All The Claims

1. An allophanate-modified, partially trimerized cycloaliphatic diisocyanate which is characterized by a low Tg, and which comprises the reaction product of:
(1) organic diisocyanate having cycloaliphatically bound isocyanate groups, with
(2) an hydroxyl-functional organic compound having a molecular weight of 200 to 2,000 and a functionality of greater than 1 to less than or equal to 2.9, in the presence of
(3) at least one suitable catalyst,
wherein the organic diisocyanate component (1) is free of diisocyanates which have aliphatically bound isocyanate groups andor of diisocyanates which have aromatically bound isocyanate groups, and wherein the Tg of the resultant product ranges from about \u221230\xb0 C. to about 40\xb0 C. and is measured after the removal of an unreacted excess monomer from the resultant product.
2. The allophanate-modified, partially trimerized cycloaliphatic diisocyanate of claim 1, wherein
(1) said organic diisocyanate is 1-isocyanato-3,3,5-trimethyl-5-isocyanatomethyl cyclohexane,
and
(2) said hydroxyl-functional organic compound is selected from the group consisting of polyester diols, and caprolactone based polyester diols.
3. The allophanate-modified, partially trimerized cycloaliphatic diisocyanate of claim 1, wherein the Tg. ranges from about \u221220\xb0 C. and to about 30\xb0 C.
4. A process for preparing an allophanate-modified, partially trimerized cycloaliphatic diisocyanate which is characterized by a Tg from about \u221230\xb0 C. to about 40\xb0 C. measured after the removal of an unreacted excess monomer from the resultant product, such process comprising:
(A) providing an organic diisocyanate having cycloaliphatically bound isocyanate groups,
(B) trimerizing a portion of the isocyanate groups of an organic diisocyanate having cycloaliphatically bound isocyanate groups in the presence of a suitable catalyst,
(C) terminating the trimerization reaction at the desired degree of trimerization, and
(D) removing unreacted excess diisocyanate from the resultant product such that the product has the free monomer content of the diisocyanate is less than 0.5% by weight;
wherein prior to step (D), the process additionally comprises adding at least one hydroxyl-functional organic compound having a molecular weight of 200 to 2,000 and a functionality of greater than 1 to less than or equal to 2.9, and allowing the reaction to continue until the desired quantity of allophanate groups are formed and wherein the organic diisocyanate component in step (B) is free of diisocyanates which have aliphatically bound isocyanate groups andor of diisocyanates which have aromatically bound isocyanate groups.
5. The process of claim 4, wherein
(1) said organic diisocyanate is 1-isocyanato-3,3,5-trimethyl-5-isocyanatomethyl cyclohexane,
and
(2) said hydroxyl-functional organic compound is selected from the group consisting of polyester diols, and caprolactone based polyester diols.
6. The process of claim 4, wherein the Tg ranges from about \u221220\xb0 C. and to about 30\xb0 C.
7. The process of claim 4, in which the trimerization and the allophanatization reactions occur simultaneously.
8. The process of claim 4, in which the trimerization reaction occurs first, followed by the allophanatization reaction.
9. The process of claim 4, in which the allophanatization reaction occurs first, followed by the trimerization reaction.
10. A coating composition comprising:
(A) the allophanate-modified, partially trimerized cycloaliphatic diisocyanate of claim 1,
and
(B) at least one compound that contains isocyanate-reactive groups.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

What is claimed is:

