All The Claims

1. A method of repairing a device configured to comminute material comprising:
removing at least one first insert from a portion of a crushing body such that at least one opening is formed in the portion of the crushing body, the portion of the crushing body comprised of metal, the at least one first insert being harder than the metal of the portion of the crushing body;
positioning at least one second insert in the at least one opening formed by the removing of the at least one first insert, the at least one second insert being harder that the metal of the portion of the crushing body;
positioning an explosive material adjacent to the at least one second insert and the portion of the crushing body;
igniting the explosive material to deform the portion of the crushing body to attach the at least one second insert to the portion of the crushing body.
2. The method of claim 1 wherein the explosive material is comprised of at least one explosive.
3. The method of claim 2 wherein the explosive material is an explosive powder, a plastic explosive, a plasticite explosive material, an emulsion explosive material, a liquid explosive material, a castable form explosive material, a sheet form explosive material, or a solid explosive material.
4. The method of claim 1 further comprising wherein the at least one first insert is only one first insert and the at least one second insert is only one second insert.
5. The method of claim 1 wherein the at least one second insert is mechanically interconnected to the portion of the crushing body after the explosive material is ignited, the mechanical interconnection of the portion of the crushing body and the at least one second insert being formed such that there is no intramolecular bond between the at least one second insert and the portion of the crushing body; and
wherein the portion of the crushing body is comprised of a portion of a wearable surface of the crushing body; and
wherein the wearable surface is configured to comminute material, the material being at least one of rock, ore, minerals, stone and agglomerated material.
6. The method of claim 1 further comprising positioning the at least one second insert in at least one sleeve assembly prior to the positioning of the at least one second insert in the at least one opening formed by the removing of the at least one first insert, the at least one sleeve assembly sized and configured to be positioned within the at least one opening.
7. The method of claim 6 wherein the positioning of the at least one second insert in the at least one opening formed by the removing of the at least one first insert is performed such that at least one gap is formed between the at least one sleeve and the portion of the crushing body.
8. The method of claim 1 wherein the positioning of the at least one second insert in the at least one opening formed by the removing of the at least one first insert is performed such that a gap is formed between each second insert and the portion of the crushing body adjacent that second insert in each of the at least one opening.
9. The method of claim 8 wherein each gap has a width of between 0.0625 inches and 0.125 inches.
10. The method of claim 9 wherein the removal of the at least one first insert is at least partially performed by at least one of drilling, chiseling or hammering and wherein the sleeve assembly is comprised of a sleeve and a cap attached adjacent to an end of the sleeve.
11. The method of claim 1 wherein the explosive material is an explosive material and the method further comprises positioning an ignition mechanism adjacent to the explosive material, the ignition mechanism configured to detonate the explosive material after the ignition mechanism is actuated.
12. The method of claim 1 wherein the crushing body is a roller of a roller mill, a roller of a roller press, a liner of a cone crusher, a bowl of a cone crusher, a die of a mill, a table of a mill, or a crushing body of a crushing device that is configured to impact material to comminute the material.
13. The method of claim 1 wherein the removing at least one first insert from a portion of a crushing body, the positioning at least one second insert in the at least one opening formed by the removing of the at least one first insert, the positioning of the explosive material adjacent to the at least one second insert and the portion of the crushing body; and the igniting of the explosive material are performed while the device configured to comminute material is positioned in a material processing facility, manufacturing facility or in a crushing circuit of a manufacturing process.
14. The method of claim 1 further comprising providing a localized stress relief to the portion of the crushing body after the explosive material is ignited and the at least one second insert is attached to the crushing body.
15. The method of claim 14, wherein the localized stress relief is provided via a thermal pad, the thermal pad being controlled to provide heat treatment to a local area of the crushing body adjacent to the at least one second insert.
16. The method of claim 1 further comprising covering the explosive material with a shield such that the shield is able to direct a force provided by the ignited explosive material, the shield being positioned to direct the force or energy provided by the explosive material toward the portion of the crushing body.
17. The method of claim 16 wherein the shield is comprised of at least one of metal and a material capable of absorbing at least a portion of sound emitted after the explosive material is detonated
18. The method of claim 17 further comprising moving the shield away from the crushing body after the explosive material is detonated.
19. The method of claim 1 wherein the portion of the crushing body is integral with the crushing body and is a portion of a wearable surface of the crushing body.
20. A method of forming a wearable surface for a device configured for material comminution comprising:
positioning inserts at least partially within sleeves;
positioning the inserts and sleeves adjacent to a first metal structure, the inserts being harder than the first metal structure;
positioning a second metal structure adjacent to the inserts, sleeves, and the first metal structure such that there is a gap between the second metal structure and the first metal structure, the second metal structure having a first side facing toward the gap and a second side opposite the first side;
positioning at least one explosive material adjacent to the second side of the second metal structure; and
igniting the at least one explosive material to deform a portion of the first metal structure to attach the inserts and sleeves to the first metal structure to form the wearable surface.
