing plasticizers, light stabilizers andor materials for the photochrome microencapsulation.
15. A photochromic article according to any one of claims 12 to 14, said article being a plastic lens.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A stepped riser comprising:
one or more generally horizontal treads; and
one or more generally vertical rises, each of said treads and rises comprising a sandwich structure having upper and lower metal plates and an intermediate layer of a compact polyurethane material bonded to said metal plates so as to transfer shear forces therebetween,
wherein each of said treads extends between adjacent rises and comprises said sandwich structure throughout its extent between said adjacent rises, and
wherein each of said rises extends between adjacent treads and comprises said sandwich structure throughout its extent between said adjacent treads.
2. A stepped riser according to claim 1 wherein said riser is a seating riser.
3. A stepped riser according to claim 2 further comprising mounting details for at least one seat andor railings.
4. A stepped riser according to any one of claims 1 to 3 wherein said riser has a maximum length of from 6 to 20 m.
5. A stepped riser according to any one of claims 1 to 3 wherein said stepped riser has a run of from 600 to 1200 mm.
6. A stepped riser according to any one of claims 1 to 3 wherein said upper and lower metal plates are formed by folding or roll-forming respective flat plates.
7. A stepped riser according to any one of claims 1 to 3 wherein said intermediate layer is thicker in treads of said stepped riser than in rises.
8. A stepped riser according to claim 1 wherein one of said rises joins the front edge of an upper one of said treads to the rear edge of a lower one of said treads and a said second rise extends upwardly from the rear edge of said upper tread, the front edge of said lower tread having a downwardly projection lip portion.
9. A stepped riser according to claim 8 wherein said upper and lower plates are flared in said lip portion to receive an upper edge of an upper rise of a like stepped riser.
10. A stepped riser according to any one of claims 1 to 3 wherein said upper plate is made of a different metal or alloy than said lower plate.
11. A stepped riser according to claim 10 wherein said upper plate is more corrosion resistant than said lower plate.
12. A stepped riser according to any one of claims 1 to 3 wherein said upper plate is thinner than said lower plate.
13. A stepped riser according to any one of claims 1 to 3 wherein said upper plate is provided with a corrosion prevention treatment.
14. A stepped riser according to any one of claims 1 to 3 wherein said upper plate has a thickness in the range of from 2 to 10 mm, said lower plate has a thickness in the range of from 2 to 10 mm and said intermediate layer has a thickness in the range of from 10 to 100 mm.
15. A spectator stand having at least one stepped riser according to any one of claims 1 to 3.