1. An electrical connector comprising:
a contact plate comprising a plurality of conductive terminals electrically coupled to the contact plate;
at least one conductive wire connected to the contact plate;
wherein the contact plate distributes signals received via the at least one conductive wire, to the plurality of conductive terminals; and
a housing for holding the contact plate;
2. The connector of claim 1, wherein the conductive wire is connected to the contact plate with an insulation displacement contact.
3. The connector of claim 1, wherein the conductive wire is connected to the contact plate by solder.
4. The connector of claim 1, wherein the conductive wire is connected to the contact plate by crimping.
5. The connector of claim 1, wherein the contact plate and conductive terminals are made of copper alloy.
6. An electrical connector comprising:
a housing having a plurality of first protrusions on one end, wherein the first protrusions are separated from each other by a plurality of slots;
a contact plate having a plurality of conducting structures, wherein the conducting structures are connected at one end to form a contact part, and the contact plate is inserted into the housing; and
a cover having a plurality of indentations formed on one side, wherein positions of the indentations match positions of the slots, wherein the cover is fit onto the contact plate and the housing.
7. The connector of claim 6, wherein the conductive wire is connected to the contact plate with an insulation displacement contact.
8. The connector of claim 6, wherein the conductive wire is connected to the contact plate by solder.
9. The connector of claim 6, wherein the conductive wire is connected to the contact plate by crimping.
10. The connector of claim 6, wherein the contact plate and conductive terminals are made of copper alloy.
11. An electrical connector comprising:
a housing having a plurality of first protrusions on one end, wherein the first protrusions are separated from each other by a plurality of slots;
a contact plate having a plurality of conducting structures, wherein the conducting structures are connected at one end to form a contact part, and the contact plate is inserted into the housing; and
a cover having a plurality of second protrusions formed on one side, wherein positions of the second protrusions match positions of the slots, wherein the cover is fit onto the contact plate and the housing.
12. The connector of claim 11, wherein the conductive wire is connected to the contact plate with an insulation displacement contact.
13. The connector of claim 11, wherein the conductive wire is connected to the contact plate by solder.
14. The connector of claim 11, wherein the conductive wire is connected to the contact plate by crimping.
15. The connector of claim 11, wherein the contact plate and conductive terminals are made of copper alloy.
16. An electrical connector comprising:
a housing having a plurality of first protrusions on one end, wherein the first protrusions are separated from each other by a plurality of slots;
a contact plate having a plurality of sets of conducting structures, wherein the conducting structures of each set are connected together at one end to form a contact part, and an oblong-shaped slot is formed on the contact part, the contact plate being inserted into the housing; and
a cover having a hollow in the middle and a plurality of second protrusions formed on one side, wherein a portion of the second protrusions have a concave surface, the second protrusions being separated from each other by a plurality of holes, and positions of the second protrusions and the holes of the cover are matched and correspond to positions of the slots and first protrusions of the housing, wherein the cover is fit onto the contact plate and the housing.
17. The connector of claim 16, wherein the conductive wire is connected to the contact plate with an insulation displacement contact.
18. The connector of claim 16, wherein the conductive wire is connected to the contact plate by solder.
19. The connector of claim 16, wherein the conductive wire is connected to the contact plate by crimping.
20. The connector of claim 16, wherein each set of the conducting structures comprises two conducting structures.
21. The connector of claim 16, wherein each set of the conducting structures comprises three conducting structures.
22. The connector of claim 16, wherein the conducting structures are made of copper alloy.

1. a quinazolinone of formula:
wherein
R1 is hal;
X is N or CR8;
R2 is hal; nitro; C1-C8alkylcarbonyl; C1-C6alkyl or C3-C8cycloalkyl;
R3 is C1-C6alkyl; C1-C6alkoxy or amino:
R4 is H; hal; hydroxy; amino; C1-C6alkyl-amino di(C1-C6alkyl)-amino, C1-C6alkyl; C1-C6alkoxy which is unsubstituted or mona, di- or trisubstituted by halogen or hydroxy; C1-C6alkoxyC1-C6alkoxy; C1C6alkoxyC1-C6alkoxyC1-C6alkoxy; C1-C6alkoxyC1-C6alkyl; C3-C7cycloalkyl or C3-C7cycloalkylC1-C6alkoxy that may be substituted at the cycloalkyl residue by C1-C6alkyl C1-C6alkoxycarbonyl; C3-C6alkenyloxy; (C1-C6alkyl)2N-C1-C6alkoxy; C1-C6alkyl-sulfanylC1-C8alkoxy,
or
\u2014O\u2014CH2n-A wherein A represents
Y represents O or NR13,
and n is 0, 1, 2, 3, 4, 5 or 6;
R5 and R6, independently, are H; hal; C1-C6alkoxy; or C1-C6alkyl;
R7 and R8a independently are H or C1-C6alkyl;
R9 and R10, independently, are H or hal;
R11 is H; hal, C1-C6alkoxy; or C1-C6alkyl
R12 is H; hal; C1-C6alkoxy; or C1-C6alkyl;
R13 is H or C1-C6alkyl;
R14 is H; hal;: C1-C6alkoxy; or C1-C6alkyl; and
R15 and R16, independently, are H; hal; or C1-C6alkyl;
with the exception of the compound of formula I wherein R1 and R2 are both iodo or chloro and
R3 is methyl, and of the compound of formula I wherein R1 and R2 are both selected from fluoro and bromo and R3 is butyl,