21. The method of claim 20 wherein the inserts are attached to the first metal structure such that no intramolecular bonding between the first metal structure and the inserts take place.
22. The method of claim 21 wherein intramolecular bonding or metallurgical bonding between the sleeves and the first metal structure occurs via the ignited at least one explosive material.
23. The method of claim 20 further comprising moving the second metal structure away from the wearable surface; and
wherein the first metal structure is a plate, a tube, or a generally cylindrical structure and the second metal structure is a plate, a tube, or a generally cylindrical structure and wherein the second metal structure is moved away from the wearable surface by at least one of cutting and hitting the second metal structure to move the second metal structure away from the wearable surface.
24. The method of claim 20 further comprising at least one of cutting the wearable surface to a desired shape, bending the wearable surface into a desired shape, flattening the wearable surface into a desired shape, and testing the wearable surface, the at least one of cutting, bending, flattening and testing configured to permit the wearable surface to be attached to a grinding component of the device.
25. A method of repairing a device configured to comminute material comprising:
removing at least one first insert from a portion of a crushing body such that at least one opening is formed in the portion of the crushing body, the portion of the crushing body comprised of metal, the at least one first insert being harder than the metal of the portion of the crushing body;
positioning at least one second insert in the at least one opening formed by the removing of the at least one first insert, the at least one second insert being harder that the metal of the portion of the crushing body;
positioning a force application mechanism adjacent to the at least one second insert and the portion of the crushing body;
actuating the force application mechanism to deform the portion of the crushing body to attach the at least one second insert to the portion of the crushing body.
26. The method of claim 25 wherein the deformation of the portion of the crushing body is a plastic deformation of the portion of the crushing body.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. An inkjet printer comprising:
a replaceable cartridge with an orifice plate mounted on a surface surrounding the orifice plate; and
a capping mechanism with a movable cap to seal against the surface surrounding the orifice plate,

wherein the capping mechanism comprises:
a base structure mounted on the chassis, the base structure being elongate and substantially coextensive with the printhead;
at least one static solenoid mounted on the base structure, the at least one solenoid being elongate and substantially coextensive with the printhead;
a support member reciprocally movable, with respect to the chassis, between an operative position and an inoperative position, said support member being actuated by the at least one solenoid; and
a printhead capping member mounted directly on the support member and arranged such that when the support member is in the operative position, the cap seals the printhead and when the support member is in the inoperative position, the cap is disengaged from the printhead.
2. An inkjet printer according to claim 1 wherein the orifice plate defines a nozzle array on a pagewidth printhead integrated circuit (IC).
3. A printer cartridge according to claim 2 wherein the platform is a plastic component and the surface for sealingly engaging the cap is flat, the plastic component being injection moulded such that the surface has a predetermined surface roughness.
4. A printer cartridge according to claim 3 wherein the surface has a recess for receiving the printhead IC such that the plastic component stores ink for the printhead IC to eject and supplies the ink to a surface of the printhead IC that is opposite the orifice plate.
5. A printer cartridge according to claim 4 wherein the recess is dimensioned such that the orifice plate is substantially flush with the surface that sealably engages the cap.
6. The printer of claim 1, wherein the support member is biased towards the operative position.
7. The printer of claim 1, wherein the solenoid is configured to move the support member into its inoperative position when the solenoid is actuated.
8. The printer of claim 1, wherein the capping member further comprises a length of sponge dimensioned to cover the printhead when the support member is displaced into its operative position.
9. The printer of claim 8, wherein a sealing member is positioned on the support member for sealing engagement with the sponge.

1. A power device package comprising:
a lead frame;
a metal tab die attach paddle (DAP) attached to the lead frame; and
a power device die bonded to the metal tab DAP wherein the lead frame is formed of Cu, and the metal tab DAP is formed of an alloy of Fe and Ni having a coefficient of thermal expansion (CTE) lower than that of Cu,
wherein the metal tab DAP is attached to the lead frame using a first conductive adhesive material, the power device die is bonded to the metal tab DAP using a second conductive adhesive material, and a melting point of the first conductive adhesive material is higher than that of the second conductive adhesive material.
2. The power device package of claim 1, wherein the metal tab DAP comprises a plated portion in order to improve the wettability of the metal tab DAP for the first and second conductive adhesive materials, and the first and second conductive adhesive materials are attached to the plated portion.
3. The power device package of claim 1, wherein the first and second conductive adhesive materials are formed of solder wire or solder paste.