in free base or acid addition salt form.
2. A quinazolinone of formula I according to claim 1 wherein
R1 is hal;
X is N or CR8;
R2 is C1-C6alkyl;
R3 is C1-C6alkyl or amino;
R4 is hal; hydroxy; amino; C1-C6alkyl-amino, C1-C6alkyl; C1-C6alkoxy which is unsubstituted or monosubstituted by halogen or hydroxy; C1-C6alkoxyC1-C6alkoxy; C1-C6alkoxyC1-C6alkoxyC1-C6alkoxy; C1-C6alkoxyC1-C6alkyl; C3-C7cycloalkyl or C3-C7cycloalkylC1-C6alkoxy that may be substituted at the cycloalkyl residue by C1-C6alkyl; C1-C6alkoxycarbonyl; C3-C6alkenyloxy; (C1-C6alkyl)2N-C1-C6alkoxy; C1-C6alkyl-sulfanyl; C1-C6alkyl-sulfanylC1-C6alkoxy,
or
\u2014O\u2014CH2n-A wherein A represents
Y represents O or NR13,
and n is 0, 1 or 2;
R5 and R6, independently, are H; hal; or C1-C6alkoxy;
R7 and R8, independently, are H or C1-C6alkyl;
R9 and R10, independently, are H or hal;
R11 is H; hal; C1-C6alkoxy; or C1-C6alkyl;
R12 is H;
R13 is C1-C6alkyl;
R14 is H; or C1-C6alkoxy; and
R15 and R16 are H; hal; or C1-C6alkyl;

in free base or acid addition salt form.
3. A quinazolinone of formula I according to claim 1 wherein
R1 is hal;
X is N or CR8;
R2 is C1-C6alkyl;
R3 is C1-C6alkyl or amino;
R4 is hal; hydroxy; amino; C1-C6alkyl-amino, C1-C6alkyl; C1-C6alkoxy which is unsubstituted or monosubstituted by halogen or hydroxy; C1-C6alkoxyC1-C6alkoxy; C1-C6alkoxyC1-C6alkoxyC1-C6alkoxy; C1-C6alkoxyC1-C6alkyl; C3-C7cycloalkyl or C3-C7cycloalkylC1-C6alkoxy that may be substituted at the cycloalkyl residue by C1-C6alkyl; C1-C6alkoxycarbonyl; C3-C6alkenyloxy; (C1-C6alkyl)2N-C1-C6alkoxy; C1-C6alkyl-sulfanyl; C1-C6alkyl-sulfanylC1-C6alkoxy, or \u2014O\u2014CH2n-A wherein A represents
Y represents O or NR13,
and n is 0, 1 or 2;
R5 and R6, independently, are H; hal; or C1-C6alkoxy;
R7 and R8, independently, are H or C1-C6alkyl;
R9 and R10, independently, are H or hal;
R12 is H;
R13 is C1-C6alkyl;
R14 is H; or C1-C6alkoxy; and
R15 and R16 are H; hal; or C1-C6alkyl;