4. The power device package of claim 1, wherein the metal tab DAP has a coefficient of thermal expansion (CTE) to compensate for a difference between a CTE of the lead frame and a CTE of the power device die so as to minimize a stress exerted on the power device die.
5. The power device package of 1, further comprising a sealant surrounding the lead frame, the metal tab DAP, and the power device die so as to seal the power device die, the sealant having a long surface creepage distance from an outside of the package to the power device die due to the metal tab DAP.
6. The power device package of claim 1, wherein the metal tab DAP comprises a Cu-plated portion and a Ag-plated portion in order to improve the wettability of the metal tab DAP for the first and second conductive adhesive materials, the first conductive adhesive material is attached to the Cu plated portion, and the second conductive adhesive material is attached to the Ag plated portion.
7. The power device package of claim 1, wherein the metal tab DAP has a CTE lower than that of the lead frame.
8. The power device package of claim 1, wherein the metal tab DAP has an area larger than that of the lead frame.
9. The power device package of claim 1, wherein the lead frame is a single gauged lead frame having the same thickness as an outside lead or a dual gauged lead frame having a different thickness than the outside lead.
10. The power device package of claim 1, wherein the power device package is a surface mount device type package.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

What is claimed is:

1. A method of manufacturing a semiconductor device having a manufacturing sequence comprising:
a flow shop process of sequentially performing a series of plural different steps; and
a job shop process of providing a plurality of processing apparatuses of a kind and concurrently performing processing of different conditions,
wherein, in a process in said manufacturing sequence, either said flow shop process or said job shop process or both are performed, and said manufacturing sequence combines said flow shop process and said job shop process.
2. The method of manufacturing a semiconductor device according to claim 1, wherein a loader unit is provided at the joint between said flow shop process and said job shop process and, when a workpiece is transferred between said flow shop process and said job shop process, said workpiece is moved into said loader unit.
3. The method of manufacturing a semiconductor device according to claim 1, wherein a serial processing apparatus performs a series of plural different steps in said flow shop process.
4. The method of manufacturing a semiconductor device according to claim 3, wherein said serial processing apparatus sequentially performs die bonding, clean cure and wire bonding.
5. The method of manufacturing a semiconductor device according to claim 3, wherein said serial processing apparatus sequentially performs marking, cutting, testing and visual inspection.
6. The method of manufacturing a semiconductor device according to claim 1, wherein said manufacturing sequence uses two different types of said serial processing apparatuses and three different types of job shop process apparatuses, and one of said two serial processing apparatuses as a first serial processing apparatus performs die bonding, clean cure, and wire bonding and the other as a second serial processing apparatus performs marking, cutting, testing and visual inspection, and said three job processing apparatuses respectively perform dicing, molding, and coating.
7. The method of manufacturing a semiconductor device according to claim 6, wherein the number of wire bonders in said first serial processing apparatus is varied depending on the number of external terminals of said semiconductor device.
8. A method of manufacturing a semiconductor device having a manufacturing sequence comprising:
a flow shop process of sequentially performing a series of plural different steps; and
a job shop process of providing a plurality of processing apparatuses of a kind and concurrently performing processing of different conditions,
wherein in a process in said manufacturing sequence, either said flow shop process or said job shop process or both are performed, said manufacturing sequence combines said flow shop process and said job shop process, and for said flow shop process a serial processing apparatus is used to assemble a main product while for said job shop process, job processing apparatuses are used to assemble a small-lot product.
9. A method of manufacturing a semiconductor device having a manufacturing sequence comprising:
a flow shop process of sequentially performing a series of plural different steps; and
a job shop process of providing a plurality of processing apparatuses of a kind and concurrently performing processing of different conditions,
wherein in a process in said manufacturing sequence, either said flow shop process or said job shop process or both are performed, said manufacturing sequence combines said flow shop process and said job shop process, two different types of serial processing apparatuses are used to perform said flow shop process and said job shop process is performed between said two flow shop processes.
10. A method of manufacturing a semiconductor device having a manufacturing sequence comprising:
a flow shop process of sequentially performing a series of plural different steps; and
a job shop process of providing a plurality of processing apparatuses of a kind and concurrently performing processing of different conditions,
wherein in a process in said manufacturing sequence, either said flow shop process or said job shop process or both are performed, said manufacturing sequence combines said flow shop process and said job shop process, a serial processing apparatus is used to perform said flow shop process, and when said semiconductor device is an unscheduled product, said serial processing apparatus preferentially performs processing for said unscheduled product.
11. A method of manufacturing a semiconductor device having a manufacturing sequence comprising:
a flow shop process of sequentially performing a series of plural different steps; and
a job shop process of providing a plurality of processing apparatuses of a kind and concurrently performing processing of different conditions,
wherein in a process in said series manufacturing sequence, either said flow shop process or said job shop process or both are performed, said manufacturing sequence combines said flow shop process and said job shop process, and a serial processing apparatus having at least one loader unit is used for said flow shop process.
12. The method of manufacturing a semiconductor device according to claim 11, wherein said first serial processing apparatus is comprised of a die bonder, a clean cure unit, and a wire bonder, said loader unit is located between said clean cure unit and said wire bonder, and in transferring a workpiece from said clean cure unit to said loader unit, said workpiece is placed in a container and handled on a container basis.
13. The method of manufacturing a semiconductor device according to claim 11, wherein said first serial processing apparatus has a plurality of wire bonders and a clean cure unit, an unloader unit is located between two neighboring ones of said plural wire bonders, and in said plural wire bonders, the number of wire bonders located after said unloader unit, or remoter from said clean cure unit, is larger than the number of wire bonders located between said unloader unit and said clean cure unit.
14. A method of manufacturing a semiconductor device having a manufacturing sequence comprising:
a flow shop process of sequentially performing a series of plural different steps; and
a job shop process of providing a plurality of processing apparatuses of a kind and concurrently performing processing of different conditions,
wherein in a process in said manufacturing sequence, either said flow shop process or said job shop process or both are performed, and said manufacturing sequence combines said flow shop process and said job shop process,
wherein said flow shop process includes first serial processing and second serial processing, said first serial processing including die bonding, clean cure and wire bonding and said second serial processing including marking, cutting, testing and visual inspection, and
wherein the processing capacity of a first serial processing apparatus for performing said first serial processing is larger than that of a second serial processing apparatus for processing said second serial processing.
15. The method of manufacturing a semiconductor device according to claim 14, wherein a main product is assembled by said first serial processing and a small-lot product is assembled by job shop process which corresponds to said first serial processing.
16. A method of manufacturing a semiconductor device having a manufacturing sequence comprising:
a flow shop process of sequentially performing a series of plural different steps; and
a job shop process of providing a plurality of processing apparatuses of a kind and concurrently performing processing of different conditions,
wherein in a process in said manufacturing sequence, either said flow shop process or said job shop process or both are performed, and said manufacturing sequence combines said flow shop process and said job shop process,
wherein said flow shop process includes first serial processing and second serial processing, said first serial processing including die bonding, clean cure and wire bonding and said second serial processing including of marking, cutting, testing and visual inspection, and
wherein a testing unit which performs said testing uses a plurality of test heads.
17. A method of manufacturing a semiconductor device having a manufacturing sequence comprising:
a flow shop process of sequentially performing a series of plural different steps; and
a job shop process of providing a plurality of processing apparatuses of a kind and concurrently performing processing of different conditions,
wherein in a process in said manufacturing sequence, either said flow shop process or said job shop process or both are performed, and said manufacturing sequence combines said flow shop process and said job shop process, and
wherein data from a main process in said manufacturing sequence is sent to a control means and according to this data, instructions for a product for which a manufacturing process is to be started are sent from said control means to processing apparatuses in said main process in said manufacturing sequence.
18. The method of manufacturing a semiconductor device according to claim 17, wherein an instruction for wafer input is given to a dicing unit for dicing as a first step in said manufacturing sequence.
19. The method of manufacturing a semiconductor device according to claim 17, wherein an instruction to give priority to serial processing for said flow shop process in said manufacturing sequence is sent to job processing apparatuses in said job shop process.
20. The method of manufacturing a semiconductor device according to claim 17, wherein if a problem occurs in a serial processing apparatus which performs said flow shop process in said manufacturing sequence, an instruction to make steps performed by said serial processing be performed by said job shop process is sent to job processing apparatuses in said job shop process.
21. The method of manufacturing a semiconductor device according to claim 17, wherein in said manufacturing sequence, at least any one of a serial processing apparatus responsible for said flow shop process and a job processing apparatus responsible for said job shop process is stopped on purpose and upon this stop, an instruction to start a process is sent to an offline job processing apparatus.
22. A method of manufacturing a semiconductor device having a manufacturing sequence comprising:
a flow shop process of sequentially performing a series of plural different steps; and
a job shop process of providing a plurality of processing apparatuses of a kind and concurrently performing processing of different conditions,
said method comprising the steps of:
(a) dicing a semiconductor wafer into chips as said job shop process;
(b) after said step (a), sequentially performing die bonding, clean cure and wire bonding for semiconductor chips by a first serial processing apparatus as said flow shop process;
(c) after said step (b), plastic-molding said semiconductor chips as said job shop process;
(d) after said step (c), coating external terminals as said job shop process; and
(e) after said step (d), sequentially performing marking, cutting, testing and visual inspection as said flow shop process by a second serial processing apparatus,
wherein said flow shop process and said job shop process are combined to assemble a semiconductor device through said manufacturing sequence.