in free base or acid addition salt form.
4. A compound of formula I according to claim 1 wherein
R1 is hal;
R2 is hal; nitro; C1-C6alkylcarbonyl; C1-C6alkyl or C3-C6cycloalkyl;
R3 is C1-C6alkyl; C1-C6alkoxy or amino;
R4 is hal; hydroxy; amino; C1-C6alkyl-amino, C1-C6alkyl; C1-C6alkoxy which is unsubstituted or monosubstituted by halogen or hydroxy; C1-C6alkoxyC1-C6alkoxy; C1-C6alkoxyC1-C6alkoxyC1-C6alkoxy; C1-C6alkoxyC1-C6alkyl; C3-C7cycloalkyl or C3-C7cycloalkylC1-C6alkoxy that may be substituted at the cycloalkyl residue by C1-C6alkyl; C1-C6alkoxycarbonyl; C3-C6alkenyloxy; (C1-C6alkyl)2N-C1-C6alkoxy; C1-C6alkyl-sulfanyl; C1-C6alkyl-sulfanylC1-C6alkoxy,
wherein n is 0, 1, 2, 3, 4, 5 or 6;
R5, R6, R11 and R14, independently, are H hal; C1-C6alkoxy; or C1-C6alkyl;
R12 is H or C1-C6alkyl; and
R9 and R10, independently are H or hal;
with the exception of the compound of formula I wherein R1 and R2 are both iodo or chloro and R3 is methyl, and of the compound of formula I wherein R1 and R2 are both selected from fluoro and bromo and R3 is butyl,
in free base or acid addition salt form.
5. A compound of formula II
wherein
R1 is hal;
and
R2 is hal; nitro; C1-C6alkylcarbonyl; C1-C6alkyl or C3-C6cycloalkyl.
6. A process for the preparation of a compound of formula I
wherein
R1 is hal;
X is N or CR8;
R2 is hal; nitro; C1C6alkylcarbonyl; C1-C6alkyl or C3-C8cycloalkyl;
R3 is C1-C6alkoxy or amino;
R4 is hal; hydroxy; amino; C1-C6alkyl-amino, C1-C6alkyl; C1-C6alkoxy which is unsubstituted or monosubstituted by halogen or hydroxy; C1-C6alkoxyC1-C6alkoxy; C1-C6alkoxyC1-C6alkoxyC1-C6alkoxy; C1-C6alkoxyC1-C6alkyl; C3-C7cycloalkyl or C3-C7cycloalkylC1-C6alkoxy that may be substituted at the cycloalkyl residue by C1-C6alkyl; C1-C6alkoxycarbonyl; C3-C6alkenyloxy; (C1-C6alkyl)2N-C1-C6alkoxy; C1-C6alkyl-sulfanyl; C1-C6alkyl-sulfanylC1-C6alkoxy,
or
\u2014O\u2014CH2n-A wherein A represents
Y represents O or NR13,
and n is 0, 1 or 2;
R5 and R6, independently, are H; hal; or C1-C6alkoxy;
R7 and R8, independently, are H or C1-C6alkyl;
R9 and R10, independently, are H or hal;
R11 is H; hal; C1-C6alkoxy; or C1-C6alkyl;
R12 is H;
R13 is C1-C6alkyl;
R14 is H; or C1-C6alkoxy; or C1-C6alkyl; and
R15 and R16 independently, are H; hal; or C1-C6alkyl; with the exception of the compound of formula I where R1 and R2 are both selected from fluor and bromo and R3 is butyl,
or a salt thereof, comprising the step of
a) for the production of a compound of formula I wherein R3 is not NH2, reacting a compound of formula II
wherein
R1 and R2 are as defined above, with a compound of formula III
N\u2261C\u2014R3\u2003\u2003(III)
wherein R3 is as defined in claim 1; or
b) for the production of a compound of formula I wherein R3 is NH2, reacting a compound of formula IV
wherein R1 and R2 is as defined above,
with 2-ethyl-2-thiopseudourea hydrobromide;
and recovering the obtained compound, in free or in salt form.
7. (canceled)
8. (canceled)
9. A pharmaceutical composition comprising a compound of claim 1 in free base or pharmaceutically acceptable acid addition salt form, in association with a pharmaceutical carrier or diluent.
10. (canceled)
11. (canceled)
12. A method for treating or preventing a disease or condition in which vanilloid receptor activation plays a role or is implicated comprising administering to a mammal in need thereof a therapeutically effective amount of a quinazolinone of formula I
wherein
R1 is hal;
X is N or CR8;
R2 is hal; nitro; C1-C6alkylcarbonyl; C1-C6alkyl or C3-C8cycloalkyl;
R3 is C1-C6alky; C1-C6alkoxy or amino;
R4 is hal; hydroxy; amino; C1-C6alkyl-amino, C1-C6alkyl; C1-C6alkoxy which is unsubstituted or monosubstituted by halogen or hydroxy; C1-C6alkoxyC1-C6alkoxy; C1-C6alkoxyC1-C6alkoxyC1-C6alkoxy; C1-C6alkoxyC1-C6alkyl; C3-C7cycloalkyl or C3-C7cycloalkylC1-C6alkoxy that may be substituted at the cycloalkyl residue by C1-C6alkyl; C1-C6alkoxycarbonyl; C3-C6alkenyloxy; (C1-C6alkyl)2N-C1-C6alkoxy; C1-C6alkyl-sulfanyl; C1-C6alkyl-sulfanylC1-C6alkoxy,
or
\u2014O\u2014CH2n-A wherein A represents
Y represents O or NR13,
and n is 0, 1 or 2;
R5 and R6, independently, are H; hal; or C1-C6alkoxy;
R7 and R8, independently, are H or C1-C6alkyl;
R9 and R10, independently, are H or hal;
R11 is H; hal; C1-C6alkoxy; or C1-C6alkyl;
R12 is H; hal; C1-C6alkoxy; or C1-C6alkyl;
R13 is C1-C6alkyl;
R14 is H; or C1-C6alkoxy; and
R15 and R16, independently, are H; hal; or C1-C6alkyl;

in free base or acid addition salt form.
13. A pharmaceutical composition for the treatment or prevention of a diseases or condition in which vanillold receptor activation plays a role or is implicated comprising a quinazolinone of formula I
wherein
R1 is hal;
X is N or CR8;
R2 is hal; nitro; C1-C6alkylcarbonyl; C1-C6alky or C3-C6cycloalkyl;
R3 is C1-C6alkyl; C1-C6alkoxy or amino;
R4 is hal; hydroxy; amino; C1-C6alkyl-amino, C1-C6alkyl; C1-C6alkoxy which is unsubstituted or monosubstituted by halogen or hydroxy; C1-C6alkoxyC1-C6alkoxy; C1-C6alkoxyC1-C6alkoxyC1-C6alkoxy; C1-C6alkoxyC1-C6alkyl; C3-C7cycloalkyl or C3-C7cycloalkylC1-C6alkoxy that may be substituted at the cycloalkyl residue by C1-C6alkyl; C1-C6alkoxycarbonyl; C3-C6alkenyloxy; (C1-C6alkyl)2N-C1-C6alkoxy; C1-C6alkyl-sulfanyl; C1-C6alkyl-sulfanylC1-C6alkoxy,
or
\u2014O\u2014CH2n-A wherein A represents
Y represents O or NR13,
and n is 0, 1 or 2;
R5 and R6, independently, are H; hal; or C1-C6alkoxy; or C1-C6alkyl;
R7 and R8, independently, are H or C1-C6alkyl;
R9 and R10, independently, are H or hal;
R11 is H; hal; C1-C6alkoxy; or C1-C6alkyl;
R12 is H; C1-C6alkoxy; or C1-C6alkyl;
R13 is C1-C6alkyl;
R14 is H; or C1-C6alkoxy; or C1-C6alkyl; and
R15 and R16, independently, are H; hal; or C1-C6alkyl;

and a carrier.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

What is claimed is:

1. A method of manufacturing a workpiece, comprising:
forming a sheet of material having a predetermined shape; and
forming a physical marker on said sheet of material, said physical marker indicating a position on said sheet of material, where said sheet of material is to be bent.
2. A method of manufacturing a workpiece as recited in claim 1, wherein said physical marker is a line where said sheet of material is to be bent along said line.
3. A method of manufacturing a workpiece as recited in claim 1, wherein said physical marker is a shape where said sheet of material is to be bent through said shape.
4. A method of manufacturing a workpiece as recited in claim 3, wherein said shape includes at least two vertices and said sheet of material is to be bent along said at least two vertices.
5. A method of manufacturing a workpiece as recited in claim 4, wherein said shape is a diamond.
6. A method of manufacturing a workpiece as recited in claim 4, wherein said shape is a four-sided arrow.
7. A workpiece, comprising:
a sheet of material having a predetermined shape;
a physical marker on said sheet of material, said physical marker indicating a position on said sheet of material, where said sheet of material is to be bent.
8. A workpiece as recited in claim 7, wherein said physical marker is a line where said sheet of material is to be bent along said line.
9. A workpiece as recited in claim 7, wherein said physical marker is a shape where said sheet of material is to be bent through said shape.
10. A workpiece as recited in claim 9, wherein said shape includes at least two vertices and said sheet of material is to be bent along said at least two vertices.
11. A workpiece as recited in claim 10, wherein said shape is a diamond.
12. A workpiece as recited in claim 10, wherein said shape is a four-sided arrow.
13. A method of determining whether a workpiece has been properly bent, comprising:
forming a sheet of material having a predetermined shape;
forming a physical marker on said sheet of material, said physical marker indicating a position on said sheet of material, where said sheet of material is to be bent;
bending said sheet of material along said position on said sheet of material;
determining whether said sheet of material has been properly bent by comparing said physical marker with a line along which said sheet of material has been bent.
14. A workpiece as recited in claim 13, wherein said physical marker is a line where said sheet of material is to be bent along said line.
15. A workpiece as recited in claim 13, wherein said physical marker is a shape where said sheet of material is to be bent through said shape.
16. A workpiece as recited in claim 15, wherein said shape includes at least two vertices and said sheet of material is to be bent along said at least two vertices.
17. A workpiece as recited in claim 16, wherein said shape is a diamond.
18. A workpiece as recited in claim 16, wherein said shape is a four-sided arrow.